Laser

Abstract

The embodiment of the utility model belongs to the laser technology, and provides a laser. The laser comprises a bottom plate, a frame, a light-emitting chip and a light-transmitting component, the frame is arranged on the bottom plate, the frame and the bottom plate define a containing space, the light-emitting chip is arranged on the bottom plate, light beams emitted by the light-emitting chip are emitted through the light-transmitting component, the side, away from the bottom plate, of the frame is provided with a first face and a second face, and the distance between the first face and the bottom plate is larger than the distance between the second face and the bottom plate. The distance between the second face and the bottom plate is larger than the distance between the second face and the bottom plate, the light-transmitting component covers the second face, the outer periphery of the light-transmitting component and the frame are arranged in a spaced mode, and a first installation position is formed. The second surface is provided with at least one second installation position, and the light-transmitting component covers the second installation position. The first mounting position and the second mounting position are arranged on the frame at the same time, and under the condition that the boundary dimension of the laser is not increased, the same packaging structure is used for achieving packaging in different modes, so that the same packaging structure can be applied to scenes with different reliability requirements.

Description

Technical Field

[0001] The embodiments of the present application relate to laser technology, and more particularly to a laser. Background Art

[0002] In recent years, with the increase in laser application scenarios, the demand for lasers has also steadily increased. Different application scenarios have different requirements for laser packaging, especially the impact of ambient temperature, which directly affects the reliability and life of the laser.

[0003] In scenarios with high reliability requirements, the laser is packaged through a high-reliability connection method, that is, after the internal light-emitting chip is mounted, the tube shell is packaged through a high-reliability connection method, which can be used in complex environments (-65℃-150℃), such as automotive, aerospace and other application fields. In ordinary environmental scenarios (-10℃-65℃), such as home use and AR / VR products, the ambient temperature is not particularly high, and the requirements for packaging reliability are relatively low. From the perspective of resources and costs, it is not appropriate to use a high-reliability packaging method, and a low-reliability packaging method is usually used.

[0004] However, different packaging methods are quite different, and the corresponding tube shell structures are also quite different. When using different packaging methods, the structural compatibility of the laser is poor, and the same tube shell cannot be used to achieve different packaging methods. Utility Model Content

[0005] The embodiment of the present application provides a laser that can use the same tube shell to achieve different packaging methods without increasing the size of the laser.

[0006] The present application provides a laser, including:

[0007] Base plate;

[0008] A frame is arranged on the bottom plate and encloses a receiving space with the bottom plate;

[0009] The light emitting chip is arranged on the bottom plate and is located in the accommodation space;

[0010] A light-transmitting component is arranged on a side of the frame away from the bottom plate;

[0011] The light beam emitted by the light emitting chip is emitted through the light-transmitting component;

[0012] The frame has a first surface and a second surface on a side facing away from the bottom plate, and the distance between the first surface and the bottom plate is greater than the distance between the second surface and the bottom plate;

[0013] The light-transmitting component covers the second surface, the outer periphery of the light-transmitting component is spaced apart from the frame, and a first mounting position is formed; at least one second mounting position is arranged on the second surface, and the light-transmitting component covers the second mounting position;

[0014] The first installation position is arranged around the outer periphery of at least one second installation position.

[0015] In this way, by setting the first mounting position and the second mounting position on the frame at the same time, the sealing between the light-transmitting component and the frame is achieved, so that the same packaging structure can achieve both high-reliability packaging and low-reliability packaging. Without increasing the external dimensions of the laser, the same packaging structure can be used to achieve different packaging methods, so that the same packaging structure can be applied to scenarios with different reliability requirements.

[0016] In some embodiments of the present application, the second installation position is arranged around the accommodating space;

[0017] And / or, the frame has a side edge on a side facing away from the bottom plate, and the side edge surrounds the periphery of the first mounting position and the second mounting position;

[0018] A gap is arranged between the second installation position and the inner side wall of the side edge.

