Laser bridging structure, laser assembly and laser light source

Abstract

The utility model provides a laser bridging structure, which comprises a bridging plate used for bridging a laser chip and a laser driving plate, and an insertion hole is formed in the bridging plate; each group of contact pin interfaces is correspondingly connected with one laser chip, each group of contact pin interfaces comprises a plurality of contact pins, each contact pin comprises a first extension part and a second extension part which are integrally formed, the first extension part and the second extension part are respectively in a long strip shape, and the first extension part and the second extension part are respectively in a strip shape. A non-zero included angle is formed between the length extension direction of the first extension part and the length extension direction of the second extension part, the first extension part is inserted into the jack so as to be electrically connected with the bridging plate, and the second extension part is used for being electrically connected with a corresponding laser chip; and the driving board interface is electrically connected with the pin interfaces respectively, so that the laser driving board performs driving control on the laser chips electrically connected to the pin interfaces through the driving board interface. The utility model also provides a laser assembly and a laser light source.

Description

Technical Field

[0001] The present application relates to a laser bridge structure, a laser component including the laser bridge structure, and a laser light source including the laser component. Background Art

[0002] The laser is usually electrically connected to the laser driver board using a connector provided with the laser.

[0003] The connector that comes with the laser will increase the size of the laser itself, and will also increase the overall size of the optical machine used by the laser. If multiple lasers need to be connected to form a three-dimensional array layout, because the connectors that come with the laser are prone to mutual interference in structure, a larger space is required to place the laser, which increases costs and limits the miniaturization of the optical machine. Utility Model Content

[0004] The first aspect of the present application provides a laser bridge structure, including: a bridge plate, used to bridge the laser chip and the laser driving board, the bridge plate is formed with a socket; at least one group of pin interfaces, each group of the pin interfaces corresponds to connecting one of the laser chips, each group of the pin interfaces includes a plurality of pins, each of the pins includes a first extension portion and a second extension portion formed integrally, the first extension portion and the second extension portion are respectively strip-shaped, and the length extension direction of the first extension portion and the length extension direction of the second extension portion have a non-zero angle, the first extension portion is inserted into the socket to be electrically connected to the bridge plate, and the second extension portion is used to be electrically connected to the corresponding laser chip; and a driving board interface, which is electrically connected to each of the pin interfaces, so that the laser driving board drives and controls the laser chips electrically connected to each of the pin interfaces through the driving board interface.

[0005] In at least one embodiment of the present application, the socket is a through hole, the first extension portion is inserted into the socket and exposed relative to the socket; the first extension portion is electrically connected to the inner wall of the socket by spot welding.

[0006] In at least one embodiment of the present application, the first extension portion and the second extension portion are perpendicular to each other, and each of the pin interfaces is overall in an "L" shape.

[0007] In at least one embodiment of the present application, the laser bridge structure further includes an insulating rubber sleeve, which is sleeved on the second extension portion, and an end of the second extension portion away from the first extension portion extends relative to the insulating rubber sleeve.

[0008] In at least one embodiment of the present application, the bridge plate is formed with a plurality of the sockets; the laser bridge structure includes a plurality of groups of the pin interfaces and a plurality of the insulating rubber sleeves, each of the pins in each group of the pin interfaces is plugged into the sockets one by one, and the insulating rubber sleeves are sleeved on the pins one by one; at least two adjacently arranged insulating rubber sleeves are detachably connected.

[0009] In at least one embodiment of the present application, the plug holes are arranged along a straight line.

[0010] The second aspect of the present application provides a laser component, comprising: a laser bridge structure as described in any of the above items; and at least one laser chip, each of the laser chips being formed with a conductive terminal, each of the laser chips being electrically connected to a corresponding group of the pin interfaces, the second extension portion of each of the pins in each group of the pin interfaces being electrically connected to the conductive terminal of a corresponding laser chip by spot welding, and the length extension direction of the second extension portion being parallel to a contact surface of the conductive terminal contacting the second extension portion.

