Semiconductor double-station feeding machine

Abstract

The utility model belongs to the technical field of semiconductor packaging and feeding equipment, and particularly discloses a semiconductor double-station feeding machine which comprises a machine frame, a feeding workbench, a dispensing workbench, a die bonding workbench and a discharging workbench are sequentially arranged on a working panel of the machine frame in the transverse conveying direction of material sheets, and each workbench is provided with two stations in parallel. The dispensing workbench and the die bonding workbench are both arranged on the working panel in a sliding mode, a dispensing mechanism is arranged beside the dispensing workbench, two pairs of feeding wobble plates are arranged on the working panel, the die bonding workbench is located between the two pairs of feeding wobble plates, and the same pair of feeding wobble plates are transversely arranged on the working panel in a sliding mode. And a wafer suction mechanism is longitudinally and movably arranged between the same pair of feeding wobble plates and the die bonding workbench. According to the utility model, the four workbenches with double stations are arranged on the working panel and are matched with the actions of dispensing, die bonding and discharging, so that the simultaneous processing of two material sheets is realized, the process flow is simplified, the productivity efficiency can be greatly improved, and the labor cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging feeding equipment, in particular to a semiconductor double-station feeding machine. Background Art

[0002] In the semiconductor manufacturing industry, especially when it comes to chip packaging, die bonding and other process flows, traditional single-station loaders often have problems such as low production efficiency, high dependence on manual labor, and cumbersome process flows. These problems not only limit the development speed of the semiconductor manufacturing industry, but also increase production costs and waste of human resources.

[0003] At present, most of the semiconductor loaders commonly used in the market are single-station designs, that is, they can only process one wafer at a time. This design has obvious bottlenecks in efficiency and production capacity. In addition, they also adopt a split type, that is, 3-5 workstations alternately complete the chip packaging, resulting in complicated process flow and high labor costs.

[0004] Therefore, the inventor is committed to designing a semiconductor loader to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor double-station loading machine, which simplifies the process flow, can greatly improve production efficiency and reduce labor costs.

[0006] In order to achieve the above object, a technical solution adopted by the utility model is:

[0007] A semiconductor double-station loader comprises a frame, wherein a feeding workbench, a glue dispensing workbench, a crystal bonding workbench and a discharging workbench are sequentially arranged on the working panel of the frame along the lateral conveying direction of the material sheet, wherein the feeding workbench, the glue dispensing workbench, the crystal bonding workbench and the discharging workbench are each provided with two workstations in parallel, the glue dispensing workbench and the crystal bonding workbench are both slidably arranged on the working panel, a glue dispensing mechanism is arranged on the side of the glue dispensing workbench, two pairs of feeding rocking plates are arranged on the working panel, the crystal bonding workbench is located between the two pairs of the feeding rocking plates, the same pair of the feeding rocking plates are laterally slidably arranged on the working panel, and a chip suction mechanism is arranged between the same pair of the feeding rocking plates and the crystal bonding workbench for longitudinal movement.

[0008] As an improvement of the semiconductor double-station loader of the utility model, the bottom of the glue dispensing workbench and the bottom of the crystal bonding workbench are respectively connected to the working panel in a transverse sliding manner through a slide, and the glue dispensing workbench and the crystal bonding workbench are respectively arranged in a longitudinal sliding manner on the corresponding slides.

[0009] As an improvement of the semiconductor double-station loader of the utility model, two dispensing and crystal bonding tracks are horizontally and spaced apart and fixed on the working panel, each of the slides is slidably arranged on the two dispensing and crystal bonding tracks, and the two slides are driven by the same dispensing and crystal bonding driving source to slide in opposite directions.

[0010] As an improvement of the semiconductor double-station loading machine of the utility model, the structures of the feeding workbench, the dispensing workbench, the crystal bonding workbench and the discharging workbench are all the same.

[0011] As an improvement of the semiconductor double-station loader of the utility model, the feeding workbench includes a frame, and two pairs of belt transmission structures are arranged in parallel on the frame. The two pairs of belt transmission structures are arranged in a one-to-one correspondence in the two stations and are driven by the same active rotating shaft.

[0012] As an improvement of the semiconductor double-station loader of the utility model, two sheet placement trays are arranged at intervals at the feeding end of the working panel, the feeding workbench is located between the two sheet placement trays, and the sheets stored in the two sheet placement trays are transferred to the feeding workbench by a feeding robot.

