Conductive connecting sheet, conductive connecting sheet array and packaging body

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a conductive connecting piece, a conductive connecting piece array and a packaging body. The conductive connecting piece provided by the utility model comprises a first connecting part, a middle connecting part and a second connecting part, the first connecting part is provided with a first notch; the second connecting part is provided with a second notch; the first side and the second side, opposite to each other, of the middle connecting part are connected with the first connecting part and the second connecting part respectively, and the middle connecting part protrudes relative to the first connecting part and the second connecting part. Wherein the width of the first connecting part is smaller than that of the second connecting part. According to the scheme, overflowing and exhausting of the soldering paste are facilitated, the short circuit phenomenon is avoided, the welding reliability is guaranteed, meanwhile, packaging impedance and inductive reactance can be greatly reduced, and the application field is wide.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a conductive connecting piece, a conductive connecting piece array and a packaging body. Background Art

[0002] In the prior art, a conductive connecting piece (CLIP FRAME) can replace wires to connect chip electrodes and pins. The conductive connecting piece can usually include a clip for electrical and mechanical connection with the chip. Compared with traditional wire bonding, it can greatly improve the electrical and thermal performance of semiconductor components, achieve more reliable contact, improve the reliability and stability of semiconductor packaging, and improve product yield.

[0003] In the packaging process, it is usually necessary to solder the conductive connecting piece to the semiconductor device through a solder paste including lead, tin and silver powder and other additives such as flux media to achieve electrical and mechanical connection between the conductive connecting piece and the semiconductor device, and then achieve electrical and mechanical connection between the outside and the inside of the semiconductor device.

[0004] However, the above structure often causes solder paste overflow, resulting in a short circuit between the chip electrode and the pin; there is also a situation where air cannot be discharged, resulting in unstable welding and affecting the yield. In addition, the existing conductive connecting sheet structure is not suitable for certain specific application scenarios. Utility Model Content

[0005] The present application provides a conductive connecting sheet that can effectively solve the above or other potential technical problems.

[0006] The first aspect of the present application is to provide a conductive connecting sheet, including a first connecting part, an intermediate connecting part and a second connecting part; the first connecting part is provided with a first notch; the second connecting part is provided with a second notch; the first side and the second side opposite to the intermediate connecting part are respectively connected to the first connecting part and the second connecting part, and the intermediate connecting part protrudes compared to the first connecting part and the second connecting part; wherein the width of the first connecting part is smaller than that of the second connecting part.

[0007] In an optional embodiment according to the first aspect, at least one first notch is provided on the first connecting portion, and the at least one first notch divides the first connecting portion into at least two first connecting branches.

[0008] In an optional embodiment according to the first aspect, at least two second notches are provided on the second connecting portion, and the at least two second notches are evenly distributed on the second connecting portion to divide the second connecting portion into a plurality of second connecting branches.

[0009] In an optional embodiment according to the first aspect, the first notch and the second notch are U-shaped holes.

[0010] In an optional embodiment according to the first aspect, the first connecting portion is close to the third side of the intermediate connecting portion.

[0011] In an optional embodiment according to the first aspect, the conductive connecting piece is L-shaped as a whole.

[0012] In an optional embodiment according to the first aspect, a middle hole is provided on the middle connecting portion.

[0013] In an optional embodiment according to the first aspect, the first connecting portion, the middle connecting portion and the second connecting portion are not on the same plane.

[0014] A second aspect of the present application also provides a conductive connecting piece array, comprising at least two of the above-mentioned conductive connecting pieces.

[0015] The third aspect of the present application also provides a package body, including a wafer, a frame and the above-mentioned conductive connecting sheet, the wafer is arranged on a base island of the frame, the first connecting part is electrically connected to the wafer, and the second connecting part is electrically connected to a pin of the frame.

[0016] The conductive connecting sheet provided in the embodiment of the present application includes a first connecting portion, an intermediate connecting portion and a second connecting portion; the first connecting portion is provided with a first notch; the second connecting portion is provided with a second notch; the first side and the second side opposite to the intermediate connecting portion are respectively connected to the first connecting portion and the second connecting portion, and the intermediate connecting portion is protruding compared to the first connecting portion and the second connecting portion; wherein the width of the first connecting portion is smaller than that of the second connecting portion. The solution of the present application facilitates solder paste overflow and exhaust, thereby avoiding short circuits and ensuring the reliability of welding, and can greatly reduce package impedance and inductance, and has a wide range of applications.

