Test fixture for mobile phone mainboard

Abstract

The utility model provides a test fixture for a mobile phone mainboard, which is characterized in that after the mobile phone mainboard is placed in a product groove for conventional test, a lower probe group is firstly contacted with a basic test point of the mobile phone mainboard for electrification, so that basic test on the mobile phone mainboard and basic electrification required during the test are realized; the lower hollow hole penetrating through the lower probe module, the lower PCB and the lower layer seat is formed in the product groove, so that the test fixture can penetrate through the lower hollow hole through a lead or another probe to be in contact with a component or a new test point on the lower surface of the mobile phone mainboard for electrification, and further another test on the mobile phone mainboard is realized. According to the utility model, a new function test can be added or temporarily added without redesigning a probe module, remanufacturing the probe module, repeatedly assembling and repeatedly replacing the probe module, so that the maintenance of the test fixture is facilitated, the maintenance time is shortened, and the test cost of the test fixture is reduced; the utility model belongs to the technical field of test equipment.

Description

Technical Field

[0001] The utility model belongs to the technical field of testing equipment, and in particular relates to a testing fixture for a mobile phone mainboard. Background Art

[0002] In a conventional test fixture, if you want to add additional test points for contacting a mobile phone motherboard or mobile phone motherboard components to the test fixture, you need to redesign and manufacture components such as probe modules, and you also need to disassemble and reinstall the test fixture. If you just want to temporarily add test points for contacting a mobile phone motherboard or mobile phone motherboard components, you need to repeatedly reorganize the test fixture and replace components such as probe modules. As a result, the test fixture maintenance is too complicated, the maintenance time is long, and the testing cost is high. Utility Model Content

[0003] The purpose of the utility model is to provide a test fixture for a mobile phone motherboard to solve the technical defects described in the background technology.

[0004] The test fixture of a mobile phone motherboard comprises a lower seat, a lower PCB board is installed on the lower seat, a lower probe module is fixed on the lower PCB board, the lower probe module is provided with a lower probe group energized with the lower PCB board, a carrier board is arranged on the lower probe module, the carrier board is provided with a product slot, a lower hollow hole is provided in the product slot which passes through the lower probe module, the lower PCB board and the lower seat, a supporting part for supporting the mobile phone motherboard is provided around the lower hollow hole, so that when the mobile phone motherboard is placed in the product slot, the test fixture can be customized to pass through the lower hollow hole through the lead or another probe to contact and energize the components or new test points on the lower surface of the mobile phone motherboard, and the lower probe group is used to pass through the supporting part to contact and energize the basic test points on the lower surface of the mobile phone motherboard.

[0005] According to the technical solution, the utility model can achieve the following beneficial effects:

[0006] After the mobile phone motherboard is placed in the product slot for routine testing, the lower probe group is first contacted with the basic test points of the mobile phone motherboard to be energized, so as to realize basic testing of the mobile phone motherboard and the basic power-on required for testing. In addition, since the product slot is provided with a lower hollow hole that passes through the lower probe module, the lower PCB board and the lower seat, the test fixture can pass through the lower hollow hole through the lead or another probe to contact and energize the components on the lower surface of the mobile phone motherboard or a new test point, thereby realizing another test on the mobile phone motherboard. Therefore, there is no need to redesign the probe module, remanufacture the probe module, repeatedly assemble and repeatedly replace the probe module to realize adding or temporarily adding new functional tests, thereby facilitating the maintenance of the test fixture and reducing the maintenance time, so as to reduce the testing cost of the test fixture.

[0007] In order to further optimize the above technical solution, it can be optionally combined with one or more of the following implementation methods without conflict.

[0008] In some embodiments, the test fixture further comprises an upper plate for pressing down onto the carrier plate;

[0009] According to the technical solution, after the mobile phone motherboard is placed in the product slot for routine testing, it can be pressed down to the carrier board through the upper plate to limit or fix the mobile phone motherboard, so that the lower probe group, the lead passing through the lower hollow hole or another probe can contact the mobile phone motherboard more stably and be powered.

[0010] In some embodiments, the upper plate is provided with an upper hollow hole located directly above the lower hollow hole, and a fixing block for pressing down and fixing the mobile phone mainboard is protruded from one periphery of the upper hollow hole, and the test fixture can be customized to contact and energize the components or new test points on the upper surface of the mobile phone mainboard through a lead or another probe passing through the upper hollow hole;

[0011] According to the technical solution, after the upper plate limits or fixes the mobile phone mainboard, a lead or another probe can pass through the upper hollow hole to contact and energize the components or new test points on the upper surface of the mobile phone mainboard, thereby realizing the addition of another new functional test to the front and back sides of the mobile phone mainboard or temporarily adding another new functional test.

[0012] In some embodiments, an upper probe module is fixed to one side of the upper hollow hole, the upper probe module is provided with an upper probe group for contacting and energizing the upper surface of the mobile phone motherboard, and the upper probe module is fixed with an upper PCB board electrically connected to the upper probe group;

[0013] According to the technical solution, it is possible to carry out basic tests on the front and back sides of a mobile phone mainboard and to provide basic power supply required for the tests, thereby being applicable to mobile phone mainboards of the same shape but different specifications.

