Multi-layer circuit board pressing device

Abstract

The utility model relates to the field of multilayer circuit board processing, in particular to a multilayer circuit board pressing device, which comprises a rack, a pressing mechanism arranged at the upper end of the rack, and a placing mechanism. When the device works, the device is adjusted according to the thickness of the laminated multi-layer circuit board, a second motor is started to enable lifting frames to ascend and descend, and after the lifting frames are adjusted to the proper height, the heights of several protruding plates at the corresponding ends of the two lifting frames correspond to the thickness of the laminated multi-layer circuit board; then, the multilayer circuit board to be pressed is placed in the middle of the heightening table, a first motor is started at the same time, two sliding baffles move in the opposite directions, after the two sliding baffles move to the proper positions, a pressing mechanism is started, pressing operation is conducted on the multilayer circuit board, and at the moment, due to the arrangement of protruding plates at the corresponding ends of two lifting frames, pressing operation is conducted on the multilayer circuit board; the limit pressing length of the pressing structure can be limited by the convex plate of the lifting frame, so that the condition that the circuit board is damaged due to excessive pressing of the pressing structure can be reduced.

Description

Technical Field

[0001] The utility model relates to the field of multi-layer circuit board processing, in particular to a multi-layer circuit board pressing device. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards. The production method of multi-layer circuit boards generally starts with making the inner layer graphics first, and then using the printing and etching method to make a single-sided or double-sided substrate, and incorporate it into the specified interlayer, and then heat, pressurize and bond it. As for the subsequent drilling, it is the same as the plated through-hole method of the double-sided board.

[0003] After searching the patent document with the announcement number CN220359463U, the patent document discloses "a multi-layer circuit board pressing device, which is slidably installed on the top of the table by four baffles. During pressing, the hydraulic rod drives the downward pressing plate to move and utilizes the elastic cooperation between the sliding assembly, the connecting rod, the sleeve, the supporting rod, and the spring to make the four baffles spliced ​​to limit the position of the circuit board during pressing. When pressing is completed, the four baffles are moved outward under the elastic action of the spring, and the pressed circuit board can be taken out, which reduces the use of driving devices such as cylinders or motors, and reduces the cost of manufacturing and use.";

[0004] Circuit boards are mostly made of ceramics. When the multi-layer circuit boards are pressed together, if the stack of circuit boards is not properly placed or the pressing structure is pressed down too much, the pressed circuit boards may be easily broken and damaged, which may cause the multi-layer circuit boards to be easily damaged. Utility Model Content

[0005] The purpose of the utility model is to provide a multi-layer circuit board pressing device in order to solve the above problems.

[0006] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0007] A multi-layer circuit board pressing device comprises a stand, a pressing mechanism is installed on the upper end of the stand, and a placing mechanism;

[0008] The placing mechanism includes a raising platform, which is fixed in the middle of the upper end of the platform. A bidirectional screw is rotatably connected inside the raising platform, and a first motor is installed at the input end of the bidirectional screw. Two sliding baffles are threadedly connected to the outer periphery of the bidirectional screw, and the sliding baffles are slidably connected to the raising platform. A second motor is installed on the rear side of each sliding baffle, and a unidirectional screw is fixed to the output end of the second motor. A limiting rod is fixed to the front side of each sliding baffle, and a lifting frame is threadedly connected to the outer periphery of each unidirectional screw, and the lifting frame is slidably connected to the corresponding limiting rod. Two convex plates are provided at the corresponding ends of the two lifting frames, and a scale is opened at one end of one of the sliding baffles corresponding to the position of the lifting frame.

[0009] Preferably, the middle structure of the bidirectional screw is a cylindrical structure whose size is larger than its own diameter.

[0010] Preferably, the upper ends of the one-way screw rod and the limiting rod are both provided with a disc structure whose size is larger than their own diameter.

[0011] Preferably, two boss structures are fixed at the middle position of the upper end of the elevated platform.

[0012] Preferably, the pressing mechanism comprises an L-shaped frame, which is fixed to the upper end of the rear side of the platform, an electric push rod is installed in the middle of the L-shaped frame, a pressing plate is fixed to the telescopic end of the electric push rod, and two support rods are fixed to the front end of the L-shaped frame.

[0013] Preferably, the electric push rod and the pressing plate are located at the center of the stand.

