Wafer centering device and wafer gluing equipment

Abstract

The utility model provides a wafer centering device and wafer gluing equipment, comprising symmetrically arranged support driving assemblies, and a first centering block and a second centering block which are respectively arranged on the support driving assemblies, the opposite sides of the first centering block and the second centering block are both provided with arc grooves used for centering a wafer; an elastic piece and a check block are sequentially arranged on the side, away from the arc groove, of the first centering block, and the elastic piece is used for connecting the check block and the first centering block. The wafer gluing equipment comprises the wafer centering device. According to the wafer centering device provided by the utility model, the problem that a plant illuminating lamp bead which is high in universality and low in cost is lacked in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and in particular to a wafer centering device and wafer gluing equipment. Background Art

[0002] In the process of wafer manufacturing, automated equipment is usually used to implement the process flow. For example, in some occasions where wafers need to be transferred, robots are often used to transfer wafers. When using automated equipment to implement processes on wafers, the position coordinates of the wafer are more critical. Whether the position coordinates of the wafer are accurate determines whether the automated equipment can smoothly implement the process flow on the wafer. If the position coordinates of the wafer deviate, the automated equipment will not be able to implement the operation correctly, and may even cause serious errors in the wafer process, which will lead to process errors in the chip area on the upper surface of the wafer and cause the entire wafer to be scrapped. Therefore, before the automated equipment implements the process flow on the wafer, the wafer needs to be centered to determine the position coordinates of the center of the wafer.

[0003] The existing LED chip industry uses a hard-to-hard method to perform operations such as gluing, exposure, and development when physical alignment is used. That is, the wafer is taken out of the crystal box by a robotic arm and placed flat on the suction cups in the center of two centering blocks. The centering blocks clamp the wafer under the drive of the cylinder, and the suction cups then adsorb the wafer to the surface of the suction cups through vacuum pipes. Then the centering blocks release the clamps under the drive of the cylinder. This action ensures that the wafer is in the same position when it is transferred to the next unit. This action is called mechanical alignment.

[0004] However, since the centering blocks are mostly made of PEEK, ceramic and PP materials, this hard-to-hard centering method will cause the centering blocks to wear and groove over time as the wafer size deviates or there are foreign objects on the edge of the wafer. It may even break the wafer. Once grooves appear in the centering block, the clamped wafer will no longer be fixed in the same position every time. The wafer will be abnormal when being transferred to the next process. Taking the glue coating process as an example, when the wafer is inconsistent in position during centering, the wafer will be elliptical when rotating after reaching the glue coating tank, which will lead to uneven glue coating, glue deficiency, or even the wafer being thrown away. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide a wafer centering device and a wafer gluing equipment, aiming to solve the problem that the centering block of the centering device in the prior art is easily worn, resulting in deviation in the wafer centering position.

[0006] The wafer centering device proposed in the utility model comprises a symmetrically arranged support drive component and a first centering block and a second centering block respectively arranged on the support drive component, wherein the first centering block and the second centering block are provided with arc grooves for centering the wafer on opposite sides, and an elastic member and a stopper are sequentially provided on the side of the first centering block away from the arc groove, and the elastic member is used to connect the stopper and the first centering block.

[0007] The wafer centering device is configured such that the first centering block and the second centering block are arranged on two symmetrically arranged support drive assemblies, so that the support drive assemblies drive the first centering block and the second centering block to move closer to or farther from each other, thereby realizing the centering and positioning effect of the wafer through the arc grooves on the two centering blocks, and then a stopper is arranged on the side of the first centering block away from the second centering block, and the stopper is connected to the first centering block through an elastic member, so that when the first centering block squeezes the wafer during wafer centering, a part of the interaction force between the wafer and the first centering block is transmitted to the elastic member, thereby realizing the centering and positioning effect of the wafer through the arc grooves on the two centering blocks. Even if there are foreign objects on the outside of the wafer or there are deviations in the size of the wafer, the force acting on the first centering block will be dispersed by the elastic member, thereby greatly reducing the wear of the arc groove of the first centering block. In addition, due to the existence of the first centering block and the elastic member, and the second centering block is fixedly arranged on the support drive assembly, the force between the wafer and the second centering block will also be shared by the elastic member, and the wear on the second centering block will also be reduced, thereby greatly extending the service life of the first centering block and the second centering block, and reducing the probability of the centering block wearing and producing grooves, resulting in deviations in the centering position of the wafer. Therefore, the utility model solves the problem that the centering block of the centering device in the prior art is easily worn, resulting in deviations in the centering position of the wafer.