[0019] In this way, the light-transmitting component can well seal the accommodation space through the second installation position, so that there is no overlapping part between the first installation position and the second installation position, and no waste is caused to the second installation position.

[0020] In some embodiments of the present application, when at least two second mounting positions are provided, the at least two second mounting positions are spaced apart from each other, the first mounting position is arranged outside the at least two second mounting positions, and there is a gap between the first mounting position and each second mounting position.

[0021] In this way, there will be no overlap between different installation positions, and no installation positions will be wasted.

[0022] In some embodiments of the present application, the frame is a non-metallic part, and a metal layer is at least partially provided on the second surface, the metal layer forms the second mounting position, and the metal layer is used for welding;

[0023] And / or, the first installation position is filled with adhesive.

[0024] In this way, by providing a metal layer, the non-metallic frame can be welded to other parts; by providing an adhesive, the non-metallic frame can be glued to other parts.

[0025] In some embodiments of the present application, a step is provided between the first surface and the second surface of the frame, the step is close to the first surface, and the step surface of the step is lower than the first surface.

[0026] In this way, when the glue in the first installation position overflows, the overflowing glue first overflows onto the step, thereby reducing the glue overflowing onto the outer side wall of the frame.

[0027] In some embodiments of the present application, the ratio of the distance between the first surface and the second surface to the width of the first mounting position is greater than 1;

[0028] The ratio of the distance between the first surface and the second surface to the width of the first mounting position is less than 3.

[0029] In this way, the distance between the first surface and the second surface, and the width of the first mounting position are in a relatively reasonable state, and the width of the first mounting position is not smaller, or the distance between the first surface and the second surface is not smaller, thereby improving the packaging effect.

[0030] In some embodiments of the present application, the distance between the first surface and the second surface is greater than or equal to 0.2 mm;

[0031] The distance between the first surface and the second surface is less than or equal to 1 mm.

[0032] In this way, the distance between the first surface and the second surface is in a relatively reasonable state, the light-transmitting component will not be too close to the light-emitting chip or even cause size interference, and the distance between the first surface and the second surface will not be too small, thereby improving the sealing effect.

[0033] In some embodiments of the present application, the thickness of the side edge is greater than or equal to 0.5 mm;

[0034] The thickness of the side edge is less than or equal to 1 mm.

[0035] In this way, the thickness of the side edge is kept in a relatively reasonable state, the overall size of the laser will not be increased, which is conducive to the miniaturization of the laser; and the sealing structure of the laser installation will not be affected.

[0036] In some embodiments of the present application, at least a portion of the surface of the light-transmitting component facing away from the bottom plate is higher than the first surface.

[0037] In this way, when the glue in the first installation position overflows, the overflowing glue will not overflow onto the light-transmitting component, and will not affect the light-transmitting effect of the light-transmitting component.

[0038] In some embodiments of the present application, a sealing ring is provided on the first surface of the frame;

[0039] And / or, a gap is provided between the outer edge of the light-transmitting component and the inner edge of the sealing ring.

[0040] In this way, sealing between the laser and the light source housing can be achieved, and the sealing ring will not block the light-transmitting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0042] Figure 1 A first structural schematic diagram of a laser provided in some embodiments of the present application;

[0043] Figure 2 A second structural schematic diagram of a laser provided in some embodiments of the present application;

[0044] Figure 3 A schematic diagram of the structure of a laser at a first installation position provided in some embodiments of the present application;

[0045] Figure 4 A schematic diagram of the structure of the second installation position of the laser provided in some embodiments of the present application;

[0046] Figure 5 A schematic diagram of the overall structure of a laser provided in some embodiments of the present application;

[0047] Figure 6 A schematic diagram of the explosion structure of a laser provided in some embodiments of the present application;

[0048] Figure 7 A schematic diagram of the structure of a base plate and a frame of a laser provided in some embodiments of the present application;

[0049] Figure 8 A schematic diagram of the structure of a bottom plate of a laser provided in some embodiments of the present application;

[0050] Fig. 9 A schematic diagram of the structure of a step of a laser provided in some embodiments of the present application;

[0051] Fig.10 A schematic diagram of the dimensions of a first mounting position of a laser provided in some embodiments of the present application.

