Single-chip cleaning device

Abstract

The utility model relates to the technical field of semiconductor substrate material manufacturing, and particularly discloses a single-chip cleaning device which comprises two coaxially arranged water passing discs, water guiding cavities are formed in the opposite surfaces of the two water passing discs, water spraying discs are arranged on the opposite surfaces of the two water passing discs, and the water guiding cavities are communicated with the water spraying discs. A limiting module is arranged between the two water spraying discs so that an interval can be formed between the two water spraying discs, water spraying holes distributed in a rectangular array mode are formed in the two water spraying discs, the water guiding cavity is communicated with the interval through the water spraying holes, and the axis direction of all the water spraying holes and the axis direction of the water spraying discs form the same inclination angle. And the water spraying directions of the water spraying holes in the two water spraying discs towards the interval are opposite. The axis direction of the water spraying holes and the axis direction of the water spraying disc form the same inclination angle, so that inclined impulsive force is formed after water spraying and acts on the surfaces of the two sides of the substrate piece, meanwhile, the directions of water flow sprayed to the surfaces of the two sides of the substrate piece can be opposite, and the water flow for cleaning the surfaces of the two sides of the substrate piece is conveniently divided and collected; therefore, the cross contamination of water is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor substrate material manufacturing, in particular to a single-wafer cleaning device. Background Art

[0002] At present, in the preparation of indium phosphide substrates, vacuum adsorption and manual picking of the back of the substrate are mostly used to clean the indium phosphide substrates. This method is only suitable for cleaning single-sided polished substrates with no requirements on the back side, and cannot meet the cleaning requirements of double-sided polished substrates with high requirements on the cleanliness of the back side. Vacuum adsorption and manual picking of the back of the substrate will inevitably leave marks and cannot ensure the quality of the substrate. Moreover, since the thickness of the substrate is very thin, vacuum adsorption is likely to cause deformation and depression of the substrate, which leads to unsatisfactory cleaning effect.

[0003] In the prior art, a cleaning jig is designed to replace vacuum adsorption. During cleaning, the substrate sheet needs to be placed in the jig and cleaned with a water jet perpendicular to the substrate sheet. However, this cleaning method easily causes dirty water from the top and bottom of the substrate sheet to mix together, increasing cross-contamination of water, and still cannot guarantee the cleanliness of the substrate sheet. Utility Model Content

[0004] The technical problem to be solved by the utility model is: how to solve the problem that the existing cleaning method increases the cross contamination of water and cannot ensure the cleanliness of the substrate sheet.

[0005] In order to solve the above technical problems, the utility model provides a single-chip cleaning device, comprising two coaxially arranged water-passing trays, water-guiding cavities are provided on the facing surfaces of the two water-passing trays, water-spraying trays are provided on the facing surfaces of the two water-passing trays, a limiting module is provided between the two water-spraying trays so that a gap is formed between the two water-spraying trays, water-spraying holes arranged in a rectangular array are provided on the two water-spraying trays, the water-guiding cavities and the gap are connected through the water-spraying holes, the axial directions of all the water-spraying holes are at the same inclination angle with the axial directions of the water-spraying trays, and the water-spraying holes on the two water-spraying trays spray water into the gap in opposite directions.

[0006] Further preferably, the water spray tray is tightly and sealingly connected to the corresponding water passage tray.

[0007] Further preferably, water inlets communicating with the water guiding cavity are formed on opposite surfaces of the two water passing plates, and the water inlets are used to introduce pressurized water into the water guiding cavity.

[0008] Further preferably, the limiting modules are provided with at least two groups, each group of the limiting modules comprises two limiting posts, and the two limiting posts are arranged opposite to each other on the water spray plate.

[0009] Further preferably, the limiting column is arranged at the outer edge of the water spray disc along the radial direction of the water spray disc.

[0010] Compared with the prior art, the single-wafer cleaning device provided by the utility model has the following beneficial effects:

[0011] The utility model is provided with two water-passing trays and a water-guiding cavity is formed on the water-passing trays. When in use, pressurized water is introduced into the water-guiding cavity, and after a substrate sheet is placed in the interval between the two water-spraying trays, a limiting module limits the circumference of the substrate sheet, and the pressurized water in the water-guiding cavity is sprayed toward the two side surfaces of the substrate sheet in the interval through the water-spraying holes on the water-spraying trays, thereby realizing the cleaning of the substrate sheet; since the axial directions of all the water-spraying holes and the axial directions of the water-spraying trays are at the same inclination angle, an inclined impulse is formed after the water is sprayed to act on the two side surfaces of the substrate sheet, and in addition, the water-spraying holes on the two water-spraying trays spray water in opposite directions into the interval, so that the water flow directions sprayed toward the two side surfaces of the substrate sheet are opposite, which is convenient for diverting and converging the water flow for cleaning the two side surfaces of the substrate sheet, thereby reducing the cross contamination of water, and further ensuring the cleanliness of the substrate sheet cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a single-wafer cleaning device described in the utility model.

