Branch-type multi-channel heat dissipation packaging structure
Through the branch-buncture multi-channel heat dissipation packaging structure, the problems of complex packaging, high cost and poor heat dissipation channels in the existing technology are solved, and more efficient chip heat dissipation is achieved and the development of high-performance computers is supported.
Patent Information
- Application Number
- CN202420842778.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The existing technology has complex packaging implementation process, high overall cost, and poor heat transfer channels in chip heat dissipation design, which cannot effectively improve chip temperature transfer, limiting the development of high-performance computers.
A branch-buncture-type multi-channel heat dissipation packaging structure is adopted, and multiple heat transfer channels are established through the combination of N metal substrate frames, multi-layer conductive material layers and dielectric components to improve heat dissipation efficiency.
It reduces packaging cost and complexity, enhances heat dissipation capabilities, effectively solves the performance problems caused by excessive chip temperature, and supports product applications with higher current and voltage.
Smart Images
Figure CN222801740U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a tree-branch-type multi-channel heat dissipation packaging structure. Background Art
[0002] With the continuous development of Moore's Law, chip processing technology has been continuously breaking through, and the manufacturing process node has entered the angstrom era. Due to the more advanced manufacturing process, more transistors are integrated inside the chip with higher density and overall quantity, which has more functions and higher performance, but the increase in transistors brings higher power consumption requirements for heat dissipation design. If the accumulated heat cannot be dissipated in time to ensure that the chip temperature is below the safe temperature, the chip's operating performance will be affected at best, and it will be directly burned and paralyzed at worst, which seriously restricts the development of high-performance computers.
[0003] The current mainstream packaging and heat dissipation solutions in the industry are:
[0004] An additional metal heat dissipation component carrier is added to the top of the chip and thinned after plastic packaging to ensure the leakage of the metal heat dissipation component. At the same time, a heat dissipation channel of the top heat dissipation component is established through the bonding interface at the bottom of the top heat dissipation component.
[0005] The above structure has the following deficiencies:
[0006] A metal heat dissipation component carrier is added to the chip surface, and the non-functional area on the chip surface is limited, which cannot enhance the utilization of the functional area, and the chip heat dissipation interface cannot be maximized;
[0007] It is necessary to first plastic seal and then thin it to ensure that the metal heat dissipation component carrier is exposed, which increases the plastic seal grinding process and makes the packaging process more complicated;
[0008] Adding the combination and welding of the heat dissipation component on the top of the metal heat dissipation component carrier increases the packaging structure cost and the complexity of the packaging process. Utility Model Content
[0009] The current packaging implementation process is complex, the overall cost is high, the heat dissipation channel is poor, and the temperature transfer of the chip itself cannot be improved. In view of the problem of heat power dissipation, it is impossible to achieve higher current and higher voltage product application areas.
[0010] The utility model aims to provide a tree branch type multi-channel heat dissipation packaging structure.
[0011] A tree-branch-type multi-channel heat dissipation packaging structure.
[0012] including N metal substrate frames;
[0013] The first conductive material layer is printed on the upper surfaces of the N metal substrate frames;
[0014] The upper surface of the first conductive material layer is mounted with a first chip;
[0015] A second conductive material layer is printed on the upper surface of the first chip;
[0016] The same first conductive medium component is mounted on the second conductive material layer on all metal substrate frames;
[0017] In the N metal substrate frames, a third conductive material layer is printed on the upper surface of the first conductive medium component directly above the A metal substrate frames;
[0018] A second conductive medium component is mounted on the upper surface of the third conductive material layer;
[0019] The entire inner component is covered with a plastic layer.
[0020] Preferably, a plurality of heat dissipation holes are evenly arranged on the top of the plastic sealing layer directly above the second conductive medium component.
[0021] Furthermore, the heat dissipation holes are filled with a conductive or thermal conductive medium.
