Heat dissipation mechanism for SMT production workshop line

Abstract

The utility model relates to the technical field of SMT patch production, and discloses a heat dissipation mechanism used on an SMT patch production workshop line, which comprises a conveyor, a conveying plate is arranged at the top of the conveyor, a PCB body is placed at the top of the conveying plate, an isolation frame is arranged on the outer side of the conveyor, an air cooler is fixedly mounted at the top of the isolation frame, and the air cooler is connected with the conveying plate. And the right side of the air cooler is fixedly provided with the bottom extending into the isolation frame, the interior of the isolation frame is fixedly provided with a connecting plate, and the bottom of the connecting plate is fixedly provided with a plurality of air guide boxes which are evenly distributed. According to the heat dissipation mechanism for the SMT production workshop line, cold air is conveyed to the position above the connecting plate through the air cooler and the air conveying pipe, air is conveyed through the multiple air guide grooves, the air can be increased through the multiple small air guide grooves, and therefore heat dissipation can be better conducted on the PCB body.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patch production, in particular to a heat dissipation mechanism used on an SMT patch production workshop line. Background Art

[0002] SMT patch refers to the abbreviation of a series of process flows based on PCB. PCB is a printed circuit board, which is a circuit assembly technology that mounts pinless or short-lead surface-mount components on the surface of a printed circuit board or other substrate, and assembles them by soldering through reflow soldering or dip soldering.

[0003] During the production process of SMT patches, reflow soldering is required to solder the components to the circuit board. The temperature generated during the production process is relatively high, resulting in an overly high temperature on the PCB. The cooling device during the reflow soldering process can only dissipate heat on the top of the PCB, and the cooling air is transmitted to the top of the PCB through a combination of cold air and a cooling fan. The air duct generated by the cooling fan has certain dead angles, resulting in poor heat dissipation effect on the PCB boards on both sides. Therefore, a heat dissipation mechanism for the SMT patch production workshop line is proposed to solve the above problems. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the utility model provides a heat dissipation mechanism for an SMT patch production workshop line, which has the advantage of arranging multiple air ducts to reasonably utilize cooling air to dissipate heat from a PCB board, and solves the problem that the cooling device in the reflow soldering process can only dissipate heat from the top of the PCB board. The heat dissipation mechanism combines cold air with a heat dissipation fan, and transmits cold air to the top of the PCB board through the heat dissipation fan. The air duct generated by the heat dissipation fan has certain dead angles, resulting in a poor heat dissipation effect on the PCB boards on both sides.

[0006] (II) Technical solution

[0007] The utility model solves the above-mentioned technical problem through a technical solution as follows: a heat dissipation mechanism for an SMT patch production workshop line, comprising a conveyor, a conveyor plate is arranged on the top of the conveyor, a PCB board body is placed on the top of the conveyor plate, an isolation frame is arranged on the outside of the conveyor, a cold air fan is fixedly installed on the top of the isolation frame, a bottom extending to the interior of the isolation frame is fixedly installed on the right side of the cold air fan, a connecting plate is fixedly installed on the interior of the isolation frame, a number of evenly distributed air guide boxes are fixedly installed on the bottom of the connecting plate, and an air guide groove penetrating the air guide box is opened on the top of the connecting plate.

[0008] As a preferred technical solution, a coolant tank is fixedly installed on the rear side of the conveyor, a delivery pump is fixedly installed on the top of the coolant tank, a connecting box is fixedly installed on the top of the coolant tank, the delivery pump is connected to the coolant tank and the connecting box through a pipeline, and guide pipes that are connected to each other are fixedly installed on the front and rear sides of the inner wall of the isolation frame, the delivery pump is connected to the guide pipe through a pipeline, and the guide pipe is connected to the coolant tank through a pipeline.

[0009] As a preferred technical solution, two cylinders are fixedly installed at the bottom of the inner wall of the conveyor and are symmetrically distributed front to back. The tops of the telescopic ends of the two cylinders are connected to the bottom of the cold water tank, and the cold water tank is connected to the coolant tank and the delivery pump through a pipeline.

[0010] As a preferred technical solution, slide grooves are provided on the front and rear sides of the inner wall of the conveyor, moving rods are fixedly installed on the front and rear sides of the cold water tank, and sliders slidably connected to the inside of the slide grooves are fixedly installed on the opposite sides of the two moving rods.

[0011] As a preferred technical solution, a dust shield is slidably connected to the top of the air cooler.

