Wafer insertion turnover device and wafer cleaning device

Abstract

The utility model discloses a wafer insert turnover device and a wafer cleaning device.The wafer insert turnover device comprises a base, a turnover assembly, a bearing assembly and a lifting driving part, the turnover assembly comprises a turnover driving part and a rotating support, the turnover driving part is installed on the base and connected with the rotating support, and the bearing assembly is installed on the base and connected with the rotating support. The turnover driving piece can drive the rotating support to rotate; the bearing assembly comprises a supporting piece, the supporting piece is connected with the lifting driving piece, the supporting piece is provided with a plurality of first containing grooves, the first containing grooves are used for containing wafers, and the lifting driving piece has a jacking state in which the supporting piece is driven to be away from the rotating support and a reset state in which the supporting piece is driven to be close to the rotating support. By means of the wafer inserting and overturning device, the wafer does not need to be transferred between devices, the wafer inserting action, the overturning action and the jacking action of the wafer can be completed, the cleaning efficiency of the wafer is improved, the wafer inserting device is high in integration degree, and the occupied space needed by a plurality of independent devices is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer insert flipping device and a wafer cleaning device. Background Art

[0002] During the continuous processing, shaping and polishing of wafers, they come into contact with various organic matter, particles, metal impurities and other pollutants, causing pollutants to adhere to the wafers, so the wafers need to be cleaned. Wafer cleaning is an important process step in the wafer manufacturing process. It is necessary to effectively use chemical solutions or gases to remove impurities remaining on the surface of the wafer without destroying the surface characteristics and electrical characteristics of the wafer. With the improvement of semiconductor manufacturing requirements, the requirements for wafer cleanliness are also getting higher and higher. Since the cassette-less cleaning method only needs to move the wafer without moving the carrier when cleaning the wafer, it saves space and is easier to control impurities (partic le), so this cleaning method has been more and more widely used.

[0003] During the carrier-free cleaning process, the wafer needs to complete a series of actions such as flipping, clamping, inserting, lateral movement, and lifting, and each action is performed in the corresponding equipment, such as flipping the wafer in the flipping equipment, inserting the wafer in the inserting equipment, and lifting the wafer in the lifting equipment. However, during the above-mentioned carrier-free cleaning process, the wafer needs to be transferred between various devices, resulting in low wafer cleaning efficiency and large space occupied by each device. Utility Model Content

[0004] In view of this, the utility model provides a wafer insert flipping device and a wafer cleaning device to solve the problem that in the existing carrier-free cleaning process, the wafer needs to be transferred between various devices, resulting in low wafer cleaning efficiency and a large space occupied by each device.

[0005] The utility model provides a wafer insert flipping device, comprising:

[0006] Pedestal;

[0007] The flip assembly comprises a flip driving member and a rotating support, wherein the flip driving member is mounted on the base and connected to the rotating support, and the flip driving member can drive the rotating support to rotate;

[0008] A lifting drive member, wherein the lifting drive member is mounted on the rotating support;

[0009] A bearing assembly, comprising a supporting member, wherein the supporting member is connected to the lifting driving member, and the supporting member has a plurality of first accommodating grooves, wherein the first accommodating grooves are used to accommodate wafers;

[0010] The lifting drive member has a lifting state for driving the support member away from the rotating support, and a resetting state for driving the support member close to the rotating support.

[0011] Optionally, in the above-mentioned wafer insert flipping device, the support member includes:

[0012] A bearing support, fixedly connected to the lifting drive member;

[0013] A first sub-support member, connected to the bearing support, with a plurality of first limiting grooves spaced apart along the axial direction of the first sub-support member;

[0014] A second sub-support member, connected to the bearing support, with a plurality of second limiting grooves spaced apart along the axial direction of the second sub-support member;

[0015] Any one of the first limiting grooves is arranged opposite to the corresponding second limiting groove to enclose the first loading state of the corresponding first containing groove.

[0016] Optionally, the wafer insert flipping device is provided with a plurality of third limiting grooves spaced apart in the axial direction of the first sub-support, and the plurality of the third limiting grooves and the plurality of the first limiting grooves are located on different sides of the first sub-support; a plurality of fourth limiting grooves are spaced apart in the axial direction of the second sub-support, and the plurality of the fourth limiting grooves and the plurality of the second limiting grooves are located on different sides of the second sub-support; any one of the third limiting grooves is arranged opposite to the corresponding fourth limiting groove to enclose the second loading state of the corresponding second accommodating groove;

[0017] The first sub-support and the second sub-support have a first switching state for rotating under an external force to switch between the first loading state and the second loading state.

