Semiconductor protection device

Abstract

The utility model discloses a semiconductor protection device, which relates to the technical field of protection devices and comprises a protection box, a sealing cover is arranged on the protection box, a placing block is fixedly mounted in the protection box, a pull rod is slidably connected in the placing block, and a lifting plate is fixedly mounted at the lower end of the pull rod. The lifting plate is slidably connected in the placement block, the pull rod is movably sleeved with an elastic spring, the upper end of the elastic spring is fixedly connected with the interior of the placement block, the lower end of the elastic spring is fixedly connected with the top of the lifting plate, the two rolling wheels are extruded, then the two moving blocks slide in the two limiting sliding grooves, and the two tension springs are stretched; and the two protective covers move relatively, so that the two protective covers cover the semiconductor, the semiconductor can be protected conveniently, the semiconductor is prevented from being collided by the outside, the protection effect on the semiconductor is improved, the probability of damage to the semiconductor is avoided to the greatest extent, and the semiconductor is prevented from moving.

Description

Technical Field

[0001] The utility model relates to the technical field of protection devices, in particular to a semiconductor protection device. Background Art

[0002] Semiconductors are materials with electrical conductivity between that of insulators and conductors. Their electrical conductivity is easily controlled and can be used as a component material for information processing. From the perspective of science and technology or economic development, semiconductors are very important. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use the changes in the electrical conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential semiconductor material in commercial applications.

[0003] When the semiconductor is moved, a protective box is required. However, when protecting the semiconductor, some existing protective boxes usually place the semiconductor in a designated groove and then close the protective cover. However, when protecting the semiconductor in the above manner, it is easy to cause incomplete semiconductor protection, which can easily cause the semiconductor to move and cause damage to the semiconductor.

[0004] In view of the above problems, a semiconductor protection device is proposed. Utility Model Content

[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a semiconductor protection device that can solve the problems of the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor protection device, comprising a protection box, a sealing cover is arranged on the protection box, a placement block is fixedly installed inside the protection box, a pull rod is slidably connected inside the placement block, a lifting plate is fixedly installed on the lower end of the pull rod, the lifting plate is slidably connected inside the placement block, an elastic spring is movably sleeved on the pull rod, the upper end of the elastic spring is fixedly connected to the inside of the placement block, the lower end of the elastic spring is fixedly connected to the top of the lifting plate, a semiconductor placement groove is opened on the surface of the lifting plate, and a handle is fixedly installed on the upper end of the pull rod.

[0007] Preferably, the lifting plate is provided with two limiting slide grooves, and the interiors of the two limiting slide grooves are both slidably connected with moving blocks.

[0008] Preferably, protective covers are fixedly mounted on the upper ends of the two moving blocks.

[0009] Preferably, limiting rods are fixedly installed inside the two limiting slide grooves, and the surfaces of the two limiting rods are slidably connected to the insides of the two moving blocks respectively.

[0010] Preferably, the two limiting rods are movably sleeved with tension springs, the opposite ends of the two tension springs are respectively fixedly connected to the two sides of the two moving blocks, and the opposite ends of the two tension springs are respectively fixedly connected to the inside of the two limiting slide grooves.

[0011] Preferably, the lifting plate is internally slidably connected to two moving rods, and the two moving rods are respectively slidably connected inside two limiting sliding grooves.

[0012] Preferably, rollers are rotatably connected inside the two moving rods.

[0013] Preferably, two shallow slides and two deep slides are provided inside the placement block, the two shallow slides and the two deep slides are interconnected, and the two rollers are slidably connected inside the two shallow slides and the two deep slides respectively.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] (1) The semiconductor protection device squeezes the two rollers, thereby causing the two moving blocks to slide inside the two limiting slide grooves, and stretches the two tension springs, thereby causing the two protection covers to move relative to each other, thereby causing the two protection covers to cover the semiconductor, thereby facilitating the protection of the semiconductor, preventing the semiconductor from being impacted by the outside, improving the protection effect of the semiconductor, minimizing the probability of semiconductor damage, and preventing the semiconductor from moving. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0017] Figure 1 This is a schematic diagram of the structure of a semiconductor protection device of the utility model;

[0018] Figure 2 It is a schematic diagram of placing blocks of the utility model;

[0019] Figure 3 It is a schematic diagram of the interior of the placement block of the utility model;

[0020] Figure 4 For this utility model Figure 3 Enlarged schematic diagram at point A in the middle.

