Plastic uptake tray and packaging box thereof
By setting up a boss on the back of the blister pallet to limit the vertical movement of the memory, the problem of the LP-CAMM jumping out of the pallet slot due to vibration during transportation is solved, and transportation safety and pallet stability are improved.
Patent Information
- Application Number
- CN202421252342.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-06-03
AI Technical Summary
The LP-CAMM memory is easily jumped out of the limit slot of the blister pallet due to violent vibration during transportation, and collide with other memory, resulting in damage.
A blister tray is designed, with a boss on the back of the tray body, which extends into the placement slot when the tray is stacked to limit the vertical movement of the memory and prevent it from jumping out.
It effectively prevents memory parts from jumping out of the pallet slot due to vibration during transportation, reduces the risk of memory damage, and improves the stacking stability of the pallet.
Smart Images
Figure CN222808467U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of product packaging, in particular to a blister tray and a packaging box thereof. Background Art
[0002] LP-CAMM (Low Power-Compression Attached Memory Module) memory is a widely used high-density memory module. When storing or transporting LP-CAMM memory, it needs to be carried on a blister tray, and multiple blister trays are usually stacked together to facilitate batch handling and reduce the number of handling times. Blister trays are inevitably shaken during transportation. The blister tray is provided with a limit groove on its surface. The limit groove can only limit the rotation of the LP-CAMM memory, and cannot limit the jumping of the LP-CAMM memory along the thickness direction of the blister tray. When the blister tray is bumped during transportation, the LP-CAMM memory will jump out of the limit groove and collide with other LP-CAMM memories in the blister tray, causing damage to the LP-CAMM memory. Utility Model Content
[0003] The utility model provides a blister tray, which is used to solve the technical problem that an LP-CAMM memory jumps out of a limiting groove and collides with other LP-CAMM memories in the blister tray, thus causing damage to the LP-CAMM memory.
[0004] The utility model is realized by the following technical solutions:
[0005] The utility model provides a blister tray, comprising: a tray body, wherein the front of the tray body is provided with a plurality of placement grooves for placing memory components, and the back of the tray body is provided with bosses corresponding to the placement grooves. When the blister trays are stacked, the bosses extend into the placement grooves to prevent the memory components from jumping out of the placement grooves.
[0006] Furthermore, a buckle is provided on the front of the tray body, and a slot is provided on the back of the tray body. When the blister trays are stacked, the buckle is inserted into the slot so that the top surface of the lower blister tray fits with the bottom surface of the upper blister tray.
[0007] Furthermore, a partition is formed between two adjacent placement slots, and a material taking slot is provided on the partition, and the material taking slot is communicated with the placement slot.
[0008] Furthermore, a supporting portion is provided on the trough wall of the material taking trough.
[0009] Furthermore, an apron portion is provided on the circumference of the tray body, and a skirt extending outward is provided on the bottom of the apron portion.
[0010] Furthermore, the apron portion is provided with a plurality of bearing platforms protruding outward, and when the blister trays are stacked, the bearing platforms abut against the skirt edges.
[0011] Furthermore, the skirt is provided with a plurality of inwardly concave positioning grooves.
[0012] Furthermore, a positioning portion is provided at a corner of the apron portion, and the positioning portion is used for stacking and positioning the blister trays.
[0013] Furthermore, the tray body is made of PS material.
[0014] The utility model also provides a packaging box, comprising: a box body, a cover body and a plurality of blister trays as described above, wherein the plurality of blister trays are stacked and placed on the box body, and the cover body is arranged to cover the top surface of the topmost blister tray.
[0015] Beneficial effects of the utility model:
[0016] Compared with the prior art, the blister tray proposed by the utility model has a placement groove on the front side of the tray body, and a boss corresponding to the placement groove on the back side of the tray body. When the blister trays are stacked, the boss extends into the placement groove, thereby preventing the blister tray from encountering severe vibration during transportation and causing the memory device to jump out of the placement groove.
[0017] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the overall structure of a blister tray (front side facing upward) in the implementation of the utility model;
[0019] Figure 2 This is a schematic diagram of the overall structure of a blister tray (back side facing upward) in the implementation of the utility model;
[0020] Figure 3 for Figure 1 The enlarged structural diagram at A in the middle;
[0021] Figure 4 This is a schematic diagram of the stacking structure of a blister tray in the implementation of the utility model;
[0022] Figure 5 It is a schematic cross-sectional structure diagram of a stacked state of a blister tray in the implementation of the utility model;
[0023] Figure 6The figure is a schematic diagram of the explosion structure of a packaging box in the implementation of the utility model.
