Chip manufacturing equipment
By designing normally open infusion valves and infusion pipelines in chip manufacturing equipment, the residual liquid on the wafer surface is automatically diluted and neutralized when the equipment is powered off, solving the wafer corrosion and scrapping problems caused by equipment failure, and effectively protecting the wafer surface.
Patent Information
- Application Number
- CN202420512448.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-15
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-03-15
AI Technical Summary
When the chip manufacturing equipment fails or power is cut off, the residual drug liquid on the wafer surface cannot be neutralized or removed in time, resulting in long-term retention of the drug liquid, resulting in corrosion of the wafer surface and scrapping of the wafer surface.
A chip manufacturing device is designed, including a cover body with a chamber, a carrier table arranged in the chamber, an infusion pipeline communicating with the chamber, and a normally open infusion valve. When the equipment is powered off, the infusion valve will automatically open, and the infusion pipeline will spray diluted liquid to the wafer surface, diluting and neutralizing the residual drug liquid.
It effectively reduces the corrosiveness of the drug solution, protects the wafer surface, and avoids wafer scrapping caused by equipment failure.
Smart Images
Figure CN222826359U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip manufacturing, in particular to chip manufacturing equipment. Background Art
[0002] A variety of liquid chemicals are needed in the chip manufacturing process, such as etching liquid needed for wet etching during chip packaging, cleaning liquid needed for wet cleaning, and crystal surface protection liquid used on laser slotting machines.
[0003] These liquids are generally strong acids or bases with certain corrosiveness. If they act on the wafer surface for a long time, it will cause etching on the wafer surface, and in severe cases, it will cause damage to the wafer circuit layer. In normal operation, the acid or alkali liquid will be neutralized or removed before entering the next process after use. However, when the equipment fails or the machine loses power, the wafer cannot be transferred to the next station in time, and the residual liquid on the wafer surface cannot be neutralized or removed. When the liquid stays on the wafer surface for a long time, it is easy to cause corrosion to the wafer surface circuit, thereby causing the wafer to be scrapped. Utility Model Content
[0004] The purpose of the utility model is to provide a chip manufacturing device to solve the deficiencies in the prior art. After a malfunction occurs in the chip manufacturing device, the device can dilute the acid or alkali liquid remaining on the surface of the wafer, thereby reducing the corrosiveness of the liquid and protecting the wafer, thus avoiding the scrapping of the wafer placed on the carrier table due to a malfunction of the manufacturing device.
[0005] The chip manufacturing equipment provided by the utility model comprises: a cover body having a chamber, a carrier platform arranged in the chamber, an infusion pipeline connected to the chamber, and an infusion valve for controlling the opening or closing of the infusion pipeline, wherein the infusion pipeline has an outlet for injecting a dilution liquid toward the carrier platform;
[0006] The infusion valve is a normally open valve body. After the infusion valve is powered off, the infusion pipeline is connected to allow the diluted liquid to flow out from the liquid outlet.
[0007] In the chip manufacturing equipment as described above, preferably, the liquid infusion pipeline has a plurality of liquid outlets, and the plurality of liquid outlets are arranged in a ring shape and are disposed around the supporting platform.
[0008] As described above, in the chip manufacturing equipment, preferably, the chip manufacturing equipment has a plurality of infusion pipelines, and the infusion pipelines correspond one-to-one to the liquid outlets.
[0009] In the chip manufacturing equipment as described above, preferably, the infusion pipeline includes a manifold and several branch pipelines, several branch pipelines are connected to the manifold, and each of the liquid outlets is connected to the corresponding branch pipeline.
[0010] The chip manufacturing equipment as described above, wherein preferably, the upper surface of the carrier is provided with a vacuum adsorption port for adsorbing wafers, and the chip manufacturing equipment also has a vacuum adsorption tube connected to the vacuum adsorption port and a vacuum adsorption machine connected to the vacuum adsorption tube.
[0011] The chip manufacturing equipment as described above, wherein preferably, the chip manufacturing equipment also has a vacuum buffer device, and the vacuum buffer device includes a vacuum buffer bottle; the vacuum buffer device is arranged in parallel with the vacuum adsorption machine and is connected to the vacuum adsorption tube.