[0011] In at least one embodiment of the present application, the bridge plate is formed with a plurality of the sockets, and each of the sockets is arranged in a straight line; the laser bridge structure includes a plurality of groups of the pin interfaces, each group of the pin interfaces includes at least one pin, and the pins are plugged into the sockets one by one; the laser assembly includes a plurality of the laser chips, and the plurality of laser chips are electrically connected to the plurality of groups of pin interfaces one by one, and each of the laser chips is electrically connected to the second extension portions of all the pins in a corresponding group of the pin interfaces.

[0012] The third aspect of the present application provides a laser light source, comprising: a housing having a first non-coplanar mounting surface and a second non-coplanar mounting surface; and two laser assemblies as described above, wherein the two laser assemblies are fixedly connected to the first mounting surface and the second mounting surface, respectively; the driving board interface in each of the laser assemblies is used to electrically connect to the same laser driving board, so that the laser driving board can drive and control each of the laser chips in each of the laser assemblies through the driving board interface in each of the laser assemblies.

[0013] In at least one embodiment of the present application, the first mounting surface and the second mounting surface are perpendicular to each other.

[0014] The above-mentioned laser bridge structure, laser assembly and laser light source, the laser bridge structure includes a bridge board and at least one group of pin interfaces electrically connected to the bridge board, and each group of pin interfaces includes at least one pin. The first extension of each pin is electrically connected to the bridge board, and the second extension of the pin can be used to electrically connect the laser chip. One group of pin interfaces corresponds to an electrically connected laser chip, and different groups of pin interfaces are electrically connected to different laser chips. By increasing the number of groups of pin interfaces in the laser bridge structure, the laser bridge structure can be connected to a larger number of laser chips. The bridge board also includes a driver board interface electrically connected to the laser driver board, which enables the bridge board to be used to bridge multiple laser chips with a single laser driver board, so that a single laser driver board can drive and control multiple laser chips.

[0015] The above-mentioned laser bridge structure allows the laser itself to be without a connector, and the size of the laser itself can be minimized. In addition, pins can replace welding wires, and spot welding can be completed through automated fixtures, which is accurate, fast, and low-cost. Furthermore, the length extension directions of the first extension portion and the second extension portion of the pin are different, that is, the first extension portion and the second extension portion form a non-zero angle. Therefore, in the case where multiple laser chips need to be connected to form a three-dimensional layout array, the laser bridge structure can realize the layout of multiple laser chips without interfering with each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural diagram of the laser bridge structure of an embodiment of the present application.

[0017] Figure 2 for Figure 1 Three-dimensional structural diagram of the middle pin interface and rubber sleeve.

[0018] Figure 3 This is a three-dimensional structural diagram of a laser assembly according to an embodiment of the present application.

[0019] Figure 4 It is a three-dimensional structural diagram of two laser components according to an embodiment of the present application.

[0020] Figure 5 This is a three-dimensional structural diagram of the laser light source according to an embodiment of the present application.

[0021] Main component symbols

[0022] Laser bridge structure 1

[0023] Bridge plate 10

[0024] First surface 11

[0025] Second surface 12

[0026] Jack 13

[0027] Pin interface 20

[0028] Pin 21

[0029] The first extension portion 211

[0030] The second extension portion 212

[0031] Insulation rubber sleeve 30

[0032] Driver board interface 40

[0033] Laser assembly 100, 110, 120

[0034] Laser chip 2

[0035] Conductive terminal 201

[0036] Laser source 1000

[0037] Housing 200

[0038] First mounting surface 210

[0039] Second mounting surface 220

[0040] Fixed plate 300

[0041] Length extension direction X, Y

[0042] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0043] The present application provides a laser bridge structure, a laser component including the laser bridge structure, and a laser light source including the laser component. The laser bridge structure is used to establish an electrical connection between a laser chip and a laser driving board. The laser driving board outputs a control signal to the laser chip through the laser bridge structure to control the operation of the laser chip.

