Optimized FPC electroplating structure

Abstract

The utility model discloses an optimized FPC electroplating structure, which comprises an FPC, the FPC comprises a binding end and an interface end, the binding end and the interface end are respectively arranged at two ends of the FPC, the binding end is used for being bound on a display screen, the binding end and the display screen are arranged in a one-time binding mode, an electroplating layer is arranged on the binding end, and the interface end is arranged on the interface end. And the electroplated layer is communicated with the interface end. The electroplating has the effect that the electroplating layer is arranged on the binding end of the FPC so as to avoid short circuit caused by repeated plugging.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC, in particular to an optimized FPC electroplating structure. Background Art

[0002] Display modules usually include a cover plate, a display screen, and a backlight. The display screen is usually bound with an FPC, which is used to connect to the customer's motherboard to ensure the normal use of the display module. Electroplating on the gold fingers connecting the FPC to the customer's motherboard can effectively prevent the FPC from oxidation and corrosion in a humid environment, extending the service life of the FPC. The electroplating layer can also improve the conductivity of the FPC gold fingers and ensure the stable transmission of current, so many customers have FPC electroplating requirements.

[0003] However, the FPC needs to be plated at the location where it is connected to the customer's mainboard, and the plated leads will remain at the end of the FPC, which poses a risk of short circuit after the FPC is repeatedly plugged into the customer's mainboard for use. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide an optimized FPC electroplating structure.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] An optimized FPC electroplating structure comprises: an FPC, wherein the FPC comprises a binding end and an interface end, wherein the binding end and the interface end are respectively located at two ends of the FPC, wherein the binding end is used to be bound to a display screen, wherein the binding end and the display screen are set for one-time binding, wherein an electroplating layer is arranged on the binding end, and wherein the electroplating layer is connected to the interface end.

[0007] In one embodiment, the electroplating layer is plated on the surface of the binding end, and the electroplating layer is provided with an electroplating lead, one end of the electroplating lead is an electroplating lead crimping area, and the electroplating lead crimping area is located at the position where the binding end faces the binding position with the display screen.

[0008] In one embodiment, the interface end is used to connect to the client mainboard, and the interface end is communicated with the binding end.

[0009] In one embodiment, a plurality of binding leads are provided at the binding end, and the plurality of binding leads are used for binding to a display screen.

[0010] In one embodiment, a plurality of interface leads are provided at the interface end, and the plurality of interface leads are used to connect to a customer mainboard.

[0011] In one embodiment, the plurality of interface leads are connected to the plurality of binding leads corresponding to the binding ends in a one-to-one correspondence, and the electroplating effect of the electroplating layer can act on the interface ends.

[0012] In one embodiment, the number of the interface leads at the interface end is an odd number.

[0013] In one embodiment, a gold finger is provided at the interface end of the FPC, a plurality of interface leads are located at the gold finger, the gold finger is used for plugging with the customer's mainboard, and a reinforcement plate is provided on the side of the FPC away from the gold finger.

[0014] In one embodiment, the binding end is covered with a protective glue for isolating water vapor, and the protective glue is arranged along the periphery of the binding end.

[0015] In one embodiment, the protective glue is in a U-shape and surrounds the outer periphery of the binding end, and the side of the binding end bound to the display screen is not covered by the protective glue.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] An optimized FPC electroplating structure of the utility model is achieved by arranging an electroplating layer on the binding end of the FPC, and the binding end is fixed after being bound to the display screen for one time, and the electroplated lead crimping area will not short-circuit after the binding end is bound for one time, thereby avoiding the risk of short circuit, and the interface end is connected with the binding end, so that the electroplating layer arranged on the binding end can also act on the interface end, thereby improving the conductive performance and service life of the interface end. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 A schematic diagram of an optimized FPC electroplating structure provided by the utility model;

[0020] Figure 2 for Figure 1 A magnified schematic diagram of part A;

[0021] Figure 3 A side structural schematic diagram of an optimized FPC electroplating structure provided by the utility model.

[0022] Description of the drawings: 10, FPC; 20, binding end; 21, binding lead; 30, interface end; 31, interface lead; 40, electroplating layer; 41, electroplated lead crimping area; 50, gold finger; 60, reinforcement plate; 70, protective glue. DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0024] An optimized FPC electroplating structure, referring to Figure 1 , including FPC10, FPC10 is a flexible circuit board. FPC10 includes a binding end 20 and an interface end 30, and the binding end 20 and the interface end 30 of FPC10 are respectively located at two ends of FPC10. The binding end 20 of FPC10 is used to bind with the display screen, and the binding of the binding end 20 and the display screen is fixed after one binding. The interface end 30 of FPC10 is used to connect with the customer's mainboard, and multiple plug-ins may be required during the connection process.

[0025] Reference Figure 1 and Figure 2 In order to prevent the electroplated lead from remaining at the end of the interface end 30 after electroplating to cause a short circuit during multiple plugging, a plating layer 40 is provided on the binding end 20 of the FPC 10, and the plating layer 40 is connected to the interface end 30. By providing the plating layer 40 on the binding end 20 of the FPC 10, the interface end 30 of the FPC 10 can be prevented from causing a short circuit after multiple plugging.

