High-connection-strength piezoelectric ceramic buzzer with special-shaped structure electrodes

Abstract

The utility model discloses a piezoelectric ceramic buzzer with a high-connection-strength special-shaped structure electrode, and belongs to the technical field of buzzers, the piezoelectric ceramic buzzer comprises a metal substrate and a piezoelectric ceramic piece, and the piezoelectric ceramic piece comprises a ceramic piece and an electrode; the electrodes comprise a bonding electrode and a wiring electrode which are respectively arranged on the two surfaces of the ceramic chip and are arranged in the ceramic chip; the piezoelectric ceramic piece is bonded with the metal substrate through a bonding electrode, and the bonding electrode is provided with a through hole; the area of the wiring electrode is larger than that of the bonding electrode. The beneficial effects of the utility model are that: (1) the electrodes with the through holes of the special-shaped structure are adopted, so that the connection strength between the metal substrate and the ceramic chip is enhanced, and the electrodes are prevented from stripping and falling off; (2) one surface of the electrode connected with the power supply is larger than one surface of the electrode bonded with the power supply, so that the problem of capacitance reduction of the buzzer is solved; and (3) non-silver paste electrodes are adopted, so that the problem of silver ion migration is solved, the insulation resistance of the piezoelectric ceramic buzzer is improved, and meanwhile, the cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of buzzer pieces, and in particular to a piezoelectric ceramic buzzer piece with a special-shaped electrode structure and high connection strength. Background Art

[0002] Piezoelectric ceramic buzzer is an electronic product that uses the piezoelectric effect of piezoelectric ceramics to produce sound. It has the advantages of low power consumption, low cost, high reliability, resistance to harsh working environment, and not susceptible to electromagnetic interference. Therefore, it is widely used and matched in electronic clocks, car speakers, audio, communications, remote sensing, calculators, electronic toys, household appliances, machinery and equipment, vehicle anti-theft, home security and other working fields. It has a wide range of market applications and has broad market prospects.

[0003] However, the existing piezoelectric ceramic buzzer has the following defects: most of them use silver paste electrodes, which increases the cost of use and causes the problem of silver ion migration; the bonding strength is not high, the components are easy to peel off, and the problem of the buzzer capacitance decreasing is serious. How to solve the above problems of piezoelectric ceramic buzzer is an urgent issue to be solved. Summary of the invention

[0004] The purpose of the present application is to provide a piezoelectric ceramic buzzer that can solve at least one of the defects in the above-mentioned background technology.

[0005] To achieve the above objectives, the present application provides a piezoelectric ceramic buzzer with a special-shaped electrode with high connection strength, including a metal substrate and a piezoelectric ceramic sheet, the piezoelectric ceramic sheet is bonded to the metal substrate, and the piezoelectric ceramic sheet includes a ceramic sheet and an electrode; the electrode includes: a bonding electrode, the bonding electrode is arranged on a side of the ceramic sheet close to the metal substrate and is arranged inside the ceramic sheet; the bonding electrode is provided with a central through hole, the bonding electrode and the through hole are filled with an adhesive, so that the piezoelectric ceramic sheet is bonded to the metal substrate through the bonding electrode; and a wiring electrode, the wiring electrode is arranged on a side of the ceramic sheet away from the metal substrate and is arranged inside the ceramic sheet; the area of ​​the wiring electrode is larger than that of the bonding electrode. The through hole of the bonding electrode spreads outward from the center. The overall area of ​​the through hole is small but the range of the through hole is large. The use of a special-shaped bonding electrode to connect to the metal substrate can enhance the connection strength; the bonding electrode is provided with a through hole and the wiring electrode is not provided with a through hole. The area of ​​the wiring electrode is larger than the bonding electrode, thereby improving the problem of decreased capacitance of the piezoelectric ceramic buzzer when the electrodes are misaligned.

[0006] As a preferred method, the electrode ion migration is further inhibited. The silver paste electrode has the problem of silver ion migration. The use of non-silver paste conductors such as graphene, graphite, aluminum, copper, etc. can avoid this problem, improve the insulation resistance of the piezoelectric ceramic buzzer, and reduce costs.

[0007] Preferably, the through hole shape includes but is not limited to a four-pointed star shape, a five-pointed star shape, a snowflake shape, and a deconstructed dodecagon shape. By adopting the above shapes, the through hole of the bonding electrode can have a small overall area but a wide range, which greatly enhances the bonding strength of the bonding electrode.