[0052] Reference numerals:

[0053] 100-base plate;

[0054] 200-frame;

[0055] 202- steps;

[0056] 203-side 1;

[0057] 204-side 2;

[0058] 300-light-transmitting parts;

[0059] 400-first installation position;

[0060] 500-second installation position;

[0061] 600-seal ring;

[0062] 700-luminescent chip. DETAILED DESCRIPTION

[0063] In related technologies, in scenarios with high reliability requirements, laser packaging is achieved through high-reliability connection methods (such as welding), that is, after the internal light-emitting chip is mounted, the tube shell is connected through a high-reliability connection method to achieve laser packaging, which can be used in complex environments (-65℃-150℃), such as automotive, aerospace and other application fields. In ordinary environmental scenarios (-10℃-65℃), such as home use and AR / VR products, the ambient temperature is not particularly high, and the requirements for packaging reliability are relatively low. From the perspective of resources and costs, it is not appropriate to use high-reliability packaging methods (such as welding methods), and packaging methods with lower reliability (such as gluing methods) are usually used. However, different packaging methods (such as welding methods and gluing methods) vary greatly, and the corresponding tube shell structures also vary greatly. When different packaging methods are used, the structural compatibility of the laser is poor, and the same tube shell cannot be used to achieve different packaging methods.

[0064] In view of this, some embodiments of the present application provide a laser, including a base plate, a frame, a light-emitting chip and a translucent component, wherein the frame is arranged on the base plate and encloses a receiving space with the base plate, the light-emitting chip is arranged on the base plate and is located in the receiving space, the translucent component is arranged on the side of the frame away from the base plate, and the light beam emitted by the light-emitting chip is emitted through the translucent component, and the side of the frame away from the base plate has a first surface and a second surface, and the distance between the first surface and the base plate is greater than the distance between the second surface and the base plate, wherein the translucent component covers the second surface, and the outer periphery of the translucent component is spaced from the frame, and a first mounting position is formed; at least one second mounting position is arranged on the second surface, the translucent component covers the second mounting position, and the first mounting position is arranged around the periphery of at least one second mounting position. By simultaneously arranging the first mounting position and the second mounting position on the frame, the sealing between the translucent component and the frame is realized, so that the same packaging structure can realize both high-reliability packaging and low-reliability packaging, and the same packaging structure is used to realize different packaging methods without increasing the outer dimensions of the laser, so that the same packaging structure can be applied to scenes with different reliability requirements.

[0065] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0066] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0067] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components explicitly listed but may include other components not explicitly listed or inherent to such products or devices.

[0068] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0069] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0070] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0071] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0072] Figure 1 A first structural schematic diagram of a laser provided in some embodiments of the present application; Figure 2 A second structural schematic diagram of a laser provided in some embodiments of the present application; Figure 3 A schematic diagram of the structure of a laser at a first installation position provided in some embodiments of the present application; Figure 4 A schematic diagram of the structure of the second installation position of the laser provided in some embodiments of the present application; Figure 5 A schematic diagram of the overall structure of a laser provided in some embodiments of the present application; Figure 6 A schematic diagram of the explosion structure of a laser provided in some embodiments of the present application; Figure 7 A schematic diagram of the structure of a base plate and a frame of a laser provided in some embodiments of the present application; Figure 8 A schematic diagram of the structure of a bottom plate of a laser provided in some embodiments of the present application; Fig. 9 A schematic diagram of the structure of a step of a laser provided in some embodiments of the present application; Fig.10 A schematic diagram of the dimensions of a first mounting position of a laser provided in some embodiments of the present application.