[0022] Specifically, among the N metal substrate frames, a fourth conductive material layer is printed on the first conductive medium member directly above the remaining metal substrate frames on which the third conductive material layer is not printed, and a second chip is mounted on the upper surface of the fourth conductive material layer;
[0023] The second chip is electrically connected to the first conductive medium component through a bonding wire.
[0024] Specifically, the first conductive medium component and the second conductive medium component are made of metal;
[0025] The first conductive material layer, the second conductive material layer, the third conductive material layer and the fourth conductive material layer are made of metal.
[0026] Compared with the prior art, the utility model has the following advantages in the packaging structure of multi-channel heat dissipation with a branch-branch type:
[0027] (1) Product cost: Eliminate inefficient processes such as surface thinning, and eliminate processes such as the production and installation of metal heat-conducting components; eliminate special plastic sealing equipment or grinding equipment solutions to reduce heavy asset investment costs;
[0028] (2) Heat dissipation effect: Increase heat transfer and establish heat channels between heat dissipation chips, enhance the heat dissipation capacity of the bottom and top heat dissipation structures, effectively and quickly transfer the heat generated by the chip to the outside of the plastic package, and solve the performance problems of the chip caused by excessive temperature;
[0029] (3) Currently, the application of the packaging heat dissipation channel and process method of this top heat dissipation structure has not been promoted and applied in the field of semiconductor packaging. The overall heat dissipation industry still mainly achieves multi-functional heat dissipation by adding heat sinks or heat sinks on the top. The number of packaging heat dissipation channels can be increased to effectively transfer the temperature generated by the chip to the top heat dissipation channel, thereby reducing the impact of the chip junction temperature on the product itself. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] Figure 1 A schematic diagram of a packaging structure of a branch-branched multi-channel heat dissipation provided in Example 1 Figure 1 ;
[0031] Figure 2 A schematic diagram of a packaging structure of a branch-branched multi-channel heat dissipation provided in Example 1 Figure 2 ;
[0032] Figure 3 This is a schematic diagram of the product after step B1 in Example 2 is completed;
[0033] Figure 4 This is a schematic diagram of the product after step B2 in Example 2 is completed;
[0034] Figure 5 This is a schematic diagram of the product after step B3 in Example 2 is completed;
[0035] Figure 6 This is a schematic diagram of the product after step B4 in Example 2 is completed;
[0036] Figure 7 This is a schematic diagram of the product after step B5 in Example 2 is completed;
[0037] Figure 8 This is a schematic diagram of the product after step B6 in Example 2 is completed;
[0038] Fig. 9 The product after step B7 in Example 2 is completed Figure 1 ;
[0039] Fig.10 The product after step B7 in Example 2 is completed Figure 2 ;
[0040] Fig.11 This is a schematic diagram of the product after step B8 in Example 2 is completed;
[0041] Fig.12 This is a schematic diagram of the product after step B9 in Example 2 is completed;
[0042] Fig.13 This is a schematic diagram of the product after step B10 in Example 2 is completed. DETAILED DESCRIPTION
[0043] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.
[0044] Example 1
[0045] like Figure 1 As shown, a tree-branch type multi-channel heat dissipation packaging structure of the utility model comprises N metal substrate frames 1; the upper surfaces of the N metal substrate frames 1 are all printed with a first conductive material layer 2; the upper surfaces of the first conductive material layer 2 are all mounted with a first chip 3; the upper surfaces of the first chip 3 are all printed with a second conductive material layer 4; the same first conductive medium component 5 is mounted on the second conductive material layer 4 on all metal substrate frames 1; among the N metal substrate frames 1, the upper surfaces of the first conductive medium components 5 directly above the A metal substrate frames are printed with a third conductive material layer 6; the upper surfaces of the third conductive material layer 6 are all mounted with a second conductive medium component 7; and the entire internal component is covered with a plastic sealing layer 11. In this embodiment, N is 2, A is 1; in addition, as Figure 2 As shown, it is a schematic diagram of a packaging structure where N is 3 and A is 2. In the dotted box: a series or parallel structure of multiple semiconductor chips or devices can be realized.