[0008] Preferably, the four-pointed star-shaped through hole spreads from the center of the bonding electrode to four directions, leaving a blank space from the center of the bonding electrode to the edge, and the size gradually decreases until it is closed. The four-pointed star-shaped through hole has a larger area at the center and a smaller area at the spreading edge. The overall through hole area is not large but covers a wide range, thereby improving the bonding strength.

[0009] Preferably, the five-pointed star-shaped through hole spreads from the center of the bonding electrode to five directions, leaving a blank space from the center of the bonding electrode to the edge, and the size gradually decreases until it is closed. The area of ​​the five-pointed star-shaped through hole is larger at the center, and the area of ​​the spreading edge is very small. The overall through hole area is not large but covers a wide range, which improves the bonding strength.

[0010] Preferably, the snowflake-shaped through hole spreads from the center of the bonding electrode to twelve directions, leaving a blank space from the center of the bonding electrode to the edge, and the size gradually decreases until it is closed. The area of ​​the snowflake-shaped through hole is larger at the center, and the area of ​​the spreading edge is very small. The overall through hole area is not large but covers a wide range, which improves the bonding strength.

[0011] Preferably, the deconstructed dodecagonal through hole is composed of twelve triangles, and the deconstructed dodecagonal through hole spreads from the center of the bonding electrode to twelve directions, with the center of the bonding electrode as the vertex of the triangle, leaving a blank from the center of the bonding electrode to the edge, and the size gradually increases to the short base of the triangle. The deconstructed dodecagonal through hole is equivalent to a dodecagon divided into twelve equal parts and then separated, and then the length of the base of the triangle is greatly reduced, thereby obtaining; the area of ​​the snowflake-shaped through hole is almost non-existent at the center, and the area at the diffused edge is larger. The overall through hole area is not large but covers a wide range, which improves the bonding strength.

[0012] Compared with the prior art, the beneficial effects of this application are:

[0013] (1) Use electrodes with special-shaped through holes to strengthen the connection strength with the metal substrate and ceramic sheet to prevent the electrode from peeling off;

[0014] (2) The electrode on the side connected to the power supply is larger than the electrode on the bonding side, which improves the problem of decreased capacitance of the buzzer chip.

[0015] (3) Use non-silver paste electrodes to solve the problem of silver ion migration, improve the insulation resistance of the piezoelectric ceramic buzzer, and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the first embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the piezoelectric ceramic sheet in the first embodiment of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the four-pointed star-shaped through-hole bonding electrode in the first embodiment of the utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the pentagram-shaped through-hole bonding electrode in the first embodiment of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of the snowflake-shaped through-hole bonding electrode in the first embodiment of the utility model;

[0021] Figure 6 It is a schematic diagram of the structure of the deconstructed dodecagonal through-hole bonding electrode in the first embodiment of the utility model.

[0022] In the figure: 1, piezoelectric ceramic sheet; 2, metal substrate; 3, lead; 11, ceramic sheet; 12, electrode; 121, bonding electrode; 122, wiring electrode; 123, through hole. DETAILED DESCRIPTION

[0023] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0024] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0025] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0026] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0027] The present application provides a piezoelectric ceramic buzzer with a special-shaped electrode structure having high connection strength, such as Figure 1 As shown, it includes: a piezoelectric ceramic sheet 1, a metal substrate 2 and a lead 3. The piezoelectric ceramic sheet 1 is bonded to the metal substrate 2, one lead 3 is connected to the piezoelectric ceramic sheet 1, and the other lead 3 is fixed to the metal substrate 2, which can be fixed by welding; the piezoelectric ceramic sheet 1 includes a ceramic sheet 11 and an electrode 12, and the two electrodes 12 are respectively arranged on both sides of the ceramic sheet 11 and arranged in the ceramic sheet 11. It should be known that the specific installation method and working principle of the piezoelectric ceramic sheet are well-known technologies for those skilled in the art, so they will not be elaborated in detail here.

[0028] The specific structural features of each component are described below. In the present application, there are many shapes of bonding electrode through holes. For ease of understanding, the following is an explanation through specific embodiments. It should be noted that the specific number includes but is not limited to the following embodiments.