[0013] As an improvement of the semiconductor double-station loader of the utility model, two pairs of feeding tracks are fixed horizontally and at intervals on the working panel, and the two pairs of feeding rockers are slidably arranged on the two pairs of feeding tracks in a one-to-one correspondence. The same pair of feeding rockers are driven by the same feeding drive source to slide in opposite directions.

[0014] As an improvement of the semiconductor double-station loader of the utility model, one of the wafer suction mechanisms is provided with an abnormality detection CCD device, and the wafer suction mechanism includes a wafer suction member.

[0015] As an improvement of the semiconductor double-station loader of the utility model, a dispensing detection CCD machine is provided above the dispensing workbench, a solid crystal detection CCD machine is provided above the solid crystal workbench, a discharging conveyor belt is provided at the discharging end of the working panel, and a discharging robot is provided above the discharging conveyor belt.

[0016] As an improvement of the semiconductor double-station loader of the utility model, the discharging robot includes a discharging slide, a rotating cylinder and a discharging suction piece. The discharging slide is arranged to move horizontally and vertically beside the discharging conveyor belt, the rotating cylinder is arranged to slide vertically on the discharging slide, the discharging suction piece is arranged at the output end of the rotating cylinder, and the rotating cylinder drives the discharging suction piece to rotate 90 degrees.

[0017] Compared with the prior art, the semiconductor double-station loader of the utility model has a total of four workbenches, namely, a feeding workbench, a glue dispensing workbench, a crystal bonding workbench and a discharging workbench, on the work panel, and each workbench is provided with a double station. Two sheets are transferred from the feeding workbench to the glue dispensing workbench, the glue dispensing mechanism dispenses glue, and the glue dispensing workbench transfers the glued sheets to the crystal bonding workbench. The chip suction mechanism sucks the chip on the feeding rocker and places it on the glued sheet for crystal bonding. The crystal bonding workbench transfers the crystal bonded sheet to the discharging workbench, thus realizing the simultaneous processing of two sheets, simplifying the process flow, greatly improving production efficiency, and reducing labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a top view of the semiconductor double-station loading machine of the utility model;

[0019] Figure 2 It is a three-dimensional diagram of the semiconductor double-station loading machine of the utility model;

[0020] Figure 3 yes Figure 2 The enlarged view of point A in the middle;

[0021] Figure 4 yes Figure 2 The enlarged view of point B in the middle;

[0022] Figure 5 It is a three-dimensional diagram of the semiconductor double-station loading machine of the utility model from another perspective;

[0023] Figure 6 It is a three-dimensional enlarged view of the feeding manipulator of the utility model;

[0024] Figure 7 It is a three-dimensional enlarged view of the CCD machine for solid crystal detection and two wafer suction mechanisms of the utility model;

[0025] Figure 8 It is a three-dimensional enlarged view of the discharging manipulator of the utility model;

[0026] Fig. 9 It is a three-dimensional enlarged view of a single workbench of the utility model;

[0027] Fig.10 It is a three-dimensional enlarged view of a single workbench of the utility model from another viewing angle.

[0028] Illustration Description:

[0029] 1. Rack; 11. Working panel; 12. Glue dispensing and crystal bonding slide rail; 13. Feeding slide rail; 14. Sheet placement plate; 15. Discharging conveyor belt; 16. Sheet; 2. Feeding workbench; 21. Glue dispensing workbench; 22. Crystal bonding workbench; 23. Discharging workbench; 24. Slide plate; 241. Glue dispensing and crystal bonding linear motor; 242. Longitudinal slide rail; 25. Stand; 26. Forward motor; 27. Active shaft; 28. Conveyor belt; 29. ​​Driven shaft; 3. Feeding manipulator; 31. Suction head; 32. Feeding linear motor; 33. Feeding slide rail; 4. Glue dispensing mechanism; 41. Glue dispensing linear motor; 42. Fixed plate ;421, dispensing vertical slide rail;43, dispensing rack;5, dispensing detection CCD machine;6, feeding rocker;61, chip placement surface;62, feeding linear motor;7, chip suction mechanism;71, chip longitudinal linear motor;72, chip suction piece;73, chip slide;731, chip vertical slide rail;74, chip vertical motor;75, abnormality detection CCD machine;8, solid crystal detection CCD machine;9, discharge robot;91, discharge suction piece;92, rotating cylinder;93, discharge transverse motor;94, discharge slide;941, discharge transverse slide rail;942, discharge vertical slide rail;95, discharge vertical motor. DETAILED DESCRIPTION

[0030] The following is a detailed explanation of the implementation of the present invention in conjunction with the accompanying drawings. The accompanying drawings are for reference and illustration only and do not constitute a limitation on the scope of patent protection of the present invention.

