Circuit board assembly and electronic equipment

Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board assembly and electronic equipment, and the circuit board assembly comprises a first substrate, a first electronic device, a radiator, and a sub-circuit board. The first electronic device is arranged on the first surface of the first substrate. The radiator is arranged on the first surface, and the radiator is electrically connected with the grounding end of the first substrate. The sub-circuit board is arranged on the side, opposite to the first electronic device, of the radiator, the sub-circuit board is electrically connected with the first substrate, the sub-circuit board is in thermal contact with the radiator, and the sub-circuit board is provided with a second electronic device. By means of the mode, the radiator of the circuit board assembly has the heat dissipation effect on the second electronic device and the shielding effect on electromagnetic interference at the same time, the structure is simple, and the space occupancy rate is small.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] The power tube is one of the important components of the power module. In order to meet the heat dissipation requirements and electromagnetic compatibility of the power tube, the current power module sets a heat sink and an electromagnetic shielding cover on the circuit board to dissipate the heat of the power tube and protect the power tube from electromagnetic interference from other electronic devices on the circuit board.

[0003] However, in the current trend of increasingly miniaturized and modularized design, the rational use of space is becoming increasingly important. The current separate setting of the power module heat sink and the electromagnetic shielding cover takes up a large space and is difficult to meet the miniaturized design requirements of the product. Utility Model Content

[0004] In view of the problems existing in the background technology, the purpose of the present application is to provide a circuit board assembly and an electronic device, which overcome the above problems or at least partially solve the above problems.

[0005] According to a first aspect of the present application, a circuit board assembly is provided, comprising a first substrate, a first electronic device, a heat sink and a sub-circuit board. The first electronic device is arranged on a first surface of the first substrate. The heat sink is arranged on the first surface, and the heat sink is electrically connected to a ground terminal of the first substrate. The sub-circuit board is arranged on a side of the heat sink facing away from the first electronic device, the sub-circuit board is electrically connected to the first substrate, the sub-circuit board is in thermal contact with the heat sink, and the sub-circuit board is provided with a second electronic device.

[0006] In one or more optional embodiments above, the sub-circuit board includes a second substrate and the second electronic device, one surface of the second substrate is in thermal contact with the surface of the heat sink facing away from the first electronic device, and the second electronic device is arranged on the other surface of the second substrate.

[0007] In one or more of the above optional embodiments, the second substrate is disposed perpendicular to the first surface.

[0008] In one or more optional embodiments above, the first substrate is provided with a mounting hole, and one end of the second substrate is provided with a mounting protrusion, the mounting protrusion is inserted into the mounting hole, and the mounting protrusion is welded to the mounting hole.

[0009] In one or more of the above optional embodiments, a surface of the heat sink facing the first electronic device is provided with heat dissipation fins.

[0010] In one or more optional embodiments above, the heat sink is provided with a welding column, the first substrate is provided with a welding hole, and the welding column is welded to the welding hole.

[0011] In one or more of the above optional embodiments, the heat sink is made of metal material.

[0012] According to a second aspect of the present application, an electronic device is provided, comprising the circuit board assembly as described above.

[0013] In one or more optional embodiments above, a shell is included, the shell is provided with a receiving cavity, the circuit board assembly is arranged in the receiving cavity, and the heat sink is electrically connected to the shell.

[0014] In one or more of the above optional embodiments, a threaded hole is provided at one end of the radiator away from the first surface, and the electronic device further comprises a connecting bolt, which passes through the shell and is screwed and fixed to the threaded hole, and the radiator is electrically connected to the shell via the connecting bolt.

[0015] In one or more optional embodiments above, according to the second aspect of the present application, there is provided an energy storage power supply, comprising the housing, the battery module and the control board as described above, wherein the battery module is disposed in the second cavity, the control board is disposed in the first cavity, and the control board is electrically connected to the second connection portion.

[0016] The beneficial effects of the embodiment of the present application are as follows: the heat sink of the circuit board assembly of the embodiment of the present application is in thermal contact with the sub-circuit board, and can absorb the heat of the sub-circuit board to dissipate heat for the second electronic device. The sub-circuit board is arranged on the side of the heat sink facing away from the first electronic device, and the heat sink is electrically connected to the ground terminal of the first substrate, so that the heat sink can play an electromagnetic shielding role between the first electronic device and the second electronic device. The heat sink has both the heat dissipation effect for the second electronic device and the shielding effect for electromagnetic interference, and has a simple structure and a small space occupancy rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for the specific embodiments or the prior art description. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0018] Figure 1 A three-dimensional diagram of a circuit board assembly provided in an embodiment of the present application;

[0019] Figure 2 An exploded view of a circuit board assembly provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of a circuit board assembly provided by an embodiment of the present application when viewed along a direction opposite to a first direction;