[0014] In some embodiments, the carrier plate is floatingly arranged above the lower probe module by means of equal height screws, and a spring is arranged between the carrier plate and the lower probe module, so that when the carrier plate is pressed down by the upper plate, the lower probe module passes through the supporting part and contacts the lower surface of the mobile phone mainboard to be energized;

[0015] According to the technical solution, when the upper plate is not pressed down onto the carrier plate, the needles of the lower probe group can be hidden in the carrier plate, thereby preventing the lower probe group from rubbing against the mobile phone mainboard and causing damage during the process of placing the mobile phone mainboard in the product slot.

[0016] In some embodiments, the upper plate is provided with a hand screw for passing through the carrier plate and threadedly connected to the lower probe module;

[0017] According to the technical solution, after the upper plate is pressed down onto the carrier plate, the upper plate can be driven to push the carrier plate down by rotating the hand screws, so that the lower probe group can pass through the supporting part and stably contact the lower surface of the mobile phone mainboard and be powered. At the same time, the upper plate can also be stably fixed on the carrier plate, so that the upper probe group can stably contact the upper surface of the mobile phone mainboard and be powered.

[0018] In some embodiments, the carrier plate is provided with a positioning hole, and the upper plate is provided with a positioning pin for inserting into the positioning hole;

[0019] According to the technical solution, when the upper plate is placed on the carrier plate, the fixing block can stably and accurately press down and fix the mobile phone mainboard.

[0020] In some embodiments, the supporting portion is provided with guide pins for pushing the mobile phone motherboard for positioning;

[0021] According to the technical solution, during the process of placing the mobile phone mainboard in the product slot, the mobile phone mainboard can be positioned by means of guide pins, so that the lower probe module and the upper probe module can be accurately aligned to specific positions of the mobile phone mainboard.

[0022] In some embodiments, the lower probe module has a thickness of 4.5 mm;

[0023] According to the technical solution, the distance of the lead wire is shortened to a great extent, thereby reducing the difficulty of the operator in leading the wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific implementation of the present invention, the following is a brief description of the drawings and reference numerals required to be used in the description of the specific implementation.

[0025] Figure 1 It is a structural schematic diagram of the utility model;

[0026] Figure 2 It is a structural schematic diagram of the lower seat of the utility model;

[0027] Figure 3 is a cross-sectional view of the lower probe module of the utility model;

[0028] Figure 4 It is a structural schematic diagram of the top surface of the upper plate of the utility model;

[0029] Figure 5 It is a structural schematic diagram of the bottom surface of the upper plate of the utility model.

[0030] Reference numerals:

[0031] 1. Lower seat; 11. Lower PCB board; 12. Lower probe module; 13. Lower probe group; 2. Carrier board; 21. Product slot; 22. Lower hollow hole; 23. Supporting part; 24. Equal height screws; 25. Spring; 26. Positioning hole; 27. Guide pin; 3. Upper board; 31. Upper hollow hole; 32. Fixing block; 33. Upper probe module; 34. Upper probe group; 35. Upper PCB board; 36. Thumb screw; 37. Positioning pin. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings.

[0033] like Figures 1 to 5 As shown, this specific embodiment provides a test fixture for a mobile phone motherboard, which includes a lower seat 1 and an upper plate 3.

[0034] The lower seat 1 is mounted with a lower PCB board 11 , on which a lower probe module 12 is fixed. The lower probe module 12 is provided with a lower probe group 13 electrically connected to the lower PCB board 11 , and the thickness of the lower probe module 12 is 4.5 mm. A carrier plate 2 is arranged on the lower probe module 12, and the carrier plate 2 is floatingly arranged above the lower probe module 12 by means of equal height screws 24, and a spring 25 is arranged between the carrier plate 2 and the lower probe module 12; the carrier plate 2 is provided with a product slot 21 and a positioning hole 26, and a lower hollow hole 22 is provided in the product slot 21, which passes through the lower probe module 12, the lower PCB board 11 and the lower seat 1, and a supporting part 23 for supporting a mobile phone mainboard is provided around the lower hollow hole 22, and the supporting part 23 is provided with a guide pin 27 for pushing the mobile phone mainboard for positioning, and the lower probe group 13 is used to pass through the supporting part 23 to contact and energize the lower surface of the mobile phone mainboard, and the test fixture can be customized to contact and energize the components or new test points on the lower surface of the mobile phone mainboard through the lead or another probe through the lower hollow hole 22.

