Heater for plate-type PECVD (plasma enhanced chemical vapor deposition) cavity
By designing a closed chamber heater with upper, lower and side heaters in the plate PECVD cavity, the problem of uneven temperature in the prior art is solved, and a more efficient and uniform substrate heating effect is achieved.
Patent Information
- Application Number
- CN202421754006.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-23
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-23
AI Technical Summary
The temperature of the existing plate PECVD cavity heaters is not uniform enough, resulting in poor heating effect and affecting the quality of the substrate.
A closed chamber heater is designed including an upper heater, a lower heater and a side heater. The lower heater is divided into at least two independent temperature-controlled heating zones, and the heating wire density per unit area in each heating zone is the same.
Through uniform heating wire density and independent temperature-controlled heating zone, the heating efficiency and quality of the substrate are improved, ensuring uniformity of the temperature in the chamber.
Smart Images
Figure CN222821646U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of photovoltaic technology, and in particular to a heater for a plate-type PECVD chamber. Background Art
[0002] The existing plate-type PECVD vacuum chamber equipment heater is designed with multiple zone block temperature control. While achieving heating in the chamber, the different heating temperatures of each zone can be individually adjusted and controlled. However, on the one hand, the number of heater temperature zones is small, and the regional distribution area occupies an inconsistent proportion of space. On the other hand, factors such as the different heating wire wiring per unit area will make the temperature in the chamber uneven, which can easily lead to poor heating effect and further cause quality problems of the heated substrate. Utility Model Content
[0003] In view of this, the present application provides a heater for a plate-type PECVD chamber, which improves the heating efficiency and quality of the substrate by placing the substrate in a closed chamber for heating and ensuring that the density of heating wires per unit area in each heating zone in the lower heater is the same.
[0004] In order to achieve the above objectives, this application provides the following technical solutions:
[0005] A heater for a plate-type PECVD chamber, comprising:
[0006] Can be placed in the plate-type PECVD chamber, characterized by comprising:
[0007] An upper heater, a lower heater and a side heater, wherein the upper heater, the lower heater and the side heater form a closed chamber, and a substrate can be placed in the closed chamber;
[0008] The lower heater comprises at least two heating zones capable of independent temperature control, and the density of heating wires per unit area in each heating zone is the same.
[0009] Optionally, the lower heater includes a lower heat transfer aluminum plate, a lower heating wire and a lower reflective plate stacked in sequence, the lower reflective plate includes at least two layers of reflective mirror surfaces, and the upper surface of the lower heat transfer aluminum plate constitutes the inner surface of the closed chamber.
[0010] Optionally, the lower heat transfer aluminum plate is provided with 6 independently temperature-controlled heating zones, including inner zone 1, inner zone 2, outer zone 1, outer zone 2, outer zone 3 and outer zone 4; the inner zone 1 and the inner zone 2 are rectangles of equal size and are arranged in the central area of the lower heat transfer aluminum plate; the outer zone 1, the outer zone 2, the outer zone 3 and the outer zone 4 are all L-shaped and are respectively arranged on the peripheries of the inner zone 1 and the inner zone 2.
[0011] Optionally, the substrate can be placed on the lower heat transfer aluminum plate with a gap between it and the upper heater.
[0012] Optionally, the upper heater includes an upper reflective plate, an upper heating wire and an upper heat transfer aluminum plate stacked in sequence, the upper reflective plate includes at least two layers of reflective mirror surfaces, and the lower surface of the heat transfer aluminum plate constitutes the inner surface of the closed chamber.
[0013] Optionally, the heat transfer aluminum plate is provided with three independently temperature-controlled heating zones, including an inner zone, a middle zone and an outer zone, the inner zone is a rectangle, the middle zone is arranged at the periphery of the inner zone, and the outer zone is arranged at the periphery of the middle zone and located at the edge of the heat transfer aluminum plate; the area of the inner zone accounts for more than 50% of the entire heat transfer aluminum plate.
[0014] Optionally, an upper heating wire wiring groove is provided on the upper surface of the upper heat transfer aluminum plate, and the upper heating wire is arranged in the upper heating wire wiring groove; and / or, a lower heating wire wiring groove is provided on the lower surface of the lower heat transfer aluminum plate, and the lower heating wire is arranged in the lower heating wire wiring groove.