[0008] In addition, the wafer centering device proposed by the utility model may also have the following additional technical features:

[0009] Preferably, guide plates are extended outwardly from both sides of the stopper, and grooves adapted to the guide plates are provided on both sides of the first centering block close to one end of the stopper.

[0010] Preferably, a slide groove is provided on the guide plate, and a sliding block adapted to the slide groove is provided in the groove.

[0011] Preferably, both ends of the slide groove are closed, the top of the middle section of the slide groove is recessed inward to form an assembly groove, and the sliding block is placed in the slide groove through the assembly groove.

[0012] Preferably, the first centering block and the stopper are provided with mutually matching mounting grooves on one side opposite to each other, and both ends of the elastic member are arranged in the mounting grooves.

[0013] Preferably, the support driving assembly includes a support frame, a driving member arranged on the support frame and a mounting plate arranged on the driving member, the first centering block, the second centering block and the stop block are respectively arranged on the mounting plate, and the driving plate of the driving member is fixedly connected to the mounting plate for driving the two mounting plates to move closer or farther away.

[0014] Preferably, a mounting hole and a positioning hole are provided on a side of the second centering block away from the arc groove, so as to fix the second centering block on the mounting plate.

[0015] Preferably, the plurality of elastic members are equidistantly distributed on the support drive assembly along the width direction of the first centering block.

[0016] Preferably, the central angle of the circular arc groove is less than 180 degrees.

[0017] In addition, the utility model also provides a wafer gluing device, which includes the above-mentioned wafer centering device and wafer fixing device, and the wafer centering device is arranged on both sides of the wafer fixing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a wafer centering device proposed in an embodiment of the utility model;

[0019] Figure 2 This is a schematic structural diagram of a first centering block proposed in an embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of a stopper proposed in one embodiment of the utility model;

[0021] Figure 4 It is a structural schematic diagram of a support driving assembly proposed in one embodiment of the utility model.

[0022] Description of main component symbols:

[0023] Support drive assembly 10 The first pair of blocks 20 The second pair of blocks 30 Arc groove 21 Elastic parts 40 Stopper 50 Guide plate 51 Grooves 22 Chute 52 slider 23 Mounting slot 53 Mounting slot 54 Support frame 11 Drive parts 12 Mounting Plate 13 Driver board 121 Mounting holes 31 Positioning hole 32

[0024] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] See also Figures 1 to 4 , shown is a wafer centering device in an embodiment of the utility model, comprising a symmetrically arranged support drive assembly 10 and a first centering block 20 and a second centering block 30 respectively arranged on the support drive assembly 10, wherein:

[0029] The first centering block 20 and the second centering block 30 are both provided with arc grooves 21 for centering the wafer on opposite sides. The first centering block 20 away from the arc groove 21 is provided with an elastic member 40 and a stopper 50 in sequence. The elastic member 40 is used to connect the stopper 50 and the first centering block 20 .

[0030] It can be understood that by respectively arranging the first centering block 20 and the second centering block 30 on two symmetrically arranged support drive assemblies 10, the support drive assembly 10 drives the first centering block 20 and the second centering block 30 to move closer to or farther away from each other, and then the centering and positioning effect of the wafer is achieved through the arc grooves 21 on the two centering blocks, and then a stopper 50 is arranged on the side of the first centering block 20 away from the second centering block 30, and the stopper 50 is connected to the first centering block 20 through the elastic member 40, so that when the wafer is centered, when the first centering block 20 squeezes the wafer, a part of the interaction force between the wafer and the first centering block 20 will be transmitted to the elastic member 40, and then Even if there are foreign objects on the outside of the wafer or there is a deviation in the size of the wafer, the force acting on the first centering block 20 will be dispersed by the elastic member 40, thereby greatly reducing the wear of the arc groove 21 of the first centering block 20. In addition, due to the existence of the first centering block 20 and the elastic member 40, and the second centering block 30 is fixedly arranged on the support drive assembly 10, the force between the wafer and the second centering block 30 will also be shared by the elastic member 40, and the wear on the second centering block 30 will also be reduced, thereby greatly extending the service life of the first centering block 20 and the second centering block 30, and reducing the probability of the centering block wearing and producing grooves to cause the centering position deviation of the wafer. Therefore, the utility model solves the problem that the centering block of the centering device in the prior art is easy to wear and cause the centering position deviation of the wafer.