[0031] Reference Figures 1 to 10 A semiconductor double-station loading machine comprises a frame 1, a feeding workbench 2, a glue dispensing workbench 21, a crystal bonding workbench 22, a discharging workbench 23, a glue dispensing mechanism 4, two pairs of feeding oscillating plates 6 and two wafer suction mechanisms 7. The feeding workbench 2, the glue dispensing workbench 21, the crystal bonding workbench 22 and the discharging workbench 23 are sequentially arranged on a working panel 11 of the frame 1 along a lateral conveying direction of a material sheet 16. The feeding workbench 2, the glue dispensing workbench 21, the crystal bonding workbench 22 and the discharging workbench 23 are sequentially arranged on a working panel 11 of the frame 1 along a lateral conveying direction of a material sheet 16. There are two workstations arranged in parallel on the discharge workbench 23, the glue dispensing workbench 21 and the crystal bonding workbench 22 are both slidably arranged on the work panel 11, the glue dispensing mechanism 4 is arranged on the side of the glue dispensing workbench 21, two pairs of feeding rockers 6 are arranged on the work panel 11, the crystal bonding workbench 22 is located between the two pairs of feeding rockers 6, the same pair of feeding rockers 6 are horizontally slidably arranged on the work panel 11, and the same wafer suction mechanism 7 is longitudinally movable and arranged between the corresponding pair of feeding rockers 6 and the crystal bonding workbench 22.

[0032] Reference Figure 1 and Figure 2The working panel 11 is located on the top surface of the frame 1. Two sheet placement trays 14 are arranged at intervals at the feeding end of the working panel 11. Each sheet placement tray 14 is in a U-shape and is used to stack multiple sheets 16. The entire feeding workbench 2 is located between the two sheet placement trays 14. Two dispensing and crystal bonding slides 12 are also transversely and spaced apart on the working panel 11. The two dispensing and crystal bonding slides 12 are located between the feeding workbench 2 and the discharging workbench 23. Two pairs of feeding slides 13 are transversely and spaced apart on the working panel 11. The two dispensing and crystal bonding slides 12 and the crystal bonding workbench 22 are both located between the two pairs of feeding slides 13. The same pair of feeding slides 13 are arranged at intervals. A discharging conveyor belt 15 is provided at the discharging end of the working panel 11.

[0033] Reference Figure 1 , Figure 2 , Fig. 9 and Fig.10 The structures of the four workbenches, the feeding workbench 2, the dispensing workbench 21, the solid crystal workbench 22 and the discharging workbench 23, are the same. Specifically, each workbench includes a frame 25, a forward motor 26, a driving shaft 27, two pairs of belt transmission structures and a driven shaft 29. The top of the frame 25 is separated to form two workstations. The driving shaft 27 is arranged at the feeding end of the frame 25 along the longitudinal rotation of the frame 25, and the driven shaft 29 is arranged at the discharging end of the frame 25 along the longitudinal rotation of the frame 25. The two pairs of belt transmission structures are arranged at the feeding end of the frame 25. The two rectangular sheets 16 are supported by two belt drive structures respectively, and the conveying belt 28 of each belt drive structure is respectively sleeved on the driving wheel of the driving shaft 27 and the driven wheel of the driven shaft 29. The forward motor 26 is fixed to the feeding end of the table 25 and drives the driving shaft 27 to rotate through the belt drive, thereby driving the two pairs of belt drive structures to operate synchronously, so that the two sheets 16 move forward synchronously.