[0018] Optionally, in the above-mentioned wafer insert flipping device, the support member includes a first bearing driving member, which is fixedly connected to the bearing support, and the first bearing driving member is respectively connected to the first sub-support member and the second sub-support member through a first belt transmission mechanism, and the first bearing driving member can drive the first sub-support member and the second sub-support member to rotate.

[0019] Optionally, in the above-mentioned wafer insert flipping device, the carrying component further includes:

[0020] A first limiting member connected to the rotating support, with a plurality of fifth limiting grooves spaced apart along the axial direction of the first limiting member;

[0021] A second limiting member connected to the rotating support, a plurality of sixth limiting grooves are spaced apart along the axial direction of the second limiting member, and a distance between the first limiting member and the second limiting member is greater than a distance between the first sub-support member and the second sub-support member;

[0022] Any of the fifth limiting grooves has a first limiting state arranged opposite to the corresponding sixth limiting groove;

[0023] In the first loading state, the fifth limiting groove and the sixth limiting groove respectively abut against two sides of the wafer in the corresponding first containing groove.

[0024] Optionally, the wafer insert flipping device described above has a plurality of seventh limiting grooves spaced apart along the axial direction of the first limiting member, and the plurality of the seventh limiting grooves and the plurality of the fifth limiting grooves are located on different sides of the first limiting member; a plurality of eighth limiting grooves are spaced apart along the axial direction of the second limiting member, and the plurality of the eighth limiting grooves and the plurality of the sixth limiting grooves are located on different sides of the second limiting member; any of the seventh limiting grooves has a second limiting state arranged opposite to the corresponding eighth limiting groove; in the second loading state, the seventh limiting groove and the eighth limiting groove are respectively abutted against two sides of the wafer in the corresponding second accommodating groove;

[0025] The first limiting member and the second limiting member have a second switching state that rotates under an external force to switch between the first limiting state and the second limiting state;

[0026] And / or, the dimensional tolerance of any one of the seventh limiting grooves (422) is greater than the dimensional tolerance of any one of the fifth limiting grooves (421), and the dimensional tolerance of any one of the eighth limiting grooves is greater than the dimensional tolerance of any one of the sixth limiting grooves (431).

[0027] Optionally, in the above-mentioned wafer insert flipping device, the supporting assembly also includes a second supporting driving member, which is fixedly connected to the rotating support, and the second supporting driving member is respectively connected to the first limiting member and the second limiting member through a second belt transmission mechanism, and the second supporting driving member can drive the first limiting member and the second limiting member to rotate.

[0028] Optionally, in the above-mentioned wafer insert flipping device, the rotating support has at least one open accommodating cavity, and the lifting drive member, the bearing support, the first limit member, the second limit member, the first sub-support member and the second sub-support member are all located in the accommodating cavity.

[0029] Optionally, the above-mentioned wafer insert flipping device further includes a positioning detection component, which is arranged on the rotating support and is used to obtain positioning information of the wafer on the supporting component.

[0030] The utility model also provides a wafer cleaning device, comprising the above-mentioned wafer insert flipping device.

[0031] The technical solution provided by the utility model has the following advantages:

[0032] 1. The wafer insert flipping device provided by the utility model includes a base, a flipping assembly, a bearing assembly and a lifting drive member. The flipping assembly includes a flipping drive member and a rotating support. The flipping drive member is installed on the base and connected to the rotating support. The flipping drive member can drive the rotating support to rotate; the bearing assembly includes a supporting member, which is connected to the lifting drive member, and the supporting member has a plurality of first accommodating grooves, and the first accommodating grooves are used to accommodate wafers. The lifting drive member has a lifting state that drives the supporting member away from the rotating support, and a resetting state that drives the supporting member close to the rotating support. The wafer inserting and flipping device provided by the utility model integrates a bearing component, a flipping component and a lifting drive component. The wafer is placed in each first accommodating groove to complete the inserting action, and then the flipping drive component drives the rotating support to rotate to drive the lifting drive component to rotate. The lifting drive component drives the supporting component to rotate to drive the wafer in the first accommodating groove to flip, so as to realize the flipping action. Then, the lifting drive component drives the supporting component to rise to drive the wafer to rise and realize the lifting action of the wafer. Through the wafer inserting and flipping device, the wafer does not need to be transferred between devices to complete the wafer inserting action, flipping action and lifting action, which reduces the transfer time of the wafer between various devices and improves the cleaning efficiency of the wafer. In addition, the wafer inserting device has a high degree of integration and only requires a single device to realize the functions of inserting, lifting and flipping, thereby reducing the occupied space required for multiple independent devices, improving space utilization, simplifying the operation process, and reducing production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 This is an axonometric diagram of the wafer flipping device provided by the utility model when loading a wafer;