[0044] See also Figure 1 The laser bridge structure 1 includes a bridge plate 10, a plurality of pin interfaces 20 and a plurality of insulating rubber sleeves 30. Each pin interface 20 includes a plurality of pins 21, and all the pins 21 in each pin interface 20 are electrically connected to the bridge plate 10. The insulating rubber sleeves 30 correspond to the pins 21 one by one, and each insulating rubber sleeve 30 is sleeved on a corresponding pin 21. Each pin 21 is a rigid conductive material, such as metal.

[0045] In this embodiment, the bridge plate 10 is a thin plate-shaped Hub bridge plate of equal thickness, having a first surface 11 and a second surface 12 that are parallel to each other and arranged oppositely in the thickness direction. The first surface 11 and the second surface 12 are roughly rectangular. The bridge plate 10 is provided with a plurality of plug holes 13. Each plug hole 13 passes through the first surface 11 and the second surface 12. The plug holes 13 are arranged in sequence along a straight line. In this embodiment, the plug holes 13 are provided at the edge positions of the first surface 11 and the second surface 12 of the bridge plate 10, and the arrangement direction of the plug holes 13 is parallel to the long sides of the first surface 11 and the second surface 12.

[0046] Please also read Figure 1 and Figure 2 In this embodiment, each pin 21 has a substantially identical structure. Each pin 21 includes an integrally formed first extension portion 211 and a second extension portion 212. The first extension portion 211 and the second extension portion 212 are both long strip structures with substantially identical cross-sectional shapes and sizes. In this embodiment, the cross-sections of the first extension portion 211 and the second extension portion 212 are rectangular. Each pin 21 is spaced apart on the bridge plate 10. The first extension portions 211 of each pin 21 are parallel to each other, and the second extension portions 212 are parallel to each other.

[0047] The first extension portion 211 has a length extension direction X, and the second extension portion 212 has a length extension direction Y. The length extension direction X and the length extension direction Y have a non-zero angle. In this embodiment, the length extension direction X is perpendicular to the length extension direction Y. That is, in this embodiment, the length extension direction X and the length extension direction Y have a 90° angle, and each pin 21 is "L" shaped as a whole.

[0048] The pins 21 correspond to the sockets 13 on the bridge plate 10 one by one. The first extension portion 211 of each pin 21 is inserted into a corresponding socket 13 and is exposed relative to the socket 13. That is, the length extension direction X of the first extension portion 211 is perpendicular to the first surface 11 and the second surface 12; the first extension portion 211 of each pin 21 extends from the first surface 11 into the corresponding socket 13, and extends from the second surface 12 along the inner wall of the socket 13. The first extension portion 211 is in direct contact with the inner wall of the socket 13, thereby being electrically connected to the bridge plate 10 (for example, a conductive terminal protrudes from the inner wall of the socket 13). In this embodiment, the first extension portion 211 of the pin 21 is also fixedly connected to the inner wall of the socket 13 by spot welding.

[0049] Each insulating rubber sleeve 30 is sleeved on the second extension portion 212 of a corresponding plug pin 21. The insulating rubber sleeve 30 electrically insulates the adjacently arranged plug pins 21. At least two adjacently arranged insulating rubber sleeves 30 are connected in a detachable manner (for example, protrusions and grooves are formed on the adjacently arranged insulating rubber sleeves to engage with each other), thereby fixing and maintaining the relative positional relationship between the plug pins 21.

[0050] The length extension direction Y of the second extension portion 212 of each pin 21 is parallel to the first surface 11 and the second surface 12 of the bridge plate 10, and is perpendicular to the long sides of the first surface 11 and the second surface 12. The second extension portion 212 of each pin 21 extends from the insertion hole 13 on the bridge plate 10 toward the edge of the bridge plate 10, so that the second extension portion 212 partially extends on the first surface 11 and partially extends outside the first surface 11. The insulating rubber sleeve 30 is sleeved on the portion of the second extension portion 212 extending outside the first surface 11. One end of the second extension portion 212 away from the first extension portion 211 extends relative to the insulating rubber sleeve 30.

