Vibration monitoring system and vibration testing system
By setting conductive elements on the mechanical structure of the equipment under test during the vibration test, a loop sending level signal is formed, and the vibration table is controlled to stop urgently, solving the problem of insufficient sensitivity of traditional monitoring methods and achieving rapid and real-time protection of the equipment under test.
Patent Information
- Application Number
- CN202421798015.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-26
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-07-26
AI Technical Summary
In the prior art, when the mechanical structure of the equipment being tested occurs during vibration test, the sensitivity of the traditional monitoring method is insufficient, making it difficult to respond to abnormal displacement in real time, resulting in the inability to effectively protect the equipment being tested.
A vibration monitoring system is designed, by setting two conductive elements on the mechanical structure of the equipment under test, forming a loop using the power supply element and the output interface element, and sending a level signal to the control collector immediately to control the vibration table to stop urgently to avoid further damage.
It realizes fast and real-time monitoring of the mechanical structure displacement of the equipment under test, improves the testing speed, solves the problem of insufficient sensitivity of traditional monitoring methods, and effectively protects the equipment under test.
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Figure CN222812543U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic monitoring equipment, in particular to a vibration monitoring system and a vibration testing system. Background Art
[0002] Vibration tests are often used to evaluate the performance and durability of the device under various vibration conditions to simulate the vibration environment that the device may encounter in actual use, so as to test the reliability and durability of the device under test. This test is widely used in the fields of automobiles, aerospace, electronic equipment, etc. During the vibration test, the mechanical structure in the device under test will be subjected to periodic or random vibration forces, which will cause excessive displacement of the mechanical structure on the device under test.
[0003] In the prior art, when the device under test is subjected to a vibration test, displacement of the mechanical structure of the device under test may cause damage or failure of the device under test. Traditional monitoring methods usually use accelerometers, displacement sensors, etc. for data collection, but there are delays in data collection and processing, and it is difficult to respond at the moment when abnormal displacement occurs, resulting in insufficient sensitivity, making it difficult to respond to abnormal displacement of the device under test mechanism in real time, and failing to effectively protect the device under test.
[0004] Based on this, a new technical solution is needed. Utility Model Content
[0005] In view of this, the embodiments of the present invention provide a vibration monitoring system and a vibration testing system to at least solve the problem that the existing monitoring methods have low sensitivity and are difficult to respond to abnormal displacement of the mechanical structure of the tested equipment in real time.
[0006] The utility model embodiment provides the following technical solutions:
[0007] The utility model embodiment provides a vibration monitoring system, which is applied to a device under test placed on a vibration table, and the vibration monitoring system includes:
[0008] Two conductive elements, the two conductive elements are correspondingly arranged on the mechanical structure of the device under test, and when the mechanical structure of the device under test vibrates and displaces, the two conductive elements come into contact and conduct with the vibration displacement of the mechanical structure;
[0009] A power supply element, the power supply element is connected to one of the conductive elements;
[0010] An output interface element, the output interface element is connected to the output end of the power supply element and the other conductive element respectively;
[0011] A control acquisition instrument, wherein the input end of the control acquisition instrument is connected to the output end of the output interface element, and the output end is connected to the vibration table. The control acquisition instrument is used to control the opening and closing of the vibration table according to the level signal sent by the power supply element through the output interface element.
[0012] Furthermore, the conductive element is adhered to the mechanical structure.
[0013] Furthermore, the two conductive elements are arranged opposite to each other.
[0014] Furthermore, the conductive element is an electrode sheet.
[0015] Furthermore, the power supply element is an adjustable voltage stabilized power supply, and the power supply element is used to send a level signal to the control acquisition instrument through the output interface element immediately after the two conductive elements are in contact and turned on.
[0016] Furthermore, the output interface element is a BNC output interface.
[0017] Furthermore, the output interface element is connected to the input terminal of the control acquisition instrument through a BNC connecting line.
[0018] Furthermore, the output end of the control acquisition instrument is connected to the vibration table through a power amplifier.