[0035] Figure 2 This is an axonometric diagram of the insert flipping device provided by the utility model after flipping;

[0036] Figure 3 This is a front view of the insert flipping device provided by the utility model after flipping;

[0037] Figure 4 This is an axonometric diagram of the insert flipping device provided by the utility model after being lifted up;

[0038] Figure 5 This is a front view of the wafer flipping device provided by the utility model when no wafer is loaded;

[0039] Figure 6 It is a schematic diagram of the first sub-support member in the insert flipping device provided by the utility model;

[0040] Figure 7 It is a schematic diagram of the first limiting member in the insert flipping device provided by the utility model.

[0041] Description of reference numerals:

[0042] 1. Base;

[0043] 21. Flip driving member; 22. Rotating support;

[0044] 3. Lifting drive parts;

[0045] 41. Support member; 411. Bearing support; 412. First sub-support member; 4121. First limiting groove; 4122. Third limiting groove; 4123. First inclined plane; 413. Second sub-support member; 4131. Second limiting groove; 414. First bearing drive member; 415. First belt transmission mechanism; 42. First limiting member; 421. Fifth limiting groove; 422. Seventh limiting groove; 43. Second limiting member; 431. Sixth limiting groove; 44. Second bearing drive member; 45. Second belt transmission mechanism;

[0046] 51. first detection member; 52. second detection member;

[0047] 6. Wafer. DETAILED DESCRIPTION

[0048] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0049] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0050] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0052] Example 1

[0053] The wafer insert flipping device provided in this embodiment is as follows: Figures 1 to 7 As shown, it includes a base 1, a flip assembly, a bearing assembly and a lifting drive member 3. The flip assembly includes a flip drive member 21 and a rotating support 22. The flip drive member 21 is installed on the base 1 and is connected to the rotating support 22. The flip drive member 21 can drive the rotating support 22 to rotate; the bearing assembly includes a support member 41, the support member 41 is connected to the lifting drive member 3, and the support member 41 has a plurality of first accommodating grooves, the first accommodating grooves are used to accommodate wafers 6, and the lifting drive member 3 has a lifting state that drives the support member 41 away from the rotating support 22, and a reset state that drives the support member 41 close to the rotating support 22.

[0054] Specifically, the wafer insert flipping device provided in this embodiment, the base 1 includes a bottom plate and two vertical plates, the two vertical plates are fixedly connected to the bottom plate, and the fixing method can be welding, bolt connection, plugging or other fixed connection methods. The two vertical plates are arranged at intervals, and the two vertical plates are perpendicular to the bottom plate. Any vertical plate is also fixedly connected to the bottom plate through a triangular rib plate, and the two right-angled sides of the triangular rib plate are respectively fixedly connected to the vertical plate and the bottom plate, and the stability of the vertical plate is increased by the triangular rib plate; the flipping drive member 21 is a motor and a reducer, and the flipping drive member 21 can also be a turbine, a steam turbine or other device that can perform circular motion, the motor housing is fixedly connected to the reducer housing, and the reducer housing is fixedly connected to the outer wall of one of the vertical plates, and the motor drives the torque of the rotating support 22 through the reducer. force; both sides of the rotating support 22 are provided with a first columnar protrusion and a second columnar protrusion, the first columnar protrusion passes through one of the vertical plates and is fixedly connected to the output shaft of the reducer, the second columnar protrusion passes through the other vertical plate and is rotatably connected to the vertical plate, and a limiting plate is provided on the outer periphery of the second columnar protrusion extending outside the vertical plate. Due to the limiting of the output shaft of the reducer and the limiting plate, the rotating support 22 can be prevented from moving left and right; the flipping drive member 21 can drive the first columnar protrusion to rotate, thereby driving the rotating support 22 to rotate, the lifting drive member 3 can be a hydraulic cylinder, or a cam mechanism, or a gear rack mechanism, or a screw mechanism, the support member 41 is fixedly connected to the lifting drive member 3, and the lifting drive member 3 can drive the support member 41 to lift and lower, thereby realizing the lifting of the wafer 6 in the first accommodating groove.

