Wafer magazine placing mechanism and inner pin bonding device with same

Abstract

The utility model relates to a wafer magazine placing mechanism and an inner pin jointing device with the same, the wafer magazine placing mechanism comprises a bearing table and a plurality of movable stand columns connected to the bearing table, and the bearing table is provided with a bearing surface for placing a wafer magazine. Each movable stand column has an initial state of protruding upwards out of the bearing surface and a retraction state of retracting at least part of the movable stand column towards the interior of the bearing table after being pressed, and the movable stand columns are configured in the mode that when the wafer magazine is placed on the bearing surface, at least part of the movable stand columns adjust the current state in a self-adaptive mode according to the bottom form of the wafer magazine; the side walls of at least part of the movable stand columns abut against the wafer magazine so as to limit the position of the wafer magazine on the bearing face. The wafer magazine placing mechanism provided by the utility model not only can adapt to wafer magazines with different sizes and structures and improve the universality of the placing mechanism, but also allows an operator to flexibly adjust the positions of the magazines within a certain range so as to meet the requirements of different production scenes.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a wafer magazine placement mechanism and an inner pin bonding device having the same. Background Art

[0002] In the industry, the wafer magazine placement platform in the inner pin bonding device mostly relies on the limit block to ensure its stability on the platform. Although this limit block design can basically meet the needs of fixing the magazine, due to the large differences in the size and bottom structure of each magazine, the limit block can often only be designed for a specific magazine model, resulting in limited versatility of the wafer magazine placement platform. In addition, the limit block is usually tightly connected to the platform by bolts, and its position is fixed. Once installed, the adjustment space for the magazine position is extremely limited.

[0003] Therefore, it is necessary to provide an improved technical solution to solve the above problems. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To achieve the above-mentioned purpose of the utility model, the utility model provides a wafer magazine placement mechanism, and its specific design method is as follows.

[0005] A wafer magazine placement mechanism comprises a carrier platform and a plurality of movable columns connected to the carrier platform, the carrier platform having a carrier surface for placing the wafer magazine, the movable columns having an initial state of protruding upward beyond the carrier surface, and a retracted state of retracting at least part of the structure toward the inside of the carrier platform after being pressed, and the plurality of movable columns are configured as follows: when the wafer magazine is placed on the carrier surface, at least part of the movable columns adaptively adjust the current state according to the bottom shape of the wafer magazine, and the wafer magazine is supported by the side walls of at least part of the movable columns to limit the position of the wafer magazine on the carrier surface.

[0006] Furthermore, the wafer magazine placement mechanism also has an elastic reset member that drives the movable column to reset from the retracted state to the initial state.

[0007] Furthermore, the elastic return member is a spring connected between the movable column and the bearing platform.

[0008] Furthermore, the support platform includes a bottom plate and a cover plate that are detachably connected, and a plurality of mounting holes that match the movable columns one by one are formed on the cover plate.

[0009] Furthermore, an inner cavity is formed between the cover plate and the bottom plate and is connected to the mounting hole to provide a receiving space for the movable column when the movable column is retracted.

[0010] Furthermore, the base plate includes a main body portion spaced apart from the cover plate and a side portion protruding from the periphery of the main body portion toward the direction where the cover plate is located, and the cover plate is connected to the side portion by screws.

[0011] Furthermore, two ends of the elastic reset member are respectively connected to the movable column and the bottom plate.

[0012] Furthermore, the shape of the side wall of the mounting hole is adapted to the outer shape of the corresponding movable column to limit the movement of the movable column in its own length direction.

[0013] Furthermore, the plurality of movable columns are evenly distributed in a rectangular array.

[0014] The utility model also provides an inner pin bonding device, which comprises the wafer magazine placing mechanism mentioned above.

[0015] The beneficial effect of the utility model is that based on the specific design structure of the wafer magazine placement mechanism provided by the utility model, in specific application scenarios, it can not only adapt to wafer magazines of different sizes and structures, improve the versatility of the placement mechanism, but also allow operators to flexibly adjust the magazine position within a certain range to meet the needs of different production scenarios. Through such improvements, not only can the practicality of the wafer magazine placement mechanism be improved, but also the efficiency and standardization of related production processes can be further promoted. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0017] Figure 1 The figure is a three-dimensional schematic diagram of an implementation structure of the wafer magazine placement mechanism of the utility model;

[0018] Figure 2 Shown is a schematic diagram of a wafer magazine placed on the wafer magazine placement mechanism of the utility model;

[0019] Figure 3 Shown are schematic diagrams of the movable pillars in different states when the wafer magazine is placed on the wafer magazine placement mechanism;

[0020] Figure 4 Shown Figure 2 A partial schematic diagram of the structure after cutting at the AA' position;

[0021] Figure 5 Shown Figure 4 Enlarged schematic diagram of part a in the middle.

