Parallel clamping mechanism

Abstract

The utility model relates to the technical field of semiconductors, in particular to a parallel clamping mechanism. Comprising a bottom plate and a top plate, the top plate is hinged to the bottom plate through a connecting piece, the bottom plate is provided with a containing area used for containing materials, one end of the top plate is provided with a pressing part, the pressing part is located above the containing area, and the top plate moves front and back to be close to or away from the bottom plate so that the materials can be clamped or loosened in parallel. When the top plate moves in place towards the bottom plate, the pressing part is parallel to the placing area, the pressing part stably presses the wafer, the wafer is prevented from being subjected to acting force in the horizontal direction, deviation of left and right relative positions of the wafer is prevented, the equipment precision is improved, and the grabbing quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a parallel clamping mechanism. Background Art

[0002] Wafer refers to the silicon chip used to make silicon semiconductor circuits, and its original material is silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer. The back of the wafer will be covered with a thin film, which is supported by a wafer frame we call "Frame" to form an integral sheet material. Multiple sheets of sheet materials are usually loaded in a sheet material box (Framebox), which is used as a carrier for transportation.

[0003] In existing equipment, since the wafer is subjected to horizontal force, the wafer causes deviation in left-right relative position, resulting in deviation in placement position, thus causing equipment accuracy deviation. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a parallel clamping mechanism, which realizes parallel clamping or releasing of materials by moving the top plate forward and backward to approach or move away from the bottom plate. After the pressing part moves smoothly into place in the placement area, it stably presses the wafer to avoid horizontal forces on the wafer and prevent the wafer from causing relative position deviation to the left and right, thereby improving the equipment accuracy and the grasping quality.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] The utility model provides a parallel clamping mechanism, comprising a bottom plate and a top plate, wherein the top plate is hinged to the bottom plate by a connecting piece, the bottom plate is provided with a placement area for placing materials, a pressing portion is provided at one end of the top plate, and the pressing portion is located above the placement area, and the top plate moves forward and backward to approach or move away from the bottom plate to realize parallel clamping or releasing of materials.

[0007] Wherein, the connecting member comprises at least two parallel mounting blocks, the top ends of the mounting blocks are hinged to the top plate via upper shafts, and the bottom ends of the mounting blocks are hinged to the bottom plate via lower shafts.

[0008] Wherein, the top plate is provided with a first accommodating groove, and the upper end and the upper shaft of the mounting block are both mounted in the first accommodating groove.

[0009] Wherein, the bottom plate is provided with a second accommodating groove, and the lower end and the lower shaft of the mounting block are both mounted in the second accommodating groove.

[0010] Wherein, a mounting portion is arranged at the other end of the top plate, and the mounting portion is connected with a moving block, and the moving block drives the top plate to move forward and backward so that the pressing portion is close to or away from the placement area.

[0011] Wherein, the mounting portion is installed with a bearing, the moving block is provided with a guide groove, and the bearing is arranged in the guide groove.

[0012] Wherein, the mounting portion is provided with a clearance opening, the bearing is installed in the clearance opening, and the front end wall of the guide groove is arranged in the clearance opening.

[0013] Beneficial effects of the utility model:

[0014] The utility model realizes parallel clamping or releasing of materials by moving the top plate forward and backward to approach or move away from the bottom plate. The pressing part moves smoothly to the placement area and then stably presses the wafer to avoid the wafer being subjected to horizontal force and preventing the wafer from causing relative position deviation to the left and right, thereby improving equipment accuracy and grasping quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the exploded structure of the parallel clamping mechanism.

[0016] Figure 2 It is a structural side view of the parallel clamping mechanism.

[0017] Figure 3 This is a schematic diagram of the structure of the top plate.

[0018] 1. Bottom plate; 101. Placement area; 102. Second accommodating groove; 2. Top plate; 201. First accommodating groove; 301. Mounting block; 302. Upper shaft; 303. Lower shaft; 4. Pressing portion; 5. Mounting portion; 501. Clearance opening; 6. Moving block; 601. Guide groove; 7. Bearing. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the examples and drawings. The specific implementation methods of the present invention will be described below. It should be noted that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all the features of the actual implementation methods. It should be understood that in the actual implementation of any one of the implementation methods, it should be understood that for those of ordinary skill in the art related to the content disclosed in the present invention, some changes such as design, manufacturing or production based on the technical content disclosed in the present invention are only conventional technical means, and should not be understood as the content of the present disclosure being insufficient. The present utility model is described in detail below in conjunction with the drawings.

[0020] refer to Figures 1 to 3As shown, the utility model provides a parallel clamping mechanism, including a bottom plate 1 and a top plate 2, the top plate 2 is hinged to the bottom plate 1 by a connecting piece, the bottom plate 1 is provided with a placement area 101 for placing materials, a pressing portion 4 is provided at one end of the top plate 2, the pressing portion 4 is located above the placement area 101, the top plate 2 moves forward and backward to approach or move away from the bottom plate 1 to achieve parallel clamping or releasing of materials; in actual application, a wafer is placed in the placement area 101, the placement area 101 supports the wafer, and the top plate 2 is moved forward and backward to approach or move away from the bottom plate 1 to achieve parallel clamping or releasing of materials, and the pressing portion 4 moves smoothly to the placement area 101 and then stably presses the wafer to avoid the wafer being subjected to horizontal force, thereby preventing the wafer from causing deviation of the left and right relative position, improving the equipment accuracy, and improving the grasping quality.