[0013] Figure 2 It is a structural schematic diagram of the first water-passing tray or the second water-passing tray of the utility model.

[0014] Figure 3 It is a top view of a single-wafer cleaning device described in the utility model.

[0015] Figure 4 This utility model Figure 3 Cross-sectional view of section AA.

[0016] Figure 5 It is an assembly diagram of the first water spray tray and the second water spray tray of the utility model.

[0017] Figure 6 It is a structural schematic diagram of the first water spray disc of the utility model.

[0018] Figure 7 It is a structural schematic diagram of the second water spray disc of the utility model.

[0019] Figure 8 This is an assembly diagram of the first water spray disc and the substrate sheet of the utility model.

[0020] In the figure:

[0021] 10. First water-passing tray; 11. First water-conducting cavity; 12. First water inlet;

[0022] 20. Second water tray; 21. Second water guide cavity; 22. Second water inlet;

[0023] 30. First water spray plate; 31. First water spray hole; 32. First limiting column;

[0024] 40. Second water spray plate; 41. Second water spray hole; 42. Second limiting column;

[0025] 50. Substrate sheet. DETAILED DESCRIPTION

[0026] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like used in the present invention to indicate the orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0028] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0032] like Figure 1-Figure 8 As shown, the present embodiment provides a single-wafer cleaning device, comprising a first water passing tray 10 and a second water passing tray 20 which are coaxially arranged, a first water guiding cavity 11 is provided on the surface of the first water passing tray 10 facing the second water passing tray 20, a first water inlet 12 which is connected to the first water guiding cavity 11 is provided on the surface of the first water passing tray 10 which is opposite to the second water passing tray 20, pressurized water can be introduced into the first water guiding cavity 11 through the first water inlet 12, a second water guiding cavity 21 is provided on the surface of the second water passing tray 20 facing the first water passing tray 10, a second water inlet 22 is provided on the surface of the second water passing tray 20 which is opposite to the first water passing tray 10, pressurized water can be introduced into the second water guiding cavity 21 through the second water inlet 22.

[0033] In a specific embodiment, a first water spraying plate 30 is provided on the surface of the first water passing plate 10 facing the second water passing plate 20, and the first water spraying plate 30 is closely and sealedly connected to the first water passing plate 10, so that the first water guiding cavity 11 forms a sealed space, thereby avoiding overflow, leakage, etc. during the cleaning process of the substrate sheet 50; similarly, in order to achieve synchronous cleaning of the two sides of the substrate sheet 50, a second water spraying plate 40 is provided on the surface of the second water passing plate 20 facing the first water passing plate 10, and the second water spraying plate 40 is closely and sealedly connected to the second water passing plate 20, so that the first water guiding cavity 11 forms a sealed space; when the substrate sheet 50 is actually cleaned, the substrate sheet 50 is cleaned. 0 is placed between the first water spray tray 30 and the second water spray tray 40. For this purpose, a gap for placing the substrate sheet 50 is reserved between the two first water spray trays 30 and the second water spray trays 40. The first water guide cavity 11 is connected to the gap through the first water spray hole 31, and the second water guide cavity 21 is connected to the gap through the second water spray hole 41. Further, the first water spray tray 30 is provided with first water spray holes 31 arranged in a rectangular array, and the second water spray tray 40 is provided with second water spray holes 41 arranged in a rectangular array. The first water spray holes 31 and the second water spray holes 41 correspond to the two side surfaces of the substrate sheet 50 respectively, so that the two side surfaces of the substrate sheet 50 can be cleaned at the same time.

[0034] In the above embodiment, the axial direction of the first water spray hole 31 and the second water spray hole 41 is the same, and is at the same inclination angle as the axial direction of the first water spray plate 30 or the second water spray plate 40. After the water spray holes spray water, an inclined impulse is formed to act on the two side surfaces of the substrate sheet 50, so that the directions of the water flows sprayed to the two side surfaces of the substrate sheet 50 are opposite, which is convenient for diverting and converging the water flows for cleaning the two side surfaces of the substrate sheet 50, thereby reducing cross-contamination of water and ensuring the cleanliness of the substrate sheet 50.

[0035] Specifically, please combine Figure 4 It is understood that the pressurized water in the first water guiding cavity 11 is sprayed obliquely toward the upper surface of the substrate sheet 50 through the first water spray hole 31, and when the water flow contacts the upper surface of the substrate sheet 50, it continues to flow along the first direction a until it flows out of the device from the gap for collection; similarly, the pressurized water in the second water guiding cavity 21 is sprayed obliquely toward the lower surface of the substrate sheet 50 through the second water spray hole 41, and when the water flow contacts the lower surface of the substrate sheet 50, it continues to flow along the second direction b until it flows out of the device from the other side of the gap for collection; it can be seen that although the first water spray hole 31 and the second water spray hole 41 have the same inclination angle, they flow in different directions after acting on the two side surfaces of the substrate sheet 50, thereby effectively reducing cross contamination of water.

