Solder paste physical first-in first-out device
By designing a physical first-in-first-out device that uses the gravity of the solder paste tank, and combining the technology of wireless lock controller and computer database comparison, the problem of solder paste not being used according to the first-in-first-out principle in the traditional solder paste management method is solved, and the effective management and correct operation of solder paste is achieved.
Patent Information
- Application Number
- CN202421688012.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-07-17
AI Technical Summary
During the surface mounting of circuit boards, the traditional solder paste management method causes the solder paste to not be used according to the first-in-first-out principle, resulting in the problem of expired and waste of solder paste. The existing first-in-first-out device lacks the computer database comparison function, resulting in operation errors and confusion in control barcodes.
Design a physical first-in-first-out device for solder paste, adopts pure mechanical design, and uses the gravity rolling principle of the circular solder paste tank to achieve first-in-first-out management, and compares it with the computer database through a wireless lock controller to ensure that the solder paste is used according to the first-in-first-out principle.
It realizes effective first-in-first-out management of solder paste, reduces expired and waste of solder paste, and ensures correct operation and smooth control.
Smart Images
Figure CN222845652U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solder paste management in the process of mounting the surface of a circuit board, in particular to a physical first-in-first-out device for solder paste. Background Art
[0002] The traditional packaging method of solder paste is a round can with a diameter of 60mm and a length of 77mm. Since it is a mixture of tin-silver powder alloy and flux, it has a certain shelf life. The traditional management is to number the solder paste according to the shelf life or purchase date, and take it in order from small to large. However, the solder paste is generally stacked and stored in a low-temperature environment. During the operation, employees are prone to not follow the first-in-first-out principle, resulting in the first solder paste not being taken out and used, while the later solder paste is indeed taken out and used, causing the solder paste to expire and cannot be used. Because stacking is also inconvenient to take, etc., it causes a great waste of man-hours and solder paste. The existing first-in-first-out device has no computer database comparison function, so it is easy for employees to make mistakes when putting solder paste, which causes confusion in the subsequent control barcode. Therefore, it is necessary to make a physical fool-proof device that can roll down by its own gravity, and use a computer database to compare the first-in-first-out to ensure that employees will not make mistakes in operation and realize the first-in-first-out management of solder paste. Summary of the invention
[0003] The utility model aims to solve the above technical problems and provides a physical first-in-first-out device for solder paste.
[0004] In order to achieve the above technical objectives and meet the above technical requirements, the technical solution adopted by the utility model is: a physical first-in-first-out device for solder paste, including a shell, the shell including a left panel, a right panel, a front panel, a rear panel, and a bottom plate, the top of the front panel is a solder paste inlet, and the bottom is a solder paste outlet, a wireless lock controller is arranged on the shell above the solder paste inlet, a first ramp module, a second ramp module, a third ramp module, a fourth ramp module, and a fifth ramp module are arranged from top to bottom in the shell, and a solder paste inlet and outlet channel is arranged between two adjacent ramp modules, the second ramp module includes a fixing member A, and a guide track A is arranged on the fixing member A, the third ramp module includes a fixing member B, and a guide track B is arranged on the fixing member B, the fourth ramp module includes a fixing member C, and a guide track C is arranged on the fixing member C, the fifth ramp module includes a fixing member D, and a guide track D is arranged on the fixing member D, and triangular guide blocks are respectively arranged at the ends of the guide track B, the guide track C, and the guide track D.
[0005] Preferably, the angle of the upper surfaces of the first slope module, the second slope module, the third slope module, the fourth slope module and the fifth slope module relative to the horizontal is 8°.
[0006] Preferably, the guide track A, guide track B, guide track C and guide track D are configured as U-shaped track grooves to reduce the friction of the bottle body on the surface of the slope module.
[0007] Preferably, the first slope module, the second slope module, the third slope module, the fourth slope module and the fifth slope module are connected to the left panel and the right panel respectively through rivets.
[0008] Preferably, the triangular guide block is arranged at one end of the guide track close to the shell.
