Light-transmitting carrying disc for photosensitive uv solution before wafer film tearing

Abstract

The utility model discloses a light-transmitting carrying disc for photosensitive uv solution before film tearing of a wafer, which comprises a supporting ring capable of being placed on an annular carrying table and a light-transmitting supporting plate installed on the supporting ring and used for placing the wafer. The supporting plate is provided with finger grooves which are arranged in the radial direction and can stretch into fingers. The supporting plate is provided with at least three rows of limiting round holes arranged in the radial direction, each row of limiting round holes comprises a plurality of limiting round holes, and a limiting column with the lower end capable of being inserted into the limiting round hole and pulled out is arranged in each row of limiting round holes. The light-transmitting carrying disc has the advantages of being durable and convenient to use.

Description

Technical Field

[0001] The utility model relates to a light-transmitting carrier plate used for photosensitive UV decomposition before wafer film tearing, and belongs to the technical field of chip processing. Background Art

[0002] After the wafer is taped with UV film in the DP process of the packaging factory, there are often abnormalities of foreign matter in the film, which requires tearing off the film and re-taping. However, if the UV film is not removed, the UV film tearing will be accompanied by residual glue abnormalities, and the residual glue is small and difficult to handle. It is easy to scratch the wafer surface during handling and cause secondary abnormalities.

[0003] UV decomposition is to use the light-sensitive property of UV glue to reduce the viscosity of UV adhesive on UV film. UV decomposition needs to be carried out on a UV machine, which has a photolysis chamber, and a UV lamp that can emit UV light upward is provided at the bottom of the photolysis chamber. The UV machine is provided with a ring-shaped carrier that can slide into the photolysis chamber. When UV decomposition of the UV film on the wafer is carried out, the side of the wafer with the UV film facing down is placed on the ring-shaped carrier, and then the ring-shaped carrier together with the wafer is pushed into the photolysis chamber so that the UV film is exposed to ultraviolet light.

[0004] Since wafers have different specifications and the size of the ring stage is fixed, when the diameter of the wafer is smaller than the ring stage, the wafer cannot be placed on the stage. The traditional method is to make a simple carrier, specifically a ring, cover the ring with a light-transmitting film, place it on the stage when in use, and then place the wafer on the simple carrier.

[0005] This simple carrier has many defects, such as the film used needs to be glued to the ring, which is easy to loosen and the film is easy to break. In addition, since the wafer is thin, it is difficult to pick up the UV film attached to the wafer by hand after the UV is removed. Utility Model Content

[0006] The technical problem to be solved by the utility model is: how to design a durable carrier plate.

[0007] In view of the above problems, the technical solution proposed by the utility model is:

[0008] A light-transmitting carrier used for photosensitive UV decomposition before wafer film tearing comprises a supporting ring that can be placed on an annular carrier and a light-transmitting supporting plate installed on the supporting ring for placing the wafer.

[0009] The support plate is provided with radially arranged finger grooves into which fingers can be inserted.

[0010] The support plate is provided with at least three rows of radially arranged limiting circular holes, each row of limiting circular holes has a plurality of limiting circular holes, and each row of limiting circular holes has a limiting column whose lower end can be inserted into and pulled out of the limiting circular hole.

[0011] The lower end of the limiting column is provided with an inserting handle which can be inserted into the limiting circular hole.

[0012] The inner ring of the support ring is provided with an annular support edge extending radially inwards, and the support plate is placed on the annular support edge and fixed by glue or screws.

[0013] The supporting plate is a plexiglass plate. Beneficial Effects

[0014] 1. The light-transmitting carrier is durable;

[0015] 2. Easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a three-dimensional schematic diagram of the support ring;

[0017] Figure 2 is a three-dimensional schematic diagram of the support plate;

[0018] Figure 3 is a schematic diagram of assembling the light-transmitting carrier;

[0019] Figure 4 It is a three-dimensional schematic diagram of the limiting column.

[0020] In the figure: 1, supporting ring; 101, annular supporting edge; 2, supporting plate; 201, finger groove; 202, limiting circular hole; 3, limiting column; 301, plug handle. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings:

[0022] like Figure 1 As shown in FIG. 3 , a light-transmitting carrier for photosensitive UV decomposition before wafer film tearing includes a support ring 1 that can be placed on a ring-shaped carrier, and also includes a light-transmitting support plate 2 that is fixed on the support ring 1 and used to place the wafer. Since the strength of the support plate 2 is greater than the strength of the film, the light-transmitting carrier consisting of the support ring 1 and the support plate 2 fixed on the support ring 1 can be durable.

[0023] The supporting plate 2 has a radially arranged finger groove 201 into which a finger can be inserted. In this way, when taking a wafer from the light-transmitting carrier, a finger can be inserted into the finger groove 201 to hook the edge of the wafer and pick up the wafer.

[0024] like Figure 3 , 4As shown, further, there are at least three rows of radially arranged limiting circular holes 202 on the support plate 2, and each row of limiting circular holes 202 has a plurality of limiting circular holes 202, and each row of limiting circular holes 202 has a limiting column 3 whose lower end can be inserted into the limiting circular hole 202 and can be pulled out. When used, the limiting column 3 can be adjusted to the corresponding limiting circular hole 202 in the row according to the size of the wafer, and a placement interval roughly equal to the size of the wafer is defined by at least three limiting columns 3 arranged with equal arc lengths, so that the wafer placed in the interval is not easy to move.

[0025] The lower end of the limiting column 3 has an inserting handle 301 which can be inserted into the limiting circular hole 202 .

[0026] The inner circle of the supporting ring 1 is provided with an annular supporting edge 101 extending radially inwards, and the supporting plate 2 is placed on the annular supporting edge 101 and fixed by glue or screws.

[0027] Preferably, the support plate 2 is a plexiglass plate.

[0028] The above embodiments are only used to more clearly describe the present invention and cannot be regarded as limiting the protection scope of the present invention. Any modifications in equivalent forms should be regarded as falling within the protection scope of the present invention.

Claims

1. A light-transmitting carrier for photosensitive UV decomposition before wafer film tearing, comprising a support ring (1) that can be placed on an annular carrier, characterized in that: It also comprises a light-transmitting support plate (2) mounted on the support ring (1) and used for placing wafers; the support plate (2) has radially arranged finger grooves (201) into which fingers can be inserted.

2. The light-transmitting carrier for photosensitive UV decomposition before wafer film tearing according to claim 1, characterized in that: The support plate (2) has at least three rows of radially arranged limiting circular holes (202), each row of limiting circular holes (202) has a plurality of limiting circular holes, and each row of limiting circular holes (202) has a limiting column (3) whose lower end can be inserted into the limiting circular hole (202) and can be pulled out.

3. The light-transmitting carrier for photosensitive UV decomposition before wafer film tearing according to claim 2, characterized in that: The lower end of the limiting column (3) has an inserting handle (301) capable of being inserted into the limiting circular hole (202).

4. The light-transmitting carrier for photosensitive UV decomposition before wafer film tearing according to any one of claims 1 to 3, characterized in that: The inner ring of the support ring (1) is provided with an annular support edge (101) extending radially inwards, and the support plate (2) is placed on the annular support edge (101) and fixed by glue or screws.

5. The light-transmitting carrier for photosensitive UV decomposition before wafer film tearing according to any one of claims 1 to 3, characterized in that: The support plate (2) is a plexiglass plate.

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