[0036] In some embodiments, in order to prevent the first water spray disc 30 and the second water spray disc 40 from clamping and damaging the substrate sheet 50, and to ensure that the sewage after cleaning can be diverted and collected, a limiting module is provided between the first water spray disc 30 and the second water spray disc 40, and the width of the interval is limited by the limiting module. During cleaning, the substrate sheet 50 is placed in the interval, and the circumference of the substrate sheet 50 is limited by the limiting module, which can prevent the substrate sheet 50 from moving during the cleaning process and ensure the cleaning effect.

[0037] In the above embodiment, there are at least two groups of limiting modules, each group of limiting modules includes two limiting columns, and the two limiting columns are arranged opposite to each other on the water spray disk so as to be able to limit the circumference of the substrate sheet 50; the limiting columns are arranged at the outer edge of the water spray disk along the radial direction of the water spray disk to ensure that the limiting of the substrate sheet 50 does not affect the water flow collection through the gap.

[0038] In the above embodiment, the limiting module includes a first limiting column 32 and a second limiting column 42, wherein the first limiting column 32 is arranged on the outer edge of one side of the first water spray disk 30 facing the second water spray disk 40, and the second limiting column 42 is arranged on the outer edge of one side of the second water spray disk 40 facing the first water spray disk 30. The first limiting column 32 and the second limiting column 42 are staggered with each other to form a gap. The first limiting column 32 and the second limiting column 42 can limit the circumference of the substrate sheet 50, thereby ensuring the balance and stability of the substrate sheet 50 during the cleaning process, and avoiding the substrate sheet 50 from moving under the action of the oblique water flow.

[0039] In summary, the embodiment of the utility model provides a single-wafer cleaning device, which is provided with two water-passing trays and a water-conducting cavity is formed on the water-passing trays. When in use, pressurized water is introduced into the water-conducting cavity, and after the substrate sheet is placed in the interval between the two water-spraying trays, the limiting module limits the circumference of the substrate sheet, and the pressurized water in the water-conducting cavity is sprayed onto the two side surfaces of the substrate sheet in the interval through the water-spraying holes on the water-spraying trays, thereby achieving cleaning of the substrate sheet; since the axial directions of all the water-spraying holes are at the same inclination angle as the axial directions of the water-spraying trays, an inclined impulse is formed after water spraying to act on the two side surfaces of the substrate sheet, and in addition, the water-spraying holes on the two water-spraying trays spray water into the interval in opposite directions, so that the water flow directions sprayed onto the two side surfaces of the substrate sheet are opposite, which is convenient for diverting and converging the water flow for cleaning the two side surfaces of the substrate sheet, thereby reducing cross-contamination of water, and further ensuring the cleanliness of the substrate sheet cleaning.

[0040] The above is only a preferred embodiment of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the utility model, and these improvements and substitutions should also be regarded as the protection scope of the utility model. The above shows and describes the basic principles, main features and advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above preferred embodiments. The embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, so it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims in the utility model.

[0041] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A single-wafer cleaning device, characterized in that: It comprises two coaxially arranged water-passing trays, the surfaces facing each other of the two water-passing trays are provided with water-guiding cavities, the surfaces facing each other of the two water-passing trays are provided with water-spraying trays, a limiting module is provided between the two water-spraying trays so as to form a gap between the two water-spraying trays, the two water-spraying trays are provided with water-spraying holes arranged in a rectangular array, the water-guiding cavities and the gap are connected through the water-spraying holes, the axial directions of all the water-spraying holes are at the same inclination angle with the axial directions of the water-spraying trays, and the water-spraying holes on the two water-spraying trays spray water into the gap in opposite directions.

2. A single-wafer cleaning device according to claim 1, characterized in that: The water spraying disc is closely and sealingly connected to the corresponding water passing disc.

3. A single-wafer cleaning device according to claim 1, characterized in that: Water inlets communicated with the water guide cavity are provided on the opposite surfaces of the two water-passing plates, and the water inlets are used to introduce pressurized water into the water guide cavity.

4. A single-wafer cleaning device according to claim 1, characterized in that: The limiting modules are provided with at least two groups, each group of the limiting modules comprises two limiting posts, and the two limiting posts are arranged opposite to each other on the water spraying plate.

5. A single-wafer cleaning device according to claim 4, characterized in that: The limiting column is arranged at the outer edge of the water spray disc along the radial direction of the water spray disc.

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