[0021] Figure numerals: 1. protective box; 2. placement block; 3. handle; 4. sealing cover; 5. elastic spring; 6. pull rod; 7. lifting plate; 8. deep slide; 9. protective cover; 10. semiconductor placement slot; 11. moving block; 12. limiting slide; 13. limiting rod; 14. tension spring; 15. moving rod; 16. roller; 17. shallow slide. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] In order to further understand the content of the utility model, the utility model is described in detail in conjunction with the accompanying drawings.

[0024] See also Figure 1-4 The utility model provides a technical solution: a semiconductor protection device, including a protection box 1, a sealing cover 4 is arranged on the protection box 1, a placement block 2 is fixedly installed inside the protection box 1, a pull rod 6 is slidably connected inside the placement block 2, a lifting plate 7 is fixedly installed on the lower end of the pull rod 6, the lifting plate 7 is slidably connected inside the placement block 2, an elastic spring 5 is movably sleeved on the pull rod 6, the upper end of the elastic spring 5 is fixedly connected to the inside of the placement block 2, the lower end of the elastic spring 5 is fixedly connected to the top of the lifting plate 7, a semiconductor placement groove 10 is opened on the surface of the lifting plate 7, and a handle 3 is fixedly installed on the upper end of the pull rod 6.

[0025] Pull the handle 3 to make the pull rod 6 slide upward inside the placement block 2, thereby squeezing the elastic spring 5, so that the lifting plate 7 slides inside the placement block 2, and the semiconductor is placed inside the semiconductor placement groove 10. The handle 3 is no longer pulled, so that the lifting plate 7 is reset by the elastic force of the elastic spring 5, and the semiconductor enters the interior of the placement block 2.

[0026] Two limiting slots 12 are provided on the lifting plate 7, and moving blocks 11 are slidably connected inside the two limiting slots 12. Protective covers 9 are fixedly installed on the upper ends of the two moving blocks 11. Limiting rods 13 are fixedly installed inside the two limiting slots 12. The surfaces of the two limiting rods 13 are respectively slidably connected to the insides of the two moving blocks 11. Tension springs 14 are movably sleeved on the two limiting rods 13. The opposite ends of the two tension springs 14 are respectively fixedly connected to the two sides of the two moving blocks 11, and the opposite ends of the two tension springs 14 are respectively fixedly connected to the insides of the two limiting slots 12.

[0027] The two limiting rods 13 are provided to facilitate limiting the moving block 11 , thereby preventing the moving block 11 from sliding out of the limiting sliding groove 12 , thereby improving the limiting effect on the moving block 11 .

[0028] The lifting plate 7 is internally slidably connected with two moving rods 15, and the two moving rods 15 are respectively slidably connected inside the two limiting slide grooves 12, and the two moving rods 15 are rotatably connected inside with rollers 16. The placement block 2 has two shallow slides 17 and two deep slides 8 inside, and the two shallow slides 17 and the two deep slides 8 are connected to each other, and the two rollers 16 are respectively slidably connected inside the two shallow slides 17 and the two deep slides 8.

[0029] When the lifting plate 7 moves upward, the two rollers 16 will roll inside the two shallow slides 17, and then when the two rollers 16 enter the two deep slides 8, the two rollers 16 will no longer be restricted by the two shallow slides 17, and then the two moving rods 15 and the two limiting rods 13 will be reset by the tension of the two tension springs 14, and then the two protective covers 9 will move away from each other, the semiconductor placement groove 10 will be opened, and the semiconductor will be placed inside the semiconductor placement groove 10. When the lifting plate 7 is reset by the elastic force of the elastic spring 5, the two rollers 16 will enter the two shallow slides 17 from the inside of the two deep slides 8, and then the two rollers 16 will be squeezed, and then the two moving blocks 11 will slide inside the two limiting slides 12, and the two tension springs 14 will be stretched, so that the two protective covers 9 will move relatively, and then the two protective covers 9 will cover the semiconductor, which is convenient for protecting the semiconductor, preventing the semiconductor from being hit by the outside, improving the protection effect of the semiconductor, avoiding the probability of semiconductor damage to the greatest extent, and preventing the semiconductor from moving.