[0073] See also Figure 1-Figure 6 The embodiment of the present application provides a laser, including: a base plate 100 and a frame 200, wherein the frame 200 is disposed on the base plate 100 and encloses a receiving space with the base plate 100. The base plate 100 can be used to support the frame 200.

[0074] In some embodiments of the present application, the bottom plate 100 includes a surface close to the frame 200 and a surface away from the frame 200, the frame 200 includes a surface close to the bottom plate 100 and a surface away from the bottom plate 100, and the surface of the frame 200 close to the bottom plate 100 is fixedly mounted on the surface of the bottom plate 100 close to the frame 200. The frame 200 can be fixedly mounted on the bottom plate 100, for example, the frame 200 can be fixedly mounted on the bottom plate 100 by welding, gluing, bolting, etc.

[0075] See also Figure 1-Figure 4In some embodiments of the present application, the laser further includes a light-emitting chip 700 and a light-transmitting component 300. The light-emitting chip 700 is disposed on the base plate 100 and is located in the accommodating space. The light-transmitting component 300 is disposed on a side of the frame 200 away from the base plate 100. The light beam emitted by the light-emitting chip 700 is emitted through the light-transmitting component 300.

[0076] In some embodiments of the present application, the light emitting chip 700 is packaged in a space enclosed by the base plate 100 , the frame 200 and the light transmissive component 300 , and the frame 200 supports the light transmissive component 300 .

[0077] In some embodiments of the present application, the light-transmitting component 300 may be a light window, which may allow light to pass through.

[0078] In some embodiments of the present application, the light emitting chip 700 may be fixedly mounted on the base plate 100. For example, the light emitting chip 700 may be fixedly mounted on the base plate 100 by welding, bolting, or the like.

[0079] In some embodiments of the present application, the laser may include at least one group of light-emitting chips 700 , and the number of the accommodating spaces corresponds to the number of the light-emitting chips 700 .

[0080] See also Figure 1-Figure 2 In some embodiments of the present application, the side of the frame 200 facing away from the base plate 100 has a first surface 203 and a second surface 204, and the distance between the first surface 203 and the base plate 100 is greater than the distance between the second surface 204 and the base plate 100.

[0081] In some embodiments of the present application, the first surface 203 and the second surface 204 are planes at different heights of the frame 200 , and the distances between the first surface 203 and the second surface 204 and the bottom plate 100 are not equal.

[0082] In some embodiments of the present application, the light-transmitting component 300 covers the second surface 204 , the outer periphery of the light-transmitting component 300 is spaced apart from the frame 200 , and a first mounting position 400 is formed.

[0083] In some embodiments of the present application, a U-shaped gap may be formed between the outer periphery of the light-transmitting component 300 and the frame 200 , and the U-shaped gap may be the first mounting position 400 , and the widths of different positions of the first mounting position 400 may be equal or unequal.

[0084] In some embodiments of the present application, at least one second mounting position 500 is disposed on the second surface 204 , the light-transmissive component 300 covers the second mounting position 500 , and the first mounting position 400 is disposed around the periphery of the at least one second mounting position 500 .

[0085] In some embodiments of the present application, the positions of the first installation position 400 and the at least one second installation position 500 may be staggered, that is, the positions of the first installation position 400 and the at least one second installation position 500 do not overlap, thereby reducing waste of installation positions.

[0086] By simultaneously setting the first mounting position 400 and the second mounting position 500 on the frame 200, sealing is achieved between the light-transmitting component 300 and the frame 200, so that the same packaging structure can achieve both high-reliability packaging and low-reliability packaging. Without increasing the external dimensions of the laser, the same packaging structure can be used to achieve different packaging methods, so that the same packaging structure can be applied to scenarios with different reliability requirements.

[0087] In some embodiments of this application, please refer to Figure 1 The second installation position 500 is arranged around the accommodating space.