[0034] Reference Figure 1 , Figure 2 and Figure 3The bottom of the dispensing workbench 21 and the bottom of the crystal bonding workbench 22 are respectively provided with a slide plate 24, and two longitudinal sliding rails 242 are provided on the top surface of each slide plate 24 along the longitudinal interval thereof. The dispensing workbench 21 and the crystal bonding workbench 22 are respectively longitudinally slidably arranged on the longitudinal sliding rails 242 of the corresponding slide plates 24, so that the dispensing workbench 21 and the crystal bonding workbench 22 can both slide longitudinally relative to the working panel 11, and the two slide plates 24 are both transversely slidably arranged on the two dispensing crystal bonding slide rails 12, so that the bottom of the dispensing workbench 21 and the bottom of the crystal bonding workbench 22 pass through the corresponding The slide plate 24 is connected to the working panel 11 for transverse sliding, so that the glue dispensing workbench 21 and the crystal bonding workbench 22 can both slide transversely relative to the working panel 11, and the two slide plates 24 are driven by the same glue dispensing and crystal bonding driving source to slide in opposite directions. In the utility model, the glue dispensing and crystal bonding driving source is preferably a glue dispensing and crystal bonding linear motor 241, which is a bidirectional linear motor. The glue dispensing and crystal bonding linear motor 241 is located between the two glue dispensing and crystal bonding slide rails 12, and the glue dispensing and crystal bonding linear motor 241 can drive the glue dispensing workbench 21 and the crystal bonding workbench 22 to move away or approach synchronously.

[0035] Reference Figure 2 and Figure 6 The sheets 16 stored in the two sheet placement trays 14 are transferred to the feeding workbench 2 by a feeding robot 3. The feeding robot 3 includes a feeding linear motor 32 and a suction head 31. The two ends of the feeding linear motor 32 are respectively connected to the working panel 11 of the frame 1 through support columns, so that the feeding linear motor 32 is longitudinally arranged above the feeding workbench 2. A feeding slide rail 33 is provided on the side of the feeding linear motor 32. A feeding rack is provided on the feeding slide rail 33. The suction head 31 is arranged at the end of the feeding rack. The feeding linear motor 32 drives the feeding rack and the suction head 31 to slide longitudinally along the feeding slide rail 33 to suck the sheets 16 in the two sheet placement trays 14 onto the feeding workbench 2.

[0036] Reference Figure 2 and Figure 4The dispensing mechanism 4 includes a dispensing linear motor 41 and three dispensing racks 43. A fixed plate 42 is vertically arranged on the working panel 11. Two dispensing vertical sliding rails 421 are arranged on the fixed plate 42 at intervals. The dispensing linear motor 41 is vertically slidably arranged on the two dispensing vertical sliding rails 421 and is driven up and down by the dispensing motor. The three dispensing racks 43 are arranged at intervals on the dispensing linear motor 41. Each dispensing rack 43 is provided with a dispensing head. The dispensing motor drives the dispensing linear motor 41 through a screw rod. The motor 41, three glue dispensing racks 43 and three glue dispensing heads slide up and down along the glue dispensing vertical slide rail 421 together. The glue dispensing linear motor 41 drives the three glue dispensing racks 43 and the three glue dispensing heads to move horizontally (left and right) together to dispense glue at specific positions of two material sheets 16 on the glue dispensing workbench 21. A glue dispensing detection CCD machine 5 is provided above the glue dispensing workbench 21. The glue dispensing detection CCD machine 5 is located on the right side of the glue dispensing mechanism 4. The glue dispensing detection CCD machine 5 is used to detect the glue dispensing status of the material sheet 16.

[0037] Reference Figure 1 , Figure 2 and Figure 5 Each feeding rocker 6 is T-shaped and its top is a wafer placing surface 61 for placing wafers. Two pairs of feeding rockers 6 are slidably arranged on two pairs of feeding rails 13 in a one-to-one manner. The same pair of feeding rockers 6 are driven by the same feeding driving source to slide in opposite directions. In this embodiment, the feeding driving source is preferably a feeding linear motor 62, and the feeding linear motor 62 is specifically a bidirectional linear motor. Each feeding linear motor 62 is located between the same pair of feeding rails 13, and the same feeding linear motor 62 drives a pair of feeding rockers 6 to move away or approach synchronously laterally.