[0026] Reference Figure 1 and Figure 2 The electroplating layer 40 is plated on the surface of the binding end 20, and the electroplating layer 40 is provided with an electroplating lead, one end of the electroplating lead is an electroplating lead crimping area 41, and the electroplating lead crimping area 41 is located at the binding end 20 facing the display screen. The binding end 20 is fixed after the binding mode with the display screen is a one-time binding, and the electroplating lead crimping area 41 will not short-circuit after the binding end 20 is bound once, thereby avoiding the risk of short circuit.

[0027] Reference Figure 1 and Figure 2 The binding end 20 and the interface end 30 of the FPC 10 are connected so that the electroplating layer 40 provided on the binding end 20 can also act on the interface end 30, thereby improving the conductive performance and service life of the interface end 30.

[0028] Reference Figure 1 and Figure 2A plurality of binding leads 21 are provided at the binding end 20, and the plurality of binding leads 21 are used to bind to the display screen. A plurality of interface leads 31 are provided at the interface end 30, and the plurality of interface leads 31 are used to connect to the customer's mainboard. The plurality of interface leads 31 are connected one-to-one with the plurality of binding leads 21 corresponding to the binding end 20, so that the interface end 30 and the binding end 20 are connected, and the electroplating effect of the electroplating layer 40 can also act on the interface end 30.

[0029] Further, refer to Figure 1 The number of interface leads 31 of the interface end 30 is set as an odd number, and the interface leads 31 of the interface end 30 retain the odd number leads as a reserve, and additional electroplating can be performed from the interface end 30 when necessary, thereby ensuring the electroplating effect of the interface end 30.

[0030] Reference Figure 1 and Figure 3 A gold finger 50 is provided at the interface end 30 of the FPC 10, and a plurality of interface leads 31 are located at the gold finger 50. The gold finger 50 is used to be plugged with the customer's mainboard. Since the FPC 10 is a flexible circuit board, it will bend when plugged. Therefore, a reinforcing plate 60 is provided at the position of the FPC 10 relative to the gold finger 50. The reinforcing plate 60 is located on the side of the FPC 10 away from the gold finger 50. The reinforcing plate 60 is used to strengthen the strength of the interface end 30 of the FPC 10 so that it is not easy to bend and be damaged when plugged.

[0031] Further, refer to Figure 1 and Figure 2 The binding end 20 of the FPC 10 is covered with a protective glue 70, which is arranged along the periphery of the binding end 20 and surrounds the binding end 20 to protect the binding end 20. The protective glue 70 can isolate water vapor to prevent the binding area from being disturbed by water vapor.

[0032] Reference Figure 1 and Figure 2 The protective glue 70 is U-shaped and surrounds the periphery of the binding end 20 . The protective glue 70 does not cover the side where the binding end 20 is bound to the display screen, and the other sides of the binding end 20 are covered by the protective glue 70 .

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An optimized FPC electroplating structure, characterized in that: include: An FPC (10), the FPC (10) comprising a binding end (20) and an interface end (30), the binding end (20) and the interface end (30) being located at two ends of the FPC (10), respectively, the binding end (20) being used to be bound to a display screen, the binding end (20) and the display screen being a one-time binding arrangement, the binding end (20) being provided with an electroplating layer (40), the electroplating layer (40) being in communication with the interface end (30).

2. The optimized FPC electroplating structure according to claim 1, characterized in that: The electroplating layer (40) is plated on the surface of the binding end (20), and the electroplating layer (40) is provided with an electroplating lead, one end of the electroplating lead is an electroplating lead crimping area (41), and the electroplating lead crimping area (41) is located at a position where the binding end (20) faces the binding position with the display screen.

3. The optimized FPC electroplating structure according to claim 2, characterized in that: The interface end (30) is used to connect to a client mainboard, and the interface end (30) is in communication with the binding end (20).

4. The optimized FPC electroplating structure according to claim 3, characterized in that: A plurality of binding leads (21) are provided at the binding end (20), and the plurality of binding leads (21) are used for binding to a display screen.

5. The optimized FPC electroplating structure according to claim 4, characterized in that: A plurality of interface leads (31) are arranged at the interface end (30), and the plurality of interface leads (31) are used to connect to a customer mainboard.

6. The optimized FPC electroplating structure according to claim 5, characterized in that: The plurality of interface leads (31) are connected to the plurality of binding leads (21) corresponding to the binding end (20) in a one-to-one correspondence, and the electroplating effect of the electroplating layer (40) can act on the interface end (30).

7. The optimized FPC electroplating structure according to claim 6, characterized in that: The number of the interface leads (31) of the interface end (30) is an odd number.

8. The optimized FPC electroplating structure according to claim 7, characterized in that: A gold finger (50) is provided at the interface end (30) of the FPC (10), a plurality of interface leads (31) are located at the gold finger (50), the gold finger (50) is used for plugging with a customer's mainboard, and a reinforcing plate (60) is provided on a side of the FPC (10) away from the gold finger (50).

9. The optimized FPC electroplating structure according to claim 1, characterized in that: The binding end (20) is covered with a protective adhesive (70) for isolating from water vapor, and the protective adhesive (70) is arranged along the periphery of the binding end (20).

10. The optimized FPC electroplating structure according to claim 9, characterized in that: The protective glue (70) is in a U-shape and surrounds the periphery of the binding end (20), and the side of the binding end (20) bound to the display screen is not covered by the protective glue (70).

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