[0055] The wafer inserting and flipping device provided in the present embodiment integrates a bearing component, a flipping component and a lifting drive component 3. The wafer 6 is placed in each first accommodating groove to complete the inserting action, and then the flipping drive component 21 drives the rotating support 22 to rotate to drive the lifting drive component 3 to rotate. The lifting drive component 3 drives the supporting component 41 to rotate to drive the wafer 6 in the first accommodating groove to flip, thereby realizing the flipping action, and then the lifting drive component 3 drives the supporting component 41 to rise to drive the wafer 6 to rise and realize the lifting action of the wafer 6. Through the wafer inserting and flipping device, the wafer 6 does not need to be transferred between devices to complete the inserting action, flipping action and lifting action of the wafer 6, thereby reducing the transfer time of the wafer 6 between various devices and improving the cleaning efficiency of the wafer 6. In addition, the wafer 6 inserting device has a high degree of integration, and only a single device is required to realize the functions of inserting, lifting and flipping, thereby reducing the occupied space required for multiple independent devices, improving space utilization, simplifying the operation process, and reducing production costs.

[0056] like Figure 2 , Figure 5 and Figure 6As shown, the wafer insert flipping device provided in this embodiment, the support member 41 includes a bearing support 411, a first sub-support member 412 and a second sub-support member 413, the bearing support 411 is a hollow shell, preferably, the bearing support 411 is a square hollow shell, the bearing support 411 is surrounded by plates, and the bottom of the bearing support 411 is fixedly connected to the lifting drive member 3; the first sub-support member 412 and the second sub-support member 413 are both located in the bearing support 411, and the first sub-support member 412 and the second sub-support member 413 are symmetrically arranged, as shown in FIG. Figure 6 As shown, the first sub-support member 412 includes a first shaft body and a first block sleeved thereon, the first block is fixedly connected to the first shaft body, and the two ends of the first shaft body are respectively connected to the two inner side walls opposite to the bearing support 411, and the first block has a first inclined surface 4123, and a plurality of first limiting grooves 4121 are opened on the first inclined surface, and the plurality of first limiting grooves 4121 on the first inclined surface are evenly spaced along the axial direction of the first shaft body; the second sub-support member 413 includes a second shaft body and a second block sleeved thereon, the second block is fixedly connected to the second shaft body, and the two ends of the second shaft body are respectively connected to the two inner side walls opposite to the bearing support 411, the first shaft body and the second shaft body are arranged side by side, and the first shaft body and the second shaft body are arranged side by side. The two blocks have a second inclined surface, and a plurality of second limiting grooves 4131 are formed on the second inclined surface. The plurality of second limiting grooves 4131 on the second inclined surface are evenly spaced along the axial direction of the second shaft body. The spacing between the first inclined surface 4123 and the second inclined surface gradually decreases along the descending direction of the lifting drive member 3, and the minimum spacing between the first inclined surface 4123 and the second inclined surface is smaller than the diameter of the wafer 6, so as to prevent the wafer 6 from falling between the first inclined surface 4123 and the second inclined surface. Any first limiting groove 4121 is arranged opposite to the corresponding second limiting groove 4131 to enclose the first loading state of the first receiving groove. The first receiving groove is an inverted trapezoidal groove, and the first receiving groove is used to insert one of the wafers 6. The first limiting groove 4121 and the second limiting groove 4131 are arranged opposite to each other to clamp the wafer 6 therein to prevent the wafer 6 from moving. Since a plurality of first limiting grooves 4121 and a plurality of second limiting grooves 4131 are provided, multiple wafers 6 can be inserted to increase the loading capacity of the wafer 6.

[0057] In a replaceable implementation, the support member 41 is a box body, and the box body is in the shape of an inverted trapezoid. The inner wall of the box body is provided with multiple first accommodating grooves, and any first accommodating groove is an inverted trapezoidal groove, that is, a first sub-accommodating groove and a second sub-accommodating groove are respectively provided on the two opposite inner walls of the box body, and no groove is provided on the bottom of the box body. Of course, an accommodating groove may also be provided on the bottom. The first sub-accommodating groove and the second sub-accommodating groove are enclosed to form a first accommodating groove, and a wafer 6 is inserted into the first accommodating groove.

