Fixture suitable for grinding and polishing end face of optical fiber lithium niobate wafer

Abstract

The fixture comprises a chip fixture body and a pressing block body, a chip clamping groove used for containing a wafer set is formed in the top of the chip fixture body, and a crimping part used for being matched with the chip clamping groove is correspondingly arranged at the bottom of the pressing block body. The pressing block body is in sliding connection with the chip clamp body through the limiting guide columns in the vertical direction, and the pressing block body is connected with the chip clamp body through the locking screws. The polishing and grinding efficiency of the lithium niobate wafer can be improved, and meanwhile the problem that the end face of the lithium niobate wafer is damaged or even the whole lithium niobate wafer is broken due to the fact that stress is uneven when a locking screw is tightened in the process of mounting and dismounting the lithium niobate wafer is solved.

Description

Technical Field

[0001] The present application relates to the technical field of lithium niobate end face processing, and in particular to a fixture suitable for grinding and polishing the end face of an optical fiber lithium niobate wafer. Background Art

[0002] Lithium niobate modulators have a dominant position in electro-optical modulators due to their excellent optical and electro-optical properties. The production process of lithium niobate modulators generally requires evaporation, glue coating, photolithography, electroplating, etc. of the waveguide chip (lithium niobate wafer). During the above process, the end face of the lithium niobate wafer will inevitably be worn to varying degrees and often requires grinding and polishing.

[0003] In the prior art, the end faces of lithium niobate wafers are usually ground and polished with the aid of a grinding and polishing fixture. The traditional grinding and polishing fixture mainly includes a slot and a cover plate of a specific size. During the end face grinding and polishing of lithium niobate wafers, multiple wafers are first placed in the slot in sequence, and multiple wafers are stacked in the slot to form a wafer group. Then, the upper surface of the wafer group is covered with a cover plate to fix the wafer group and prevent the wafer group from loosening due to external forces during the grinding process. However, the traditional grinding and polishing fixture has the following shortcomings: First, due to the small number of wafers processed by the traditional grinding and polishing fixture, it is impossible to grind and polish the end faces of multiple wafers in a short time, thereby greatly reducing the grinding and polishing efficiency of lithium niobate wafers; second, during the process of loading and unloading the wafer group, there will be uneven force between the wafer surface and the fixture pressure block during the tightening process, which may cause the wafer to be damaged or even the entire wafer to break. To this end, the utility model proposes a fixture suitable for grinding and polishing the end faces of optical fiber lithium niobate wafers. Utility Model Content

[0004] The embodiment of the present application provides a fixture suitable for grinding and polishing the end face of an optical fiber lithium niobate wafer, which can improve the polishing efficiency of the lithium niobate wafer and avoid the problem of damage to the end face of the lithium niobate wafer or even breakage of the entire wafer due to uneven force when tightening the locking screws during installation and disassembly.

[0005] In view of this, the present application provides a fixture suitable for end surface grinding and polishing of optical fiber lithium niobate wafers, comprising: a chip fixture body and a pressing block body;

[0006] The top of the chip card body is provided with a chip card slot for placing a chip set;

[0007] A pressing portion for cooperating with the chip card slot is correspondingly provided at the bottom of the pressing block body;

[0008] The pressing block body is slidably connected with the chip fixture body along the vertical direction through a limiting guide column, and the pressing block body is connected with the chip fixture body through a locking screw.

[0009] Optionally, the limiting guide column is fixedly arranged on the top of the chip fixture body;

[0010] The pressing block body is provided with a corresponding limiting guide hole for cooperating with the limiting guide column.

[0011] Optionally, the number of the limiting guide columns is two or more;

[0012] Two or more of the limiting guide posts are symmetrically arranged on the left and right sides of the chip card slot;

[0013] The number of the limiting guide holes is equal to the number of the limiting guide columns and corresponds one to one.

[0014] Optionally, a first locking screw hole is provided on the top of the chip holder body;

[0015] The pressing block body is provided with a second locking screw hole corresponding to the first locking screw hole.

[0016] Optionally, the number of the first locking screw holes is two or more;

[0017] Two or more of the first locking screw holes are symmetrically distributed on the left and right sides of the chip card slot;

[0018] The number of the second locking screw holes is equal to the number of the first locking screw holes and corresponds one to one.

[0019] Optionally, a fixing screw hole for fixing the chip holder body on a grinding fixture is provided on the front side of the chip holder body.

[0020] Optionally, the number of the fixing screw holes is two or more.

[0021] Optionally, the shape of the crimping portion is matched with the shape of the chip card slot.

[0022] Optionally, the wafer group includes an upper companion wafer, a lower companion wafer, and a plurality of optical fiber lithium niobate wafers arranged between the upper companion wafer and the lower companion wafer;

[0023] The upper companion piece and the optical fiber lithium niobate wafer, two adjacent optical fiber lithium niobate wafers, and the optical fiber lithium niobate wafer and the lower companion piece are all bonded together by an adhesive.