[0019] The present invention also provides a vibration test system, comprising:
[0020] A vibration table, wherein the vibration table is used to place the device under test;
[0021] In any of the vibration monitoring systems described above, the two conductive elements of the vibration monitoring system are correspondingly arranged on the mechanical structure of the device under test, and the control acquisition instrument of the vibration monitoring system is connected to the vibration table.
[0022] Compared with the prior art, the at least one technical solution adopted in the embodiment of the utility model can achieve the following beneficial effects:
[0023] The utility model discloses a vibration monitoring system. When the mechanical structure of the tested device vibrates and displaces, two conductive elements are brought into contact and conducted with the displacement of the mechanical structure, so that a loop is formed between the two conductive elements, the power supply element, and the output interface element. At this time, the power supply element immediately sends a level signal to a control acquisition instrument through the output interface element, so that the control acquisition instrument controls the opening and closing of the vibration table, thereby eliminating the need for data collection and processing, thereby improving the test speed of the displacement of the mechanical structure of the tested device, and solving the problem that the existing monitoring method has low sensitivity and is difficult to respond to the abnormal displacement of the mechanical structure of the tested device in real time. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0025] Figure 1 The present invention is a schematic diagram of an application scenario of a vibration monitoring system according to an embodiment of the present invention.
[0026] The accompanying drawings of the present utility model are as follows:
[0027] 10. Vibration monitoring system; 11. Conductive element; 12. Power supply element; 13. Output interface element; 14. Control acquisition instrument; 15. Power amplifier;
[0028] 20. Equipment under test;
[0029] 30. Vibration table. DETAILED DESCRIPTION
[0030] The embodiments of the present application are described in detail below with reference to the accompanying drawings.
[0031] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.
[0032] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.
[0033] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0034] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the examples can be practiced without these specific details.
[0035] The displacement monitoring method in the prior art usually includes using accelerometers, displacement sensors, etc. to collect data to determine whether the mechanical structure of the device under test has been displaced. However, the use of accelerometers and displacement sensors has the following defects:
[0036] (1) Poor real-time performance: There is a delay in the collection and processing of accelerometer and displacement sensor data, making it difficult to respond at the moment when abnormal displacement occurs;
[0037] (2) Insufficient sensitivity: Traditional sensors have difficulty detecting tiny abnormal displacements, especially in high-frequency vibration environments;
[0038] (3) Large amount of data: The amount of data generated by vibration tests is huge, and it is difficult to process and analyze the data in real time using traditional technologies;
[0039] (4) Complex algorithms: Traditional methods require complex algorithms to process and analyze the data collected by sensors, which undoubtedly makes it impossible to determine in real time whether the vibration displacement of the mechanical structure of the device under test is abnormal.
[0040] In summary, when using sensors to monitor vibration displacement in the prior art, it is difficult to respond to the "abnormal" displacement of the mechanical structure of the device under test in real time due to the need to collect and process data, thereby failing to effectively protect the device.
[0041] Based on this, this specification embodiment proposes a processing solution: Figure 1As shown, in a vibration monitoring system 10 of the utility model, two conductive elements 11 can be displaced with the mechanical structure of the device under test 20, so that the two conductive elements 11 are in contact and connected when the mechanical structure is abnormally displaced. At this time, the two conductive elements 11, the power supply element 12 and the output interface element 13 form a loop, and the power supply element 12 sends a level signal to the control acquisition instrument 14 through the output interface element 13. The control acquisition instrument 14 controls the vibration table 30 to stop urgently according to the level signal. Therefore, in the present application, there is no need to collect and process data. After the mechanical structure vibrates and displaces, the two conductive elements 11 are directly connected, and the power supply element 12 immediately sends a level signal to the control acquisition instrument 14 through the output interface element 13 to shut down the vibration table 30, thereby effectively protecting the device under test 20.
[0042] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.