[0058] like Figure 6As shown, in the wafer insert flipping device provided in this embodiment, the first block has a third inclined surface, and the third inclined surface is located on the side of the first block opposite to the first inclined surface. Of course, the third inclined surface can also be located on other sides of the first block. The first inclined surface is parallel to the third inclined surface. The cross-sectional shape of the first block can be a parallelogram. A plurality of third limiting grooves 4122 are provided on the third inclined surface. The plurality of third limiting grooves 4122 on the third inclined surface are evenly spaced along the axial direction of the first shaft body; the second block has a fourth inclined surface, and the second inclined surface is parallel to the fourth inclined surface. The cross-sectional shape of the second block It can also be a parallelogram, and a plurality of fourth limiting grooves are provided on the fourth inclined plane. The plurality of fourth limiting grooves on the fourth inclined plane are evenly spaced along the axial direction of the second axis body. Any third limiting groove 4122 is arranged relative to the corresponding fourth limiting groove to form a second loading state of the second accommodating groove. The second accommodating groove is also an inverted trapezoidal groove, and the second accommodating groove is used to insert one of the wafers 6; the first limiting groove 4121, the second limiting groove 4131, the third limiting groove 4122 and the fourth limiting groove are all 'V'-shaped grooves to prevent the wafer 6 inserted into the limiting groove from shaking. When the first inclined surface is facing the second sub-support 413, the third inclined surface can be directed toward the second sub-support 413 by rotating the first sub-support 412 180°; the second inclined surface or the fourth inclined surface can be directed toward the first sub-support 412 by rotating the second sub-support 413 180°; when the first limiting groove 4121 and the second limiting groove 4131 are opposite to each other, this is the first loading state, which is used to load the wafer 6 before cleaning; when the third limiting groove 4122 and the fourth limiting groove are opposite to each other, this is the second loading state, which is used to load the wafer 6 after cleaning, so as to avoid cross contamination caused by using the same limiting groove to load the wafer 6 before cleaning and after cleaning. The dimensional tolerance of any first limiting groove 4121 is smaller than the dimensional tolerance of any third limiting groove 4122, and the dimensional tolerance of any second limiting groove 4131 is smaller than the dimensional tolerance of any fourth limiting groove, thereby making the dimensional tolerance of the first receiving groove smaller than the dimensional tolerance of the second receiving groove, which is beneficial for the first receiving groove to clamp the wafer before cleaning, and is beneficial for the wafer after cleaning to be detached from the second receiving groove, and can reduce the processing cost of the second receiving groove.

[0059] like Figure 2 , Figure 4 , Figure 5As shown, the wafer insert flipping device provided in this embodiment, the support member 41 also includes a first bearing driving member 414 and a first belt transmission mechanism 415, the first bearing driving member 414 is a motor and a reducer connected thereto, the housing of the motor is fixedly connected to the housing of the reducer, the housing of the reducer is fixedly connected to the outer wall of the bearing support 411, the first belt transmission mechanism 415 includes a first pulley, a second pulley, a third pulley, a fourth pulley, a fifth pulley and a belt, the first pulley is sleeved on the output shaft of the reducer, the output shaft is rotatably connected to the outer wall of the bearing support 411, the second pulley and the third pulley are both rotatably connected to the outer wall of the bearing support 411, the fourth pulley is sleeved on the outer wall of the bearing support 411, and the fourth pulley is sleeved on the outer wall of the bearing support 411. 1, the fifth pulley is sleeved on the second shaft extending out of the bearing support 411, the belt is wound around the first pulley, the second pulley, the third pulley, the fourth pulley and the fifth pulley, the first bearing driving member 414 drives the first pulley to rotate, and the first pulley drives the second pulley, the third pulley, the fourth pulley and the fifth pulley to rotate through the belt, thereby driving the first sub-support member 412 and the second sub-support member 413 to rotate, thereby realizing the switching between the first loading state and the second loading state; while transmitting power through the first belt transmission mechanism 415, it can play the role of buffering, shock absorption and protection, and the belt transmission mechanism is low in cost and reliable in transmission, saving manufacturing cost and use cost.