[0012] As a preferred technical solution, two auxiliary blocks are fixedly installed on the bottom of the dust shield and are symmetrically distributed front to back, and two electric push rods are fixedly installed on the top of the isolation frame and are symmetrically distributed front to back, and the left sides of the telescopic ends of the two electric push rods are respectively fixedly connected to the right sides of the two auxiliary blocks.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] 1. The utility model uses a cooling fan to transport cold air through an air duct to the top of the connecting plate, and transports the air through a plurality of air guide slots. In addition, a plurality of small air guide slots can increase the air volume, thereby better dissipating the heat of the PCB board body.

[0016] 2. The utility model is connected with the coolant tank through the guide pipe and the cold water tank, so that the internal temperature of the isolation frame is reduced, and the bottom of the PCB board is also cooled by the transfer of cold air. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a three-dimensional structural schematic diagram of the utility model from another viewing angle;

[0020] Figure 3 This is a schematic diagram of the internal structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the installation structure of the guide pipe of the utility model;

[0022] Figure 5 This is a schematic diagram of the connection between the cold water tank and the conveyor of the utility model.

[0023] In the figure: 1. conveyor; 2. conveying plate; 3. PCB board body; 4. isolation frame; 5. air cooler; 6. connecting plate; 7. air guide box; 8. air guide slot; 9. coolant tank; 10. conveying pump; 11. connecting box; 12. guide pipe; 13. cylinder; 14. cold water tank; 15. slide; 16. moving rod; 17. slider; 18. dust shield; 19. auxiliary block; 20. electric push rod; 21. air duct. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the embodiment, Figure 1-5 A heat dissipation mechanism for an SMT patch production workshop line is provided. The utility model discloses a heat dissipation mechanism for an SMT patch production workshop line, comprising a conveyor 1, a conveyor plate 2 is arranged on the top of the conveyor 1, a PCB board body 3 is placed on the top of the conveyor plate 2, an isolation frame 4 is arranged on the outside of the conveyor 1, a cold air fan 5 is fixedly installed on the top of the isolation frame 4, a bottom extending to the inside of the isolation frame 4 is fixedly installed on the right side of the cold air fan 5, a connecting plate 6 is fixedly installed inside the isolation frame 4, a number of evenly distributed air guide boxes 7 are fixedly installed on the bottom of the connecting plate 6, and an air guide groove 8 penetrating the air guide box 7 is opened on the top of the connecting plate 6.

[0026] A first air duct is formed between the connecting plate 6 and the conveying pipe 21 , and the number of the air guide grooves 8 is several. The second air duct is formed by the plurality of air guide grooves 8 to increase the air volume, which can accelerate the cooling of the PCB board body 3 .

[0027] As a preferred embodiment of the present invention, a coolant tank 9 is fixedly installed on the rear side of the conveyor 1, a delivery pump 10 is fixedly installed on the top of the coolant tank 9, a connecting box 11 is fixedly installed on the top of the coolant tank 9, the delivery pump 10 is connected to the coolant tank 9 and the connecting box 11 through a pipeline, and guide pipes 12 that are connected to each other are fixedly installed on the front and rear sides of the inner wall of the isolation frame 4, the delivery pump 10 is connected to the guide pipe 12 through a pipeline, and the guide pipe 12 is connected to the coolant tank 9 through a pipeline.

[0028] The temperature inside the isolation frame 4 is lowered by the air guide tube 12 , thereby further improving the heat dissipation of the PCB board body 3 that enters under the isolation frame 4 .

[0029] As a preferred embodiment of the present invention, two cylinders 13 are fixedly installed at the bottom of the inner wall of the conveyor 1 and are symmetrically distributed front to back. The tops of the telescopic ends of the two cylinders 13 are connected to the bottom of the cold water tank 14, and the cold water tank 14 is connected to the coolant tank 9 and the delivery pump 10 through a pipeline.

[0030] The surface of the cold water tank 14 is filled with cold air, and heat is exchanged when the PCB body 3 moves along with the conveying plate 2, thereby further improving the heat dissipation efficiency.

[0031] As a preferred embodiment of the present invention, slide grooves 15 are provided on both the front and rear sides of the inner wall of the conveyor 1, moving rods 16 are fixedly installed on both the front and rear sides of the cold water tank 14, and sliders 17 slidably connected to the inside of the slide grooves 15 are fixedly installed on the opposite sides of the two moving rods 16.