[0015] Optionally, the diameter of the upper heating wire and / or the lower heating wire is 5-5.5 mm.
[0016] Optionally, the side heater includes a first side heater, a second side heater, a third side heater and a fourth side heater, and the first side heater, the second side heater, the third side heater and the fourth side heater are respectively arranged between the upper heater and the lower heater and form a closed chamber with the upper heater and the lower heater.
[0017] Optionally, the side heater is provided with a heating zone with independent temperature control.
[0018] The heater for the plate-type PECVD chamber provided in the present application comprises an upper heater, a lower heater and a side heater which together form a closed chamber, and wrap the substrate to be heated in the closed chamber, so that the temperature of the substrate can be increased more quickly and effectively; since the substrate needs to be placed directly on the upper surface of the lower heater, the lower heater, as the most direct heating source for the substrate, requires precise temperature control, so in this example, the lower heater needs to be provided with at least two independently temperature-controlled heating zones, so that different heating zones can be independently adjusted in temperature when necessary, so as to compensate for the temperature loss or local overheating caused by the wiring layout or component structure layout in a certain area, and to ensure that the heating of the substrate as a whole meets the requirements; and the heating wire distribution density and average heating power per unit area of each heating zone are the same, which can ensure that the overall chamber temperature is adjusted more effectively to be uniform. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.
[0020] Figure 1 A schematic diagram of a heater for a plate-type PECVD chamber of the present application;
[0021] Figure 2 A schematic diagram of the upper heater of the present application;
[0022] Figure 3 A schematic diagram of the lower heater of the present application;
[0023] Figure 4 This is a schematic diagram of the temperature zone distribution of the upper heater of the present application;
[0024] Figure 5 This is a schematic diagram of the temperature zone distribution of the lower heater of the present application.
[0025] exist Figure 1-Figure 5 middle:
[0026] 1. Cavity cover; 2. Upper heater; 21. Upper reflective plate; 22. Upper heating wire; 23. Upper heat transfer aluminum plate; 3. Side heater; 4. Lower heater; 41. Lower reflective plate; 42. Lower heating wire; 43. Lower heat transfer aluminum plate; 5. Cavity; 61. Inner zone; 62. Middle zone; 63. Outer zone; 71. Inner zone 1; 72. Inner zone 2; 73. Outer zone 1; 74. Outer zone 2; 75. Outer zone 3; 76. Outer zone 4. DETAILED DESCRIPTION
[0027] The present application provides a heater for a plate-type PECVD chamber, which improves the heating efficiency and quality of the substrate by placing the substrate in a closed chamber for heating and ensuring that the density of heating wires per unit area in each heating zone in the lower heater is the same.
[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0029] like Figure 1As shown, the PECVD device includes a chamber 5 and a chamber cover 1 that can be arranged at an opening above the chamber 5. The embodiment of the present application provides a heater that can be placed in a plate-type PECVD chamber 5 as a whole and is used for the plate-type PECVD chamber 5, including:
[0030] A plate-shaped upper heater 2, a plate-shaped lower heater 4 and a side heater 3, wherein the upper heater 2, the lower heater 4 and the side heater 3 form a closed chamber, and the substrate can be placed in the closed chamber;
[0031] The lower heater 4 includes at least two heating zones with independently controllable temperatures, and the density of heating wires per unit area in each heating zone is the same.
[0032] In this embodiment, the upper heater 2, the lower heater 4 and the side heater 3 together form a closed chamber, and wrap the substrate to be heated in the closed chamber, so that the temperature of the substrate can be increased more quickly and effectively; because the substrate needs to be placed directly on the upper surface of the lower heater 4, the lower heater 4, as the most direct heating source for the substrate, requires precise temperature control. Therefore, in this example, the lower heater 4 needs to be provided with at least 2 heating zones with independent temperature control, so that different heating zones can be independently adjusted in temperature when necessary to compensate for the temperature loss or local overheating caused by the wiring layout or component structure layout in a certain area, and to ensure that the heating of the substrate as a whole meets the requirements; and the heating wire distribution density and average heating power per unit area of each heating zone are the same, which can ensure that the overall chamber temperature is adjusted more effectively to be uniform.