[0051] In this embodiment, the laser bridge structure 1 includes three groups of pin interfaces 20, each group of pin interfaces 20 includes 4 adjacently arranged pins 21, that is, the laser bridge structure 1 includes 12 pins 21. Twelve sockets 13 are provided on the bridge plate 10. The 12 sockets 13 are divided into three groups, each group includes 4 adjacently arranged sockets 13. The first extension portions 211 of the 4 pins 21 in each group are connected one-to-one with the 4 sockets 13 in the same group. The laser bridge structure 10 also includes 12 insulating rubber sleeves 30 corresponding one-to-one to the 12 pins. In other embodiments of the present application, the number of groups of pin interfaces 20, the number of pins 21 in each group of pin interfaces 20, the number of sockets 13, and the number of insulating rubber sleeves 30 may be different from the present application. In other embodiments of the present application, the laser bridge structure 1 includes at least one set of pin interfaces 20, each set of pin interfaces 20 includes at least one pin 21; the number of pins 21, the sockets 13 and the insulating rubber sleeves 30 are equal and correspond one to one.

[0052] In this embodiment, the angle between the length extension direction X of the first extension portion 211 and the length extension direction Y of the second extension portion 212 is 90°. In other embodiments of the present application, the length extension direction X of the first extension portion 211 and the length extension direction Y of the second extension portion 212 may have a non-90° angle. In this embodiment, the bridge plate 10 is a rectangular thin plate structure with equal thickness everywhere. In other embodiments of the present application, the bridge plate 10 may be other structures, such as the bridge plate is not equal thickness everywhere, such as the first surface 11 and the second surface 12 are other polygonal or irregular shapes, or such as the first surface 11 and the second surface 12 are non-flat surfaces. In this embodiment, the bridge plate 10 is a rigid circuit board. In other embodiments of the present application, the bridge plate 10 may also be a flexible circuit board. In this embodiment, the first extension portion 211 of the pin 21 is exposed relative to the plug hole 13. In other embodiments of the present application, the first extension portion 211 may also be completely located in the plug hole 13 without extending out of the second surface 12.

[0053] See also Figure 3 The laser assembly 100 of the embodiment of the present application includes the aforementioned laser bridge structure 1 and a plurality of laser chips 2 electrically connected to each group of pin interfaces 20. That is, each laser chip 2 is electrically connected to the bridge board 10 through a group of pin interfaces 20.

[0054] In this embodiment, the laser assembly 100 includes three laser chips 2; the three laser chips 2 are electrically connected to the three groups of pin interfaces 20 in a one-to-one correspondence. Four conductive terminals 201 (for example, copper contacts) are formed on each laser chip 2 and arranged side by side at intervals, and the second extension portions 212 of the four pins 21 in each group of pin interfaces 20 are electrically connected to the four conductive terminals 201 on the corresponding laser chip 2 in a one-to-one correspondence.

[0055] In this embodiment, the second extension portion 212 of each pin 21 is electrically connected to the surface of a corresponding conductive terminal 201 in a corresponding laser chip 2 by spot welding. The surface of the conductive terminal 201 contacting the second extension portion 212 is defined as the contact surface, and the length extension direction Y of the second extension portion 212 is parallel to the contact surface.

[0056] In this embodiment, the three laser chips 2 of the electrically connected bridge plate 10 are arranged in sequence along the long side direction of the first surface 11 (that is, the arrangement direction of each hole 13 and each pin 21), and the directions in which the three laser chips 2 emit lasers are parallel to each other and perpendicular to the first surface 11 and the second surface 12.