[0024] Optionally, the adhesive is paraffin or UV curing glue;

[0025] The upper companion plate and the lower companion plate are both made of quartz.

[0026] It can be seen from the above technical scheme that the embodiment of the present application has the following advantages: the fixture suitable for end-face grinding and polishing of optical fiber lithium niobate wafers includes a chip fixture body and a pressure block body, the top of the chip fixture body is provided with a chip slot for placing a wafer group, and the bottom of the pressure block body is correspondingly provided with a crimping portion for cooperating with the chip slot, the pressure block body is slidably connected to the chip fixture body along the vertical direction through a limiting guide column, and the distance between the chip slot and the crimping portion can be adjusted by the limiting guide column, so that multiple stacked lithium niobate wafers can be placed to improve the grinding efficiency of the lithium niobate wafers, and by utilizing the guiding effect of the limiting guide column, the problem of damage to the end face of the lithium niobate wafer or even breakage of the entire wafer due to uneven force when tightening the locking screws during installation and disassembly can be effectively avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a front view of the chip card body in the embodiment of the present application;

[0028] Figure 2 A top view of the chip holder body in the embodiment of the present application;

[0029] Figure 3 This is a front view of the pressing block body in the embodiment of the present application;

[0030] Figure 4 A top view of the pressing block body in the embodiment of the present application;

[0031] Wherein, the accompanying drawings are marked as follows:

[0032] 1-chip fixture body, 11-chip slot, 12-limiting guide column, 13-first locking screw hole, 14-fixing screw hole, 2-pressing block body, 21-crimping part, 22-limiting guide hole, 23-second locking screw hole. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] This application provides an embodiment of a fixture suitable for grinding and polishing the end surface of an optical fiber lithium niobate wafer. For details, please refer to Figures 1 to 4 .

[0037] The fixture suitable for end-face grinding and polishing of optical fiber lithium niobate wafers in this embodiment includes: a chip fixture body 1 and a pressure block body 2. The chip fixture body 1 is provided with a chip card slot 11 for placing a chip group at the top, and the pressure block body 2 is provided with a crimping portion 21 for matching with the chip card slot 11 at the bottom. The pressure block body 2 is slidably connected to the chip fixture body 1 in the vertical direction through a limiting guide column 12, and the pressure block body 2 is connected to the chip fixture body 1 through a locking screw.

[0038] It should be noted that: the fixture suitable for end-face grinding and polishing of optical fiber lithium niobate wafers includes a chip fixture body 1 and a pressure block body 2. The top of the chip fixture body 1 is provided with a chip slot 11 for placing a wafer group, and the bottom of the pressure block body 2 is correspondingly provided with a crimping portion 21 for cooperating with the chip slot 11. The pressure block body 2 is slidably connected to the chip fixture body 1 along the vertical direction through a limiting guide column 12. The distance between the chip slot 11 and the crimping portion 21 can be adjusted by the limiting guide column 12, so that multiple stacked lithium niobate wafers can be placed to improve the grinding efficiency of the lithium niobate wafers, and by utilizing the guiding effect of the limiting guide column 12, the problem of lithium niobate wafer end face damage or even entire chip breakage due to uneven force when tightening the locking screws during installation and disassembly can be effectively avoided.

[0039] The above is an embodiment of the present invention, which is a fixture for optical fiber lithium niobate wafer end surface grinding and polishing. The following is an embodiment of the present invention, which is a fixture for optical fiber lithium niobate wafer end surface grinding and polishing. For details, please refer to Figures 1 to 4 .

[0040] The fixture suitable for end-face grinding and polishing of optical fiber lithium niobate wafers in this embodiment includes: a chip fixture body 1 and a pressure block body 2. The chip fixture body 1 is provided with a chip card slot 11 for placing a chip group at the top, and the pressure block body 2 is provided with a crimping portion 21 for matching with the chip card slot 11 at the bottom. The pressure block body 2 is slidably connected to the chip fixture body 1 in the vertical direction through a limiting guide column 12, and the pressure block body 2 is connected to the chip fixture body 1 through a locking screw.

[0041] The limiting guide column 12 is fixedly arranged on the top of the chip clamp body 1 , and the pressing block body 2 is correspondingly provided with a limiting guide hole 22 for matching with the limiting guide column 12 .

[0042] The number of the limiting guide posts 12 can be two or more, and the two or more limiting guide posts 12 are symmetrically arranged on the left and right sides of the chip card slot 11; the number of the limiting guide holes 22 is equal to the number of the limiting guide posts 12, and they correspond one to one.

[0043] It should be noted that: when in use, the distance between the chip slot 11 and the crimping portion 21 can be adjusted by the limiting guide column 12, and the range is 2 to 13 mm, and a maximum of 10 stacked lithium niobate wafers can be placed.

