Impedance circuit board
By designing multi-layer structure impedance circuit boards, including optimized layer structure and material thickness, the problems of poor impedance performance and compressive resistance of existing circuit boards are solved, and better signal shielding and compressive resistance are achieved.
Patent Information
- Application Number
- CN202420626630.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-03-28
AI Technical Summary
The impedance performance and compressive resistance of existing circuit boards are poor, making it difficult to effectively solve the problem of impedance line signal shielding.
An impedance circuit board is designed, including a substrate, a multi-layer circuit layer, a shielding layer, a signal layer and an insulating layer. By optimizing the layer structure and material thickness, an antistatic layer and reinforcement ribs are added to form a mesh structure to improve strength.
It achieves better impedance performance and compressive resistance, effectively prevents interference between conductors, signal lines and grounding lines, and improves the overall performance of the circuit board.
Smart Images
Figure CN222803081U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of circuit boards, and in particular, to an impedance circuit board. Background Art
[0002] In traditional printed circuit board design, impedance is usually formed by inductance, capacitance and resistance formed in the printed circuit board, among which inductance mainly depends on the thickness of the metal layer and the length of the line; capacitance mainly depends on the width of the line, the thickness of the dielectric layer and the dielectric constant; and resistance mainly depends on the length of the line, the width of the line, the thickness of the metal layer and the resistance parameters of the metal layer. In order for the actual impedance value of the product to reach the theoretical optimal value, in the design process of the printed circuit board, in addition to strictly controlling the line length, line width and metal layer thickness of the impedance test module, it is also necessary to deal with various impedance line signal shielding problems according to the actual impedance design requirements. The existing circuit boards have poor impedance performance and poor compressive resistance. Summary of the invention
[0003] The purpose of the embodiments of the present application is to provide an impedance circuit board that can solve the above-mentioned technical problems.
[0004] An embodiment of the present application provides an impedance circuit board, including a substrate, a first circuit layer is arranged at the upper end of the substrate, a second circuit layer is arranged at the lower end of the substrate, a first shielding layer is arranged at the upper end of the first circuit layer, a second shielding layer is arranged at the lower end of the second circuit layer, a first signal layer is arranged at the upper end of the first shielding layer, a second signal layer is arranged at the lower end of the second shielding layer, a first insulating layer is arranged at the upper end of the first signal layer, a second insulating layer is arranged at the lower end of the second signal layer, a grounding layer is arranged at the lower end of the second insulating layer, and a third insulating layer is arranged at the lower end of the grounding layer.
[0005] Preferably, an antistatic layer is sprayed on the upper end of the first insulating layer and the lower end of the third insulating layer.
[0006] Preferably, reinforcing ribs are arranged inside the substrate, and the reinforcing ribs are arranged in a mesh shape.
[0007] Preferably, a contact surface between the substrate and the first circuit layer and a contact surface between the substrate and the second circuit layer are arranged in a micro-wave structure.
[0008] Preferably, the substrate is a glass fiber layer, and the thickness of the substrate is 0.5-1 mm.
[0009] Preferably, the thickness of the first insulating layer, the second insulating layer and the third insulating layer are all 1 mm.
[0010] Preferably, the thickness of the first circuit layer, the second circuit layer, the first signal layer, the second signal layer, and the ground layer is 2-3 mm.
[0011] Beneficial effects of the utility model:
[0012] The utility model provides an impedance circuit board, including a substrate, wherein a first circuit layer is arranged at the upper end of the substrate, a second circuit layer is arranged at the lower end of the substrate, a first shielding layer is arranged at the upper end of the first circuit layer, a second shielding layer is arranged at the lower end of the second circuit layer, a first signal layer is arranged at the upper end of the first shielding layer, a second signal layer is arranged at the lower end of the second shielding layer, a first insulating layer is arranged at the upper end of the first signal layer, a second insulating layer is arranged at the lower end of the second signal layer, a grounding layer is arranged at the lower end of the second insulating layer, and a third insulating layer is arranged at the lower end of the grounding layer. The first circuit layer and the second circuit layer of the utility model are used for routing conductive lines, the first signal layer and the second signal layer are used for routing signal lines, and the grounding layer is used for routing grounding lines. The first insulating layer, the second insulating layer and the third insulating layer of the utility model can prevent conductive lines, signal lines and grounding lines from directly interfering with each other. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 It is a structural schematic diagram of the utility model.