[0012] The chip manufacturing equipment as described above, wherein preferably, the chip manufacturing equipment further comprises a drying device, and the drying device dries the liquid on the surface of the wafer after the dilution liquid is emitted from the infusion pipeline.
[0013] In the chip manufacturing equipment as described above, preferably, the drying device comprises an air jet pipe, and the air jet pipe has an air jet pipe opening arranged toward the carrier platform.
[0014] The chip manufacturing equipment as described above, wherein preferably, the chip manufacturing equipment also has a temperature sensor, an exhaust pipeline, an exhaust valve arranged on the exhaust pipeline and a control unit, and the control unit is electrically connected to the temperature sensor and the exhaust valve; the temperature sensor obtains the temperature in the chamber and transmits the temperature data to the control unit, and the control unit controls the exhaust valve to open.
[0015] The chip manufacturing equipment as described above, wherein preferably, the chip manufacturing equipment has a plurality of the exhaust pipelines, and the plurality of exhaust pipelines are arranged in a ring shape with the supporting platform as the center.
[0016] Compared with the prior art, the utility model sets an infusion pipeline in the chamber, and a normally open infusion valve is set on the infusion pipeline. The infusion valve is in a closed state when the power is on, and in an open state when the power is off. The above-mentioned structure enables the infusion pipeline to be opened after an abnormality such as power failure occurs in the manufacturing equipment, and fluids such as water are sprayed out of the infusion pipeline. The sprayed fluid is sprayed out from the liquid outlet and sprayed onto the surface of the wafer on the carrier, which can dilute the acid or alkali liquid remaining on the surface of the wafer, thereby reducing the corrosiveness of the liquid, protecting the wafer, and avoiding the scrapping of the wafer placed on the carrier after the manufacturing equipment fails. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a first structural schematic diagram of the chip manufacturing equipment disclosed in the utility model;
[0018] Figure 2 It is a second structural schematic diagram of the chip manufacturing equipment disclosed in the utility model;
[0019] Figure 3 It is a schematic diagram of the internal structure of the chip manufacturing equipment disclosed in the utility model;
[0020] Explanation of the accompanying drawings: 1-cover body, 10-chamber, 2-carrying platform, 21-vacuum adsorption tube, 22-vacuum adsorption machine, 23-vacuum valve, 3-infusion pipeline, 31-liquid outlet, 4-infusion valve, 5-vacuum buffer device, 6-temperature sensor, 7-exhaust pipeline, 8-exhaust valve. DETAILED DESCRIPTION
[0021] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.
[0022] Embodiments of the present utility model: Figure 1-3 As shown, a chip manufacturing device is disclosed, including: a cover body 1 with a chamber 10, a supporting platform 2 arranged in the chamber 10, an infusion pipeline 3 connected to the chamber 10 and an infusion valve 4 for controlling the opening or closing of the infusion pipeline 3, the infusion pipeline 3 has an outlet 31 for injecting a dilution liquid toward the supporting platform 2; the infusion valve 4 is a normally open valve body, and after the infusion valve 4 is powered off, the infusion pipeline 3 is connected to allow the dilution liquid to flow out from the outlet 31.
[0023] The wafer is processed in the chamber 10. Specifically, the wafer is placed on the carrier 2. Different corrosive chemical liquids such as acids or alkalis are used in the chip production process. In normal operation, the acid or alkali liquid will be neutralized or removed before entering the next process after use. However, when the equipment fails or the machine loses power, the wafer cannot be transferred to the next workstation in time, and the residual liquid on the wafer surface cannot be neutralized or removed. When the acid or alkali stays on the wafer surface for a long time, it is easy to cause corrosion to the wafer surface circuit, thereby causing the wafer to be scrapped.
[0024] In order to solve the above technical problems, the present application sets an infusion line 3 in the chamber 10, and a normally open infusion valve 4 is set on the infusion line 3. The infusion valve 4 is in a closed state when the power is on, and in an open state when the power is off. The above structure is set to open the infusion line 3 after the manufacturing equipment has an abnormality such as power failure, and water and other fluids are sprayed out of the infusion line 3. The sprayed fluid is sprayed out from the liquid outlet 31 and sprayed onto the surface of the wafer on the carrier 2, which can dilute the acid or alkali liquid remaining on the surface of the wafer, thereby reducing the corrosiveness of the liquid, protecting the wafer, and avoiding the scrapping of the wafer placed on the carrier 2 after the manufacturing equipment fails.