[0060] like Figure 5 and Figure 7As shown, in the wafer insert flipping device provided in this embodiment, the bearing assembly also includes a first limit member 42 and a second limit member 43, the first limit member 42 and the second limit member 43 are arranged side by side, and the distance between the first limit member 42 and the second limit member 43 is greater than the distance between the first sub-support member 412 and the second sub-support member 413, the first limit member 42 and the second limit member 43 are both located above the first sub-support member 412 and the second sub-support member 413, the first limit member 42 includes a third axis and a third block sleeved thereon, the two ends of the third axis are respectively connected to the two inner side walls opposite to the rotating support 22, the third block is fixedly connected to the third axis, the third block has a first plane, the first plane is provided with a plurality of fifth limit grooves 421, and the plurality of fifth limit grooves 421 on the first plane are arranged along the third axis. The fourth block is fixedly connected to the fourth axis, and two ends of the fourth axis are respectively connected to the two inner walls of the rotating support 22 opposite to each other. The fourth axis and the third axis are arranged side by side. The fourth block has a second plane, and a plurality of sixth limiting grooves 431 are provided on the second plane. The plurality of sixth limiting grooves 431 on the second plane are evenly spaced along the axial direction of the fourth axis. Any fifth limiting groove 421 has a first limiting state opposite to the corresponding sixth limiting groove 431. In the first loading state, the fifth limiting groove 421 and the sixth limiting groove 431 respectively abut against the two sides of the wafer 6 in the corresponding first accommodating groove to further limit the wafer 6 and prevent the wafer 6 from slipping during the flipping process.

[0061] like Figure 7As shown, the wafer insert flipping device provided by this embodiment has a third plane on the first block, and the third plane is located on the side of the third block opposite to the first plane. Of course, the third plane may also be located on other sides of the third block, and the first plane is parallel to the third plane. The cross-sectional shape of the third block may be rectangular, and a plurality of seventh limiting grooves 422 are provided on the third plane, and the plurality of seventh limiting grooves 422 on the third plane are evenly spaced along the axial direction of the third axis; the fourth block has a fourth plane, and the second plane is parallel to the fourth plane. A plurality of eighth limiting grooves are provided on the fourth plane, and the plurality of eighth limiting grooves on the fourth plane are evenly spaced along the axial direction of the fourth axis, and any seventh limiting groove 422 has a second limiting state opposite to the corresponding eighth limiting groove, and in the second device In the loading state, the seventh limiting groove 422 and the eighth limiting groove are respectively abutted against the two sides of the corresponding wafer 6 in the second receiving groove, the fifth limiting groove 421, the sixth limiting groove 431, the seventh limiting groove 422, and the eighth limiting groove are all rectangular grooves. By rotating the first limiting member 42 180°, the first plane or the third plane can be directed toward the second limiting member 43; by rotating the second limiting member 43 180°, the second plane or the fourth plane can be directed toward the first limiting member 42; in the first loading state, the fifth limiting groove 421 is opposite to the sixth limiting groove 431, and is used to limit the wafer 6 before cleaning. In the second loading state, the seventh limiting groove 422 is opposite to the eighth limiting groove, and is used to limit the wafer 6 after cleaning, so as to avoid cross contamination caused by using the same limiting groove to load the wafer 6 before and after cleaning. The dimensional tolerance of any fifth limiting groove 421 is smaller than the dimensional tolerance of any seventh limiting groove 422, and the dimensional tolerance of any sixth limiting groove 431 is smaller than the dimensional tolerance of any eighth limiting groove, which is beneficial for the fifth limiting groove 421 and the seventh limiting groove 422 to clamp the wafer before cleaning, and is beneficial for the wafer after cleaning to be detached from the sixth limiting groove 431 and the eighth limiting groove, and can reduce the processing cost of the sixth limiting groove 431 and the eighth limiting groove.

[0062] like Figure 1 and Figure 5 As shown, the wafer insert flipping device provided in this embodiment also includes a second bearing drive member 44 and a second belt transmission mechanism 45. The first bearing drive member 414 is a motor and a reducer connected thereto. The housing of the reducer is fixedly connected to the outer wall of the rotating support 22. The second pulley transmission mechanism is the same as the first driving transmission mechanism. The second bearing drive member 44 drives the first limit member 42 and the second limit member 43 to rotate respectively through the second driving transmission mechanism to realize the switching between the first limit state and the second limit state.