[0035] The upper plate 3 is used to press down onto the carrier plate 2, and the upper plate 3 is provided with an upper hollow hole 31 and a positioning pin 37; the upper hollow hole 31 is located directly above the lower hollow hole 22, and a fixing block 32 for pressing down and fixing the mobile phone motherboard is protruded around the upper hollow hole 31, and the test fixture can be customized to pass through the upper hollow hole 31 through a lead or another probe to contact and energize the components or new test points on the upper surface of the mobile phone motherboard; an upper probe module 33 is fixed to one side of the upper hollow hole 31, and the upper probe module 33 is provided with an upper probe group 34 for contacting and energizing the upper surface of the mobile phone motherboard, and the upper probe module 33 is fixed with an upper PCB board 35 electrically connected to the upper probe group 34; the upper plate 3 is provided with a hand screw 36 for passing through the carrier plate 2 and threadedly connected to the lower probe module 12; the positioning pin 37 is used to insert into the positioning hole 26.

[0036] The following is the working process of the test fixture described in this specific implementation method:

[0037] The mobile phone motherboard is placed in the product slot 21. At this time, the supporting part 23 of the product slot 21 supports the mobile phone motherboard for one circle; thereafter, the upper plate 3 is placed on the carrier plate 2. At this time, the positioning pin 37 is inserted into the positioning hole 26, and the upper plate 3 presses down the carrier plate 2 by gravity; thereafter, the upper plate 3 is driven by rotating the hand screw 36 to push the carrier plate 2 down. At this time, the fixing block 32 presses down and fixes the mobile phone motherboard, and the lower probe group 13 passes through the supporting part 23 and contacts with the lower surface of the mobile phone motherboard for power, and the upper probe group 34 contacts with the upper surface of the mobile phone motherboard for power; thereby, the test fixture is in contact with both sides of the mobile phone motherboard for powering on, so as to perform basic testing and the basic powering required for testing.

[0038] In addition, the test fixture can pass through the lower hollow hole 22 through a lead or another probe to contact and energize the components or new test points on the lower surface of the mobile phone mainboard, and can pass through the upper hollow hole 31 through a lead or another probe to contact and energize the components or new test points on the upper surface of the mobile phone mainboard, thereby realizing another (or additional) functional test on the mobile phone mainboard.

Claims

1. A test fixture for a mobile phone motherboard, comprising a lower seat (1), the lower seat (1) being mounted with a lower PCB board (11), a lower probe module (12) being fixed on the lower PCB board (11), the lower probe module (12) being provided with a lower probe group (13) electrically connected to the lower PCB board (11), a carrier board (2) being arranged on the lower probe module (12), the carrier board (2) being provided with a product slot (21), characterized in that: The product slot (21) is provided with a lower hollow hole (22) penetrating the lower probe module (12), the lower PCB board (11) and the lower seat (1); a supporting portion (23) for supporting a mobile phone mainboard is provided around the lower hollow hole (22), so that when the mobile phone mainboard is placed in the product slot (21), the test fixture can be customized to pass through the lower hollow hole (22) through a lead or another probe to contact and energize the components or new test points on the lower surface of the mobile phone mainboard, and the lower probe group (13) is used to pass through the supporting portion (23) to contact and energize the basic test points on the lower surface of the mobile phone mainboard.

2. A test fixture for a mobile phone motherboard according to claim 1, characterized in that: It also includes an upper plate (3) for pressing down onto the carrier plate (2).

3. A test fixture for a mobile phone motherboard according to claim 2, characterized in that: The upper plate (3) is provided with an upper hollow hole (31) located directly above the lower hollow hole (22); fixed blocks (32) for pressing down and fixing the mobile phone mainboard are protruded at positions around the upper hollow hole (31); the test fixture can be customized to contact and energize components or new test points on the upper surface of the mobile phone mainboard through leads or another probe passing through the upper hollow hole (31).

4. A test fixture for a mobile phone motherboard according to claim 3, characterized in that: An upper probe module (33) is fixed to one side of the upper hollow hole (31); the upper probe module (33) is provided with an upper probe group (34) for contacting and energizing the upper surface of the mobile phone mainboard; and the upper probe module (33) is fixed with an upper PCB board (35) electrically connected to the upper probe group (34).

5. The mobile phone motherboard test fixture according to claim 3, characterized in that: The carrier plate (2) is floatingly arranged above the lower probe module (12) by means of equal height screws (24), and a spring (25) is arranged between the carrier plate (2) and the lower probe module (12), so that after the carrier plate (2) is pressed down by the upper plate (3), the lower probe module (13) passes through the supporting part (23) and contacts the lower surface of the mobile phone mainboard to be energized.

6. A test fixture for a mobile phone motherboard according to claim 5, characterized in that: The upper plate (3) is provided with a hand screw (36) for passing through the carrier plate (2) and being threadedly connected to the lower probe module (12).

7. The mobile phone motherboard test fixture according to claim 3, characterized in that: The carrier plate (2) is provided with a positioning hole (26), and the upper plate (3) is provided with a positioning pin (37) for inserting into the positioning hole (26).

8. The mobile phone motherboard test fixture according to claim 1, characterized in that: The supporting portion (23) is provided with a guide pin (27) for pushing the mobile phone mainboard to position.

9. The mobile phone motherboard test fixture according to claim 1, characterized in that: The thickness of the lower probe module (12) is 4.5 mm.

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