[0025] The liquid outlets 31 are provided in a plurality, and the plurality of liquid outlets 31 are arranged in a ring shape and are provided around the supporting platform 2 .
[0026] The multiple liquid outlets 31 arranged around the carrier 2 can spray the dilution liquid from multiple angles, so that the dilution liquid can be sprayed more evenly onto the wafer placed on the carrier, thereby better flushing or diluting the liquid on the wafer surface and better protecting the wafer surface.
[0027] In this embodiment, two liquid outlets 31 are provided, and the two liquid outlets 31 are relatively arranged on both sides of the supporting platform 2. Of course, in other embodiments, multiple liquid outlets 31 can also be provided, and the multiple liquid outlets 31 are evenly spaced along the circumference of the supporting platform 2.
[0028] The infusion pipelines 3 are also provided in a plurality, and the infusion pipelines 3 correspond one-to-one with the liquid outlets 31. In one embodiment, each liquid outlet 31 has a corresponding infusion pipeline 3 to supply liquid thereto.
[0029] In other embodiments, the infusion pipeline 3 includes a confluence pipe and several branch pipes, the several branch pipes are connected to the confluence pipe, and each of the liquid outlets 31 is connected to a corresponding branch pipe. In this embodiment, the branch pipes directly connect the liquid outlet 31 and the confluence pipe.
[0030] In another embodiment, the liquid outlets 31 can also be connected through branch pipes, and then several branch pipes are connected to the manifold. In this embodiment, the branch pipes first complete the connection with several liquid outlets 31, and then the branch pipes are connected to the manifold through other pipes. Compared with other embodiments, in this embodiment, the pipes can be arranged more flexibly.
[0031] In order to better place the wafer on the carrier 2, the upper surface of the carrier 2 is provided with a vacuum adsorption port for adsorbing the wafer, and the chip manufacturing equipment also has a vacuum adsorption tube 21 connected to the vacuum adsorption port and a vacuum adsorption machine 22 connected to the vacuum adsorption tube 21.
[0032] There are multiple vacuum adsorption ports, which are evenly arranged on the carrier 2. Under the action of the vacuum adsorption machine 22, the wafer can be adsorbed on the surface of the carrier 2 by the vacuum adsorption port, so that the wafer can be more stably supported during the processing.
[0033] It is understandable that a vacuum valve 23 is also provided on the vacuum adsorption tube 21 , and the vacuum valve 23 is used to control the opening or closing of the vacuum adsorption tube 21 .
[0034] The vacuum adsorption machine 22 is generally powered by the manufacturing equipment. When the manufacturing equipment fails, the vacuum adsorption machine 22 will also stop working. At this time, the carrier 2 will no longer adsorb the wafer, but the carrier 2 cannot stop rotating in time due to its own inertia. Such structural features are prone to the problem of wafer flying, causing the wafer to fall off the surface of the carrier 2 and cause damage to the wafer.
[0035] In order to avoid the technical problem that the wafer cannot be vacuum adsorbed after a sudden failure of the manufacturing equipment, the chip manufacturing equipment also has a vacuum buffer device 5, which can generate vacuum adsorption force on the wafer after a failure of the manufacturing equipment.
[0036] The vacuum buffer device 5 includes a vacuum buffer bottle; the vacuum buffer device 5 is arranged in parallel with the vacuum adsorption machine 22 and is connected to the vacuum adsorption tube 21 .
[0037] The chip manufacturing equipment also has a drying device, which dries the liquid on the surface of the wafer after the dilution liquid is emitted from the infusion pipeline 3. The setting of the drying device can dry the liquid on the surface of the wafer in time, thereby better protecting the wafer.
[0038] The drying device comprises an air jet pipe having an air jet pipe opening arranged toward the carrier platform. In this embodiment, the drying device adopts an air jet method, and the air jet flow can dry the wafer surface. Of course, the air jet can also make the hot steam heat and evaporate the liquid on the wafer surface.