[0029] Embodiment 1:

[0030] like Figure 2 As shown, it is a schematic diagram of the structure of the piezoelectric ceramic sheet 1, the electrode 12 includes a bonding electrode 121 and a wiring electrode 122, the bonding electrode 121 is arranged on the side of the ceramic sheet 11 close to the metal substrate 2 and is arranged in the ceramic sheet 11; the piezoelectric ceramic sheet 1 is bonded to the metal substrate 2 through the bonding electrode 121; the bonding electrode 121 is provided with a through hole 123 that spreads from the center to the edge, and the through hole 123 is filled with an adhesive, and the through hole 123 of the bonding electrode 121 spreads outward from the center, and the overall area of ​​the through hole is small but the range of the through hole is large. The use of a special-shaped bonding electrode 121 to connect with the metal substrate 2 can enhance the connection strength and prevent the bonding electrode 121 from peeling off; the wiring electrode 122 is arranged on the side of the ceramic sheet 11 away from the metal substrate 2 and is arranged inside the ceramic sheet 2; the bonding electrode 121 is provided with a through hole 123 and the wiring electrode 122 is not provided with a through hole 123, and the area of ​​the wiring electrode 122 is larger than that of the bonding electrode 121. When the electrode 12 is misaligned, the decrease in the capacitance of the piezoelectric ceramic buzzer is reduced, thereby improving the problem of the decrease in the capacitance of the buzzer.

[0031] like Figure 3As shown, it is a structural schematic diagram of the bonding electrode 121 of a four-pointed star-shaped through hole 123 in the present embodiment. The bonding electrode 121 is concentrically arranged with the ceramic sheet 11, and the bonding electrode 121 is entirely inside the ceramic sheet 11, leaving a circular ring of the ceramic sheet 11 visible outside; a four-pointed star-shaped through hole 123 is opened at the center of the bonding electrode 121, and there are four directions from the center to the edge with blank space, and the size gradually decreases until it is closed. The overall area of ​​the through hole 123 is small but the through hole range is large. The through hole 123 is filled with adhesive, and the bonding electrode 121 with a special-shaped structure is connected to the metal substrate 2 to enhance the connection strength.

[0032] like Figure 4 As shown, it is a structural schematic diagram of the bonding electrode 121 with a five-pointed star-shaped through hole 123 in the first embodiment of the present invention. The bonding electrode 121 is concentrically arranged with the ceramic sheet 11. The bonding electrode 121 is completely inside the ceramic sheet 11, leaving a ring of the ceramic sheet 11 outside. A five-pointed star-shaped through hole 123 is opened at the center of the bonding electrode 121, leaving blank space from the center to the edge in five directions, and the size gradually decreases until it is closed. The overall area of ​​the through hole 123 is small but the through hole range is large. The through hole 123 is filled with adhesive. The bonding electrode 121 with a special-shaped structure is connected to the metal substrate 2 to enhance the connection strength. In addition, the remaining structural features are the same as those of the first embodiment.

[0033] like Figure 5 As shown, it is a structural schematic diagram of the bonding electrode 121 with a snowflake-shaped through hole 123 in the first embodiment of the present invention. The bonding electrode 121 is concentrically arranged with the ceramic sheet 11. The bonding electrode 121 is completely inside the ceramic sheet 11, leaving a ring of the ceramic sheet 11 outside. A snowflake-shaped through hole 123 is opened at the center of the bonding electrode 121, leaving blank space from the center to the edge in twelve directions, and the size gradually decreases until it is closed. The overall area of ​​the through hole 123 is small but the through hole range is large. The through hole 123 is filled with adhesive. The bonding electrode 121 with a special-shaped structure is connected to the metal substrate 2 to enhance the connection strength. In addition, the remaining structural features are the same as those of the first embodiment.

[0034] like Figure 6As shown, it is a structural schematic diagram of the deconstructed dodecagonal through hole 123 bonding electrode 121 of the first embodiment of the present invention, the bonding electrode 121 is concentrically arranged with the ceramic sheet 11, the bonding electrode 121 is entirely in the ceramic sheet 11, and a ring of the ceramic sheet 11 is left outside; a deconstructed dodecagonal through hole 123 is opened at the center of the bonding electrode 121, and the deconstructed dodecagonal through hole 123 is composed of twelve triangles, which is equivalent to a dodecagon divided into twelve equal parts and then separated, and the length of the base side of the triangle is greatly reduced, thereby obtaining; the deconstructed dodecagonal through hole 123 spreads from the center of the bonding electrode 121 to twelve directions, with the center of the bonding electrode 121 as the vertex of the triangle, leaving a blank from the center to the edge of the bonding electrode 121, and the size gradually increases to the short base side of the triangle, the overall area of ​​the through hole 123 is small but the through hole range is large, and the through hole 123 is filled with adhesive, and the bonding electrode 121 with a special-shaped structure is connected to the metal substrate 2 to enhance the connection strength. Apart from this, the remaining structural features are the same as those of the first embodiment.