[0024] Description of reference numerals:
[0025] 10. Blister tray; 11. Tray body; 111. Placement slot; 112. Buckle; 113. Boss; 114. Slot; 115. Partition; 1151. Material chute; 116. Support part; 117. Apron; 1171. Positioning part; 118. Skirt; 1181. Positioning slot; 119. Loading platform; 20. Box body; 30. Cover body; 40. Buffer. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and specific implementation methods.
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0030] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.
[0033] See also Figures 1 to 5 The embodiment of the utility model provides a blister tray 10, comprising: a tray body 11, a front side of the tray body 11 is provided with a plurality of placement slots 111 for placing memory components, a back side of the tray body 11 is provided with bosses 113 corresponding to the placement slots 111, when the blister trays 10 are stacked, the bosses 113 extend into the placement slots 111 to prevent the memory components from jumping out of the placement slots 111.
[0034] Specifically, the memory component is an LP-CAMM memory, and the shape of the placement slot 111 matches the shape of the LP-CAMM memory, so that the LP-CAMM memory can be placed in the placement slot 111. When the blister trays 10 filled with memory components are stacked, the boss 113 of the upper blister tray 10 extends into the placement slot 111 of the lower tray, limiting the vertical movement range of the memory component, avoiding the phenomenon that the blister tray 10 encounters severe vibration during transportation and causing the memory component to jump out of the placement slot 111, thereby improving the safety of the memory component during transportation. When the blister trays 10 are stacked on each other, the boss 113 extends into the placement slot 111, making it difficult for the stacked blister trays 10 to collapse, thereby improving the stacking stability of the blister trays 10.
[0035] Compared with the prior art, the blister tray 10 proposed by the utility model has a placement groove 111 on the front side of the tray body 11, and a boss 113 corresponding to the placement groove 111 is provided on the back side of the tray body 11. When the blister trays 10 are stacked, the boss 113 extends into the placement groove 111, thereby preventing the blister tray 10 from encountering severe vibration during transportation and causing the memory device to jump out of the placement groove 111.
[0036] See also Figure 1 , Figure 2 and Figure 5 A buckle 112 is provided on the front of the tray body 11, and a slot 114 is provided on the back of the tray body 11. When the blister trays 10 are stacked, the buckle 112 is inserted into the slot 114, so that the top surface of the lower blister tray 10 fits with the bottom surface of the upper blister tray 10.
[0037] Specifically, a buckle 112 is provided on the front of the tray body 11, and a slot 114 is provided on the back of the tray body 11. When the blister trays 10 are stacked, the upper and lower blister trays 10 are precisely connected to each other, so that the upper and lower blister trays 10 fit tightly together, thereby enhancing the stability of the stacking of the blister trays 10, reducing the risk of collapse of the blister trays 10, and preventing the internal memory components from being damaged.
[0038] See also Figure 1 and Figure 3 A partition 115 is formed between two adjacent placement slots 111 , and a material taking slot 1151 is provided on the partition 115 , and the material taking slot 1151 is communicated with the placement slot 111 .
[0039] Specifically, each placement slot 111 is provided with a raised partition 115 in the horizontal and vertical directions to fix the memory element in the placement slot 111. The partition 115 is provided with a material taking slot 1151, which is connected to the placement slot 111, so that the operator can take the memory element placed in the placement slot 111.
[0040] See also Figure 1 and Figure 3A supporting portion 116 is provided on the trough wall of the material taking trough 1151 .
[0041] Specifically, support parts 116 are provided on the groove walls on both sides of the material taking groove 1151. The second support parts 116 support the upper blister tray 10, so that the pressure of the upper blister tray 10 is dispersed to the lower blister tray 10, rather than concentrated in a specific area of the lower blister tray 10, to avoid deformation or damage of the blister tray 10 due to concentrated pressure when stacking.
[0042] See also Figure 1 and Figure 4 An apron portion 117 is provided on the circumference of the tray body 11 , and a skirt edge 118 extending outward is provided at the bottom of the apron portion 117 .
[0043] Specifically, the bottom surface of the skirt 118 is a plane, and the skirt 118 is arranged around the lower edge of the apron portion 117, thereby increasing the contact area of the bottom of the tray body 11 and improving the stability of the blister tray 10. At the same time, the skirt 118 is arranged at the bottom end of the apron portion 117 to prevent the apron portion 117 from being torn due to uneven force when the blister tray is loaded, thereby extending the service life of the blister tray.
