Semiconductor automatic cleaning device

Abstract

The utility model relates to the technical field of cleaning devices, and discloses an automatic semiconductor cleaning device which comprises an ultrasonic cleaning device body, the top of the ultrasonic cleaning device body is fixedly connected with a cleaning bin, the bottom of the inner wall of the cleaning bin is fixedly connected with a motor, and the output end of the motor is fixedly connected with a fixing block. A fixing block is fixedly connected to the outer side of the cleaning bin, a containing basket is fixedly connected to the outer side of the fixing block, a supporting plate is fixedly connected to the top of the inner wall of the cleaning bin and rotationally connected with the containing basket, and a driving mechanism is rotationally connected to the outer side of the containing basket. The problems that impurities adhered to the surface of a semiconductor material in water are stripped, and due to the fact that a large number of semiconductor materials are stacked during stripping, the impurities cannot be separated from the surface of the material in time and can be stacked between the semiconductor materials, and the cleaning effect is affected are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning devices, in particular to an automatic semiconductor cleaning device. Background Art

[0002] Semiconductor is a material with conductivity between conductors and insulators at room temperature. Common semiconductor materials include silicon, germanium and gallium arsenide. Ultrasonic cleaning devices are used when cleaning semiconductor materials. Ultrasonic cleaning devices are equipment that uses ultrasonic technology for cleaning. The working principle of ultrasonic cleaning devices is mainly to use the high-frequency vibration generated by ultrasonic waves in the cleaning liquid to cause the bubbles in the cleaning liquid to burst and generate high pressure, forming tiny water flows and impact forces. These tiny water flows and impact forces can penetrate into the tiny holes and gaps on the surface of objects, peel off dirt, grease, dust and other impurities from the surface of the object, and achieve the cleaning effect.

[0003] Existing ultrasonic cleaning machines use the high-frequency vibrations generated by ultrasound in the cleaning liquid to peel off impurities adhered to the surface of semiconductor materials in the water. During the peeling process, due to the accumulation of a large amount of semiconductor materials, the impurities cannot be detached from the material surface in time and will accumulate between the semiconductor materials, affecting the cleaning effect. Utility Model Content

[0004] The utility model provides a semiconductor automatic cleaning device, which has the beneficial effect of timely discharging the peeled impurities after rotating the material, and solves the problem that the existing ultrasonic cleaning machine mentioned in the above background technology uses high-frequency vibration generated by ultrasonic waves in the cleaning liquid to peel off impurities adhered to the surface of the semiconductor material in the water. During the peeling process, due to the accumulation of a large amount of semiconductor material, the impurities cannot be separated from the material surface in time and will accumulate between the semiconductor materials, affecting the cleaning effect.

[0005] The utility model provides the following technical solution: a semiconductor automatic cleaning device, comprising an ultrasonic cleaning device body, the top of the ultrasonic cleaning device body is fixedly connected to a cleaning chamber, the bottom of the inner wall of the cleaning chamber is fixedly connected to a motor, the output end of the motor is fixedly connected to a fixed block, the outer side of the fixed block is fixedly connected to a placement basket, the top of the inner wall of the cleaning chamber is fixedly connected to a support plate, the support plate is rotatably connected to the placement basket, and the outer side of the placement basket is rotatably connected to a driving mechanism.

[0006] As an optional solution of the semiconductor automatic cleaning device described in the utility model, the driving mechanism includes a gear ring, both sides of the gear ring are fixedly connected with connecting frames, one end of the connecting frame is fixedly connected to the inner wall of the cleaning chamber, and the bottom of the gear ring is meshed with a gear.

[0007] As an optional solution of the semiconductor automatic cleaning device described in the utility model, the inner part of the placement basket is rotatably connected to a fixed shaft, the outer side of the fixed shaft is fixedly connected to a stirring plate, the number of the stirring plates is several, and the several stirring plates are evenly distributed, both ends of the fixed shaft are fixedly connected to connecting columns, one end of the connecting column extends to the outside of the placement basket and is fixedly connected to the gear.

[0008] As an optional solution of the semiconductor automatic cleaning device of the utility model, a protective sleeve is fixedly connected to the outer side of the fixed shaft, and one end of the protective sleeve is rotatably connected to the inner wall of the placement basket.

[0009] As an optional solution of the semiconductor automatic cleaning device of the utility model, wherein: the bottom of the placement basket is fixedly connected to a sliding frame, and the bottom of the sliding frame is slidably connected to a sliding column.

[0010] As an optional solution of the semiconductor automatic cleaning device of the utility model, wherein: the bottom of the sliding column is fixedly connected to a support frame, and one end of the support frame is fixedly connected to the inner wall of the cleaning chamber.

[0011] As an optional solution of the semiconductor automatic cleaning device of the utility model, wherein: a shielding cover is fixedly connected to the bottom of the fixed block, and the shielding cover is located on the top of the motor.