[0031] It should be noted that when the support driving assembly 10 moves to the preset position to achieve centering, the presence of the elastic member 40 will cause the first centering block 20 to move toward the elastic member 40, so it is necessary to adjust the size and elastic force of the elastic member 40. When the support driving assembly 10 moves to the preset position, so that the first centering block 20 squeezes the elastic member 40, the elastic member 40 is compressed to a certain length and applies sufficient force to move the first centering block 20 and the wafer to the preset position to abut against and slightly squeeze the second centering block 30, thereby achieving the centering effect of the wafer.

[0032] Specifically, guide plates 51 extend outwardly from both sides of the stopper 50, and grooves 22 adapted to the guide plates 51 are provided on both sides of the first centering block 20 near one end of the stopper 50. By providing the guide plates 51 to cooperate with the grooves 22 on both sides of the first centering block 20, the guide plates 51 limit the degrees of freedom on both sides of the first centering block 20 when centering the wafer, preventing the first centering block 20 from deviating to both sides, resulting in deviation in the centering position of the wafer.

[0033] Furthermore, a slide groove 52 is provided on the guide plate 51, and a slider 23 adapted to the slide groove 52 is provided in the groove 22. The slide groove 52 and the slider 23 are provided to limit the freedom of the first centering block 20 in the up and down directions, so that the first centering block 20 can only move along the length direction of the guide plate 51, thereby ensuring the accuracy of the wafer centering position.

[0034] Furthermore, both ends of the slide groove 52 are closed, and the top of the middle section of the slide groove 52 is recessed inward to form an assembly groove 53, and the slider 23 is placed in the slide groove 52 through the assembly groove 53. Since the first centering block 20 and the stopper 50 are slidably connected, in order to ensure that the first centering block 20 does not fall off the stopper 50, the two ends of the slide groove 52 are closed, and an elastic member 40 is provided between the stopper 50 and the first centering block 20, so that the first centering block 20 is not easy to fall off the stopper 50. In addition, in order to facilitate the disassembly and replacement of the first centering block 20 after wear, the assembly groove 53 is provided in the middle section of the slide groove 52, so that when the first centering block 20 is disassembled and replaced, the elastic member 40 is first removed, and the first centering block 20 is slid toward the stopper 50, so that the slider 23 is moved out of the assembly groove 53, and the disassembly of the first centering block 20 is completed.

[0035] In addition, the first centering block 20 and the stopper 50 are provided with mutually adapted mounting grooves 54 on opposite sides, and both ends of the elastic member 40 are arranged in the mounting grooves 54. By arranging the elastic member 40 in the mounting grooves 54 and adjusting the relative distance between the stopper 50 and the first centering block 20, the elastic member 40 does not need to be fixedly connected with the first centering block 20 or the stopper 50, but only needs to be slightly compressed and placed in the mounting groove 54, thereby facilitating the replacement of the elastic member 40 and the first centering block 20.

[0036] Specifically, the support driving assembly 10 includes a support frame 11, a driving member 12 arranged on the support frame 11, and a mounting plate 13 arranged on the driving member 12. The first centering block 20, the second centering block 30 and the stopper 50 are respectively arranged on the mounting plate 13. The driving plate 121 of the driving member 12 is fixedly connected to the mounting plate 13, and is used to drive the two mounting plates 13 to move closer or farther away. The two centering blocks are located at a specific height by setting the support frame 11, and then connected to the mounting plate 13 by the driving plate 121, so that the driving member 12 drives the mounting plates 13 to move closer or farther from each other, thereby achieving the wafer centering effect of the centering block. In specific use, a displacement sensor or a detection sensor can also be set to monitor the moving distance of the centering block to ensure the wafer centering effect of the centering block.

[0037] In addition, a mounting hole 31 and a positioning hole 32 are provided on the side of the second centering block 30 away from the arc groove 21, which are used to fix the second centering block 30 on the mounting plate 13. By providing the mounting hole 31 and the positioning hole 32, the second centering block 30 can be detachably connected to the mounting plate 13, so that when the arc groove 21 of the second centering block 30 is worn, the second centering block 30 can be directly replaced without disassembling or replacing the entire wafer centering device.

[0038] Specifically, a plurality of elastic members 40 are equidistantly distributed on the support driving assembly 10 along the width direction of the first centering block 20. A plurality of elastic members 40 are provided so that when the wafer is centered, the plurality of elastic members 40 share the squeezing force between the first centering block 20 and the wafer, further reducing the degree of wear of the first centering block 20. In addition, the plurality of elastic members 40 can also ensure that the first centering block 20 moves as a whole when squeezed, preventing the problem that when the elastic member 40 is provided on one side, the first centering block 20 is squeezed, and the movement of both sides deviates, thereby affecting the wafer centering effect.