[0088] In some embodiments of the present application, the second mounting position 500 may be annular, and the annular second mounting position 500 is arranged around the accommodating space. The second mounting position 500 may enable the light-transmitting component 300 to well seal the accommodating space.

[0089] In some embodiments of this application, please refer to Figure 1-Figure 2 and Figure 8 The frame 200 has a side edge on a side facing away from the bottom plate 100 , and the side edge surrounds the outer periphery of the first mounting position 400 and the second mounting position 500 , and a gap is set between the second mounting position 500 and the inner side wall of the side edge.

[0090] In some embodiments of the present application, the end surface of the side edge facing toward or away from the base plate 100 can be in a U-shape, the end surface of the side edge facing toward the base plate 100 can be flush with the second surface 204, and the end surface of the side edge away from the base plate 100 can be flush with the first surface 203, and the first mounting position 400 and the second mounting position 500 are located in the enclosing cavity of the side edge.

[0091] In some embodiments of the present application, the first mounting position 400 can be set in the gap between the second mounting position 500 and the inner wall of the side edge, so that there is no overlapping part between the first mounting position 400 and the second mounting position 500, and no waste is caused on the second mounting position 500.

[0092] In some embodiments of this application, please refer to Figure 1-Figure 7 , the frame 200 is a non-metallic part.

[0093] In some embodiments of the present application, the material of the frame 200 may be glass or ceramic, etc., and a ceramic frame 200 is preferred.

[0094] It should be noted that, since solder cannot wet the surface of ceramics, ceramics cannot be directly welded to other components. Therefore, the second surface 204 of the frame 200 needs to be metallized.

[0095] In some embodiments of this application, please refer to Figure 1 A metal layer is at least partially disposed on the second surface 204 , and the metal layer forms a second mounting position 500 , and the metal layer is used for welding.

[0096] In some embodiments of the present application, a metal layer can be formed on the second surface 204 by gold plating, copper plating or tin plating. Preferably, the metal layer is formed by gold plating on the second surface 204, and the welding of the frame 200 and the translucent component 300 is achieved by setting a solder layer between the metal layer and the translucent component 300.

[0097] In some embodiments of the present application, the laser includes a light-emitting chip 700 , and a ring-shaped metal layer is disposed on the second surface 204 .

[0098] In some embodiments of the present application, the laser includes a plurality of light-emitting chips 700 , and a plurality of annular metal layers are disposed on the second surface 204 .

[0099] In some embodiments of the present application, the second mounting position 500 covers the second surface 204 , and the second surface 204 is entirely provided with a metal layer.

[0100] It should be noted that the outer periphery of the light-transmitting component 300 is spaced from the frame 200 and forms a first mounting position 400. If the second surface 204 is entirely provided with a metal layer, the first mounting position 400 and the second mounting position 500 partially overlap, resulting in a waste of the second mounting position 500.

[0101] In some embodiments of the present application, a gap may be provided between the second mounting position 500 and the inner wall of the side edge, so that there is no overlapping portion between the first mounting position 400 and the second mounting position 500 and the second mounting position 500 is not wasted.

[0102] In some embodiments of this application, please refer to Figure 2-Figure 3 The first mounting position 400 is filled with adhesive.

[0103] In some embodiments of the present application, the frame 200 and the light-transmitting component 300 are bonded by filling the first mounting position 400 with adhesive. The first mounting position 400 can effectively control the direction and amount of glue overflow, increase the bonding area and thickness of the glue and the two materials, and improve the reliability of the glue dispensing process.

[0104] In some embodiments of this application, please refer to Figure 1-Figure 2, the distance between the first surface 203 and the second surface 204 is greater than or equal to 0.2 mm, and the distance between the first surface 203 and the second surface 204 is less than or equal to 1 mm.

[0105] In some embodiments of the present application, the distance between the first surface 203 and the second surface 204 can be 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, 1 mm, etc.