[0022] In the figure, 11-carrying platform, 111-bottom plate, 1111-main body, 1112-side portion, 112-cover plate, 113-screw, 110-inner cavity, 12-movable column, 121-first movable column, 122-second movable column, 13-elastic reset member, 200-wafer magazine, 21-bottom raised area, 22-bottom recessed area. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] refer to Figure 1 As shown, the wafer magazine placement mechanism of the present invention includes a carrier 11 and a plurality of movable columns 12 connected to the carrier 11. Figure 2 As shown, the carrier 11 has a carrier surface for placing the wafer magazine 200. In the orientation shown in the figure, the carrier surface of the carrier 11 is the top surface thereof.

[0025] In the utility model, each movable column 12 has an initial state of protruding upward beyond the bearing surface of the bearing platform 11 and a retracted state of at least partially retracting toward the inside of the bearing platform 11 after being pressed. Several movable columns 12 are configured as follows: when the wafer magazine 200 is placed on the bearing surface, at least part of the movable columns 12 adaptively adjust the current state according to the bottom shape of the wafer magazine 200, and support the wafer magazine 200 through the side walls of at least part of the movable columns 12 to limit the position of the wafer magazine 200 on the bearing surface.

[0026] More detailed, combined Figure 2 , Figure 3 , Figure 4 , Figure 5As shown, the bottom of the wafer magazine 200 includes a bottom raised area 21 and a bottom recessed area 22. When the wafer magazine 200 is placed on the bearing surface, the first movable column 121 corresponding to the position of the bottom raised area 21 will be subjected to pressure and switch from the initial state to the retracted state, so that the wafer magazine 200 is supported by the bearing surface of the carrier 11; the second movable column 122 corresponding to the position of the bottom recessed area 22 and the periphery of the wafer magazine 200 will remain in the initial state. At this time, since the outer side wall of the wafer magazine 200 and the edge side wall of the bottom recessed area 22 will form abutment with part of the side wall of the second movable column 122, the wafer magazine 200 can be confined to a specific position on the bearing surface of the carrier 11.

[0027] It can be understood that in other embodiments of the present invention, the wafer magazine 200 can also be supported and limited in position only by the side walls of the second movable column 122 corresponding to the position of the recessed area 22, or can be supported and limited in position only by the side walls of the second movable column 122 outside the wafer magazine 200.

[0028] The utility model also provides an inner pin bonding device, which comprises the wafer magazine placing mechanism mentioned above.

[0029] Based on the specific design structure of the wafer magazine placement mechanism provided by the utility model, in specific application scenarios, it can not only adapt to wafer magazines 200 of different sizes and structures, improving the versatility of the placement mechanism; it also allows operators to flexibly adjust the position of the wafer magazine 200 within a certain range to meet the needs of different production scenarios. When the wafer magazine 200 needs to be adjusted, it is only necessary to pick up the wafer magazine 200 and re-place it at the target position. Through the improved technology of the utility model, not only can the practicality of the wafer magazine placement mechanism be improved, but also the efficiency and standardization of related production processes can be further promoted.

[0030] In some specific embodiments of the present invention, Figure 4 , Figure 5 As shown, the wafer magazine placement mechanism also has an elastic reset member 13 that drives the movable column 12 to return from the retracted state to the initial state. In this way, when the wafer magazine 200 is removed from the carrier 11, the movable column 12 can be restored to the initial state and can be used for the next positioning and placement action of the wafer magazine 200.

[0031] As a preferred embodiment, the elastic reset member 13 is a spring connected between the movable column 12 and the support platform 11. It can be understood that in other embodiments of the utility model, the elastic reset member 13 can also be other springs, elastic pads, etc. that can provide elastic restoring force, which will not be described one by one here.