[0043] Example 1
[0044] The embodiment of the utility model provides a vibration monitoring system 10, which is applied to a device under test 20 placed on a vibration table 30, and the vibration monitoring system 10 includes two conductive elements 11, a power supply element 12, an output interface element 13 and a control acquisition instrument 14. Among them, the two conductive elements 11 are correspondingly arranged on the mechanical structure of the device under test 20, and when the mechanical structure of the device under test 20 undergoes vibration displacement, the two conductive elements 11 are in contact and connected with the vibration displacement of the mechanical structure; the power supply element 12 is connected to one conductive element 11; the output interface element 13 is respectively connected to the output end of the power supply element 12 and the other conductive element 11; the input end of the control acquisition instrument 14 is connected to the output end of the output interface element 13, and the output end is connected to the vibration table 30, and the control acquisition instrument 14 is used to control the opening and closing of the vibration table 30 according to the level signal sent by the power supply element 12 through the output interface element 13.
[0045] The two conductive elements 11 are installed at positions on the device under test 20 where the mechanical structure displacement is relatively large.
[0046] When the mechanical structure of the device under test 20 does not undergo abnormal displacement, the two conductive elements 11 are spaced apart and do not touch each other, so that the two conductive elements 11, the power supply element 12 and the output interface element 13 are in an open circuit state.
[0047] The conductive element 11 is made of a conductive material, for example, the conductive element 11 may be a sheet-like structure or a columnar structure.
[0048] Preferably, the conductive element 11 may be an electrode sheet.
[0049] In some of the embodiments, the conductive element 11 may be a metal electrode sheet, a graphene electrode sheet, etc.
[0050] Among them, the two conductive elements 11 are arranged relative to each other and are respectively arranged on relative mechanical structures on the device under test 20, so that when the relative mechanical structures undergo abnormal displacement, the two conductive elements 11 approach each other along with the abnormal displacement of the relative mechanical structures until they come into contact and conduct, and at this time, a loop is formed between the two conductive elements 11, the power supply element 12 and the output interface element 13.
[0051] The connection method between the conductive element 11 and the mechanical structure of the device under test 20 may be adhesive connection, welding, etc.
[0052] The power supply element 12 is connected to a conductive element 11 through a cable, and is also connected to an output interface element 13 through a cable.
[0053] The power supply element 12 may be an adjustable voltage stabilizing power supply.
[0054] The power supply element 12 is used to send a level signal to the control acquisition instrument 14 through the output interface element 13 immediately after the two conductive elements 11 are in contact and connected.
[0055] For example, after the two conductive elements 11 are in contact and turned on, the power supply element 12 immediately sends a high level signal to the control acquisition instrument 14 through the output interface element 13 .
[0056] Among them, in the utility model, the signal sent by the power supply element 12 is a level signal rather than a code signal or an indication signal in the software. Therefore, the power supply element 12 in the utility model does not require additional programming and does not involve program improvements. It is only a level signal automatically sent by the power supply element 12 after the circuit is turned on.
[0057] Furthermore, the output interface element 13 is a BNC output interface.
[0058] Among them, the BNC output interface is a coaxial cable connector that can be quickly connected and disconnected. It adopts a snap-on structure, can be quickly connected and disconnected, and has good electrical performance and durability.
[0059] The output interface element 13 is connected to the input end of the control acquisition instrument 14 through a BNC connection line.
[0060] The control collector 14 is used to control the vibration table 30 to be turned off after acquiring the level signal, so as to prevent the vibration table 30 from causing further vibration damage to the device under test 20 .
[0061] The control acquisition device 14 can generate a control signal to control the vibration table 30 to stop suddenly.
[0062] Furthermore, the output end of the control collector 14 is connected to the vibration table 30 through the power amplifier 15 .
[0063] The power amplifier 15 is used to receive the signal sent by the collector and amplify the signal to a level suitable for the vibration table 30 .
[0064] Specifically, the control acquisition instrument 14 usually outputs signals in a relatively low voltage or current range, which may not be sufficient to directly drive the vibration table 30, while the vibration table 30 usually requires a relatively high voltage and current to achieve the required vibration power and frequency. Therefore, the main function of the power amplifier 15 is to amplify the low amplitude signal of the control acquisition instrument 14 to a level capable of driving the vibration table 30.