[0038] Reference Figure 2 , Figure 5 and Figure 7The working panel 11 is supported and connected to a wafer longitudinal linear motor 71 through an n-shaped fixed frame. Two wafer suction mechanisms 7 are both arranged on the wafer longitudinal linear motor 71 and driven to move longitudinally by the wafer longitudinal linear motor 71. One of the wafer suction mechanisms 7 is provided with an abnormality detection CCD machine 75. Each wafer suction mechanism 7 includes a wafer vertical movement motor 74, a wafer slide 73 and a wafer suction member 72. The wafer slide 73 is arranged on the wafer vertical movement motor 74. Two wafer vertical movement slide rails 731 are vertically arranged on the wafer slide 73. The wafer suction member 72 moves along the two wafer vertical movement motors. The slide rail 731 slides vertically, and the abnormality detection CCD machine 75 is fixed on the chip suction piece 72 of the corresponding chip suction mechanism 7. A chip bonding detection CCD machine 8 is provided above the chip bonding workbench 22. The chip bonding detection CCD machine 8 is fixed on the fixed frame and is located above the chip suction mechanism 7. It can be used to detect the placement position of the chip. The chip longitudinal movement linear motor 71 drives the two chip slides 73 and the two chip suction pieces 72 to move longitudinally. The chip suction piece 72 sucks the chip on the corresponding feeding rocker 6 and places it on the material sheet 16 of the chip bonding workbench 22, and then the chip bonding position is detected by the chip bonding detection CCD machine 8.

[0039] Reference Figure 1 , Figure 2 , Figure 5 and Figure 8 A discharging robot 9 is arranged above the discharging conveyor belt 15, and the discharging robot 9 includes a discharging transverse movement motor 93, a discharging vertical movement motor 95, a discharging slide 94, a rotating cylinder 92 and a discharging suction piece 91. The discharging slide 94 is arranged on a discharging fixed plate beside the discharging conveyor belt 15 for transverse and vertical movement. The discharging transverse movement motor 93 is fixed on the discharging fixed plate, and a discharging transverse movement slide rail 941 is arranged transversely on the discharging transverse movement slide rail 941. The discharging vertical movement motor 95 is fixed on the discharging slide 94. Two discharging vertical sliding rails 942 are provided at vertical intervals on the front side, and the rotating cylinder 92 is vertically slidably set on the two discharging vertical sliding rails 942. The discharging suction piece 91 is set at the output end of the rotating cylinder 92. The discharging transverse movement motor 93 drives the discharging vertical movement motor 95, the discharging slide 94, the rotating cylinder 92 and the discharging suction piece 91 to move horizontally together through a belt transmission. The discharging vertical movement motor 95 drives the discharging slide 94, the rotating cylinder 92 and the discharging suction piece 91 to move vertically (i.e., move up and down) together through another belt transmission and a screw rod, and the rotating cylinder 92 drives the discharging suction piece 91 to rotate 90 degrees.

[0040] Reference Figures 1 to 10 The working principle of the semiconductor double-station loading machine of the utility model is:

[0041] The blank 16 is placed in two blank placement trays 14 → the feeding robot 3 picks up two blanks 16 → places them on two stations of the feeding workbench 2 → the feeding workbench 2 transfers the two blanks 16 to the dispensing workbench 21 → the dispensing workbench 21 moves to the dispensing mechanism 4 for dispensing → the dispensing workbench 21 moves to the bottom of the dispensing detection CCD machine 5 for detection → the detection is completed → the dispensing workbench 21 transfers the blank 16 to the crystal bonding workbench 22 → the chip The suction mechanism 7 respectively sucks the chips from the two pairs of feeding shakers 6 and fixes them onto the two sheets 16 on the crystal bonding workbench 22 → the crystal bonding workbench 22 moves to the bottom of the crystal bonding detection CCD machine 8 for crystal bonding detection → the crystal bonding workbench 22 moves to the vicinity of the unloading workbench 23 and transfers the two sheets 16 to the unloading workbench 23 → the unloading robot 9 sucks the two sheets 16 from the unloading workbench 23 → the unloading robot 9 rotates 90 degrees and moves to place the sheets 16 on the unloading conveyor belt 15.