[0035] Specifically, the connection structure of the piezoelectric ceramic buzzer piece with a special-shaped structure electrode with high connection strength is described in detail as follows: the piezoelectric ceramic buzzer piece includes a piezoelectric ceramic piece 1, a metal substrate 2 and a lead 3; the piezoelectric ceramic piece 1 includes an electrode 12 and a ceramic piece 11, and the electrode includes a wiring electrode 122 and a bonding electrode 121; the wiring electrode 122 is arranged on the front side of the ceramic piece 11 and is arranged in the ceramic piece 2, and the bonding electrode 121 is arranged on the back side of the ceramic piece 11 and is arranged in the ceramic piece 11, and the wiring electrode 122 and the bonding electrode 121 are both arranged concentrically with the ceramic piece 11; the bonding electrode 121 has a through hole 123, and the through hole 123 is filled with an adhesive, and the piezoelectric ceramic piece 1 is connected to the metal substrate 2 through the bonding electrode 121; one lead 3 is connected to the piezoelectric ceramic piece 1, and the other lead 3 is fixed on the metal substrate 2.

[0036] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A piezoelectric ceramic buzzer with a special-shaped electrode having high connection strength, comprising a metal substrate and a piezoelectric ceramic sheet, wherein the piezoelectric ceramic sheet is bonded to the metal substrate, and the piezoelectric ceramic sheet comprises a ceramic sheet and an electrode; characterized in that: The electrode comprises: A bonding electrode, wherein the bonding electrode is disposed on a side of the ceramic sheet close to the metal substrate and is disposed inside the ceramic sheet; the bonding electrode is provided with a central through hole, and the bonding electrode and the through hole are filled with an adhesive, so that the piezoelectric ceramic sheet is bonded to the metal substrate through the bonding electrode; and A wiring electrode is arranged on a side of the ceramic sheet away from the metal substrate and inside the ceramic sheet; the area of ​​the wiring electrode is larger than that of the bonding electrode.

2. The piezoelectric ceramic buzzer with special-shaped electrode having high connection strength as claimed in claim 1, characterized in that: The electrode is a non-silver paste conductor, thereby inhibiting the migration of ions in the electrode.

3. The piezoelectric ceramic buzzer with special-shaped electrode having high connection strength as claimed in claim 1, characterized in that: The shapes of the through holes include a four-pointed star, a five-pointed star, a snowflake, and a deconstructed dodecagon.

4. The piezoelectric ceramic buzzer with special-shaped electrode having high connection strength as claimed in claim 3, characterized in that: The four-pointed star-shaped through hole spreads from the center of the bonding electrode to four directions, leaving a blank space from the center to the edge of the bonding electrode, and the size gradually decreases until it is closed.

5. The piezoelectric ceramic buzzer with special-shaped electrode having high connection strength as claimed in claim 3, characterized in that: The five-pointed star-shaped through hole spreads from the center of the bonding electrode to five directions, leaving a blank space from the center to the edge of the bonding electrode, and the size gradually decreases until it is closed.

6. The piezoelectric ceramic buzzer piece with special-shaped structure electrodes having high connection strength as claimed in claim 5, characterized in that: The snowflake-shaped through hole spreads from the center of the bonding electrode to twelve directions, leaving a blank space from the center to the edge of the bonding electrode, and the size gradually decreases until it is closed.

7. The piezoelectric ceramic buzzer piece with a special-shaped electrode having high connection strength as claimed in claim 5, characterized in that: The deconstructed dodecagonal through hole is composed of twelve triangles, and the deconstructed dodecagonal through hole diffuses from the center of the bonding electrode to twelve directions, with the center of the bonding electrode as the vertex of the triangle, leaving blank space from the center of the bonding electrode to the edge, and the size gradually increases to become the short base of the triangle.

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