[0032] It is convenient to move the cold water tank 14 up and down during the subsequent maintenance process, and to move the PCB board body 3 to make it close to the conveying plate 2 to accelerate the heat dissipation efficiency.

[0033] As a preference of this embodiment, a dust shield 18 is slidably connected to the top of the air cooler 5 .

[0034] As a preferred embodiment of the present invention, two auxiliary blocks 19 are fixedly installed on the bottom of the dust shield 18 and are symmetrically distributed front to back, and two electric push rods 20 are fixedly installed on the top of the isolation frame 4 and are symmetrically distributed front to back, and the left sides of the telescopic ends of the two electric push rods 20 are fixedly connected to the right sides of the two auxiliary blocks 19 respectively.

[0035] After shutdown, the electric push rod 20 is started so that the left side of its telescopic end acts on the right side of the auxiliary block 19, driving the auxiliary block 19 to move, thereby driving the dust shield 18 to close the top of the air cooler 5 to reduce the entry of dust.

[0036] Working principle: multiple PCB board bodies 3 are placed on the top of the conveying plate 2 and conveyed by the conveyor 1. The cooling air fan 5 conveys the cooling air to the top of the connecting plate 6, and the air volume is output through multiple air guide grooves 8 to dissipate the heat of the PCB board body 3. The internal temperature of the isolation frame 4 is reduced by the two guide pipes 12 and the circulating coolant, which is convenient for dissipating the heat of the PCB board body 3. At the same time, part of the heat is exchanged through the cold water tank 14 below to improve the heat dissipation efficiency.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation mechanism for use in an SMT patch production workshop line, comprising a conveyor (1), characterized in that: A conveying plate (2) is arranged on the top of the conveying plate (2), a PCB board body (3) is placed on the top of the conveying plate (2), an isolation frame (4) is arranged on the outside of the conveyor (1), a cooling fan (5) is fixedly installed on the top of the isolation frame (4), an air supply pipe (21) is fixedly installed on the right side of the cooling fan (5), the bottom of which extends to the inside of the isolation frame (4), a connecting plate (6) is fixedly installed inside the isolation frame (4), a plurality of evenly distributed air guide boxes (7) are fixedly installed on the bottom of the connecting plate (6), and an air guide groove (8) penetrating the air guide box (7) is opened on the top of the connecting plate (6).

2. The heat dissipation mechanism for SMT patch production line according to claim 1 is characterized in that: A coolant tank (9) is fixedly mounted on the rear side of the conveyor (1), a delivery pump (10) is fixedly mounted on the top of the coolant tank (9), a connection box (11) is fixedly mounted on the top of the coolant tank (9), the delivery pump (10) is connected to the coolant tank (9) and the connection box (11) through a pipeline, and guide pipes (12) that are connected to each other are fixedly mounted on the front and rear sides of the inner wall of the isolation frame (4), the delivery pump (10) is connected to the guide pipe (12) through a pipeline, and the guide pipe (12) is connected to the coolant tank (9) through a pipeline.

3. The heat dissipation mechanism for SMT patch production line according to claim 2 is characterized in that: Two cylinders (13) are fixedly mounted on the bottom of the inner wall of the conveyor (1) and are symmetrically distributed front to back. The tops of the telescopic ends of the two cylinders (13) are connected to the bottom of a cold water tank (14). The cold water tank (14) is connected to a coolant tank (9) and a conveying pump (10) through a pipeline.

4. The heat dissipation mechanism for SMT patch production line according to claim 3 is characterized in that: The inner wall of the conveyor (1) is provided with a slide groove (15) on both the front and rear sides, the cold water tank (14) is fixedly installed with a moving rod (16) on both the front and rear sides, and the two moving rods (16) are fixedly installed with a slider (17) slidably connected to the inside of the slide groove (15) on the opposite sides.

5. The heat dissipation mechanism for SMT patch production line according to claim 1, characterized in that: A dust shield (18) is slidably connected to the top of the cooling fan (5).

6. The heat dissipation mechanism for SMT patch production line according to claim 5, characterized in that: Two auxiliary blocks (19) are fixedly mounted on the bottom of the dust shield (18) and are symmetrically distributed in the front and back. Two electric push rods (20) are fixedly mounted on the top of the isolation frame (4) and are symmetrically distributed in the front and back. The left sides of the telescopic ends of the two electric push rods (20) are respectively fixedly connected to the right sides of the two auxiliary blocks (19).

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