[0042] The semiconductor double-station loading machine of the utility model is provided with a total of four workbenches, namely, a feeding workbench 2, a glue dispensing workbench 21, a crystal bonding workbench 22 and a discharging workbench 23, on a work panel 11, and each workbench is provided with a double station, two sheets 16 are transferred from the feeding workbench 2 to the glue dispensing workbench 21, a glue dispensing mechanism 4 dispenses glue, and the glue dispensing workbench 21 transfers the glued sheets 16 to the crystal bonding workbench 22, a chip suction mechanism 7 sucks the chip on the feeding rocker 6 and places it on the glued sheet 16 for crystal bonding, and the crystal bonding workbench 22 transfers the crystal bonded sheet to the discharging workbench 23, thereby realizing the simultaneous processing of two sheets 16, simplifying the process flow, greatly improving the production efficiency, and reducing the labor cost.

[0043] The above disclosure is only a preferred embodiment of the present invention, which cannot be used to limit the scope of protection of the present invention. Therefore, equivalent changes made within the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A semiconductor double-station loading machine, comprising a frame, characterized in that: A feeding workbench, a glue dispensing workbench, a crystal bonding workbench and a discharging workbench are sequentially arranged on the working panel of the frame along the transverse conveying direction of the material sheet; two workstations are arranged in parallel on each of the feeding workbench, the glue dispensing workbench, the crystal bonding workbench and the discharging workbench; the glue dispensing workbench and the crystal bonding workbench are both slidably arranged on the working panel; a glue dispensing mechanism is arranged on the side of the glue dispensing workbench; two pairs of feeding rocking plates are arranged on the working panel; the crystal bonding workbench is located between the two pairs of feeding rocking plates; the same pair of feeding rocking plates are slidably arranged on the working panel transversely; a chip suction mechanism is arranged between the same pair of feeding rocking plates and the crystal bonding workbench for longitudinal movement.

2. The semiconductor double-station loading machine according to claim 1, characterized in that: The bottom of the glue dispensing workbench and the bottom of the crystal bonding workbench are respectively connected to the working panel in a transverse sliding manner through a slide plate, and the glue dispensing workbench and the crystal bonding workbench are respectively arranged on the corresponding slide plates in a longitudinal sliding manner.

3. The semiconductor double-station loading machine according to claim 2, characterized in that: Two dispensing and crystal-bonding slide rails are transversely and spaced apart and fixed on the working panel. Each of the slide plates is slidably arranged on the two dispensing and crystal-bonding slide rails. The two slide plates are driven to slide in opposite directions by the same dispensing and crystal-bonding driving source.

4. The semiconductor double-station loading machine according to claim 1, characterized in that: The structures of the feeding workbench, the dispensing workbench, the crystal bonding workbench and the discharging workbench are all the same.

5. The semiconductor double-station loading machine according to claim 4, characterized in that: The feeding workbench comprises a frame, on which two pairs of belt transmission structures are arranged in parallel. The two pairs of belt transmission structures are arranged in two stations in a one-to-one correspondence and are driven by the same active rotating shaft.

6. The semiconductor double-station loading machine according to claim 1, characterized in that: Two sheet placement trays are arranged at intervals at the feeding end of the working panel, and the feeding workbench is located between the two sheet placement trays. The sheets stored in the two sheet placement trays are transferred to the feeding workbench by a feeding robot.

7. The semiconductor double-station loading machine according to claim 1, characterized in that: Two pairs of feeding slide rails are fixed transversely and at intervals on the working panel, and the two pairs of feeding rockers are slidably arranged on the two pairs of feeding slide rails in a one-to-one correspondence, and the same pair of feeding rockers are driven by the same feeding driving source to slide in opposite directions.

8. The semiconductor double-station loading machine according to claim 1, characterized in that: One of the wafer suction mechanisms is provided with an abnormality detection CCD device, and the wafer suction mechanism comprises a wafer suction member.

9. The semiconductor double-station loading machine according to claim 1, characterized in that: A dispensing detection CCD machine is provided above the dispensing workbench, a solid crystal detection CCD machine is provided above the solid crystal workbench, a discharging conveyor belt is provided at the discharging end of the working panel, and a discharging robot is provided above the discharging conveyor belt.

10. The semiconductor double-station loading machine according to claim 9, characterized in that: The discharging robot includes a discharging slide, a rotating cylinder and a discharging suction piece. The discharging slide is arranged to move horizontally and vertically beside the discharging conveyor belt. The rotating cylinder is arranged to slide vertically on the discharging slide. The discharging suction piece is arranged at the output end of the rotating cylinder. The rotating cylinder drives the discharging suction piece to rotate 90 degrees.

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