[0032] Further preferably, in some specific implementation structures of the utility model, the carrier 11 includes a detachably connected bottom plate 111 and a cover plate 112, and the cover plate 112 is formed with a plurality of mounting holes (not marked in the figure) that match the movable columns 12 one by one. In this embodiment, since the carrier 11 is composed of the detachably connected bottom plate 111 and the cover plate 112, it is convenient to repair the wafer magazine placement mechanism after it is damaged.

[0033] To ensure that the movable column 12 has sufficient retraction space when retracting, refer to Figure 4 , Figure 5 As shown, an inner cavity 110 is formed between the cover plate 111 and the bottom plate 112 in this specific embodiment. The inner cavity 110 is connected to the mounting hole to provide a receiving space for the movable column 112 when the movable column 112 retracts.

[0034] In a specific implementation, the bottom plate 112 includes a main body 1111 spaced apart from the cover plate 111 and a side edge 1112 extending from the periphery of the main body 1111 toward the direction of the cover plate 112, and the cover plate 112 is connected to the side edge 1112 by screws 113. In this embodiment, the main body 1111, the side edge 1112 and the cover plate 112 are collectively arranged to form the inner cavity 110.

[0035] Further in the illustrated embodiment, the two ends of the elastic reset member 13 are respectively connected to the movable column 12 and the bottom plate 112. Specifically, when the elastic reset member 13 is a spring, the two ends of the spring are respectively fixedly connected to the lower end of the movable column 12 and the upper surface of the bottom plate 112.

[0036] In order to make the movable column 12 move in a direction perpendicular to the plane where the bearing surface is located, the movement of the movable column 12 can be guided during the movement of the movable column 12. Specifically, in this embodiment, the movement of the movable column 12 is guided by the shape of the mounting hole on the cover plate 111. Specifically, the side wall shape of the mounting hole is adapted to the shape of the corresponding movable column 12 to limit the movement of the movable column 12 in its own length direction. For example, when the movable column 12 is cylindrical, the mounting hole is a cylindrical hole, and the movable column 12 is slidably fitted into the cylindrical hole.

[0037] As a preferred implementation structure, a plurality of movable columns 12 are evenly distributed in a rectangular array, so that the wafer magazine has more position adjustment options on the carrier 11 .

[0038] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0039] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer magazine placement mechanism, characterized in that: It includes a carrier platform and a plurality of movable columns connected to the carrier platform, the carrier platform having a carrier surface for placing the wafer magazine, the movable columns having an initial state of protruding upward beyond the carrier surface, and a retracted state of at least a portion of the structure retracting toward the inside of the carrier platform after being pressed, and the plurality of movable columns are configured as follows: when the wafer magazine is placed on the carrier surface, at least a portion of the movable columns adaptively adjust the current state according to the bottom shape of the wafer magazine, and the wafer magazine is supported by the side walls of at least a portion of the movable columns to limit the position of the wafer magazine on the carrier surface.

2. The wafer magazine placement mechanism according to claim 1, characterized in that: The wafer magazine placement mechanism also has an elastic reset member for driving the movable column to reset from the retracted state to the initial state.

3. The wafer magazine placement mechanism according to claim 2, characterized in that: The elastic return member is a spring connected between the movable column and the bearing platform.

4. The wafer magazine placement mechanism according to claim 2 or 3, characterized in that: The bearing platform comprises a bottom plate and a cover plate which are detachably connected, and a plurality of mounting holes which match the movable columns one by one are formed on the cover plate.

5. The wafer magazine placement mechanism according to claim 4, characterized in that: An inner cavity is formed between the cover plate and the bottom plate and is communicated with the mounting hole to provide a receiving space for the movable column when the movable column is retracted.

6. The wafer magazine placement mechanism according to claim 5, characterized in that: The bottom plate includes a main body portion spaced apart from the cover plate and a side portion protruding from the periphery of the main body portion toward the direction where the cover plate is located, and the cover plate is connected to the side portion by screws.

7. The wafer magazine placement mechanism according to claim 4, characterized in that: Two ends of the elastic reset member are respectively connected to the movable column and the bottom plate.

8. The wafer magazine placement mechanism according to claim 4, characterized in that: The shape of the side wall of the mounting hole is adapted to the outer shape of the corresponding movable column to limit the movement of the movable column in its own length direction.

9. The wafer magazine placement mechanism according to any one of claims 1 to 3, characterized in that: The plurality of movable columns are evenly distributed in a rectangular array.

10. An inner pin bonding device, characterized in that: It includes the wafer magazine placement mechanism as described in any one of claims 1-9.

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