[0012] As an optional solution of the semiconductor automatic cleaning device of the utility model, one end of the stirring plate is fixedly connected to a sleeve plate, and the end of the sleeve plate is arranged in an arc shape.

[0013] The utility model has the following beneficial effects:

[0014] 1. The semiconductor automatic cleaning device is provided with a motor, a placement basket and a driving mechanism. After the motor is started, the placement basket will be driven to rotate, so that the semiconductor parts inside it will rotate in the cleaning liquid. At this time, the high-frequency vibration of the ultrasonic wave causes the impurities on the outside of the semiconductor parts to be peeled off. The peeled impurities are discharged to the periphery during the rotation of the placement basket. As the placement basket rotates, the driving mechanism drives the stirring plate to rotate. After the stirring plate rotates, it stirs the parts in the placement basket, making them float in the water, and the accumulated parts will be loosened, thereby accelerating the discharge of impurities at the accumulation place, further improving the cleaning effect and preventing the accumulation of impurities.

[0015] 2. The semiconductor automatic cleaning device is provided with a sliding frame and a sliding column. The support frame supports and fixes the sliding column. The sliding column slides with the sliding frame inside the sliding frame. When the placement basket rotates, the sliding column can limit the sliding frame, so that the placement basket rotates more stably. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model.

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure of the ultrasonic cleaning device body of the utility model.

[0018] Figure 3 It is a bottom view structural schematic diagram of the placement basket of the utility model.

[0019] Figure 4 It is a structural schematic diagram of the fixed shaft and the stirring plate of the utility model.

[0020] In the figure: 1. ultrasonic cleaning device body; 2. cleaning chamber; 3. motor; 4. fixed block; 5. placement basket; 6. support plate; 701. gear ring; 702. connecting frame; 703. gear; 704. fixed shaft; 705. stirring plate; 706. connecting column; 8. protective cover; 9. sliding frame; 10. sliding column; 11. support frame; 12. shielding cover; 13. sleeve plate. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1

[0023] See also Figures 1 to 4 A semiconductor automatic cleaning device comprises an ultrasonic cleaning device body 1, which is composed of a body and an upper cover. The upper cover is snapped onto the top of the body by buckles. A cleaning chamber 2 is embedded in the top of the ultrasonic cleaning device body 1. A motor 3 is fixedly connected to the center of the bottom of the inner wall of the cleaning chamber 2. A fixed block 4 is fixedly connected to the output end of the motor 3. A placement basket 5 is fixedly connected to the outer side of the fixed block 4. The placement basket 5 is arranged in a grid shape. A support plate 6 is fixedly connected to the top of the inner wall of the cleaning chamber 2. The support plate 6 is rotatably connected to the placement basket 5. The outer side of the placement basket 5 is rotatably connected to a driving mechanism.

[0024] The driving mechanism includes a gear ring 701 , both sides of which are fixedly connected with connecting frames 702 , one end of the connecting frame 702 is fixedly connected to the inner wall of the cleaning chamber 2 , and the bottom of the gear ring 701 is meshedly connected with a gear 703 .

[0025] The placement basket 5 is rotatably connected to a fixed shaft 704 inside, and a stirring plate 705 is fixedly connected to the outside of the fixed shaft 704. There are several stirring plates 705, and the stirring plates 705 are evenly distributed. Both ends of the fixed shaft 704 are fixedly connected to connecting columns 706, and one end of the connecting column 706 extends to the outside of the placement basket 5 and is fixedly connected to the gear 703.

[0026] The working principle of this embodiment is as follows: when it is necessary to clean semiconductor parts, the user opens the upper cover of the ultrasonic cleaning device body 1, and then pours the semiconductor parts into the placement basket 5, the placement basket 5 is located in the cleaning chamber 2, and the cleaning liquid is poured into the cleaning chamber 2, and then the upper cover is covered on the top of the body, and then the ultrasonic cleaning device body 1 is started, and then the motor 3 is started, and the output end of the motor 3 drives the fixed block 4 to rotate, and the fixed block 4 drives the placement basket 5 to rotate. After the placement basket 5 rotates, the semiconductor parts inside will rotate in the cleaning liquid, and at this time, the high-frequency vibration of the ultrasonic wave is added to peel off the impurities on the outside of the semiconductor parts, and after peeling, The impurities are discharged to the periphery during the rotation of the placement basket 5 to prevent the accumulation of impurities, and as the placement basket 5 rotates, the gear 703 on the outside of the placement basket 5 will rotate accordingly, and the gear 703 will mesh with the gear ring 701 on the top after rotating, causing the gear 703 to rotate, and the gear 703 will drive the fixed shaft 704 to rotate after rotating, and the fixed shaft 704 will drive the stirring plate 705 to rotate, and the stirring plate 705 will stir the parts in the placement basket 5 after rotating, so that they float in the water, and the accumulated parts will be loosened, thereby accelerating the discharge of impurities at the accumulation place, further improving the cleaning effect and preventing the accumulation of impurities.