[0014] The beneficial effects compared with the prior art are as follows:

[0015] When the device is in operation, the device is first adjusted according to the thickness of the multi-layer circuit board after pressing. Through the threaded connection between the lifting frame and the one-way screw and the sliding connection between the lifting frame and the limit rod, the lifting frame can be lifted and lowered after the second motor drives the one-way screw to rotate. After the lifting frame is adjusted to a suitable height, the height of the several convex plates at the corresponding ends of the two lifting frames corresponds to the thickness of the multi-layer circuit board after pressing. Then, the multi-layer circuit board to be pressed is placed in the middle of the padding platform, and the first motor is started at the same time. Through the threaded connection between the sliding baffle and the two-way screw and the sliding connection between the sliding baffle and the padding platform, the two sliding baffles can be moved in relative directions after the first motor drives the two-way screw to rotate. After the two sliding baffles are moved to suitable positions, the pressing mechanism is started to press the multi-layer circuit board. At this time, due to the setting of the convex plates at the corresponding ends of the two lifting frames, the maximum pressing length of the pressing structure will be limited by the convex plates of the lifting frame. In this way, the damage of the circuit board caused by excessive pressing of the pressing structure can be reduced, and the setting of the scale makes it more convenient to adjust the height of the lifting frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 It is a structural schematic diagram of a multi-layer circuit board pressing device described in the utility model;

[0018] Figure 2 It is a structural schematic diagram of a placement mechanism of a multi-layer circuit board pressing device described in the utility model;

[0019] Figure 3 It is a structural schematic diagram of a sliding baffle of a multi-layer circuit board pressing device described in the utility model;

[0020] Figure 4 It is a structural schematic diagram of a pressing mechanism of a multi-layer circuit board pressing device described in the utility model.

[0021] The following are the descriptions of the reference numerals:

[0022] 1. Stand; 11. Base frame; 12. Fixing bolts; 2. Elevating platform; 21. Bidirectional screw; 22. First motor; 23. Sliding baffle; 24. Second motor; 25. Unidirectional screw; 26. Limit rod; 27. Lifting frame; 28. Scale; 3. L-shaped frame; 31. Electric push rod; 32. Pressing plate; 33. Support rod. DETAILED DESCRIPTION

[0023] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0025] The utility model is further described below in conjunction with the accompanying drawings:

[0026] like Figure 1-Figure 4As shown, a multi-layer circuit board pressing device includes a stand 1, a pressing mechanism is installed on the upper end of the stand 1, and also includes a placing mechanism.

[0027] Two base frames 11 are fixed at the lower end of the stand 1 , and a plurality of fixing bolts 12 are arranged in the middle of the base frames 11 ; the device can be fixed to a suitable position by the fixing bolts 12 .

[0028] The placing mechanism includes a raising platform 2, which is fixed in the middle of the upper end of the platform 1. Two boss structures are fixed in the middle position of the upper end of the raising platform 2. A bidirectional screw 21 is rotatably connected inside the raising platform 2. The middle structure of the bidirectional screw 21 is a cylindrical structure with a size larger than its own diameter. A first motor 22 is installed at the input end of the bidirectional screw 21. Two sliding baffles 23 are threadedly connected to the outer periphery of the bidirectional screw 21, and the sliding baffles 23 are slidably connected to the raising platform 2. A second motor 24 is installed on the rear side of each sliding baffle 23. The second motor 24 is installed on the rear side of each sliding baffle 23. A one-way screw 25 is fixed at the output end of the machine 24, and a limit rod 26 is fixed on the front side of each sliding baffle 23. The upper ends of the one-way screw 25 and the limit rod 26 are provided with a disc structure with a size larger than their own diameter. The outer periphery of each one-way screw 25 is threadedly connected to a lifting frame 27, and the lifting frame 27 is slidably connected to the corresponding limit rod 26. Two convex plates are provided at the corresponding ends of the two lifting frames 27. A scale 28 is opened at one end of one sliding baffle 23 corresponding to the position of the lifting frame 27; through the lifting frame 27 and the one-way screw 2 5 and the sliding connection between the lifting frame 27 and the limiting rod 26. When the second motor 24 drives the one-way screw 25 to rotate, the lifting frame 27 can be lifted and lowered. After the lifting frame 27 is adjusted to a suitable height, the height of the convex plates at the corresponding ends of the two lifting frames 27 corresponds to the thickness of the multi-layer circuit board after pressing. Then, the multi-layer circuit board to be pressed is placed in the middle of the raising platform 2, and the first motor 22 is started at the same time. Through the threaded connection between the sliding baffle 23 and the bidirectional screw 21 and the sliding connection between the sliding baffle 23 and the raising platform 2, when the first motor 24 is driven by the one-way screw 25 to rotate, the lifting frame 27 can be lifted and lowered. After the machine 22 drives the bidirectional screw 21 to rotate, the two sliding baffles 23 can move in relative directions. After the two sliding baffles 23 are moved to appropriate positions, the pressing mechanism is started to press the multi-layer circuit board. At this time, due to the setting of the corresponding end convex plates of the two lifting frames 27, the maximum pressing length of the pressing structure will be limited by the convex plates of the lifting frames 27. In this way, the damage to the circuit board caused by excessive pressing of the pressing structure can be reduced. In addition, through the setting of the scale 28, it is more convenient to adjust the height of the lifting frame 27.