[0106] It should be noted that the distance between the first surface 203 and the second surface 204 is H, and H needs to be set reasonably. When the distance between the first surface 203 and the second surface 204 is too large, the light-transmitting component 300 will be closer to the light-emitting chip 700 and even size interference will occur. In addition, when the first surface 203 is higher than the end surface of the light-transmitting component 300 facing away from the base plate 100, when the glue in the first mounting position 400 overflows, the overflowing glue will flow to the light-transmitting component 300, affecting the light-transmitting effect of the light-transmitting component 300; when the distance between the first surface 203 and the second surface 204 is too small, the glue sealing effect is not ideal.

[0107] In some embodiments of the present application, the first surface 203 may be parallel to the second surface 204, and four side surfaces perpendicular to the first surface 203 and the second surface 204 may be provided between the first surface 203 and the second surface 204. The four side surfaces and the second surface 204 form a concave space, and the concave space may be a groove. The depth direction of the groove may be parallel to the vertical direction of the end surface of the frame 200 away from the bottom plate 100. The groove extends from the end surface away from the bottom plate 100 to the end surface close to the bottom plate 100, and the cross section along the extension direction is equal.

[0108] In some embodiments of the present application, the light-transmitting component 300 covers the bottom surface of the groove, and the width of the gap formed between the outer periphery of the light-transmitting component 300 and the groove wall of the groove can be Smm, that is, the width of the first installation position 400; the depth of the groove can be Hmm, that is, the depth of the first installation position 400, and the ratio of the depth H of the first installation position 400 to the width S of the first installation position 400 can be D, that is:

[0109] D=H*S / S 2

[0110] Here, H represents the depth of the first installation position 400 ; and S represents the width of the first installation position 400 .

[0111] In some embodiments of this application, please refer to Fig.10 The ratio of the distance between the first surface 203 and the second surface 204 to the width of the first mounting position 400 is greater than 1, and the ratio of the distance between the first surface 203 and the second surface 204 to the width of the first mounting position 400 is less than 3.

[0112] In some embodiments of the present application, the ratio of the distance between the first surface 203 and the second surface 204 to the width of the first mounting position 400 may be 1.5, 2.0, 2.5, or 1.2, 1.8, 2.3, etc.

[0113] It should be noted that the ratio of the depth of the first mounting position 400 to the width of the first mounting position 400 needs to be reasonably set. When the ratio of the depth of the first mounting position 400 to the width of the first mounting position 400 is too large, the width of the first mounting position 400 is small, and the glue sealing effect is not ideal; when the ratio of the depth of the first mounting position 400 to the width of the first mounting position 400 is too small, the depth of the first mounting position 400 is small, and the glue sealing effect is not ideal.

[0114] In some embodiments of this application, please refer to Figure 1-Figure 4 When at least two second mounting positions 500 are provided, at least two second mounting positions 500 are spaced apart from each other, the first mounting position 400 is disposed outside the at least two second mounting positions 500 , and there is a gap between the first mounting position 400 and each second mounting position 500 .

[0115] In some embodiments of the present application, there may be two second mounting positions 500, a gap is set between the two second mounting positions 500, the first mounting position 400 is arranged outside the two second mounting positions 500, and there is a gap between the first mounting position 400 and the two second mounting positions 500. There will be no overlap between different mounting positions, and no waste of mounting positions will be caused.

[0116] In some embodiments of the present application, there may be three second mounting positions 500, gaps are set between adjacent second mounting positions 500, the first mounting position 400 is arranged outside the three second mounting positions 500, and there are gaps between the first mounting position 400 and the three second mounting positions 500. Different mounting positions will not overlap, and no mounting positions will be wasted.

[0117] In some embodiments of this application, please refer to Figure 1-Figure 6 The light-transmitting component 300 is connected to the frame 200 by at least one of welding and gluing.

[0118] In some embodiments of the present application, the light-transmitting component 300 can be connected to the frame 200 by welding. For example, the light-transmitting component 300 can be connected to the second mounting position 500 by a gold-tin solder sheet to achieve sealing between the light-transmitting component 300 and the frame 200.

