Horizontal copper deposition device and horizontal copper deposition processing line

Abstract

The utility model relates to the technical field of copper deposition production, in particular to a horizontal copper deposition device and a horizontal copper deposition processing line, the horizontal copper deposition device comprises a copper deposition reaction tank, a spraying device, a first filtering device and a second filtering device, and the copper deposition reaction tank comprises an overflow port; the spraying device comprises a magnetic pump and a spray pipe assembly, the spray pipe assembly comprises at least one spray pipe, and a plurality of groups of water outlet holes are formed in the spray pipe; the first filtering device is connected between the overflow port and the magnetic pump through a pipeline, the second filtering device is connected between the magnetic pump and the spray pipe through a pipeline, and a copper deposition solution flowing out of the overflow port is sprayed out from the water outlet hole after being filtered by the first filtering device and the second filtering device. The horizontal copper deposition device improves the blockage problem of the water outlet hole of the spray pipe, improves the hole penetrating capability, prolongs the maintenance frequency of the spray pipe and improves the production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of copper deposition production, in particular to a horizontal copper deposition device and a horizontal copper deposition processing line. Background Art

[0002] The horizontal copper deposition process is an important step in the manufacturing process of printed circuit boards. Its main function is to metallize the drilled hole wall. A thin layer of chemical copper is deposited on the insulating hole wall by chemical methods to serve as the base conductive layer for the subsequent electroplated copper, thereby achieving electrical interconnection between the layers of the printed circuit board.

[0003] Printed circuit boards usually use copper deposition devices to chemically react the hole walls to metalize the hole walls. Due to the different positions and sizes of the hole walls of printed circuit boards, there is a problem in the copper deposition process that the copper deposition solution only soaks the surface of the printed circuit board and cannot penetrate into its hole walls. In addition, with the advancement of technology, printed circuit boards are gradually developing towards highly dense interconnection designs, so that the printed circuit boards contain more and more small holes and micro blind holes with high aspect ratios, which further leads to poor copper deposition effects. In the prior art, the copper deposition device is equipped with multiple groups of water knives that spray copper deposition solutions, which improves the perforation capacity of the copper deposition solution, and a filtering device is set in the conveying line of the copper deposition solution to reduce the risk of the water knife being blocked by foreign matter. However, the filtering effect of the filtering device is not good, and the high aspect ratio and fine holes are very easy to be blocked, which not only affects the perforation effect, but also increases the cleaning and maintenance costs, affecting production efficiency. Utility Model Content

[0004] On the one hand, the utility model provides a horizontal copper deposition device, which improves the blockage problem of the water outlet hole of the nozzle, improves the penetration capacity, extends the maintenance frequency of the nozzle and improves the production efficiency. The horizontal copper deposition device includes a copper deposition reaction tank, a spray device, a first filter device and a second filter device. The copper deposition reaction tank includes an overflow port; the spray device includes a magnetic pump and a nozzle assembly, the nozzle assembly includes at least one nozzle, and the nozzle is provided with a plurality of groups of water outlet holes; the first filter device is connected between the overflow port and the magnetic pump through a pipeline, and the second filter device is connected between the magnetic pump and the nozzle through a pipeline. The copper deposition solution flowing out of the overflow port is filtered by the first filter device and the second filter device and then sprayed out from the water outlet.

[0005] In the above scheme, a first filtering device and a second filtering device are arranged on the conveying pipeline for the magnetic pump to absorb the copper deposition solution to the water outlet, so as to filter out the bad impurities in the copper deposition solution, prevent the water outlet of the nozzle from being blocked, extend the service life of the nozzle, and reduce the cleaning cost; and a plurality of groups of water outlet holes are arranged on the nozzle to improve the penetration capacity of the copper deposition solution.

[0006] Furthermore, the nozzle assembly includes a filter screen, and the filter screen is arranged on the inner tube wall of the nozzle.

[0007] In the above scheme, a filter screen is installed on the inner tube wall of the nozzle to further improve the blockage problem of the nozzle water outlet, reduce the cleaning frequency of the nozzle, and improve the production efficiency of the horizontal copper deposition processing line.

[0008] Furthermore, the first filtering device includes a filter bag.

[0009] In the above scheme, the first filtering device is arranged upstream of the horizontal copper precipitation device, and a filter bag with a coarse filtering function is used to perform preliminary filtration on the copper precipitation solution to reduce production costs.

[0010] Furthermore, the second filtering device comprises a filter cartridge and a filter element, and the filter cartridge is sleeved on the filter element.

