Heat dissipation module of circuit board

Abstract

The utility model relates to a heat dissipation module of a circuit board, which comprises the circuit board and a heat dissipation sheet, and the circuit board is provided with at least one wafer serving as a main heating source. And the radiating fins are correspondingly arranged on the outer surface of the wafer to export heat and radiate heat. The size of the heat dissipation module is reduced through the arrangement mode of heat dissipation aiming at the main heat source. When a plurality of groups of circuit boards are used side by side, the raised radiating fins can also abut against the adjacent circuit boards to form air flow channels, and gaps between the circuit boards are maintained, so that air flow can flow through to take away heat. Therefore, the heat dissipation module of the circuit board can improve the heat dissipation effect.

Description

Technical Field

[0001] The invention discloses a device used in the field of circuit board heat dissipation, especially a heat dissipation module for memory circuit boards used in workstations or servers with small assembly spacing. Background Art

[0002] In recent years, with the development of chip technology, chip circuit processes have become more and more sophisticated, with smaller volumes and higher working efficiency than before. However, high performance is accompanied by high power consumption. As power consumption increases, the heat generation also rises sharply. When the temperature of electronic components in the chip circuit continues to rise, the stability will begin to decrease. If the heat is not immediately discharged, the temperature will continue to rise and may even affect the performance or burn the components. Because traditional memory does not generate high heat, most of them rely solely on natural convection heat dissipation of the components themselves. As technology advances and the volume shrinks, the performance of memory chips increases, and the heat generation per unit area increases exponentially, and traditional natural heat dissipation is no longer sufficient. Therefore, external heat dissipation modules have begun to appear in memory to seek solutions to high heat generation.

[0003] The heat dissipation module of the existing memory is a full-coverage design, such as Figure 1 As shown in the disassembly diagram of the existing heat dissipation module, the heat dissipation module is divided into a first heat sink A1 and a second heat sink A2. By assembling the first heat sink A1 and the second heat sink A2, the heat dissipation module covers the entire memory. In addition, the memory particles 23 or chips are bonded to the inner sides of the first heat sink A1 and the second heat sink A2 to conduct the generated heat to the heat dissipation module. The good thermal conductivity of the heat dissipation module is used to conduct heat, increase the heat dissipation area and improve the heat dissipation effect. However, after the existing heat dissipation module is installed on the memory, the setting method of covering all electronic components will inevitably increase the total thickness of a single memory. In the past personal computer or server hardware architecture, the number of memory slots was small and the space was large enough to accommodate the thickened memory. Nowadays, in order to increase computing efficiency and functions, the number of slots in personal computers or server hosts has begun to increase; especially for server hosts or workstation hosts, most users will install several or even dozens of memories at the same time. The assembly space has shrunk, and restrictions have begun to be placed on the volume of the memory. In addition, in order to increase performance, some users use overclocking technology to increase the voltage to increase the memory's operating clock rate, that is, to increase the vibration frequency of the transistor to increase performance, which also leads to higher heat generation. Even if the existing heat dissipation device can be used, when multiple memory groups are installed on the motherboard, the thickened memory cannot provide enough space for air to circulate between the memories, which will also affect the memory's heat dissipation area and reduce the heat dissipation effect.

[0004] Taiwan Patent Nos. M608745, M401149 and M493085 disclose several existing heat dissipation module structures.

[0005] The inventor of this case has taken into account the shortcomings of the full-cover design of the existing memory heat dissipation module, which occupies too large a volume and is not conducive to heat dissipation when multiple memory groups are used side by side, and has actively and continuously developed a utility model that can solve the above problems. Utility Model Content

[0006] In view of the above-mentioned problems, the utility model mainly provides a heat dissipation device that covers the main heat sources, such as: power management integrated circuit (PMIC), register clock driver (RCD), reduces the volume of the heat dissipation module, reduces the thickness of the heat dissipation module, and increases the gap between multiple memory groups when they are used side by side.

[0007] In order to solve the above problems, the utility model provides a heat dissipation module for a circuit board, comprising a circuit board and a heat sink, wherein the circuit board is provided with at least one chip as a main heat source. The heat sink is correspondingly arranged on the surface of the chip, and the heat sink has good thermal conductivity for absorbing heat and dissipating it into the air.

[0008] Preferably, the heat sink has a groove, and the heat sink can be placed in the groove when connected to the chip, so as to improve the connection stability of the heat sink.

[0009] Preferably, the heat sink is a sheet with two relatively flat surfaces, one of which is connected to the surface of the wafer and can be adhered to the surface of the wafer using heat dissipation paste or thermally conductive adhesive.

[0010] A preferred embodiment of the utility model, wherein the heat sink has grooves, and the outer surface of the heat sink has grid-type, diamond-type, twill-type or cross-type grooves, which increase the heat dissipation surface area and avoid close fitting of heat sinks of adjacent storage devices side by side.

[0011] Preferably, the heat sink has fins, and the fins are formed on the outer surface of the heat sink to increase the heat dissipation surface area.

[0012] In a preferred embodiment of the utility model, when the storage devices are used side by side, the heat sink can abut against adjacent storage devices to form an air flow channel, thereby maintaining air circulation between adjacent storage devices and maintaining the heat dissipation effect.

[0013] Preferably, the first chip is an RCD for processing signals from a controller.

[0014] Preferably, the second chip is a PMIC for assisting in allocating power required by each module of the memory.

[0015] According to an embodiment of the present invention, the heat sink is made of metal or copper alloy.