[0017] Advantages of additional aspects of the present application will be given in part in the following description, and in part will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other purposes, features and advantages of the embodiments of the present application will become more easily understood through the following detailed description with reference to the accompanying drawings. In the accompanying drawings, multiple embodiments of the present application will be described in an exemplary and non-limiting manner, wherein:

[0019] Figure 1 A schematic diagram of the overall structure of the conductive connecting sheet provided in an embodiment of the present application at a first viewing angle;

[0020] Figure 2 A schematic diagram of the overall structure of the conductive connecting sheet provided in an embodiment of the present application at a second viewing angle;

[0021] Figure 3A schematic diagram of a conductive connecting sheet array provided in an embodiment of the present application;

[0022] Figure 4 A schematic diagram of an expanded conductive connection sheet array provided in an embodiment of the present application;

[0023] Figure 5 A schematic top view of an array of conductive connecting sheets provided in an embodiment of the present application;

[0024] Figure 6 A schematic top view of a curved assembly of a conductive connecting sheet array provided in an embodiment of the present application;

[0025] Figure 7 A schematic front cross-sectional view of a curved assembly of a conductive connecting sheet array provided in an embodiment of the present application.

[0026] Description of reference numerals:

[0027] 10. Conductive connecting piece; 11. First connecting part; 111. First notch; 112. First connecting branch; 13. Second connecting part; 131. Second notch; 132. Second connecting branch; 15. Middle connecting part; 151. Middle hole; 20. Chip; 30. Pin; 200. Connecting strip; 100. Lead frame assembly; 210. Bending assembly; 220. First positioning hole; 230. Second positioning hole; 240. Bending strip; 241. Bending angle. DETAILED DESCRIPTION

[0028] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0033] Conductive connecting sheets are used to connect chip electrodes and pins instead of wires. The conductive connecting sheets may generally include a clamp for electrical and mechanical connection to the chip. Compared with traditional wire bonding, it can greatly improve the electrical and thermal performance of semiconductor components, achieve more reliable contact, improve semiconductor packaging reliability and stability, and improve product yield. In the prior art, solder paste is generally used to achieve electrical and mechanical connection between the conductive connecting sheet and the semiconductor die. However, the above structure often has the phenomenon of solder paste overflow, resulting in a short circuit between the chip electrode and the pin; there may also be a situation where air cannot be discharged, resulting in unstable welding and affecting the yield. At the same time, the existing conductive connecting sheet structure is not suitable for certain specific application scenarios.

[0034] In view of this, the conductive connecting piece provided in the embodiment of the present application, by setting the first notch and the second notch, is convenient for solder paste overflow and air discharge, thereby avoiding short circuit. At the same time, discharging the air in the solder can ensure the reliability of the package and improve the product yield. Through the specific width and position design of the first connecting piece and the second connecting piece, the conductive connecting piece of the present application can be applied to specific packaging occasions, and the package impedance and inductance can be greatly reduced.

[0035] Please refer to Figure 1 and Figure 2 The conductive connecting sheet 10 provided in the embodiment of the present application includes a first connecting portion 11, an intermediate connecting portion 15 and a second connecting portion 13; the first connecting portion 11 is provided with a first notch 111; the second connecting portion 13 is provided with a second notch 131; the intermediate connecting portion 15 is used to connect the first connecting portion 11 and the second connecting portion 13, and the intermediate connecting portion 15 is protruding compared to the first connecting portion 11 and the second connecting portion 13; wherein the width of the first connecting portion 11 is smaller than the width of the second connecting portion 15. Figure 1 As shown, the first connection portion 11 is disposed on a first side of the middle connection portion 15; and the second connection portion 13 is disposed on a second side of the middle connection portion 15. The first side and the second side are opposite sides.

[0036] Need to explain, according to Figure 1 The top of the conductive connecting sheet 10 is the first side, the bottom is the second side, the right side is the third side, and the left side is the fourth side.

[0037] The first notch 111 and the second notch 131 are provided to facilitate solder paste overflow, thereby avoiding short circuits, and to facilitate air discharge, thereby ensuring the reliability and stability of welding and chip packaging yield. The position and width of the first connecting portion 11 and the second connecting portion 15 can make the conductive connecting sheet 10 of the present application suitable for packaging small chips to cover the Clip design, and can be applied to various types of medium and high power MOS tube packaging.

[0038] In an optional exemplary embodiment, at least one first notch 111 is disposed on the first connection portion 11 , and the at least one first notch 111 divides the first connection portion 11 into at least two first connection branches 112 .