[0119] In some embodiments of the present application, the light-transmitting component 300 can be connected to the frame 200 by welding. The number of the light-transmitting components 300 can be one or more. The number of the light-transmitting components 300 is preferably consistent with the number of the light-emitting chips, and the light-transmitting component 300 covers the second mounting position 500.

[0120] In some embodiments of the present application, the light-transmitting component 300 can be connected to the frame 200 by gluing. For example, the edge of the light-transmitting component 300 and the frame 200 can be sealed by injecting glue into the first mounting position 400.

[0121] In some embodiments of the present application, the light-transmitting component 300 can be connected to the frame 200 by gluing. The number of the light-transmitting component 300 can be one or more. The number of the light-transmitting component 300 is preferably one, that is, an integral light-transmitting component, and the light-transmitting component 300 covers the second surface 204.

[0122] In some embodiments of the present application, the light-transmitting component 300 can be connected to the frame 200 by a combination of welding and gluing. For example, the light-transmitting component 300 can be connected to the second mounting position 500 by a gold-tin solder sheet to achieve sealing between the light-transmitting component 300 and the frame 200; and glue can also be injected into the first mounting position 400 to achieve sealing between the edge of the light-transmitting component 300 and the frame 200, thereby achieving double sealing between the light-transmitting component 300 and the frame 200.

[0123] In some embodiments of the present application, the light-transmitting component 300 can be connected to the frame 200 by welding and gluing. The number of light-transmitting components 300 is preferably one, that is, an integral light-transmitting component, and the light-transmitting component 300 covers the second surface 204.

[0124] In some embodiments of this application, please refer to Figure 1 and Fig. 9 A step 202 is provided between the first surface 203 and the second surface 204 of the frame 200 . The step 202 is close to the first surface 203 , and a step surface of the step 202 is lower than the first surface 203 .

[0125] In some embodiments of the present application, after the glue is injected into the first installation position 400, the glue may overflow. In order to reduce the adverse effects of the possible overflow problem, a step 202 may be provided on the side edge.

[0126] In some embodiments of the present application, when the glue in the first installation position 400 overflows, the overflowing glue first overflows onto the step 202 , thereby reducing the glue overflowing onto the outer wall of the frame 200 .

[0127] In some embodiments of this application, please refer to Figure 1-Figure 6At least a portion of the surface of the light-transmitting component 300 that faces away from the base plate 100 is higher than the first surface 203 .

[0128] In some embodiments of the present application, the distance between the first surface 203 and the second surface 204, that is, the depth of the groove is smaller than the thickness of the light-transmitting component 300 , so that the distance between at least a portion of the surface of the light-transmitting component 300 facing away from the base plate 100 and the base plate 100 is greater than the distance between the first surface 203 and the base plate 100 .

[0129] It should be noted that if the depth of the groove is greater than the thickness of the translucent component 300 , the thickness of the frame 200 will be larger, and when the glue in the first mounting position 400 overflows, the overflowing glue will flow to the translucent component 300 , affecting the light transmission effect of the translucent component 300 .

[0130] In some embodiments of this application, please refer to Figure 5-Figure 6 A sealing ring 600 is disposed on the first surface 203 of the frame 200 .

[0131] In some embodiments of the present application, the laser can be installed on the light source housing, and the sealing ring 600 is placed in the installation groove of the light source housing. The laser abuts against the sealing ring 600, and the sealing ring 600 is used to seal between the laser and the light source housing.

[0132] In some embodiments of this application, please refer to Figure 5-Figure 6 A gap is set between the outer edge of the translucent component 300 and the inner edge of the sealing ring 600.

[0133] In some embodiments of the present application, the outer edge size of the light-transmitting component 300 is less than or equal to the inner edge size of the sealing ring 600, so that the sealing ring will not block the light-transmitting component.