[0016] In summary, the utility model reduces the volume of the heat dissipation module by using the design of the heat sink covering the main heat source. When the circuit boards are installed side by side, the protruding thickness of the heat dissipation module can push the adjacent circuit boards apart to avoid the circuit board components from contacting and fitting closely, thereby increasing the gap and improving the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional schematic diagram of the existing heat dissipation module;

[0018] Figure 2 It is an exploded perspective schematic diagram of an embodiment of the utility model;

[0019] Figure 3 It is a schematic diagram of the assembly of an embodiment of the utility model;

[0020] Figure 4 This is a schematic diagram of multiple groups of memory devices equipped with heat dissipation modules used side by side according to an embodiment of the utility model;

[0021] Figure 5 for Figure 3 The BB direction cross-sectional schematic diagram of the first embodiment of the utility model shown;

[0022] Figure 6 for Figure 3 The BB direction cross-sectional schematic diagram of the second embodiment of the utility model shown;

[0023] Figure 7 is a three-dimensional schematic diagram of a third embodiment of the utility model; and

[0024] Figure 8 It is a three-dimensional schematic diagram of the fourth embodiment of the utility model.

[0025]

Explanation of symbols

[0026] "existing"

[0027] A1: First heat sink

[0028] A2: Second heat sink

[0029] 《The utility model》

[0030] 1: Heat sink

[0031] 10: Groove

[0032] 11: Groove

[0033] 12: Fins

[0034] 13: Air flow channel

[0035] 2: Circuit Board

[0036] 21: First chip

[0037] 22: Second chip

[0038] 23: Memory particles

[0039] P: End face DETAILED DESCRIPTION

[0040] In order to facilitate the understanding of the utility model, the utility model is described in detail below in conjunction with the accompanying drawings and embodiments. The accompanying drawings provide a portion of the embodiments of the utility model, but not all of the embodiments. The utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making progressive efforts belong to the scope of protection of the utility model.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0042] Figures 2 to 8 Schematic diagram of the heat dissipation module of the circuit board of the utility model embodiment, such as Figure 2 The exploded perspective view of the embodiment of the utility model and Figure 3 As shown in the assembled three-dimensional schematic diagram of the embodiment of the utility model, the heat dissipation module of the circuit board of the utility model includes: a heat sink 1 and a circuit board 2. The circuit board 2 has a first chip 21, a second chip 22 and a plurality of memory particles 23. The heat sink is connected to the outer surfaces of the first chip 21 and the second chip 22 to absorb the heat generated by the first chip 21 and the second chip 22 and dissipate it into the air.

[0043] Furthermore, the first chip 21 and the second chip 22 are the main heat sources of the circuit board 2, and need to be responsible for regulating the power supply of multiple memory chips 23 and the circuit board 2. The utility model only connects the heat sink 1 to the main heat source of the circuit board 2 to reduce the volume of the heat dissipation module. In addition, compared with the bare chip without the heat dissipation module, the heat dissipation effect can be improved by 30% to 40%.

[0044] Specifically, the circuit board 2 is provided with at least one chip as the main heat source, and the heat sink 1 is correspondingly arranged on the surface of the chip. Through the good thermal conductivity of the heat sink 1, the heat of the chip is absorbed and the heat is taken away by the air flowing through the heat sink.

[0045] like Figure 4 As shown in the schematic diagram of the embodiment of the present invention, multiple groups of memory devices equipped with heat dissipation modules are used side by side, multiple groups of circuit boards 2 are used side by side and the heat sink 1 is installed on the surface of the chip. When the distance between adjacent circuit boards 2 is very small, the end surface P of the heat sink 1 can be pressed against the adjacent circuit board 2 to avoid adhesion, so as to maintain the air flow channel 13 for air flow to flow through and dissipate heat.

[0046] like Figure 5 of Figure 3 The first embodiment of the utility model is shown in the schematic diagram of the BB direction section. The heat sink 1 has a groove 10. The first chip 21 and the second chip 22 can be placed in the corresponding heat sink 1, so that the heat sink 1 completely covers the outer surface of the first chip 21 and the second chip 22 to increase the connection stability.

[0047] like Figure 6 of Figure 3 The schematic diagram of the second embodiment of the utility model is a cross-section along the BB direction, wherein the heat sink 1 can be a sheet with two relatively flat surfaces, one of which is connected to the surfaces of the first chip 21 and the second chip 22 and attached by thermal conductive glue or heat dissipation paste.

[0048] like Figure 7 As shown in the three-dimensional schematic diagram of the third embodiment of the utility model, the heat sink 1 has a groove 11 to increase the heat dissipation surface area.

[0049] Preferably, the groove 11 may be in a grid type, a diamond type, a twill type or a cross type.

[0050] like Figure 8 As shown in the three-dimensional schematic diagram of the fourth embodiment of the utility model, the heat sink has fins 12.

[0051] Preferably, the heat sink 1 is made of metal or copper alloy.

[0052] The above-mentioned embodiments only express the preferred implementation of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as a limitation on the claims of the present invention. It should be pointed out that, for ordinary technicians in this field, several changes and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A heat dissipation module for a circuit board, characterized in that: include: A circuit board provided with at least one chip as a main heat source; A heat sink is correspondingly arranged on the surface of the wafer; The heat sink has a groove, and the chip is placed in the groove.

2. The heat dissipation module for a circuit board according to claim 1, characterized in that: The heat sink has at least one groove.

3. The heat dissipation module for a circuit board according to claim 2, characterized in that: The grooves are formed in a grid type, a diamond type, a twill type or a cross type.

4. The heat dissipation module for a circuit board according to claim 1, characterized in that: The heat sink is formed with at least one fin.

5. The heat dissipation module for a circuit board according to claim 1, characterized in that: The heat sink is made of metal or copper alloy.

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