[0044] A first locking screw hole 13 is formed on the top of the chip holder body 1 , and a second locking screw hole 23 for matching with the first locking screw hole 13 is formed on the pressing block body 2 .

[0045] The number of the first locking screw holes 13 can be two or more, and the two or more first locking screw holes 13 are symmetrically distributed on the left and right sides of the chip card slot 11, and the number of the second locking screw holes 23 is equal to the number of the first locking screw holes 13 and corresponds one to one.

[0046] The front side of the chip fixture body 1 is provided with fixing screw holes 14 for fixing the chip fixture body 1 on the grinding fixture. Specifically, the number of the fixing screw holes 14 can be two or more.

[0047] The shape of the crimping portion 21 is matched with the shape of the chip card slot 11 .

[0048] The chip group includes an upper companion chip, a lower companion chip, and a plurality of optical fiber lithium niobate chips arranged between the upper companion chip and the lower companion chip. Specifically, the plurality of optical fiber lithium niobate chips are stacked on each other, and the upper companion chip and the lower companion chip are respectively arranged on the top and bottom of the stacked plurality of optical fiber lithium niobate chips; the upper companion chip and the optical fiber lithium niobate chip, two adjacent optical fiber lithium niobate chips, and the optical fiber lithium niobate chip and the lower companion chip are all bonded together by an adhesive.

[0049] The material of the pressing block body 2 can be metal; the adhesive can be paraffin or UV curing glue; the material of the upper and lower accompanying sheets can both be quartz; the thickness of the optical fiber lithium niobate wafer is 1mm, and the size and thickness of the upper and lower accompanying sheets are exactly the same as those of the optical fiber lithium niobate wafer.

[0050] During the specific implementation, the multiple optical fiber lithium niobate wafers that need to be ground are first bonded into a whole, and then the upper and lower companion wafers are bonded to the upper and lower surfaces of the bonded multiple optical fiber lithium niobate wafers respectively to form a wafer group. After that, the wafer group is placed in the chip card slot 11, and the limiting guide hole 22 on the pressing block body 2 is aligned with the limiting guide column 12 on the chip fixture body 1 for installation. The height of the crimping part 21 is adjusted according to the total thickness of the wafer group so that the bottom surface of the crimping part 21 is pressed onto the upper surface of the wafer group. Then, the pressing block body 2 and the chip fixture body 1 are locked together with the locking screws. Finally, the end face of the installed wafer group is facing upward, and the fixture is fixed on the grinding fixture through the fixing screw hole 14 to carry out the end face grinding and polishing process of the optical fiber lithium niobate wafer.

[0051] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A fixture suitable for grinding and polishing the end face of optical fiber lithium niobate wafer, characterized in that: include: A chip holder body and a pressing block body; The top of the chip card body is provided with a chip card slot for placing a chip set; A pressing portion for cooperating with the chip card slot is correspondingly provided at the bottom of the pressing block body; The pressing block body is slidably connected with the chip fixture body along the vertical direction through a limiting guide column, and the pressing block body is connected with the chip fixture body through a locking screw.

2. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 1 is characterized in that: The limiting guide column is fixedly arranged on the top of the chip fixture body; The pressing block body is provided with a corresponding limiting guide hole for cooperating with the limiting guide column.

3. The fixture for grinding and polishing the end surface of optical fiber lithium niobate wafer according to claim 2 is characterized in that: The number of the limiting guide columns is two or more; Two or more of the limiting guide posts are symmetrically arranged on the left and right sides of the chip card slot; The number of the limiting guide holes is equal to the number of the limiting guide columns and corresponds one to one.

4. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 1, characterized in that: A first locking screw hole is provided on the top of the chip holder body; The pressing block body is provided with a second locking screw hole corresponding to the first locking screw hole.

5. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 4, characterized in that: The number of the first locking screw holes is two or more; Two or more of the first locking screw holes are symmetrically distributed on the left and right sides of the chip card slot; The number of the second locking screw holes is equal to the number of the first locking screw holes and corresponds one to one.

6. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 1, characterized in that: A fixing screw hole for fixing the chip fixture body on a grinding fixture is provided on the front side of the chip fixture body.

7. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 6, characterized in that: The number of the fixing screw holes is two or more.

8. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 1, characterized in that: The shape of the crimping portion is matched with the shape of the chip card slot.

9. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 1, characterized in that: The wafer group includes an upper companion wafer, a lower companion wafer, and a plurality of optical fiber lithium niobate wafers arranged between the upper companion wafer and the lower companion wafer; The upper companion piece and the optical fiber lithium niobate wafer, two adjacent optical fiber lithium niobate wafers, and the optical fiber lithium niobate wafer and the lower companion piece are all bonded together by an adhesive.

10. The fixture for end surface grinding and polishing of optical fiber lithium niobate wafer according to claim 9, characterized in that: The adhesive is paraffin or UV curing glue; The upper companion plate and the lower companion plate are both made of quartz.

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