[0027] Embodiment 2

[0028] This embodiment is an improvement made on the basis of the first embodiment. For details, please refer to Figures 1 to 4 A protective sleeve 8 is fixedly connected to the outer side of the fixed shaft 704 , and one end of the protective sleeve 8 is rotatably connected to the inner wall of the placement basket 5 .

[0029] By providing the protective sleeve 8, the protective sleeve 8 can play a protective role at the connection between the fixed shaft 704 and the placement basket 5, preventing the fixed shaft 704 from being broken at the connection with the placement basket 5 after being subjected to force.

[0030] The bottom of the placement basket 5 is fixedly connected with a sliding frame 9 , and the bottom of the sliding frame 9 is slidably connected with a sliding column 10 .

[0031] A support frame 11 is fixedly connected to the bottom of the sliding column 10 , and one end of the support frame 11 is fixedly connected to the inner wall of the cleaning chamber 2 .

[0032] By setting the sliding frame 9 and the sliding column 10, the support frame 11 supports and fixes the sliding column 10. The sliding column 10 slides with the sliding frame 9 inside the sliding frame 9. When the placement basket 5 rotates, the sliding column 10 can limit the sliding frame 9, making the placement basket 5 more stable when rotating.

[0033] A shielding cover 12 is fixedly connected to the bottom of the fixing block 4 , and the shielding cover 12 is located on the top of the motor 3 .

[0034] By providing the shielding cover 12 , when the impurities in the basket 5 are discharged downward, the shielding cover 12 can protect the motor 3 .

[0035] One end of the stirring plate 705 is fixedly connected to a sleeve plate 13, and the end of the sleeve plate 13 is arranged in an arc shape.

[0036] By providing the sleeve plate 13, which is made of elastic material, the stirring plate 705 plays a protective role when it contacts the semiconductor parts after rotation, thereby preventing the rotating stirring plate 705 from colliding with the semiconductor material and causing damage to the semiconductor material.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor automatic cleaning device, comprising an ultrasonic cleaning device body (1), characterized in that: The top of the ultrasonic cleaning device body (1) is fixedly connected to a cleaning chamber (2), the bottom of the inner wall of the cleaning chamber (2) is fixedly connected to a motor (3), the output end of the motor (3) is fixedly connected to a fixed block (4), the outer side of the fixed block (4) is fixedly connected to a placement basket (5), the top of the inner wall of the cleaning chamber (2) is fixedly connected to a support plate (6), the support plate (6) is rotatably connected to the placement basket (5), and the outer side of the placement basket (5) is rotatably connected to a driving mechanism.

2. The semiconductor automatic cleaning device according to claim 1, characterized in that: The driving mechanism comprises a gear ring (701), both sides of the gear ring (701) are fixedly connected to connecting frames (702), one end of the connecting frame (702) is fixedly connected to the inner wall of the cleaning chamber (2), and the bottom of the gear ring (701) is meshingly connected to a gear (703).

3. The semiconductor automatic cleaning device according to claim 2, characterized in that: The interior of the placement basket (5) is rotatably connected to a fixed shaft (704), and the outer side of the fixed shaft (704) is fixedly connected to a stirring plate (705), and the number of the stirring plates (705) is several, and the several stirring plates (705) are evenly distributed. Both ends of the fixed shaft (704) are fixedly connected to a connecting column (706), and one end of the connecting column (706) extends to the outer side of the placement basket (5) and is fixedly connected to the gear (703).

4. The semiconductor automatic cleaning device according to claim 3, characterized in that: A protective sleeve (8) is fixedly connected to the outer side of the fixed shaft (704), and one end of the protective sleeve (8) is rotatably connected to the inner wall of the placement basket (5).

5. The semiconductor automatic cleaning device according to claim 1, characterized in that: The bottom of the placement basket (5) is fixedly connected to a sliding frame (9), and the bottom of the sliding frame (9) is slidably connected to a sliding column (10).

6. The semiconductor automatic cleaning device according to claim 5, characterized in that: The bottom of the sliding column (10) is fixedly connected to a support frame (11), and one end of the support frame (11) is fixedly connected to the inner wall of the cleaning chamber (2).

7. The semiconductor automatic cleaning device according to claim 1, characterized in that: A shielding cover (12) is fixedly connected to the bottom of the fixed block (4), and the shielding cover (12) is located on the top of the motor (3).

8. The semiconductor automatic cleaning device according to claim 3, characterized in that: One end of the stirring plate (705) is fixedly connected to a sleeve plate (13), and the end of the sleeve plate (13) is arranged in an arc shape.

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