[0057] In this embodiment, the four conductive terminals 201 on each laser chip 2 are respectively the positive and negative electrode ends, the power supply end, and the temperature control signal end of the laser chip 2. One end of the bridge board 10 is electrically connected to each laser chip 2 through the pin 21, and the other end is electrically connected to the optical driving board (not shown), thereby establishing an electrical connection between each laser chip 2 and the optical driving board. Therefore, the laser bridge structure 1 can output various electrical signals from the optical driving board to each conductive terminal 201 of the laser chip 2, and control the working process of each laser chip 2 (including laser switch, driving current, etc.).

[0058] In other embodiments of the present application, the laser component 100 may include other numbers of laser chips 2, and other numbers of conductive terminals 201 may be formed on each laser chip 2. The number of laser chips 2 is the same as the number of groups of pin interfaces 20, and the number of conductive terminals 201 on a single laser chip 2 is the same as the number of pins 21 in each group of pin interfaces 20.

[0059] It can be seen that in the laser assembly 100 of the present application, different groups of pin interfaces 20 are electrically connected to different laser chips 2. The number of groups of pin interfaces 20 in the laser bridge structure 1 is the same as the number of laser chips 2 to be connected to the laser bridge structure 1. By setting multiple groups of pin interfaces 20, the present application enables a single bridge board 10 to electrically connect multiple laser chips 2 at the same time.

[0060] On this basis, the laser bridge structure 1 of the present application also includes a driver board interface 40 formed on the bridge board 10. The driver board interface 40 is electrically connected to each group of pin interfaces 20 on the one hand, and is used to electrically connect to an external laser driver board (not shown) on the other hand. That is, by respectively providing a driver board interface 40 and multiple groups of pin interfaces 20, the laser bridge structure 1 establishes an electrical connection between multiple laser chips 2 and a single laser driver board, so that the single laser driver board can realize the drive control of multiple laser chips 2 connected to the laser bridge structure 1 through the laser bridge structure 1.

[0061] Please also read Figure 4 and Figure 5 The laser light source 1000 of the embodiment of the present application includes two aforementioned laser components 100. Figure 4 and Figure 5 The laser light source 1000 further includes a housing 200 and a fixing plate 300. The laser components 110 / 120 and the fixing plate 300 are fixedly connected to different surfaces of the housing 200.

[0062] The housing 200 includes a non-coplanar first mounting surface 210 and a second mounting surface 220. In this embodiment, the first mounting surface 210 and the second mounting surface 220 are perpendicular to each other. The laser assembly 110 is fixedly connected to the first mounting surface 210, and the laser assembly 120 is fixedly connected to the second mounting surface 220, so that the directions in which the laser chip 2 in the laser assembly 110 and the laser assembly 120 emit lasers are perpendicular to each other.

[0063] In this embodiment, the laser assembly 110 and the laser assembly 120 each include a bridge board 10, each bridge board 10 has a driver board interface 40, and the driver board interface 40 in the laser assembly 110 and the laser assembly 120 is used to electrically connect the same laser driver board. In this way, one laser driver board drives and controls all the laser chips 2 in the laser assembly 110 and the laser assembly 120.

[0064] In this embodiment, a receiving space (not shown) may be formed in the housing 200, and the laser light source 1000 further includes optical elements (not shown) such as reflection, light combining, and light homogenization located in the receiving space. The lasers emitted by the laser assembly 110 and the laser assembly 120 may be combined and shaped by the above optical elements and then emitted in the same direction as the light source.

[0065] The laser assembly 110 and the laser assembly 120 are respectively arranged on the non-coplanar first mounting surface 210 and the second mounting surface 220. The laser assembly 110 and the laser assembly 120 occupy spaces in different directions respectively, and the spatial layouts interfere with each other. Therefore, the laser bridge structure 1 of the present application enables the laser light source 1000 to include a plurality of laser chips 2 arranged in an array.