[0039] As an example, Figure 1, a first notch 111 is provided on the first connection part 11. Specifically, in this embodiment, the number of the first notch 111 on the first connection part 11 is one, and the first notch 111 divides the first connection part 11 into two first connection branches 112. That is, the first notch 111 extends inward from the edge of the first connection part 11 in a long strip shape, so the first connection part 11 is divided into two first connection branches 112. Such a configuration does not affect the stability of the original connection, and provides space for the excess solder paste and residual air to overflow.

[0040] It is understandable that the specific number of the first notches 111 is not limited here. In other specific embodiments, the number of the first notches 111 can be set to two or more according to the specific needs of the user.

[0041] In an optional exemplary embodiment, at least two second notches 131 are provided on the second connection portion 13, and the at least two second notches 131 are evenly distributed on the second connection portion 13 to divide the second connection portion 13 into a plurality of second connection branches 132. The second connection portion 13 is provided wider than the first connection portion 11, and therefore, more notches can be provided than the first connection portion 11 to facilitate the overflow of solder paste and air. It is understood that the number of second notches 131 on the second connection portion 13 is not limited here, and in other specific embodiments, the number of second notches 131 can also be set to other numbers according to user needs.

[0042] Figure 1 Taking two second notches 131 as an example, the second notches 131 divide the second connection portion 13 into three second connection branches 132. Such an arrangement does not affect the stability of the original connection, and provides a space for the excess solder paste to overflow.

[0043] It is understandable that the specific number of the second notches 131 is not limited here. In other specific embodiments, the number of the second notches 131 can be set to three or more according to the specific needs of the user.

[0044] In an optional exemplary embodiment, the first notch 111 is a U-shaped hole. It should be noted that, specifically, in this embodiment, the first notch 111 is set as a U-shaped hole. The U-shaped hole has a simple structure and is easy to process. At the same time, based on the smooth shape of the U-shaped structure itself, it can effectively reduce the risk of breakage under stress. It is understandable that the specific shape of the first notch 111 is not limited here. In other specific embodiments, the first notch 111 can also be set to other suitable shapes according to the specific needs of the user.

[0045] In an optional exemplary embodiment, the second notch 131 is a U-shaped hole. It should be noted that, specifically, in this embodiment, the second notch 131 is set as a U-shaped hole. The U-shaped hole has a simple structure and is easy to process. At the same time, based on the smooth shape of the U-shaped structure itself, it can effectively reduce the risk of breakage under stress. It is understandable that the specific shape of the second notch 131 is not limited here. In other specific embodiments, the second notch 131 can also be set to other suitable shapes according to the specific needs of the user.

[0046] In an alternative exemplary embodiment, the first connecting portion 11 is close to a third side of the intermediate connecting portion 13 . Figure 1 In the embodiment, the third side is the right side of the conductive connecting sheet 10. This arrangement ensures that the conductive connecting sheet 10 is suitable for packaging small chips and covering Clip design, and can be applied to some specific packaging scenarios, such as various medium and high power MOS tube packaging.

[0047] In an alternative exemplary embodiment, the conductive connecting sheet 10 is L-shaped as a whole.

[0048] In an alternative exemplary embodiment, a middle hole 151 is provided on the middle connecting portion 15 .

[0049] It should be noted that, specifically, a middle hole 151 is provided on the middle connecting portion 15. The middle hole 151 can effectively release stress, that is, avoid the phenomenon that the conductive connecting sheet 10 is torn during the pulling process due to stress concentration.

[0050] In an alternative exemplary embodiment, if Figure 1-Figure 2 As shown, the first connection portion 11 , the middle connection portion 15 and the second connection portion 13 are not on the same plane, and the middle connection portion 15 is protruding compared to the first connection portion 11 and the second connection portion 13 .

[0051] Specifically, in an optional exemplary embodiment, the first connection portion 11 is bonded to the chip 20 by a conductive adhesive (or soldered); the second connection portion 13 is bonded to the pin 30 by a conductive adhesive (or soldered). Conductive adhesive bonding is stable and easy to operate.

[0052] In an optional exemplary embodiment, the conductive connecting sheet 10 provided in the present application is a copper sheet with excellent heat dissipation performance.

[0053] The present application also provides a conductive connecting sheet array 100 , comprising at least two of the conductive connecting sheets 10 described above.

[0054] like Figures 3 to 7 As shown, the embodiment of the present application further provides a conductive connecting sheet array 100 , comprising a plurality (at least two) of the above-mentioned conductive connecting sheets 10 .