[0063] like Figure 1 As shown, in the wafer insert flipping device provided in this embodiment, the rotating support 22 is formed by enclosing a plate, and the rotating support 22 is a receiving cavity with an opening. Figure 1 Taking the perspective of as an example, the top of the rotating support 22 has an opening, which is used for the wafer 6 to enter and exit. The lifting drive 3, the bearing support 411, the first limit member 42, the second limit member 43, the first sub-support member 412 and the second sub-support member 413 are all located outside the accommodating cavity. The rotating support 22 plays a protective and isolating role to prevent dust from entering.

[0064] like Figure 3 As shown, the wafer insert flipping device provided in this embodiment also includes a positioning detection component, which includes a first detection component 51 and a second detection component 52. The first detection component 51 and the second detection component 52 are both reflective sensors (laser, ultrasonic). The first detection component 51 and the second detection component 52 are both installed on the rotating support 22. The height of the first detection component 51 is greater than the height of the second detection component 52, and the first detection component 51 and the second detection component 52 are located on both sides of the wafer 6. The first detection component 51 and the second detection component 52 are used to feed back the positioning information of the wafer 6 to avoid deviation in the position of the wafer 6.

[0065] When the wafer 6 before cleaning needs to be inserted, turned over and lifted, first, Figure 1 As shown, the rotating support 22 is kept horizontal, and each wafer 6 before cleaning is inserted from the opening of the rotating support 22 until the bottom of the wafer 6 abuts against the first limiting groove 4121 and the second limiting groove 4131 respectively, and the two sides of the wafer 6 abut against the fifth limiting groove 421 and the sixth limiting groove 431, and then the first detection member 51 and the second detection member 52 are started. When the positioning information fed back by the first detection member 51 and the second detection member 52 meets the requirements, the flip driving member 21 works to drive the rotating support 22 to rotate 90°, as shown in FIG. Figure 2 As shown, at this time, the rotating support 22 is in a vertical state, and the wafer 6 is flipped from horizontal to vertical, and then the lifting drive 3 works to drive the supporting support 411 to rise, so that the first limiting groove 4121 and the second limiting groove 4131 lift the wafer 6 thereon to rise until the wafer 6 rises to the set position.

[0066] When it is necessary to insert, flip and lift the cleaned wafer 6, first, the first bearing driver 414 and the second bearing driver 44 work to make the first sub-support member 412, the second sub-support member 413, the first limiting member 42 and the second limiting member 43 rotate 180°, so that the third limiting groove 4122 and the fourth limiting groove are opposite to each other, and the seventh limiting groove 422 and the eighth limiting groove are opposite to each other, and the subsequent working process is as described above for inserting, flipping and lifting the wafer 6 before cleaning.

[0067] Example 2

[0068] The wafer 6 cleaning device provided in this embodiment includes the wafer inserting flipping device and the clamping device in Embodiment 1. When each wafer 6 before cleaning in the wafer 6 inserting flipping device is lifted, the clamping device moves the lifted wafer 6 to the cleaning area for cleaning, and then the flipping drive 21 works to drive the rotating support 22 to flip 90°, so that the rotating support 22 is reset to a horizontal state for the next wafer 6 insertion, flipping, and lifting action.

[0069] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A wafer flipping device, characterized in that: include: Base (1); A turning assembly, comprising a turning drive member (21) and a rotating support (22), wherein the turning drive member (21) is mounted on the base (1) and connected to the rotating support (22), and the turning drive member (21) can drive the rotating support (22) to rotate; A lifting drive member (3) mounted on the rotating support (22); A bearing assembly, comprising a support member (41), wherein the support member (41) is connected to the lifting drive member (3), and the support member (41) has a plurality of first accommodating grooves, wherein the first accommodating grooves are used to accommodate wafers (6); The lifting drive member (3) has a lifting state in which the support member (41) is driven away from the rotating support (22), and a resetting state in which the support member (41) is driven close to the rotating support (22).

2. The wafer flipping device according to claim 1, characterized in that: The support member (41) comprises: A bearing support (411) fixedly connected to the lifting drive member (3); A first sub-support member (412) is connected to the bearing support (411), and a plurality of first limiting grooves (4121) are spaced apart and distributed along the axial direction of the first sub-support member (412); A second sub-support member (413) is connected to the bearing support (411), and a plurality of second limiting grooves (4131) are spaced apart and distributed along the axial direction of the second sub-support member (413); Any one of the first limiting grooves (4121) is arranged opposite to the corresponding second limiting groove (4131) to enclose the first loading state of the corresponding first containing groove.