[0044] See also Figure 1 , Figure 2 , Figure 4 and Figure 5 The apron portion 117 is provided with a plurality of outwardly protruding bearing platforms 119 . When the blister trays 10 are stacked, the bearing platforms 119 abut against the skirt edges 118 .
[0045] Specifically, the support platform 119 is disposed on the apron portion 117 to support the stacking of the upper and lower blister trays 10 .
[0046] See also Figure 1 , Figure 2 and Figure 4 The skirt 118 is provided with a plurality of inwardly concave positioning grooves 1181 .
[0047] Specifically, after the blister trays 10 are stacked, they are bundled with wrapping tape. In order to quickly position the wrapping tape and prevent the wrapping tape from jumping out of position during the bundling process, an inwardly concave positioning groove 1181 is provided on the skirt 118 corresponding to the wrapping path of the wrapping tape.
[0048] See also Figure 1 and Figure 4 A positioning portion 1171 is provided at a corner of the apron portion 117 , and the positioning portion 1171 is used for stacking and positioning the blister tray 10 .
[0049] Specifically, when stacking the blister trays 10, in order to avoid incorrect stacking direction, the positioning portion 1171 of the upper blister tray 10 is docked with the positioning portion 1171 of the lower blister tray 10 to prevent the upper and lower blister trays 10 from being placed upside down and damaging the memory components.
[0050] In the present application, the tray body 11 is made of PS material, which is plastic and easy to shape and process. In addition, the PS material has a low density, and the tray body 11 made of PS material is light and easy to carry and transport. At the same time, the tray body 11 made of PS material can prevent static electricity accumulation and protect the memory device from being damaged by static electricity during storage and transportation.
[0051] See also Figure 6 The utility model also proposes a packaging box, including: a box body 20, a cover body 30 and a plurality of blister trays 10 as above, wherein the plurality of blister trays 10 are stacked and placed on the box body 20, and the cover body 30 is covered on the top surface of the top blister tray 10.
[0052] Specifically, two buffers 40 are provided in the box body 20, one buffer 40 is provided at the bottom of the box body 20, and the other is provided between the inner wall of the box body 20 and the blister tray 10. The buffer 40 can be used to buffer vibrations during transportation, protect the memory components, and reduce the risk of damage to the memory components. The blister tray 10 is applied to the packaging box, so the beneficial effects of the packaging box are the same as the beneficial effects of the blister tray 10.
[0053] Compared with the prior art, the blister tray 10 proposed by the utility model has a placement groove 111 on the front side of the tray body 11, and a boss 113 corresponding to the placement groove 111 is provided on the back side of the tray body 11. When the blister trays 10 are stacked, the boss 113 extends into the placement groove 111, thereby preventing the blister tray 10 from encountering severe vibration during transportation and causing the memory device to jump out of the placement groove 111.
[0054] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A blister tray, characterized in that: include: The tray body has a plurality of placement slots for placing memory components on the front side, and bosses are provided on the back side of the tray body corresponding to the placement slots. When the blister trays are stacked, the bosses extend into the placement slots to prevent the memory components from jumping out of the placement slots.
2. The blister tray according to claim 1, characterized in that: The front side of the tray body is provided with a buckle, and the back side of the tray body is provided with a slot. When the blister trays are stacked, the buckle is inserted into the slot so that the top surface of the lower blister tray fits with the bottom surface of the upper blister tray.
3. The blister tray according to claim 1, characterized in that: A partition is formed between two adjacent placement slots, and a material taking slot is provided on the partition, and the material taking slot is communicated with the placement slot.
4. The blister tray according to claim 3, characterized in that: A supporting part is arranged on the trough wall of the material taking trough.
5. The blister tray according to claim 1, characterized in that: An apron portion is provided on the circumference of the tray body, and a skirt edge extending outward is provided at the bottom of the apron portion.
6. The blister tray according to claim 5, characterized in that: The apron portion is provided with a plurality of bearing platforms protruding outwards, and when the blister trays are stacked, the bearing platforms abut against the skirt edges.
7. The blister tray according to claim 5, characterized in that: The skirt is provided with a plurality of inwardly concave positioning grooves.
8. The blister tray according to claim 5, characterized in that: A positioning portion is provided at a corner of the apron portion, and the positioning portion is used for stacking and positioning the blister trays.
9. The blister tray according to claim 1, characterized in that: The tray body is made of PS material.
10. A packaging box, characterized in that: include: A box body, a cover body and a plurality of blister trays as described in any one of claims 1 to 9, wherein the plurality of blister trays are stacked and placed in the box body, and the cover body is arranged on the top surface of the topmost blister tray.