[0011] In the above scheme, the second filtering device is arranged downstream of the horizontal copper precipitation device, and uses a filter cartridge and a filter element with fine filtering function to further finely filter the copper precipitation solution.

[0012] Furthermore, the water outlet hole has a water inlet end and a water outlet end, and the water outlet end is formed as an oblong hole.

[0013] In the above scheme, the water outlet is set as an oblong hole, which is convenient for cleaning the water outlet.

[0014] Furthermore, the width of the water inlet end is greater than the width of the water outlet end.

[0015] In the above scheme, the width of the water inlet end is greater than the width of the water outlet end, which is beneficial to increase the water pressure and improve the penetration capacity.

[0016] Furthermore, each group of the water outlet holes is arranged along the length direction of the nozzle, and two adjacent groups of the water outlet holes are staggered.

[0017] In the above scheme, the staggered arrangement of two adjacent groups of water outlet holes can increase the effective coverage of the copper deposition solution spraying.

[0018] Furthermore, the group spacing between two adjacent groups of water outlet holes is 8 mm, and the spacing between two adjacent water outlet holes in the same group of water outlet holes is 10 mm.

[0019] In the above scheme, reasonable group spacing and hole spacing are set to ensure water pressure, increase the stability of water discharge from the nozzle, and reduce the risk of foreign matter blocking the hole.

[0020] On the other hand, the utility model provides a horizontal copper deposition processing line, including the above-mentioned horizontal copper deposition device.

[0021] In the above scheme, the horizontal copper deposition processing line is provided with a horizontal copper deposition device to reduce the situation where the metallized hole is open without copper and causes defective scrapping, thereby achieving the purpose of stabilizing the quality of the printed circuit board.

[0022] Compared with the prior art, the utility model has the following beneficial effects: a first filtering device and a second filtering device are arranged on the conveying pipeline for the magnetic pump to absorb the copper deposition solution to the water outlet, and a plurality of groups of water outlets are arranged on the nozzle, so that the filtered copper deposition solution is sprayed out from the water outlets of the nozzle, thereby effectively avoiding the problem of blockage of the water outlets of the nozzle, extending the service life of the nozzle, and also improving the penetration capacity of the copper deposition solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the horizontal copper deposition device of the utility model.

[0024] Figure 2 It is a schematic diagram of the nozzle structure of the horizontal copper sinking device of the utility model and a cross-sectional diagram of the water outlet hole A-A.

[0025] Description of the accompanying drawings: copper precipitation reaction tank 1, overflow port 11, spray device 2, magnetic pump 21, spray pipe assembly 22, water outlet 231, spray pipe 232, first filtering device 3, second filtering device 4. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0027] like Figure 1 and Figure 2 As shown, in a preferred embodiment, a horizontal copper deposition device includes a copper deposition reaction tank 1, a spray device 2, a first filter device 3 and a second filter device 4, the copper deposition reaction tank 1 includes an overflow port 11; the spray device 2 includes a magnetic pump 21 and a nozzle assembly 22, the nozzle assembly 22 includes at least one nozzle 232, and the nozzle 232 is provided with a plurality of water outlet holes 231; the first filter device 3 is connected between the overflow port 11 and the magnetic pump 21 through a pipeline, and the second filter device 4 is connected between the magnetic pump 21 and the nozzle 232 through a pipeline, and the copper deposition solution flowing out of the overflow port 11 is filtered by the first filter device and the second filter device and then sprayed out from the water outlet 231. By arranging the first filtering device 3 and the second filtering device 4 on the conveying pipeline for the magnetic pump 21 to absorb the copper deposition solution to the water outlet 231, undesirable impurities in the copper deposition solution are filtered out to prevent the water outlet 231 of the nozzle 232 from being blocked, thereby extending the service life of the nozzle 232 and reducing the cleaning cost; a plurality of groups of water outlet holes 231 are arranged on the nozzle 232 to improve the penetration capacity of the copper deposition solution.

[0028] like Figure 1 As shown, the first filtering device 3 is arranged upstream of the horizontal copper deposition device, and a filtering device with a coarse filtering function can be used to perform preliminary filtering on the copper deposition solution to reduce production costs. The second filtering device 4 is arranged downstream of the horizontal copper deposition device, and a filtering device with a fine filtering function can be used to perform further fine filtering on the copper deposition solution.