3. The wafer flipping device according to claim 2, characterized in that: A plurality of third limiting grooves (4122) are spaced apart along the axial direction of the first sub-support member (412), and the plurality of third limiting grooves (4122) and the plurality of first limiting grooves (4121) are located on different sides of the first sub-support member (412); a plurality of fourth limiting grooves are spaced apart along the axial direction of the second sub-support member (413), and the plurality of fourth limiting grooves and the plurality of second limiting grooves (4131) are located on different sides of the second sub-support member (413); any one of the third limiting grooves (4122) is arranged opposite to the corresponding fourth limiting groove to enclose a second loading state of the corresponding second containing groove; The first sub-support member (412) and the second sub-support member (413) have a first switching state in which they are rotated under an external force to switch between the first loading state and the second loading state.

4. The wafer flipping device according to claim 3, characterized in that: The support member (41) includes a first bearing driving member (414), which is fixedly connected to the bearing support (411), and the first bearing driving member (414) is respectively connected to the first sub-support member (412) and the second sub-support member (413) through a first belt transmission mechanism (415), and the first bearing driving member (414) can drive the first sub-support member (412) and the second sub-support member (413) to rotate.

5. The wafer flipping device according to any one of claims 3 or 4, characterized in that: The bearing assembly further comprises: A first limiting member (42) connected to the rotating support (22), wherein a plurality of fifth limiting grooves (421) are spaced apart and distributed along the axial direction of the first limiting member (42); A second limiting member (43) connected to the rotating support (22), a plurality of sixth limiting grooves (431) spaced apart along the axial direction of the second limiting member (43), and a distance between the first limiting member (42) and the second limiting member (43) is greater than a distance between the first sub-support member (412) and the second sub-support member (413); Any one of the fifth limiting grooves (421) has a first limiting state arranged relative to the corresponding sixth limiting groove (431); In the first loading state, the fifth limiting groove (421) and the sixth limiting groove (431) respectively abut against two sides of the wafer (6) in the corresponding first containing groove.

6. The wafer flipping device according to claim 5, characterized in that: A plurality of seventh limiting grooves (422) are spaced apart along the axial direction of the first limiting member (42), and the plurality of the seventh limiting grooves (422) and the plurality of the fifth limiting grooves (421) are located on different sides of the first limiting member (42); a plurality of eighth limiting grooves are spaced apart along the axial direction of the second limiting member (43), and the plurality of the eighth limiting grooves and the plurality of the sixth limiting grooves (431) are located on different sides of the second limiting member (43); any of the seventh limiting grooves (422) has a second limiting state arranged opposite to the corresponding eighth limiting groove; in the second loading state, the seventh limiting groove (422) and the eighth limiting groove are respectively abutted against two sides of the wafer (6) in the corresponding second containing groove; The first limiting member (42) and the second limiting member (43) have a second switching state in which they rotate under an external force to switch between the first limiting state and the second limiting state; And / or, the dimensional tolerance of any one of the seventh limiting grooves (422) is greater than the dimensional tolerance of any one of the fifth limiting grooves (421), and the dimensional tolerance of any one of the eighth limiting grooves is greater than the dimensional tolerance of any one of the sixth limiting grooves (431).

7. The wafer flipping device according to claim 6, characterized in that: The bearing assembly also includes a second bearing driving member (44), which is fixedly connected to the rotating support (22), and the second bearing driving member (44) is respectively connected to the first limiting member (42) and the second limiting member (43) through a second belt transmission mechanism (45), and the second bearing driving member (44) can drive the first limiting member (42) and the second limiting member (43) to rotate.

8. The wafer flipping device according to claim 7, characterized in that: The rotating support (22) has at least one open accommodating cavity, and the lifting drive member (3), the bearing support (411), the first limiting member (42), the second limiting member (43), the first sub-support member (412) and the second sub-support member (413) are all located in the accommodating cavity.

9. The wafer flipping device according to claim 2 or 8, characterized in that: It also comprises a positioning detection component, which is arranged on the rotating support (22) and is used to obtain positioning information of the wafer (6) on the supporting component (41).

10. A wafer cleaning device, characterized in that: It comprises a wafer (6) insert flipping device as described in any one of claims 1 to 9.

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