[0046] In this embodiment, a plurality of heat dissipation holes 12 are evenly formed on the top of the plastic sealing layer 11 located directly above the second conductive medium component 7. Furthermore, the heat dissipation holes 12 are filled with a conductive or thermal conductive medium 13.
[0047] In addition, among the N metal substrate frames, a fourth conductive material layer 8 is printed on the first conductive medium component 5 directly above the remaining metal substrate frames on which the third conductive material layer 6 is not printed, and a second chip 9 is mounted on the upper surface of the fourth conductive material layer 8; the second chip 9 is electrically connected to the first conductive medium component 5 through a welding wire 10; a series or parallel structure of multiple semiconductor chips or devices can be realized
[0048] In this embodiment, the first conductive medium component 5 and the second conductive medium component 7 are made of metal; the first conductive material layer 2, the second conductive material layer 4, the third conductive material layer 6 and the fourth conductive material layer 8 are all made of metal.
[0049] Example 2
[0050] A preparation process of a tree-branch type multi-channel heat dissipation packaging structure comprises the following steps:
[0051] B1. Take N metal substrate frames 1 and print the first conductive material layer 2 on the upper surface thereof, wherein N ≥ 2. Figure 3As shown, in this embodiment, N is 2;
[0052] B2. Mounting the first chip 3 on the first conductive material layer 2, such as Figure 4 As shown;
[0053] B3, printing a second conductive material layer 4 on the upper surface of the first chip 3, such as Figure 5 As shown;
[0054] B4, mounting the same first conductive medium component 5 on the second conductive material layer 4 on all metal substrate frames 1 to achieve electrical connection between different first chips 3, and the first conductive medium component 5 is a dendritic structure, such as Figure 6 As shown;
[0055] B5. In N metal substrate frames, a third conductive material layer 6 is printed on the upper surface of the first conductive medium component 5 directly above A metal substrate frames, 1≤A<N, such as Figure 7 As shown, in this embodiment, A is 1;
[0056] B6. Mount the second conductive medium component 7 on the upper surface of the third conductive material layer 6. Figure 8 As shown;
[0057] B7. In the N metal substrate frames, a fourth conductive material layer 8 is printed on the first conductive medium member 5 directly above the remaining metal substrate frames on which the third conductive material layer 6 is not printed, and a second chip 9 is mounted on the upper surface of the fourth conductive material layer 8, as shown in FIG. Fig. 9 and Fig.10 As shown;
[0058] B8, the second chip 9 and the first conductive medium component 5 are connected by a bonding wire 10, such as Fig.11 shown.
[0059] B9. Plastic packaging is adopted for protection around the internal components, and the end of the bifurcated part of the first conductive medium component 5 and the lower surface of the N metal substrate frames 1 are exposed outside the plastic packaging layer 11, such as Fig.12 shown.
[0060] B10, a plurality of heat dissipation holes 12 are evenly formed on the top of the plastic sealing layer directly above the second conductive medium component 7, such as Fig.13 shown.
[0061] In this embodiment, the heat dissipation hole 12 opened in step B10 is filled with a conductive or thermally conductive medium 13, such as Figure 1 shown.
[0062] Furthermore, a laser drilling process is adopted to evenly open a plurality of heat dissipation holes 12 on the top of the plastic sealing layer located directly above the second conductive medium component, and a brushing process is adopted to fill the conductive or thermal conductive medium 13 in the openings.