[0021] In this embodiment, the connecting member includes at least two parallel mounting blocks 301, the top end of the mounting block 301 is hinged to the top plate 2 through an upper shaft 302, and the bottom end of the mounting block 301 is hinged to the bottom plate 1 through a lower shaft 303; in actual application, the distance between the upper shaft 302 and the lower shaft 303 in each mounting block 301 is the same, and when the mounting block 301 swings, it drives the top plate 2 to translate stably, which facilitates the stable translation of the pressing part 4. The structure is ingenious and improves the clamping effect of the wafer.

[0022] In this embodiment, the top plate 2 is provided with a first receiving groove 201, and the upper end of the mounting block 301 and the upper shaft 302 are both installed in the first receiving groove 201; the upper end of the mounting block 301 and the upper shaft 302 are cleverly hidden in the first receiving groove 201, reducing space occupancy and making the structure compact.

[0023] In this embodiment, the base plate 1 is provided with a second receiving groove 102, and the lower end of the mounting block 301 and the lower shaft 303 are both installed in the second receiving groove 102; the lower end of the mounting block 301 and the lower shaft 303 are cleverly hidden in the second receiving groove 102, reducing space occupancy and making the structure compact.

[0024] refer to Figure 1 As shown, in this embodiment, a mounting portion 5 is provided at the other end of the top plate 2, and the mounting portion 5 is connected to a moving block 6, and the moving block 6 drives the top plate 2 to move forward and backward so that the pressing portion 4 is close to or away from the placement area 101; specifically, a power cylinder configured with the moving block 6 can be provided, and the moving block 6 is driven by the power cylinder to move, thereby driving the top plate 2 to move forward and backward so that the pressing portion 4 is close to or away from the placement area 101, which saves labor and is conducive to automatic control of the forward and backward movement of the top plate 2.

[0025] In this embodiment, the mounting portion 5 is installed with a bearing 7, the moving block 6 is provided with a guide groove 601, and the bearing 7 is arranged in the guide groove 601; during the forward and backward movement of the moving block 6, the bearing 7 is driven to move in the guide groove 601, thereby driving the mounting portion 5 and the top plate 2 to move synchronously.

[0026] refer to Figure 3 As shown, in this embodiment, the mounting portion 5 is provided with a clearance opening 501, the bearing 7 is installed in the clearance opening 501, and the front end wall of the guide groove 601 is arranged in the clearance opening 501; through the provision of the clearance opening 501, part of the structure of the moving block 6 is cleverly moved in and out of the mounting portion 5, effectively saving space occupation; refer to Figure 1 As shown, in actual application, the top end of the guide groove 601 can be penetrated, and when the top plate 2 is separated from the upper shaft 302, the bearing 7 is separated from the guide groove 601, and the top plate 2 can be removed smoothly, which is convenient for disassembly and assembly.

[0027] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A parallel clamping mechanism, characterized in that: The invention comprises a bottom plate (1) and a top plate (2), wherein the top plate (2) is hinged to the bottom plate (1) by a connecting piece, the bottom plate (1) is provided with a placement area (101) for placing materials, a pressing portion (4) is provided at one end of the top plate (2), and the pressing portion (4) is located above the placement area (101), and the top plate (2) moves forward and backward to approach or move away from the bottom plate (1) to achieve a parallel clamping or releasing action of the materials.

2. The parallel clamping mechanism according to claim 1, characterized in that: The connecting member comprises at least two parallel mounting blocks (301), the top end of the mounting block (301) being hinged to the top plate (2) via an upper shaft (302), and the bottom end of the mounting block (301) being hinged to the bottom plate (1) via a lower shaft (303).

3. The parallel clamping mechanism according to claim 2, characterized in that: The top plate (2) is provided with a first accommodating groove (201), and the upper end of the mounting block (301) and the upper shaft (302) are both mounted in the first accommodating groove (201).

4. The parallel clamping mechanism according to claim 2, characterized in that: The bottom plate (1) is provided with a second accommodating groove (102), and the lower end of the mounting block (301) and the lower shaft (303) are both mounted in the second accommodating groove (102).

5. The parallel clamping mechanism according to claim 1, characterized in that: The other end of the top plate (2) is provided with a mounting portion (5), the mounting portion (5) being connected to a moving block (6), the moving block (6) driving the top plate (2) to move forward and backward, so that the pressing portion (4) moves closer to or further away from the placement area (101).

6. The parallel clamping mechanism according to claim 5, characterized in that: The mounting portion (5) is mounted with a bearing (7), the moving block (6) is provided with a guide groove (601), and the bearing (7) is arranged in the guide groove (601).

7. The parallel clamping mechanism according to claim 6, characterized in that: The mounting portion (5) is provided with a clearance opening (501), the bearing (7) is installed in the clearance opening (501), and the front end wall of the guide groove (601) is arranged in the clearance opening (501).

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