[0029] The pressing mechanism includes an L-shaped frame 3, which is fixed at the upper end of the rear side of the stand 1. An electric push rod 31 is installed in the middle of the L-shaped frame 3. A pressing plate 32 is fixed to the telescopic end of the electric push rod 31. The electric push rod 31 and the pressing plate 32 are located at the center of the stand 1. Two supporting rods 33 are fixed to the front end of the L-shaped frame 3. The pressing plate 32 is driven to descend by the electric push rod 31, so that the pressing plate 32 can press the multi-layer circuit board to be pressed.

[0030] Working principle: When the device is in operation, the device is first adjusted according to the thickness of the multi-layer circuit board after pressing. Through the threaded connection between the lifting frame 27 and the one-way screw 25 and the sliding connection between the lifting frame 27 and the limit rod 26, when the second motor 24 drives the one-way screw 25 to rotate, the lifting frame 27 can be lifted and lowered. After the lifting frame 27 is adjusted to a suitable height, the height of the convex plates at the corresponding ends of the two lifting frames 27 corresponds to the thickness of the multi-layer circuit board after pressing. Then, the multi-layer circuit board to be pressed is placed in the middle of the raising platform 2, and the first motor 22 is started at the same time. Through the threaded connection between the sliding baffle 23 and the bidirectional screw 21 and The sliding baffle 23 is slidably connected to the raising platform 2. When the first motor 22 drives the bidirectional screw 21 to rotate, the two sliding baffles 23 can move in relative directions. After the two sliding baffles 23 are moved to appropriate positions, the electric push rod 31 is started to enable the pressing plate 32 to press the multi-layer circuit board. At this time, due to the setting of the corresponding end convex plates of the two lifting frames 27, the maximum pressing length of the pressing plate 32 will be limited by the convex plates of the lifting frames 27. In this way, the damage to the circuit board caused by excessive downward pressure of the downward pressure structure can be reduced. In addition, through the setting of the scale 28, it is more convenient to adjust the height of the lifting frame 27.

[0031] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A multi-layer circuit board pressing device, comprising a stand (1), wherein a pressing mechanism is installed at the upper end of the stand (1), characterized in that: Also includes a placement mechanism; The placement mechanism comprises a raising platform (2), wherein the raising platform (2) is fixed in the middle of the upper end of the platform (1), and a bidirectional screw (21) is rotatably connected inside the raising platform (2), and a first motor (22) is installed at the input end of the bidirectional screw (21), and two sliding baffles (23) are threadedly connected to the outer periphery of the bidirectional screw (21), and the sliding baffles (23) are slidably connected to the raising platform (2), and a second motor (24) is installed on the rear side of each sliding baffle (23), and the second motor (24) is installed on the rear side of each sliding baffle (23). A one-way screw (25) is fixed at the output end of the second motor (24), a limiting rod (26) is fixed on the front side of each sliding baffle (23), a lifting frame (27) is threadedly connected to the periphery of each one-way screw (25), and the lifting frame (27) is slidably connected to the corresponding limiting rod (26), two convex plates are arranged at the corresponding ends of the two lifting frames (27), and a scale (28) is opened at one end of one of the sliding baffles (23) corresponding to the position of the lifting frame (27).

2. A multi-layer circuit board pressing device according to claim 1, characterized in that: The middle structure of the bidirectional screw (21) is a cylindrical structure whose size is larger than its own diameter.

3. A multi-layer circuit board pressing device according to claim 1, characterized in that: The upper ends of the one-way screw rod (25) and the limiting rod (26) are both provided with a disc structure whose size is larger than their own diameter.

4. A multi-layer circuit board pressing device according to claim 1, characterized in that: Two boss structures are fixed at the middle position of the upper end of the raising platform (2).

5. A multi-layer circuit board pressing device according to claim 1, characterized in that: The pressing mechanism comprises an L-shaped frame (3), wherein the L-shaped frame (3) is fixed to the upper end of the platform (1) on the rear side, an electric push rod (31) is installed in the middle of the L-shaped frame (3), a pressing plate (32) is fixed to the telescopic end of the electric push rod (31), and two support rods (33) are fixed to the front end of the L-shaped frame (3).

6. A multi-layer circuit board pressing device according to claim 5, characterized in that: The electric push rod (31) and the pressing plate (32) are located at the center of the stand (1).

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