[0009] Compared with the traditional structure, the utility model has the following beneficial effects:
[0010] 1. The utility model has a simple structure, beautiful appearance, corrosion resistance and easy cleaning, a pure mechanical design with low failure rate, simple operation, and a compact size. It can be placed in any environment for use, and utilizes the gravity rolling principle of the round solder paste tank to achieve first-in-first-out management, which is easy to operate and maintain.
[0011] 2. By setting up a wireless lock controller, the computer will open it according to the first-in-first-out principle through database comparison to ensure the correctness of solder paste storage, prevent confusion in subsequent management and control, and effectively achieve physical anti-fouling. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a schematic diagram of the structure of the utility model;
[0013] Figure 2 This is a schematic diagram of the structure of the utility model with the right panel removed;
[0014] In the figure: 1. wireless lock controller, 2. shell, 21. left panel, 22. front panel, 23. rear panel, 24. right panel, 3. first slope module, 4. second slope module, 41. guide track A, 42. fixing part A, 5. third slope module, 51. fixing part B, 52. guide track B, 53. triangular guide block, 6. fourth slope module, 61. fixing part C, 62. guide track C, 7. fifth slope module, 71. fixing part D, 72. guide track D. DETAILED DESCRIPTION
[0015] The utility model is further described below.
[0016] See attached Figure 1-2A solder paste physical first-in-first-out device comprises a shell 2, wherein the shell 2 comprises a left panel 21, a right panel 24, a front panel 22, a rear panel 23, and a bottom plate, wherein the upper portion of the front panel 22 is a solder paste inlet, and the lower portion is a solder paste outlet, wherein a wireless lock controller 1 is arranged on the shell 2 above the solder paste inlet, wherein a first ramp module 3, a second ramp module 4, a third ramp module 5, a fourth ramp module 6, and a fifth ramp module 7 are arranged in the shell 2 from top to bottom, wherein a solder paste inlet and outlet channel is arranged between two adjacent ramp modules, wherein the second ramp module 4 includes a first ramp module 3, a second ramp module 4, a third ramp module 5, a fourth ramp module 6, and a fifth ramp module 7, wherein a solder paste inlet and outlet channel is arranged between two adjacent ramp modules, wherein the second ramp module 4 includes a first ramp module 3, a second ramp module 4, a third ramp module 5, a fourth ramp module 6, and a fifth ramp module 7, wherein the first ramp module 3 includes a second ramp module 4, ... The third slope module 5 includes a fixing member A42, on which a guide rail A41 is arranged; the third slope module 5 includes a fixing member B51, on which a guide rail B52 is arranged; the fourth slope module 6 includes a fixing member C61, on which a guide rail C62 is arranged; the fifth slope module 7 includes a fixing member D71, on which a guide rail D72 is arranged; and the ends of the guide rails B52, C62 and D72 are respectively provided with triangular guide blocks 53.
[0017] In the preferred embodiment, the angle of the upper surfaces of the first slope module 3 , the second slope module 4 , the third slope module 5 , the fourth slope module 6 , and the fifth slope module 7 relative to the horizontal is 8°.
[0018] In the present preferred embodiment, the guide rail A41, the guide rail B52, the guide rail C62, and the guide rail D72 are configured as U-shaped rail grooves.
[0019] In the preferred embodiment, the first slope module 3 , the second slope module 4 , the third slope module 5 , the fourth slope module 6 , and the fifth slope module 7 are connected to the left panel 21 and the right panel 24 respectively through rivets.
[0020] In this preferred embodiment, the triangular guide block 53 is disposed at one end of the guide track close to the housing 2 .
[0021] During specific implementation, the utility model is used for first-in-first-out control of solder paste in the process of surface mounting of circuit boards with relatively high performance during the processing and production of motor control boards. The fifth slope module 7 is installed on the bottom plate, and the fourth slope module 6 is vertically installed above the fifth slope module 7, with an installation distance of 79 cm; the third slope module 5 is vertically installed above the fourth slope module 6, with an installation distance of 79 cm; the second slope module 4 is vertically installed below the first slope module 3, with an installation distance of 79 cm; since the solder paste storage tank is a cylindrical tank with a diameter of 60 mm and a length of 77 mm, the vertical range of the device is 79 mm; the distance between the right panel 24 and the left panel 21 is 86 mm, which can effectively make the solder paste tank move in the predetermined slope module direction during the rolling process.