[0030] Working principle:

[0031] Pull the handle 3 to make the pull rod 6 slide upward inside the placement block 2, thereby squeezing the elastic spring 5, so that the lifting plate 7 slides inside the placement block 2, and the semiconductor is placed inside the semiconductor placement groove 10. The handle 3 is no longer pulled, so that the lifting plate 7 is reset by the elastic force of the elastic spring 5, and the semiconductor enters the interior of the placement block 2.

[0032] When the lifting plate 7 moves upward, the two rollers 16 will roll inside the two shallow slides 17, and then when the two rollers 16 enter the two deep slides 8, the two rollers 16 will no longer be restricted by the two shallow slides 17, and the two moving rods 15 and the two limiting rods 13 will be reset by the tension of the two tension springs 14, and the two protective covers 9 will move away from each other, the semiconductor placement groove 10 will be opened, and the semiconductor will be placed inside the semiconductor placement groove 10. When the lifting plate 7 is reset by the elastic force of the elastic spring 5, the two rollers 16 will enter the two shallow slides 17 from the inside of the two deep slides 8, and then the two rollers 16 will be squeezed, so that the two moving blocks 11 will slide inside the two limiting slides 12, and the two tension springs 14 will be stretched, so that the two protective covers 9 will move relative to each other, and the two protective covers 9 will cover the semiconductor, which is convenient for protecting the semiconductor.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor protection device, comprising a protection box (1), characterized in that: The protective box (1) is provided with a sealing cover (4), a placement block (2) is fixedly installed inside the protective box (1), a pull rod (6) is slidably connected inside the placement block (2), a lifting plate (7) is fixedly installed at the lower end of the pull rod (6), the lifting plate (7) is slidably connected inside the placement block (2), an elastic spring (5) is movably sleeved on the pull rod (6), the upper end of the elastic spring (5) is fixedly connected to the inside of the placement block (2), the lower end of the elastic spring (5) is fixedly connected to the top of the lifting plate (7), a semiconductor placement groove (10) is provided on the surface of the lifting plate (7), and a handle (3) is fixedly installed at the upper end of the pull rod (6).

2. A semiconductor protection device according to claim 1, characterized in that: The lifting plate (7) is provided with two limiting sliding grooves (12), and the interiors of the two limiting sliding grooves (12) are both slidably connected with moving blocks (11).

3. A semiconductor protection device according to claim 2, characterized in that: Protective covers (9) are fixedly mounted on the upper ends of the two moving blocks (11).

4. A semiconductor protection device according to claim 3, characterized in that: A limiting rod (13) is fixedly installed inside the two limiting sliding grooves (12), and the surfaces of the two limiting rods (13) are respectively slidably connected to the inside of the two moving blocks (11).

5. A semiconductor protection device according to claim 4, characterized in that: The two limiting rods (13) are both movably sleeved with tension springs (14), the opposite ends of the two tension springs (14) are respectively fixedly connected to the two sides of the two moving blocks (11), and the opposite ends of the two tension springs (14) are respectively fixedly connected to the inside of the two limiting sliding grooves (12).

6. A semiconductor protection device according to claim 5, characterized in that: The lifting plate (7) is internally slidably connected to two moving rods (15), and the two moving rods (15) are respectively slidably connected inside the two limiting sliding grooves (12).

7. A semiconductor protection device according to claim 6, characterized in that: The insides of the two moving rods (15) are both rotatably connected with rollers (16).

8. A semiconductor protection device according to claim 7, characterized in that: Two shallow slideways (17) and two deep slideways (8) are provided inside the placement block (2), the two shallow slideways (17) and the two deep slideways (8) are interconnected, and the two rollers (16) are slidably connected inside the two shallow slideways (17) and the two deep slideways (8), respectively.

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