[0134] In some embodiments of this application, please refer to Figure 1-Figure 6 and Fig. 9 , the thickness of the side edge is greater than or equal to 0.5mm, and the thickness of the side edge is less than or equal to 1mm.

[0135] In some embodiments of the present application, the thickness of the side edge can be 0.5, 0.7, 0.9 and 1, or 0.6 and 0.8, etc.

[0136] In some embodiments of the present application, the thickness of the side edge can be Mmm, and M needs to be reasonably set. When the thickness of the side edge is too large, the overall size of the laser increases, which is not conducive to the miniaturization of the laser; when the thickness of the side edge is too small, it is not conducive to installing a sealing structure between the frame 200 and the shell of the laser.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0138] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A laser, characterized in that: include: Bottom plate (100); A frame (200) is arranged on the bottom plate (100) and encloses a receiving space with the bottom plate (100); A light emitting chip (700) is arranged on the base plate (100) and is located in the accommodation space; A light-transmitting component (300) is arranged on a side of the frame (200) away from the bottom plate (100); The light beam emitted by the light emitting chip (700) is emitted through the light-transmitting component (300); The frame (200) has a first surface (203) and a second surface (204) on a side facing away from the bottom plate (100), and the distance between the first surface (203) and the bottom plate (100) is greater than the distance between the second surface 204 and the bottom plate (100); The light-transmitting component (300) covers the second surface (204), the outer periphery of the light-transmitting component (300) is spaced apart from the frame (200), and a first mounting position (400) is formed; at least one second mounting position (500) is arranged on the second surface (204), and the light-transmitting component (300) covers the second mounting position (500); The first installation position (400) is arranged around the periphery of at least one of the second installation positions (500).

2. The laser according to claim 1, characterized in that The second installation position (500) is arranged around the accommodating space; And / or, the frame (200) has a side edge on a side facing away from the bottom plate (100), and the side edge surrounds the periphery of the first installation position (400) and the second installation position (500); A gap is provided between the second installation position (500) and the inner side wall of the side edge.

3. The laser according to claim 2, characterized in that When at least two of the second mounting positions (500) are provided, at least two of the second mounting positions (500) are arranged at intervals, the first mounting position (400) is arranged outside the at least two second mounting positions (500), and there is a gap between the first mounting position (400) and each of the second mounting positions (500).

4. The laser according to any one of claims 1 to 3, characterized in that: The frame (200) is a non-metallic part, and a metal layer is at least partially provided on the second surface (204), the metal layer forms the second mounting position (500), and the metal layer is used for welding; And / or, the first installation position (400) is filled with adhesive.

5. The laser according to any one of claims 1 to 3, characterized in that: A step (202) is provided between the first surface (203) and the second surface (204) of the frame (200); the step (202) is close to the first surface (203); and a step surface of the step (202) is lower than the first surface (203).

6. The laser according to any one of claims 1 to 3, characterized in that: The ratio of the distance between the first surface (203) and the second surface (204) to the width of the first mounting position (400) is greater than 1; The ratio of the distance between the first surface (203) and the second surface (204) to the width of the first mounting position (400) is less than 3.

7. The laser according to any one of claims 1 to 3, characterized in that: The distance between the first surface (203) and the second surface (204) is greater than or equal to 0.2 mm; The distance between the first surface (203) and the second surface (204) is less than or equal to 1 mm.

8. The laser according to any one of claims 2 or 3, characterized in that: The thickness of the side edge is greater than or equal to 0.5 mm; The thickness of the side edge is less than or equal to 1 mm.

9. The laser according to any one of claims 1 to 3, characterized in that: At least a portion of the surface of the light-transmitting component (300) that faces away from the bottom plate (100) is higher than the first surface (203).

10. The laser according to any one of claims 1 to 3, characterized in that: A sealing ring (600) is provided on the first surface (203) of the frame (200); And / or, a gap is provided between the outer edge of the light-transmitting component (300) and the inner edge of the sealing ring (600).

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