[0039] In addition, the central angle of the arc groove 21 is less than 180 degrees. In a specific implementation, by adjusting the angle of the arc groove 21 to less than 180 degrees, the arc groove 21 can be adapted to the centering conditions of wafers of multiple sizes, and avoid being limited by the size of the arc groove 21 and only being able to adapt to wafers of one specification.

[0040] In summary, the wafer centering device in the above-mentioned embodiment of the utility model is configured by respectively arranging the first centering block 20 and the second centering block 30 on two symmetrically arranged support drive components 10, so that the support drive component 10 drives the first centering block 20 and the second centering block 30 to move closer to or farther away from each other, and then the centering and positioning effect of the wafer is achieved through the arc grooves 21 on the two centering blocks, and then a stopper 50 is arranged on the side of the first centering block 20 away from the second centering block 30, and the stopper 50 is connected to the first centering block 20 through the elastic member 40, so that when the wafer is centered, when the first centering block 20 squeezes the wafer, a part of the interaction force between the wafer and the first centering block 20 will be transmitted to On the elastic member 40, even if there are foreign objects on the outside of the wafer or there is a deviation in the size of the wafer, the force acting on the first centering block 20 will be dispersed by the elastic member 40, thereby greatly reducing the wear of the arc groove 21 of the first centering block 20. In addition, due to the existence of the first centering block 20 and the elastic member 40, and the second centering block 30 is fixedly arranged on the support drive assembly 10, the force between the wafer and the second centering block 30 will also be shared by the elastic member 40, and the wear on the second centering block 30 will also be reduced, thereby greatly extending the service life of the first centering block 20 and the second centering block 30, and reducing the probability of the centering block wearing and producing grooves to cause the centering position deviation of the wafer. Therefore, the utility model solves the problem that the centering block of the centering device in the prior art is easy to wear and cause the centering position deviation of the wafer.

[0041] In addition, the utility model also provides a wafer gluing device, which includes the above-mentioned wafer centering device and wafer fixing device. The wafer centering device is arranged on both sides of the wafer fixing device, and is used to center the wafer placed on the wafer fixing device, so that the wafer fixing device can fix the wafer in a preset position through vacuum adsorption for gluing.

[0042] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0043] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer centering device, characterized in that: It includes a symmetrically arranged support drive component and a first centering block and a second centering block respectively arranged on the support drive component, wherein the first centering block and the second centering block are provided with arc grooves for centering wafers on opposite sides, and an elastic member and a stopper are sequentially provided on the side of the first centering block away from the arc groove, and the elastic member is used to connect the stopper and the first centering block.

2. The wafer centering device according to claim 1, characterized in that: Guide plates are extended outwardly on both sides of the stopper, and grooves adapted to the guide plates are provided on both sides of the first centering block close to one end of the stopper.

3. The wafer centering device according to claim 2, characterized in that: A sliding groove is provided on the guide plate, and a sliding block adapted to the sliding groove is provided in the groove.

4. The wafer centering device according to claim 3, characterized in that: The two ends of the slide groove are closed, the top of the middle section of the slide groove is recessed inward to form an assembly groove, and the sliding block is placed in the slide groove through the assembly groove.

5. The wafer centering device according to claim 1, characterized in that: The first centering block and the stopper are provided with mutually matching mounting grooves on one side opposite to each other, and both ends of the elastic member are arranged in the mounting grooves.

6. The wafer centering device according to claim 1, characterized in that: The support driving assembly includes a support frame, a driving member arranged on the support frame and a mounting plate arranged on the driving member, the first centering block, the second centering block and the stop block are respectively arranged on the mounting plate, and the driving plate of the driving member is fixedly connected to the mounting plate for driving the two mounting plates to move closer or farther away.

7. The wafer centering device according to claim 6, characterized in that: A mounting hole and a positioning hole are provided on a side of the second centering block away from the arc groove, so as to fix the second centering block on the mounting plate.

8. The wafer centering device according to claim 1, characterized in that: The plurality of elastic members are equidistantly distributed on the support drive assembly along the width direction of the first centering blocks.

9. The wafer centering device according to claim 1, characterized in that: The central angle of the circular arc groove is less than 180 degrees.

10. A wafer glue coating device, characterized in that: It comprises the wafer centering device and the wafer fixing device according to any one of claims 1 to 9, wherein the wafer centering device is arranged on both sides of the wafer fixing device.

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