[0066] In other embodiments of the present application, the housing 200 may be a polyhedral structure of other shapes, and the first mounting surface 210 and the second mounting surface 220 may have other non-zero angles, so that the first mounting surface 210 and the second mounting surface 220 are not coplanar.

[0067] In other embodiments of the present application, the laser light source 1000 may include a greater number of laser assemblies 100, the housing 200 may have a greater number of non-coplanar mounting surfaces, and the laser assemblies 100 are fixedly connected one by one to one of the mounting surfaces of the housing 200. Furthermore, the driver board interfaces 40 in all laser assemblies are used to electrically connect to the same laser driver board.

[0068] For example, in at least one embodiment of the present application, the housing 200 is a regular hexahedron structure, wherein the five surfaces can be used as a mounting surface respectively, so that five laser assemblies 100 can be fixedly connected to the housing 200. Another surface is used as a light-emitting surface. The five laser assemblies 100 are used to emit lasers in different directions, and the optical elements in the housing 200 can combine and shape the lasers emitted by the five laser assemblies 100 and then emit them toward the light-emitting surface as light sources. That is, for the housing 200, one surface can be reserved as the light-emitting surface, and the remaining surfaces can be used as mounting surfaces for installing the laser assemblies 100 to improve space utilization. In this embodiment, the driver board interface 40 in the five laser assemblies 100 is connected to the same laser driver board, so that the single laser driver board can drive and control all the laser chips in the five laser assemblies 100.

[0069] The laser bridge structure 1 of the embodiment of the present application includes a bridge board 10 and a plurality of groups of pin interfaces 20 electrically connected to the bridge board 10. One end of each pin 21 in each group of pin interfaces 20 is electrically connected to the bridge board 10, and the other end can be used to electrically connect to a corresponding laser chip 2. In this way, the laser chip 2 itself can be provided without a connector, and the size of the laser chip 2 itself can be minimized.

[0070] The two ends of each pin 21 are respectively connected to the bridge plate 10 and the laser chip 2 by spot welding, which can replace the welding wire. The spot welding is completed by an automated fixture, which is accurate, fast and low-cost.

[0071] By increasing the number of groups of pin interfaces 20 in the laser bridge structure 1, the laser bridge structure 1 can be connected to a larger number of laser chips 2. By providing a driver board interface 40, the laser bridge structure 1 can also be electrically connected to a laser driver board. That is, by providing multiple groups of pin interfaces 20 and a single driver board interface 40, the laser bridge structure 1 can be used to bridge multiple laser chips 2 and a single laser driver board, so that a single laser driver board can drive and control multiple laser chips 2 (for example, drive and control a laser chip array) through the laser bridge structure 1.

[0072] Each pin 21 includes a first extension portion 211 and a second extension portion 212. The first extension portion 211 and the second extension portion 212 of each pin 21 are respectively long strip structures, and the length extension direction X of the first extension portion 211 and the length extension direction Y of the second extension portion 212 have a non-zero angle, so that the first extension portion 211 can be connected to the bridge plate 10 through the socket 13 on the bridge plate 10, and the second extension portion 212 is connected to the laser chip 2. Therefore, in the case where multiple laser chips 2 need to be connected to form a three-dimensional layout array, the laser assembly 100 does not add additional fixings and occupy space, and the laser bridge structure 1 can realize the layout of multiple laser chips 2 without mutual interference.

[0073] Furthermore, the laser chip 2 is relatively sensitive to temperature, and a heat sink (not shown) is usually required to continuously dissipate heat for the laser chip 2. The laser bridge structure 1 of the embodiment of the present application allows the heat sink to be disposed on the mounting surface of the housing 200, and fits with the laser chip 2 to dissipate heat for the laser chip 2, and similarly, no additional space is required, and multiple heat sinks will not interfere with each other.

[0074] The laser assembly 100 and the laser light source 1000 of the present application include the above-mentioned laser bridge structure 1, and can achieve any of the above-mentioned beneficial effects.