[0063] In this embodiment, high-precision printing equipment and printing steel mesh are used to print a high-thermal conductivity, first conductive material layer 2 of uniform thickness on a conductive metal substrate or carrier to ensure that the thickness and size of the conductive material are controllable; high-precision chip mounting equipment is used to mount an ultra-thin first chip 3 through processes such as dispensing / brushing / coating the first conductive material layer 2 of the conductive metal solid-liquid coexisting material, and ensure that the voids of the conductive metal solid-liquid coexisting material are controllable to meet the control requirements of the heat dissipation thermal resistance and conductive Rdson at the bottom of the semiconductor chip or device; high-precision mounting equipment is used to bridge the heat dissipation channels between different first chips 3 through bifurcated conductive metal / ceramic components through the process of brushing the second conductive material layer 4 of the conductive metal solid-liquid coexisting material, and transfer the heating temperature of different semiconductor chips or devices to the first conductive medium component 5; above the first conductive medium component 5, high-precision printing equipment and step-type printing steel mesh are used to increase the printing of a third conductive material layer 6 of the conductive metal solid-liquid coexisting material of uniform thickness, Ensure that the thickness and size of the conductive material are controllable; adopt high-precision chip mounting equipment, and install the conductive metal 7 on the third conductive material layer 6 of the conductive metal solid-liquid coexisting material through processes such as dispensing / brushing / coating of conductive metal solid-liquid coexisting materials, so as to ensure that the temperature of the conductive metal 5 and the semiconductor chip or device 3 is effectively transferred upward; adopt metal solid-liquid coexisting materials or ceramic powder 8 to effectively mount the semiconductor chip or device 9 on the conductive metal 5, and through the connection of welding wires 10, ensure the electrical connection between the semiconductor chip or device and each functional component to achieve product function output; adopt high heat dissipation plastic packaging materials 11 to protect the internal product components and effectively isolate the influence of external water vapor and electrical interference; adopt the process of laser laser multi-shaped heat dissipation holes to design multi-shaped heat dissipation holes for the high heat dissipation plastic packaging layer 11 above the second conductive medium component 7, and adopt processes such as brushing glue / coating to fill the multi-shaped heat dissipation holes with high heat dissipation metal solid-liquid coexisting or ceramic powder materials 13 to ensure the effective realization of the top heat dissipation channel.
[0064] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.
Claims
1. A tree-branch type multi-channel heat dissipation packaging structure, characterized in that: comprising N metal substrate frames, wherein N ≥ 2; The first conductive material layer is printed on the upper surfaces of the N metal substrate frames; The upper surface of the first conductive material layer is mounted with a first chip; A second conductive material layer is printed on the upper surface of the first chip; The same first conductive medium component is mounted on the second conductive material layer on all metal substrate frames; Among the N metal substrate frames, a third conductive material layer is printed on the upper surface of the first conductive medium component directly above the A metal substrate frames, wherein 1≤A<N; A second conductive medium component is mounted on the upper surface of the third conductive material layer; The entire inner component is covered with a plastic packaging layer, and the end of the bifurcated portion of the first conductive medium component and the lower surfaces of the N metal substrate frames are exposed outside the plastic packaging layer.
2. A tree-branch-type multi-channel heat dissipation packaging structure as claimed in claim 1, characterized in that: A plurality of heat dissipation holes are evenly arranged on the top of the plastic sealing layer directly above the second conductive medium component.
3. A tree-branch-type multi-channel heat dissipation packaging structure as claimed in claim 2, characterized in that: The heat dissipation holes are filled with conductive or thermal conductive media.
4. A tree-branch type multi-channel heat dissipation packaging structure as claimed in any one of claims 1 to 3, characterized in that: Among the N metal substrate frames, a fourth conductive material layer is printed on the first conductive medium member directly above the remaining metal substrate frames on which the third conductive material layer is not printed, and a second chip is mounted on the upper surface of the fourth conductive material layer; The second chip is electrically connected to the first conductive medium component through a bonding wire.
5. A tree-branch type multi-channel heat dissipation packaging structure as claimed in claim 4, characterized in that: The first conductive medium component and the second conductive medium component are made of metal; The first conductive material layer, the second conductive material layer, the third conductive material layer and the fourth conductive material layer are made of metal.