[0015] The reference numerals are:
[0016] 1. Substrate; 2. First circuit layer; 3. Second circuit layer; 4. First shielding layer; 5. Second shielding layer; 6. First signal layer; 7. Second signal layer; 8. First insulation layer; 9. Second insulation layer; 10. Ground layer; 11. Third insulation layer; 12. Antistatic layer; 13. Reinforcement ribs. DETAILED DESCRIPTION
[0017] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0018] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0019] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0020] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0021] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0022] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0023] like Figure 1As shown, an impedance circuit board includes a substrate 1, a first circuit layer 2 is arranged on the upper end of the substrate 1, a second circuit layer 3 is arranged on the lower end of the substrate 1, a first shielding layer 4 is arranged on the upper end of the first circuit layer 2, a second shielding layer 5 is arranged on the lower end of the second circuit layer 3, a first signal layer 6 is arranged on the upper end of the first shielding layer 4, a second signal layer 7 is arranged on the lower end of the second shielding layer 5, a first insulating layer 8 is arranged on the upper end of the first signal layer 6, a second insulating layer 9 is arranged on the lower end of the second signal layer 7, a grounding layer 10 is arranged on the lower end of the second insulating layer 9, and a third insulating layer 11 is arranged on the lower end of the grounding layer 10. The first circuit layer 2 and the second circuit layer 3 of the utility model are used for routing wires, the first signal layer 6 and the second signal layer 7 are used for routing signal lines, and the grounding layer 10 is used for routing grounding lines. The first insulating layer 8, the second insulating layer 9 and the third insulating layer 11 of the utility model can prevent wires, signal lines and grounding lines from directly interfering with each other.
[0024] like Figure 1 As shown, in this embodiment, an antistatic layer 12 is sprayed on the upper end of the first insulating layer 8 and the lower end of the third insulating layer 11. The antistatic layer 12 of the utility model can prevent interference from static electricity.
[0025] like Figure 1 As shown, in this embodiment, in order to provide strength for the utility model, reinforcing ribs 13 are arranged inside the substrate 1, and the reinforcing ribs 13 are arranged in a mesh shape. The contact surface between the substrate 1 and the first circuit layer 2 and the contact surface between the substrate 1 and the second circuit layer 3 are arranged in a micro-wave structure. The substrate 1 is a glass fiber layer, and the thickness of the substrate is 0.5-1mm.
[0026] like Figure 1 As shown, in this embodiment, the thickness of the first insulating layer 8, the second insulating layer 9, and the third insulating layer 11 are all 1 mm, which can be adjusted according to requirements.
[0027] like Figure 1 As shown, in this embodiment, the thickness of the first circuit layer 2, the second circuit layer 3, the first signal layer 6, the second signal layer 7, and the ground layer 10 is 2-3 mm, which can be adjusted according to requirements.
[0028] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An impedance circuit board, characterized in that: It includes a substrate, a first circuit layer is arranged at the upper end of the substrate, a second circuit layer is arranged at the lower end of the substrate, a first shielding layer is arranged at the upper end of the first circuit layer, a second shielding layer is arranged at the lower end of the second circuit layer, a first signal layer is arranged at the upper end of the first shielding layer, a second signal layer is arranged at the lower end of the second shielding layer, a first insulating layer is arranged at the upper end of the first signal layer, a second insulating layer is arranged at the lower end of the second signal layer, a grounding layer is arranged at the lower end of the second insulating layer, and a third insulating layer is arranged at the lower end of the grounding layer.
2. The impedance circuit board according to claim 1, characterized in that: An antistatic layer is sprayed on the upper end of the first insulating layer and the lower end of the third insulating layer.
3. The impedance circuit board according to claim 1, characterized in that: The substrate is provided with reinforcing ribs inside, and the reinforcing ribs are arranged in a mesh shape.
4. The impedance circuit board according to claim 1, characterized in that: The contact surface between the substrate and the first circuit layer and the contact surface between the substrate and the second circuit layer are arranged in a micro-wave structure.
5. The impedance circuit board according to claim 1, characterized in that: The substrate is a glass fiber layer, and the thickness of the substrate is 0.5-1 mm.
6. The impedance circuit board according to claim 1, characterized in that: The thickness of the first insulating layer, the second insulating layer, and the third insulating layer are all 1 mm.
7. The impedance circuit board according to claim 1, characterized in that: The thickness of the first circuit layer, the second circuit layer, the first signal layer, the second signal layer, and the ground layer is 2-3 mm.