[0075] Those skilled in the art should recognize that the above implementation modes are only used to illustrate the present application, and are not used as limitations on the present application. As long as they are within the essential spirit of the present application, appropriate changes and modifications made to the above embodiments are within the scope of protection claimed in the present application.

Claims

1. A laser bridge structure, characterized in that: include: A bridge board, used for bridging the laser chip and the laser driving board, wherein the bridge board is formed with a plug hole; At least one group of pin interfaces, each group of the pin interfaces correspondingly connected to one of the laser chips, each group of the pin interfaces comprising a plurality of pins, each of the pins comprising an integrally formed first extension portion and a second extension portion, the first extension portion and the second extension portion being respectively strip-shaped, and the length extension direction of the first extension portion and the length extension direction of the second extension portion having a non-zero angle, the first extension portion being inserted into the insertion hole to be electrically connected to the bridge plate, and the second extension portion being used to be electrically connected to the corresponding laser chip; as well as The driving board interface is electrically connected to each of the pin interfaces, so that the laser driving board drives and controls the laser chip electrically connected to each of the pin interfaces through the driving board interface.

2. The laser bridge structure according to claim 1, characterized in that: The plug hole is a through hole, and the first extension portion is inserted into the plug hole and exposed relative to the plug hole; The first extension portion is electrically connected to the inner wall of the insertion hole by spot welding.

3. The laser bridge structure according to claim 1, characterized in that: The first extension portion and the second extension portion are perpendicular to each other, and each of the pin interfaces is overall in an "L" shape.

4. The laser bridge structure according to claim 1, characterized in that: The laser bridge structure further includes an insulating rubber sleeve, which is sleeved on the second extension portion, and one end of the second extension portion away from the first extension portion extends relative to the insulating rubber sleeve.

5. The laser bridge structure according to claim 4, characterized in that: The bridge plate is formed with a plurality of the insertion holes; The laser bridge structure comprises a plurality of groups of the pin interfaces and a plurality of the insulating rubber sleeves, each of the pins in each group of the pin interfaces is plugged into the jacks one by one, and the insulating rubber sleeves are sleeved on the pins one by one; At least two adjacently arranged insulating rubber sleeves are detachably connected.

6. The laser bridge structure according to claim 5, characterized in that: The jacks are arranged along a straight line.

7. A laser assembly, characterized in that: include: The laser bridge structure according to any one of claims 1 to 4; as well as At least one laser chip, each of which is formed with a conductive terminal, each of which is electrically connected to a corresponding group of pin interfaces, the second extension portion of each pin in each group of pin interfaces is electrically connected to the conductive terminal of a corresponding laser chip by spot welding, and the length extension direction of the second extension portion is parallel to the contact surface of the conductive terminal contacting the second extension portion.

8. The laser assembly of claim 7, wherein: The bridge plate is formed with a plurality of the plug holes, and each of the plug holes is arranged along a straight line; The laser bridge structure comprises a plurality of groups of the pin interfaces, each group of the pin interfaces comprises at least one pin, and the pins are plugged into the sockets one by one; The laser assembly includes a plurality of the laser chips, and the plurality of laser chips are electrically connected to the plurality of groups of pin interfaces in a one-to-one correspondence, and each of the laser chips is electrically connected to the second extension portions of all the pins in a corresponding group of the pin interfaces.

9. A laser light source, characterized in that: include: A housing having a first mounting surface and a second mounting surface that are non-coplanar; as well as Two laser assemblies, the two laser assemblies are fixedly connected to the first mounting surface and the second mounting surface respectively, and each of the laser assemblies is a laser assembly as claimed in claim 7 or 8; The driving board interface in each of the laser components is used to electrically connect to the same laser driving board, so that the laser driving board drives and controls each of the laser chips in each of the laser components through the driving board interface in each of the laser components.

10. The laser light source according to claim 9, characterized in that: The first mounting surface and the second mounting surface are perpendicular to each other.

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