[0033] like Figure 3 As shown, in a preferred embodiment, the lower heater 4 includes a lower heat transfer aluminum plate 43, a lower heating wire 42 and a lower reflective plate 41 stacked in sequence, the lower reflective plate 41 includes at least two layers of reflective mirror surfaces, and the upper surface of the lower heat transfer aluminum plate 43 constitutes the inner surface of the closed chamber.
[0034] In this embodiment, the lower heater 4 is composed of a lower heat transfer aluminum plate 43, a lower heating wire 42 and a lower reflecting plate 41 stacked in sequence from top to bottom. The lower heat transfer aluminum plate 43 is responsible for transferring the heat generated by the lower heating wire 42 to the substrate, and the lower reflecting plate 41 can reflect and lock the heat in a closed chamber surrounded by the upper heater 2, the lower heater 4 and the side heater 3. Preferably, the lower reflecting plate 41 is a mirror reflecting plate, and its thickness is preferably 1 mm. There are 3 layers of mirror reflecting plates in total, which can effectively reflect more heat to the location of the substrate.
[0035] like Figure 5As shown, in a preferred embodiment, since the substrate needs to be placed on the lower heater 4 and is in direct contact with the lower heater 4, the heat conduction efficiency is high, so the temperature control of the lower heater 4 needs to be more precise, and more and more precise heating zone divisions are required. In this embodiment, the lower heater 4 is divided into 6 independent heating zones, which are reflected on the lower heat transfer aluminum plate 43 that is in direct contact with the substrate, that is, the lower heat transfer aluminum plate 43 is divided into 6 heating zones that can be independently controlled in temperature, and the lower heating wire 42 opposite to the lower heat transfer aluminum plate 43 is also divided into 6 heating wire areas that can be independently controlled in temperature, so as to realize the zoned heating of the lower heat transfer aluminum plate 43, wherein the heating zones on the lower heat transfer aluminum plate 43 include inner zone 1 71, inner zone 2 72, outer zone 34, and inner zone 43. Zone 1 73, outer zone 2 74, outer zone 3 75 and outer zone 4 76, inner zone 1 71 and inner zone 2 72 are rectangular in shape and size and are arranged in the central area of the lower heat transfer aluminum plate 43, so as to heat the main part of the substrate; outer zone 1 73, outer zone 2 74, outer zone 3 75 and outer zone 4 76 are all L-shaped and are respectively arranged at the periphery of inner zone 1 71 and inner zone 2 72, so as to heat the outer edge part of the substrate; in addition, each heating zone is also provided with a corresponding thermocouple temperature sensor for detecting the temperature of each heating zone, and the thermocouple temperature sensor can feed back the temperature signal of each heating zone to the temperature control system, so that the temperature control system can adjust the temperature of each heating zone.
[0036] In a preferred embodiment, the substrate can be placed on the lower heat transfer aluminum plate 43 with a gap between the substrate and the upper heater 2 .
[0037] Due to the direct heat conduction from the lower heater 4 to the substrate, the heat transfer aluminum plate 23 in the upper heating zone only needs to keep the substrate warm, and there is no need to press the substrate tightly. The distance between the upper heater 2 and the lower heater 4 is set so that when the substrate can be placed on the lower heat transfer aluminum plate 43, there is a gap between the substrate and the upper heater 2.
[0038] like Figure 2 As shown, in a preferred embodiment, the upper heater 2 includes an upper reflecting plate 21, an upper heating wire 22 and an upper heat transfer aluminum plate 23 stacked in sequence, the upper reflecting plate 21 includes at least two layers of reflecting mirror surfaces, and the lower surface of the heat transfer aluminum plate 23 constitutes the inner surface of the closed chamber.
[0039] The structure of the upper heater 2 is basically the same as that of the lower heater 4. In this embodiment, the upper heater 2 is composed of an upper reflecting plate 21, an upper heating wire 22 and an upper heat transfer aluminum plate 23 stacked in sequence from top to bottom. The heat transfer aluminum plate 23 is responsible for transferring the heat generated by the upper heating wire 22 to the closed chamber, and the upper reflecting plate 21 can reflect and lock the heat in the closed chamber surrounded by the upper heater 2, the lower heater 4 and the side heater 3. Preferably, the upper reflecting plate 21 is a mirror reflecting plate, and its thickness is preferably 1 mm. There are 3 layers of mirror reflecting plates in total, which can effectively reflect more heat into the closed chamber.