[0021] Figure 4 A schematic diagram of another circuit board assembly provided in an embodiment of the present application when viewed along a direction opposite to the first direction. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0024] In the description of this specification, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0025] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0026] See also Figure 1 and Figure 2The circuit board assembly 1000 includes a first substrate 1, a first electronic device 2, a heat sink 3 and a sub-circuit board 4. The first electronic device 2 and the heat sink 3 are arranged on the first surface 11 of the first substrate 1, and the heat sink 3 is electrically connected to the ground terminal of the first substrate 1. The sub-circuit board 4 is arranged on the side of the heat sink 3 facing away from the first electronic device 2, the sub-circuit board 4 is electrically connected to the first substrate 1, the sub-circuit board 4 is in thermal contact with the heat sink 3, and the sub-circuit board 4 is provided with a second electronic device 42.

[0027] Among them, "the sub-circuit board 4 is in thermal contact with the heat sink 3" means that the sub-circuit board 4 is in direct contact with the heat sink 3 or indirect contact with the heat sink 3 through a heat conductive medium, so that there is a heat transfer path between the sub-circuit board 4 and the heat sink 3, and heat can be transferred from an object with a higher temperature to an object with a lower temperature.

[0028] By thermally contacting the sub-circuit board 4, the heat sink 3 can absorb the heat of the sub-circuit board 4 to dissipate heat for the second electronic device 42. The sub-circuit board 4 is arranged on the side of the heat sink 3 facing away from the first electronic device 2, and the heat sink 3 is electrically connected to the ground terminal of the first substrate 1, so that the heat sink 3 can play an electromagnetic shielding role between the first electronic device 2 and the second electronic device 42. When the circuit board assembly 1000 provided in the embodiment of the present application is applied to a power module, the power tube of the power module serves as the second electronic device 42, and the devices such as voltage and inductance on the circuit board of the power module that will generate large electromagnetic interference to the power tube when working serve as the first electronic device 2. The heat sink 3 has both the heat dissipation effect on the power tube and the shielding effect on electromagnetic interference. Compared with the traditional power module, the electromagnetic shielding cover structure can be omitted, the structure is simple, and the space occupancy rate is small.

[0029] In some embodiments, the heat sink 3 is made of metal material, which can be copper, aluminum, silver or other metals, or alloys. In some embodiments, the heat sink 3 can also be made of graphite or graphene.

[0030] See also Figure 3 In some embodiments, the sub-circuit board 4 includes a second substrate 41 and a second electronic device 42 , a surface 411 of the second substrate 41 is in thermal contact with a surface of the heat sink 3 facing away from the first electronic device 2 , and the second electronic device 42 is disposed on another surface 412 of the second substrate 41 .

[0031] In some embodiments, a thermal interface material is disposed between the surface 411 of the second substrate 41 and the surface of the heat sink 3 facing away from the first electronic device 2. The second substrate 41 is in thermal contact with the heat sink 3 through the thermal interface material. The thermal interface material may be thermal grease, thermal silica gel, a heat dissipation gasket, a phase change material, a phase change metal sheet, a thermal conductive adhesive, etc.

[0032] Understandably, see Figure 4 In some other embodiments, the second electronic device 42 may be disposed on a surface 411 of the second substrate 41 facing the heat sink 3, and the second electronic device 42 is in thermal contact with the surface of the heat sink 3 facing away from the first electronic device 2, so as to realize the heat dissipation function of the heat sink 3 to the second electronic device 42. A thermal interface material may also be disposed between the second electronic device 42 to improve the heat transfer efficiency. Some thermal interface materials may also play a role in filling the gap between the second electronic device 42 and the surface of the heat sink 3 facing away from the first electronic device 2, so that when the second electronic device 2 is a plurality of electronic devices with different thicknesses, it can be connected to the flat surface of the heat sink 3 facing away from the first electronic device 2 through the thermal interface material. Exemplarily, the thermal interface material may be a thermally conductive silicone 5. In some other embodiments, the gap between the surface 411 of the second substrate 41 and the second electronic device 42 disposed on the surface 411 is filled by the thermal interface material, so that the surface 411 of the second substrate 41 and the second electronic device 42 disposed on the surface 411 can be in thermal contact with the surface of the heat sink 3 facing away from the first electronic device 2 at the same time.

[0033] In some implementations, the second substrate 41 is disposed perpendicular to the first surface 11 .

[0034] See also Figure 2 In some embodiments, the first substrate 1 is provided with a mounting hole 12, and one end of the second substrate 41 is provided with a mounting protrusion 413, the mounting protrusion 413 is inserted into the mounting hole 12, and the mounting protrusion 413 is welded to the mounting hole 12 so that the second substrate 41 is electrically connected to the first substrate 1.

[0035] In some embodiments, a first solder pad is provided on the outer wall of the mounting protrusion 413, the first solder pad is electrically connected to the circuit of the second substrate 41, a second solder pad is provided on the inner wall of the mounting hole 12, the second solder pad is electrically connected to the circuit of the first substrate 1, and the first solder pad is welded to the second solder pad.