[0039] The chip manufacturing equipment also has a temperature sensor 6, an exhaust pipeline 7, an exhaust valve 8 arranged on the exhaust pipeline and a control unit, and the control unit is electrically connected to the temperature sensor 6 and the exhaust valve 8; the temperature sensor 6 obtains the temperature in the chamber and transmits the temperature data to the control unit, and the control unit controls the exhaust valve 8 to open.
[0040] The temperature sensor 6 can obtain the temperature in the chamber 10 in time, and control the exhaust valve 8 to open when the temperature is high. The exhaust valve 8 allows the high-temperature air in the chamber 10 to be extracted in time to control the temperature in the chamber and avoid excessively high temperature in the chamber that affects the quality of the wafer.
[0041] The exhaust pipes 7 are provided in a plurality, and the exhaust pipes 7 are arranged in a ring shape with the carrying platform 2 as the center. The exhaust pipes 7 are arranged in a ring shape along the carrying platform 2 to better achieve uniform temperature on the carrying platform 2.
[0042] In this embodiment, two exhaust pipelines 7 are provided, and the two exhaust pipelines 7 are symmetrically arranged on both sides of the supporting platform 2 .
[0043] Of course, in other embodiments, a plurality of exhaust pipelines 7 may be provided, and the plurality of exhaust pipelines 7 are evenly spaced and arranged along the circumference of the supporting platform 2 .
[0044] The above describes in detail the structure, features and effects of the utility model based on the embodiments shown in the drawings. The above is only a preferred embodiment of the utility model, but the utility model is not limited to the scope of implementation shown in the drawings. Any changes made in accordance with the concept of the utility model, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and the drawings, should be within the protection scope of the utility model.
Claims
1. A chip manufacturing device, characterized in that: include: A cover body having a chamber, a supporting platform arranged in the chamber, an infusion pipeline communicating with the chamber, and an infusion valve controlling the opening or closing of the infusion pipeline, wherein the infusion pipeline has an outlet for injecting a dilution liquid toward the supporting platform; The infusion valve is a normally open valve body. After the infusion valve is powered off, the infusion pipeline is connected to allow the diluted liquid to flow out from the liquid outlet.
2. The chip manufacturing equipment according to claim 1, characterized in that: The infusion pipeline has a plurality of liquid outlets, which are arranged in a ring shape and are arranged around the supporting platform.
3. The chip manufacturing equipment according to claim 2, characterized in that: The chip manufacturing equipment has a plurality of infusion pipelines, and the infusion pipelines correspond to the liquid outlets one by one.
4. The chip manufacturing equipment according to claim 2, characterized in that: The infusion pipeline includes a confluence pipe and several branch pipes, the several branch pipes are connected to the confluence pipe, and each of the liquid outlets is connected to the corresponding branch pipe.
5. The chip manufacturing equipment according to claim 1, characterized in that: The upper surface of the carrier is provided with a vacuum adsorption port for adsorbing wafers, and the chip manufacturing equipment also has a vacuum adsorption tube connected to the vacuum adsorption port and a vacuum adsorption machine connected to the vacuum adsorption tube.
6. The chip manufacturing equipment according to claim 5, characterized in that: The chip manufacturing equipment also has a vacuum buffer device, which includes a vacuum buffer bottle; the vacuum buffer device is arranged in parallel with the vacuum adsorption machine and is connected to the vacuum adsorption pipe.
7. The chip manufacturing equipment according to claim 1, characterized in that: The chip manufacturing equipment also has a drying device, which dries the liquid on the surface of the wafer after the dilution liquid is emitted from the infusion pipeline.
8. The chip manufacturing equipment according to claim 7, characterized in that: The drying device comprises an air jet pipe, wherein the air jet pipe has an air jet pipe opening arranged toward the supporting platform.
9. The chip manufacturing equipment according to claim 1, characterized in that: The chip manufacturing equipment also has a temperature sensor, an exhaust pipeline, an exhaust valve arranged on the exhaust pipeline and a control unit, and the control unit is electrically connected to the temperature sensor and the exhaust valve; the temperature sensor obtains the temperature in the chamber and transmits the temperature data to the control unit, and the control unit controls the exhaust valve to open.
10. The chip manufacturing equipment according to claim 9, characterized in that: The chip manufacturing equipment has a plurality of the exhaust pipelines, and the plurality of exhaust pipelines are arranged in a ring shape with the supporting platform as the center.