[0040] like Figure 4 As shown, in a preferred embodiment, similar to the lower heater 4, at least two independently temperature-controlled heating zones are also arranged on the upper heat transfer aluminum plate 23. Unlike the six heating zones of the lower heater 4, the upper heat transfer aluminum plate 23 is provided with three independently temperature-controlled heating zones, including an inner zone 61, a middle zone 62 and an outer zone 63. The inner zone 61 is rectangular, the middle zone 62 is arranged at the periphery of the inner zone 61, and the outer zone 63 is arranged at the periphery of the middle zone 62 and located at the edge of the heat transfer aluminum plate 23. The upper heating wire 22 opposite to the upper heat transfer aluminum plate 23 is also divided into three independently temperature-controlled heating wire areas to achieve zoned heating of the heat transfer aluminum plate 23; the area of the inner zone 61 accounts for more than 50% of the entire heat transfer aluminum plate 23; in addition, each heating zone is also provided with a corresponding thermocouple temperature sensor to detect the temperature of each heating zone, and the thermocouple temperature sensor can feed back the temperature signal of each heating zone to the temperature control system so that the temperature control system can adjust the temperature of each heating zone.
[0041] The heating of the substrate mainly comes from the heating of the lower heater 4, and the upper heater 2 mainly plays the role of keeping the heating plate in the closed chamber warm. It does not need to be precisely zoned for temperature control like the lower heater 4. Therefore, an inner zone 61 with a proportion greater than 50% is set on the upper heat transfer aluminum plate 23, and the annular middle zone 62 and outer zone 63 on the outside only play an auxiliary role.
[0042] like Figure 2 and Figure 3 As shown, in a preferred embodiment, the upper surface of the upper heat transfer aluminum plate 23 is provided with an upper heating wire 22 wiring groove, and the upper heating wire 22 is arranged in the upper heating wire 22 wiring groove; and / or, the lower surface of the lower heat transfer aluminum plate 43 is provided with a lower heating wire 42 wiring groove, and the lower heating wire 42 is arranged in the lower heating wire 42 wiring groove.
[0043] The upper heating wire 22 is embedded in the upper heating wire routing groove on the upper surface of the heat transfer aluminum plate 23, and the lower heating wire 42 is embedded in the lower heating wire routing groove on the lower surface of the lower heat transfer aluminum plate 43, so that the reflective plate can be attached to the heat transfer aluminum plate to ensure that heat is transferred from the heat transfer aluminum plate to the substrate or the inside of the closed chamber as much as possible.
[0044] The upper heating wire 22 is embedded in the upper heating wire wiring groove by riveting, and then connected to the upper heat transfer aluminum plate 23 and three 1mm thick mirror reflection plates by equal height bolts; similarly, the lower heating wire 42 is embedded in the lower heating wire wiring groove by riveting, and then connected to the lower heat transfer aluminum plate 43 and three 1mm thick mirror reflection plates by equal height bolts.
[0045] The upper heat transfer aluminum plate 23 and the lower heat transfer aluminum plate 43 are close to the substrate surface, that is, the lower surface of the heat transfer aluminum plate 23 and the upper surface of the lower heat transfer aluminum plate 43 are treated with a black hard anodizing process. The thickness of the black hard anodized layer is 0.06-0.07mm, the minimum breakdown voltage is 1200V, the corrosion resistance 5% hydrochloric acid test lasts for 336 hours, and the surface density is 1100mg / dm 2 , hardness HV is not less than 400, so that it can achieve corrosion resistance and electric shock resistance, while the black hard anodized layer effectively reduces heat loss.
[0046] In a preferred embodiment, the diameter of the upper heating wire 22 and / or the lower heating wire 42 is 5-5.5 mm.
[0047] In order to make the wiring area of the heating wire wider, increase the wiring density and make the wiring distribution more uniform, and improve the heating efficiency, the diameter of the heating wire can be set to be thinner. The diameter of the upper heating wire 22 and / or the lower heating wire 42 is preferably between 5-5.5mm. In this embodiment, the diameter of the heating wire is 5.4mm.