[0029] In this embodiment, the first filter device 3 includes a filter bag; the second filter device 4 includes a filter cartridge and a filter element, the filter cartridge is sleeved on the filter element, wherein the filter element has a filtration accuracy of 20 μm, and this embodiment does not limit the filtration accuracy, and the filter element can use different filtration accuracies according to needs. The filter bag is connected to the overflow port 11 and the magnetic pump 21 through a pipeline; the filter element is connected between the magnetic pump 21 and the nozzle assembly 22 through a pipeline, and the copper precipitation solution is sprayed from the water outlet 231 of the nozzle 232 after double filtration by the filter bag and the filter element, so as to prevent the water outlet 231 of the nozzle 232 from being blocked, thereby extending the service life of the nozzle 232 and reducing the cleaning cost.

[0030] In this embodiment, the nozzle assembly 22 also includes a filter screen, which is arranged on the inner tube wall of the nozzle 232. Preferably, a PP filter screen with a filtration accuracy of 0.5 mm is installed on the inner tube wall of the nozzle 232 to further improve the blockage problem of the water outlet 231 of the nozzle 232, thereby reducing the cleaning frequency of the nozzle 232 and improving the production efficiency of the horizontal copper plating processing line.

[0031] Please refer to Figure 2 In this embodiment, three groups of water outlet holes 231 are arranged on the nozzle 232, and the three groups of water outlet holes 231 are arranged along the length direction of the nozzle 232. Two adjacent groups of water outlet holes 231 are staggered. The staggered arrangement of the two adjacent groups of water outlet holes 231 can increase the effective coverage of the copper deposition solution spraying. Among them, the group spacing between the two adjacent groups of water outlet holes 231 is 8mm, and the spacing between the two adjacent water outlet holes 231 in the same group of water outlet holes 231 is 10mm. Reasonable group spacing and hole spacing are set to ensure water pressure, increase the stability of the nozzle water outlet, and reduce the risk of foreign matter blocking the hole.

[0032] Please refer to Figure 2 In this embodiment, the water outlet 231 has a water inlet end and a water outlet end. The water outlet end is formed as an oblong hole, which is convenient for cleaning when the water outlet hole is blocked. The width of the water inlet end is greater than the width of the water outlet end, which is conducive to increasing water pressure and improving the penetration capacity. Preferably, the width of the water inlet end is 3 mm, and the width of the water outlet end is 1 mm.

[0033] The utility model also provides a horizontal copper deposition processing line, including the above-mentioned horizontal copper deposition device. By optimizing the design of the first filter device 3, the second filter device 4, the nozzle 232 and the water outlet 231, the problem of blockage of the water outlet 231 of the nozzle 232 can be effectively reduced, and the cost of scrapping PCBA due to open circuit without copper in the hole can be further reduced, the maintenance frequency can be extended and the production efficiency can be improved, so as to meet the quality requirements of high-layer precision circuit boards and have practical effects.

[0034] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A horizontal copper deposition device, characterized in that: The invention comprises a copper deposition reaction tank, a spray device, a first filter device and a second filter device, wherein the copper deposition reaction tank comprises an overflow port; the spray device comprises a magnetic pump and a nozzle assembly, wherein the nozzle assembly comprises at least one nozzle, and the nozzle is provided with a plurality of water outlet holes; the first filter device is connected between the overflow port and the magnetic pump through a pipeline, and the second filter device is connected between the magnetic pump and the nozzle through a pipeline, and the copper deposition solution flowing out of the overflow port is filtered by the first filter device and the second filter device and then sprayed out from the water outlet hole.

2. The horizontal copper deposition device according to claim 1, characterized in that: The nozzle assembly comprises a filter screen, and the filter screen is arranged at the inner pipe wall of the nozzle.

3. The horizontal copper deposition device according to claim 1, characterized in that: The first filter device includes a filter bag.

4. The horizontal copper deposition device according to claim 1, characterized in that: The second filtering device comprises a filter cartridge and a filter element, and the filter cartridge is sleeved on the filter element.

5. The horizontal copper deposition device according to claim 1, characterized in that: The water outlet hole has a water inlet end and a water outlet end, and the water outlet end is formed as an oblong hole.

6. The horizontal copper deposition device according to claim 5, characterized in that: The width of the water inlet end is greater than the width of the water outlet end.

7. The horizontal copper deposition device according to claim 1, characterized in that: Each group of water outlet holes is arranged along the length direction of the nozzle, and two adjacent groups of water outlet holes are staggered.

8. The horizontal copper deposition device according to claim 7, characterized in that: The distance between two adjacent groups of water outlet holes is 8 mm, and the distance between two adjacent water outlet holes in the same group of water outlet holes is 10 mm.

9. A horizontal copper deposition processing line, characterized in that: It comprises the horizontal copper deposition device described in any one of claims 1-8.

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