[0065] Among them, the control collector 14 is connected to the vibration table 30 by using the power amplifier 15, so that the input signal of the vibration table 30 can be accurately adjusted and controlled, which helps to maintain highly consistent vibration conditions in various tests and experiments, thereby improving the reliability and repeatability of the results.
[0066] The power amplifier 15 can also play a protective role to avoid overload or damage that may be caused by directly connecting the control acquisition instrument 14 to the vibration table 30.
[0067] The working principle of the utility model is as follows:
[0068] At the beginning of the vibration test, if the mechanical structure of the device under test 20 is abnormally displaced, causing the two conductive elements 11 to contact and conduct with each other, the conductive element 11, the power supply element 12 and the output interface element 13 will form a loop. At this time, the power supply element 12 will be triggered to send a high-level signal to the control acquisition instrument 14 through the output interface element 13, so that the control acquisition instrument 14 controls the vibration table 30 to stop urgently, thereby avoiding further damage to the device under test 20.
[0069] The utility model can monitor the displacement of the mechanical structure of the device under test 20 without using sensors, does not need to collect and process data, and does not need algorithms to judge and process signals. It can thus quickly and in real time judge the abnormal displacement of the mechanical structure of the device under test 20, and can effectively protect the device under test 20 on the vibration table 30.
[0070] Example 2
[0071] The embodiment of the utility model provides a vibration test system, comprising a vibration table 30 and a vibration monitoring system 10 as described in Embodiment 1. The vibration table 30 is used to place the device under test 20; the two conductive elements 11 of the vibration monitoring system 10 are correspondingly arranged on the mechanical structure of the device under test 20, and the control acquisition instrument 14 of the vibration monitoring system 10 is connected to the vibration table 30.
[0072] Specifically, during the vibration test, if the electrode sheets on both sides of the mechanical structure are in contact, a loop will be formed, and the voltage-stabilized power supply will output a high-level signal through the BNC output interface. After the vibration controller collects the high-level signal, it will control the vibration table 30 to stop urgently to protect the device under test 20 from damage.
[0073] In this specification, the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment described later, since it corresponds to the method, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.
[0074] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.
Claims
1. A vibration monitoring system, applied to a device under test placed on a vibration table, characterized in that: The vibration monitoring system comprises: Two conductive elements, the two conductive elements are correspondingly arranged on the mechanical structure of the device under test, and when the mechanical structure of the device under test vibrates and displaces, the two conductive elements come into contact and conduct with the vibration displacement of the mechanical structure; A power supply element, the power supply element is connected to one of the conductive elements; An output interface element, the output interface element is connected to the output end of the power supply element and the other conductive element respectively; A control acquisition instrument, wherein the input end of the control acquisition instrument is connected to the output end of the output interface element, and the output end is connected to the vibration table. The control acquisition instrument is used to control the opening and closing of the vibration table according to the level signal sent by the power supply element through the output interface element.
2. The vibration monitoring system according to claim 1, characterized in that: The conductive element is adhered to the mechanical structure.
3. The vibration monitoring system according to claim 1, characterized in that: The two conductive elements are arranged opposite to each other.
4. The vibration monitoring system according to claim 1, characterized in that: The conductive element is an electrode sheet.
5. The vibration monitoring system according to claim 1, characterized in that: The power supply element is an adjustable voltage stabilized power supply, and the power supply element is used to send a level signal to the control acquisition instrument through the output interface element immediately after the two conductive elements are in contact and turned on.
6. The vibration monitoring system according to claim 1, characterized in that: The output interface element is a BNC output interface. 7 . The vibration monitoring system according to claim 6 , wherein the output interface element is connected to the input terminal of the control acquisition instrument through a BNC connection line.
8. The vibration monitoring system according to claim 1, characterized in that: The output end of the control acquisition instrument is connected to the vibration table through a power amplifier.
9. A vibration testing system, characterized in that: include: A vibration table, wherein the vibration table is used to place the device under test; According to the vibration monitoring system as described in any one of claims 1 to 8, the two conductive elements of the vibration monitoring system are correspondingly arranged on the mechanical structure of the device under test, and the control acquisition instrument of the vibration monitoring system is connected to the vibration table.