[0048] like Figure 1 As shown, in a preferred embodiment, since the upper heater 2 and the lower heater 4 are both rectangular with four sides, the side heater 3 is configured as a first side heater, a second side heater, a third side heater and a fourth side heater that are connected to each other. The first side heater, the second side heater, the third side heater and the fourth side heater are respectively arranged between the upper heater 2 and the lower heater 4 and form a closed chamber with the upper heater 2 and the lower heater 4.
[0049] In a preferred embodiment, the side heater 3 is provided with a heating zone with independently controllable temperature.
[0050] Similar to the upper heater 2, the side heater 3 plays a role of heat preservation, so only one temperature zone is required.
[0051] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.
[0052] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.
[0053] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed or recombined, and these decompositions or recombinations should be regarded as equivalent solutions of the present application.
[0054] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
[0055] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.
[0056] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.
Claims
1. A heater for a plate-type PECVD chamber, which can be placed in the plate-type PECVD chamber, characterized in that: include: An upper heater, a lower heater and a side heater, wherein the upper heater, the lower heater and the side heater form a closed chamber, and a substrate can be placed in the closed chamber; The lower heater comprises at least two heating zones capable of independent temperature control, and the density of heating wires per unit area in each heating zone is the same.
2. The heater for a plate-type PECVD chamber according to claim 1, characterized in that: The lower heater comprises a lower heat transfer aluminum plate, a lower heating wire and a lower reflective plate stacked in sequence, the lower reflective plate comprises at least two layers of reflective mirror surfaces, and the upper surface of the lower heat transfer aluminum plate constitutes the inner surface of the closed chamber.
3. The heater for a plate-type PECVD chamber according to claim 2, characterized in that: The lower heat transfer aluminum plate is provided with 6 independently temperature-controlled heating zones, including inner zone 1, inner zone 2, outer zone 1, outer zone 2, outer zone 3 and outer zone 4. The inner zone 1 and the inner zone 2 are rectangular in shape and size and are arranged in the central area of the lower heat transfer aluminum plate; the outer zone 1, the outer zone 2, the outer zone 3 and the outer zone 4 are all L-shaped and are respectively arranged on the periphery of the inner zone 1 and the inner zone 2.
4. The heater for a plate-type PECVD chamber according to claim 2, characterized in that: The substrate can be placed on the lower heat transfer aluminum plate with a gap between the substrate and the upper heater.
5. The heater for a plate-type PECVD chamber according to claim 4, characterized in that: The upper heater comprises an upper reflective plate, an upper heating wire and an upper heat transfer aluminum plate stacked in sequence, the upper reflective plate comprises at least two layers of reflective mirror surfaces, and the lower surface of the heat transfer aluminum plate constitutes the inner surface of the closed chamber.
6. The heater for a plate-type PECVD chamber according to claim 5, characterized in that: The heat transfer aluminum plate is provided with three independently temperature-controlled heating zones, including an inner zone, a middle zone and an outer zone. The inner zone is rectangular, the middle zone is arranged at the periphery of the inner zone, and the outer zone is arranged at the periphery of the middle zone and located at the edge of the heat transfer aluminum plate. The area of the inner zone accounts for more than 50% of the entire heat transfer aluminum plate.
7. The heater for a plate-type PECVD chamber according to claim 5, characterized in that: An upper heating wire routing groove is provided on the upper surface of the upper heat transfer aluminum plate, and the upper heating wire is arranged in the upper heating wire routing groove; and / or, a lower heating wire routing groove is provided on the lower surface of the lower heat transfer aluminum plate, and the lower heating wire is arranged in the lower heating wire routing groove.
8. The heater for a plate-type PECVD chamber according to claim 7, characterized in that: The diameter of the upper heating wire and / or the lower heating wire is 5-5.5 mm.
9. The heater for a plate-type PECVD chamber according to claim 1, characterized in that: The side heater includes a first side heater, a second side heater, a third side heater and a fourth side heater, and the first side heater, the second side heater, the third side heater and the fourth side heater are respectively arranged between the upper heater and the lower heater and form a closed chamber with the upper heater and the lower heater.
10. The heater for a plate-type PECVD chamber according to claim 9, characterized in that: The side heater is provided with a heating zone capable of independent temperature control.