[0055] As an example, the conductive connecting piece array 100 includes a plurality of conductive connecting pieces 10 and a plurality of curved components 210. The plurality of conductive connecting pieces 10 are arranged in an array, and the body of each conductive connecting piece 10 is connected to the connecting bar 200 through a connecting rib. A plurality of curved components 210 are arranged on the connecting bar 200, and the plurality of curved components 210 are arranged one-to-one with the plurality of conductive connecting pieces 10, and each curved component 210 is arranged between the bodies of adjacent conductive connecting pieces 10 along the length direction of the conductive connecting piece array 100.

[0056] like Figure 3 The conductive connecting sheet array 100 is a roll structure, and the bending component 210 acts as a spacer between layers at the frame to prevent the conductive connecting sheet 10 from deforming. In addition, the bending component 210 also has the functions of positioning and facilitating the dragging of materials.

[0057] Each bending assembly 210 includes at least one bending strip 240. The first end of the bending strip 240 is connected to the connecting strip 200, and the second end of the bending strip 240 is a free end, that is, the second end of the bending strip 240 is no longer connected to the connecting strip 200, so that the bending strip 240 has a certain elasticity.

[0058] As an example, the included angle between the first end of the bending strip and the connecting strip 200 is 120 degrees, the bending angle 241 of the bending strip itself is 68 degrees, and the bending angle of the bending strip is set toward the bending component 210 .

[0059] The plurality of conductive connecting sheets 10 are arranged in rows on the connecting strip 200, and can be arranged in one row, two rows or more rows as required. In this embodiment, two rows are taken as an example for description.

[0060] A plurality of first positioning holes 220 are provided on the connecting bar 200, and the first positioning holes 220 are located at the edge of the connecting bar 200. The number of the first positioning holes 220 is consistent with the number of the conductive connecting sheets 10 in a row.

[0061] The connecting bar 200 is also provided with a second positioning hole 230, which is located in the middle of the connecting bar. At least two conductive connecting sheets 10 are provided between each two adjacent second positioning holes 230, and the number of conductive connecting sheets 10 between two adjacent second positioning holes 230 is equal.

[0062] The present application also provides a package body, including a wafer, a frame and the above-mentioned conductive connecting sheet 10, wherein the wafer is arranged on a base island of the frame, the first connecting portion 11 is electrically connected to the wafer, and the second connecting portion 13 is electrically connected to the pin 30 of the frame.

[0063] The package provided in the embodiment of the present application includes the above-mentioned conductive connecting piece 10, and therefore also has the above-mentioned technical effect of avoiding the short circuit phenomenon, reducing the overall weight of the conductive connecting piece 10, reducing the package impedance and inductance, improving the reliability of the connection, having good solderability, and having a wide range of applications.

[0064] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some or all of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the implementation modes of the present application.

[0065] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not further describe various possible combinations.

Claims

1. A conductive connecting sheet, characterized in that: It includes a first connecting portion, an intermediate connecting portion and a second connecting portion; The first connecting portion is provided with a first notch; The second connecting portion is provided with a second notch; The first side and the second side opposite to the middle connecting portion are respectively connected to the first connecting portion and the second connecting portion, and the middle connecting portion is protruding compared to the first connecting portion and the second connecting portion; Wherein, the width of the first connecting portion is smaller than the width of the second connecting portion.

2. The conductive connecting sheet according to claim 1, characterized in that: At least one first notch is disposed on the first connecting portion, and the at least one first notch divides the first connecting portion into at least two first connecting branches.

3. The conductive connecting sheet according to claim 2, characterized in that: At least two second notches are arranged on the second connection part, and the at least two second notches are evenly distributed on the second connection part, so as to divide the second connection part into a plurality of second connection branches.

4. The conductive connecting sheet according to claim 1, characterized in that: The first notch and the second notch are U-shaped holes.

5. The conductive connecting sheet according to claim 4, characterized in that: The first connecting portion is close to a third side of the middle connecting portion.

6. The conductive connecting sheet according to claim 5, characterized in that: The conductive connecting piece is L-shaped as a whole.

7. The conductive connecting sheet according to claim 6, characterized in that: The middle connecting part is provided with a middle hole.

8. The conductive connecting sheet according to any one of claims 1 to 7, characterized in that: The first connection portion, the middle connection portion and the second connection portion are not on the same plane.

9. A conductive connecting sheet array, characterized in that: The method comprises at least two conductive connecting sheets according to any one of claims 1 to 8.

10. A package, characterized in that: It comprises a wafer, a frame and a conductive connecting sheet as described in any one of claims 1 to 8, wherein the wafer is arranged on a base island of the frame, the first connecting portion is electrically connected to the wafer, and the second connecting portion is electrically connected to a pin of the frame.

Images