[0036] It is understandable that the first substrate 1 and the second substrate 41 are not limited to being fixed and electrically connected by welding with the above-mentioned mounting protrusions 413 and mounting holes 12. For example, in some other embodiments, the first substrate 1 and the second substrate 41 can also be connected by a circuit board connector.

[0037] See also Figure 2 and Figure 3 In some embodiments, the heat sink 3 includes a heat sink 31 and heat sink fins 32. The heat sink 31 is vertically arranged on the first surface 11. The heat sink 31 is arranged opposite to the second substrate 41. The surface of the heat sink 31 facing the second substrate 41 is connected to the surface 411 of the second substrate 41. The heat sink 32 is arranged on the surface of the heat sink 31 facing away from the second substrate 41.

[0038] In some embodiments, the heat dissipation fins 32 are extended along the first direction X, the number of the heat dissipation fins 32 is multiple, and the multiple heat dissipation fins 32 are arranged in sequence along the second direction Y. A heat dissipation duct 33 extending along the first direction X is formed between adjacent heat dissipation fins 32, wherein the first direction X is parallel to the first surface 11, and the second direction Y is perpendicular to the first direction X.

[0039] In some embodiments, the heat sink 3 is provided with a welding column 34 , the first substrate 1 is provided with a welding hole 13 , and the welding column 34 is inserted into and welded in the welding hole 13 , so that the heat sink 3 is electrically connected to the ground terminal of the first substrate 1 .

[0040] It is understandable that the heat sink 3 is not limited to being electrically connected to the ground terminal of the first substrate 1 by the above-mentioned welding method. For example, in some other embodiments, the heat sink 3 can be screwed to the first substrate 1 by conductive bolts.

[0041] Based on the same inventive concept, the present application also provides an electronic device, comprising the circuit board assembly 1000 in any of the above embodiments. The electronic device includes but is not limited to a power module.

[0042] In some embodiments, the electronic device includes a housing, the housing is provided with a receiving cavity, the circuit board assembly 1000 is disposed in the receiving cavity, and the heat sink 3 is electrically connected to the housing.

[0043] In some embodiments, a threaded hole is provided at one end of the heat sink 3 away from the first surface 11, and the electronic device further comprises a connecting bolt, which passes through the shell and is screwed and fixed to the threaded hole, and the heat sink 3 is electrically connected to the shell through the connecting bolt.

[0044] In some embodiments, the first substrate 1 is fixed to the bottom plate of the housing, the first surface 11 is disposed toward the top plate of the housing, and the connecting bolts pass through the top plate of the housing and are screwed and fixed to the threaded holes.

[0045] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board assembly, characterized in that: include: a first substrate; A first electronic device is disposed on the first surface of the first substrate; A heat sink is disposed on the first surface, and the heat sink is electrically connected to a ground terminal of the first substrate; The sub-circuit board is arranged on the side of the heat sink facing away from the first electronic device, the sub-circuit board is electrically connected to the first substrate, the sub-circuit board is in thermal contact with the heat sink, and the sub-circuit board is provided with a second electronic device.

2. The circuit board assembly according to claim 1, characterized in that: The sub-circuit board includes a second substrate and the second electronic device. One surface of the second substrate is in thermal contact with a surface of the heat sink facing away from the first electronic device. The second electronic device is arranged on the other surface of the second substrate.

3. The circuit board assembly according to claim 2, characterized in that: The second substrate is vertically disposed on the first surface.

4. The circuit board assembly according to claim 2, characterized in that: The first substrate is provided with a mounting hole, and one end of the second substrate is provided with a mounting protrusion, the mounting protrusion is inserted into the mounting hole, and the mounting protrusion is welded to the mounting hole.

5. The circuit board assembly according to claim 1, characterized in that: The surface of the heat sink facing the first electronic device is provided with heat dissipation fins.

6. The circuit board assembly according to claim 1, characterized in that: The heat sink is provided with a welding column, the first substrate is provided with a welding hole, and the welding column is welded to the welding hole.

7. The circuit board assembly according to any one of claims 1 to 6, characterized in that: The radiator is made of metal material.

8. An electronic device, characterized in that: Comprising a circuit board assembly as described in any one of claims 1-7.

9. The electronic device according to claim 8, characterized in that: The invention comprises a shell, wherein the shell is provided with a containing cavity, the circuit board assembly is arranged in the containing cavity, and the heat sink is electrically connected to the shell.

10. The electronic device according to claim 9, characterized in that: A threaded hole is provided at one end of the heat sink away from the first surface. The electronic device further comprises a connecting bolt which passes through the shell and is screwed and fixed to the threaded hole. The heat sink is electrically connected to the shell via the connecting bolt.

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