[0022] The angle of the upper surface of the first slope module 3, the second slope module 4, the third slope module 5, the fourth slope module 6, and the fifth slope module 7 relative to the horizontal is 8°, and each module has a guide positioning mechanism to reduce the friction of the bottle body on the module surface. The round packaging bottle of solder paste can roll down from the entrance position to the exit position under its own gravity. The device can store 20 bottles of 500g solder paste. After the solder paste is put in according to the first-in-first-out principle, a bottle of solder paste is taken out from the exit, and the remaining 19 bottles of solder paste will roll down in turn, and the first-in-first-out management will be realized repeatedly; because the entire storage mechanism is a sealed space, the solder paste cannot be taken out midway, and can only be taken at the exit position; it is put in at the entrance position, and the physical principle is used to achieve foolproofing.
[0023] The wireless lock controller 1 is installed above the entrance. According to the first-in-first-out principle of solder paste, the first solder paste that comes in is put in through the entrance; the barcode of the solder paste entering the warehouse is collected by the barcode collector; the computer compares it with the database and manages it according to the first-in-first-out principle. If it is not managed according to the first-in-first-out principle, the wireless lock controller 1 will not be opened. If it is managed according to the first-in-first-out principle, the wireless lock controller 1 will be opened, and its internal sensor will sense that a bottle of solder paste has rolled down, and the wireless lock controller 1 will be closed again. All solder pastes are stored in the warehouse in this way; they are taken out from the exit when they are used. Since the entire mechanism is sealed and cannot be taken out, it can effectively realize the first-in-first-out anti-fool management.
[0024] The above embodiments of the present invention are merely examples to clearly illustrate the present invention, but are not intended to limit the protection scope of the present invention. All equivalent technical solutions also belong to the scope of the present invention. The patent protection scope of the present invention should be defined by the claims.
Claims
1. A solder paste physical first-in-first-out device, comprising a housing (2), characterized in that: The shell (2) comprises a left panel (21), a right panel (24), a front panel (22), a rear panel (23), and a bottom panel. The front panel (22) has a solder paste inlet at the top and a solder paste outlet at the bottom. A wireless lock controller (1) is arranged on the shell (2) above the solder paste inlet. A first slope module (3), a second slope module (4), a third slope module (5), a fourth slope module (6), and a fifth slope module (7) are arranged in the shell (2) from top to bottom. A solder paste inlet and outlet channel is arranged between two adjacent slope modules. The second slope module (4) comprises a fixing member A (42). The fixing member A (43) is provided with a fixing member A (44). The guide rail A (41) is arranged on the fixing member A (42), the third slope module (5) comprises a fixing member B (51), the fixing member B (51) is provided with a guide rail B (52), the fourth slope module (6) comprises a fixing member C (61), the fixing member C (61) is provided with a guide rail C (62), the fifth slope module (7) comprises a fixing member D (71), the fixing member D (71) is provided with a guide rail D (72), and the ends of the guide rail B (52), the guide rail C (62), and the guide rail D (72) are respectively provided with triangular guide blocks (53).
2. The solder paste physical first-in-first-out device according to claim 1, characterized in that: The angle of the upper surfaces of the first slope module (3), the second slope module (4), the third slope module (5), the fourth slope module (6) and the fifth slope module (7) relative to the horizontal is 8°.
3. The solder paste physical first-in-first-out device according to claim 1, characterized in that: The guide rail A (41), the guide rail B (52), the guide rail C (62), and the guide rail D (72) are configured as U-shaped rail grooves.
4. The solder paste physical first-in-first-out device according to claim 1, characterized in that: The first slope module (3), the second slope module (4), the third slope module (5), the fourth slope module (6), and the fifth slope module (7) are respectively connected to the left panel (21) and the right panel (24) via rivets.
5. The solder paste physical first-in-first-out device according to claim 1, characterized in that: The triangular guide block (53) is arranged at one end of the guide track close to the housing (2).