Single wafer drying device

Abstract

The utility model discloses a single wafer drying device and belongs to the technical field of wafer drying. The rotary fixing mechanism comprises a suction cup rotationally connected with the workbench, the workbench is provided with a rotary driving assembly connected with the suction cup, the rotary driving assembly is used for driving the suction cup to rotate on the workbench, and the suction cup communicates with a negative pressure pipe; the swing arm blow-drying mechanism comprises a supporting rod rotationally connected with the workbench, a nozzle is arranged on the supporting rod and located above the suction cup, a swing driving assembly connected with the supporting rod is arranged on the workbench, and the swing driving assembly is used for driving the supporting rod to rotate forwards and backwards on the workbench. Therefore, the nozzle swings in a reciprocating mode above the suction cup, and the nozzle communicates with an air supply assembly. According to the utility model, a spin-drying mode and a blow-drying mode are combined to dry the wafer, so that the drying efficiency and the drying effect are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer drying, in particular to a single wafer drying device. Background Art

[0002] After ultrasonic testing of wafer contours and defects, there will be a small amount of water stains on the wafer surface, so the wafer needs to be blown dry before being put back into the wafer transfer box. Currently, most of the wafer drying methods suitable for ultrasonic testing wafers on the market use air knife drying technology, that is, using wind to dry solid, liquid or slurry substances on the surface of the material. This method has low drying efficiency for wafers.

[0003] To this end, a single wafer drying device is proposed. Utility Model Content

[0004] The utility model aims to provide a single wafer drying device, aiming to solve or improve at least one of the above technical problems.

[0005] To achieve the above-mentioned purpose, the utility model provides the following solution: The utility model provides a single wafer drying device, comprising:

[0006] Workbench;

[0007] A rotating fixing mechanism, the rotating fixing mechanism comprising a suction cup rotatably connected to the workbench, a rotating driving assembly connected to the suction cup is provided on the workbench, the rotating driving assembly is used to drive the suction cup to rotate on the workbench, and a negative pressure pipe is connected to the suction cup;

[0008] A swing-arm blowing-drying mechanism, the swing-arm blowing-drying mechanism includes a support rod rotatably connected to the workbench, the support rod is provided with a nozzle, the nozzle is located above the suction cup, a swing driving assembly connected to the support rod is provided on the workbench, the swing driving assembly is used to drive the support rod to rotate forward and reverse on the workbench, so that the nozzle swings back and forth above the suction cup, and the nozzle is connected to an air supply assembly.

[0009] Preferably, it also includes a splash-proof recovery mechanism, which includes a lifting assembly and a splash-proof plate. The lifting assembly is arranged on the workbench, and the output end of the lifting assembly is connected to the splash-proof plate. A through hole is opened in the middle of the splash-proof plate, and an annular boss is fixedly connected to the through hole. The annular boss is sleeved on the circular shaft at the bottom of the suction cup and is in sliding contact with the circular shaft at the bottom of the suction cup, and a plurality of water outlets are opened on the splash-proof plate.

[0010] Preferably, the lifting assembly includes a lifting cylinder fixedly connected to the top of the workbench, the output end of the lifting cylinder is fixedly connected to the bottom of the anti-splash plate, and a plurality of linear supports are also fixedly connected between the anti-splash plate and the workbench.

[0011] Preferably, the rotary drive assembly includes a hollow main shaft rotatably connected to the workbench, a first motor is fixedly connected to the bottom of the workbench, the first motor is transmission-connected to the hollow main shaft through a first belt drive assembly, the top of the hollow main shaft is fixedly connected to the circular shaft on the suction cup, the bottom of the hollow main shaft is located below the workbench and is rotatably connected to a rotary joint, and the rotary joint is fixed to the workbench through a fixing clamp.

[0012] Preferably, the negative pressure tube sequentially passes through the rotary joint, the hollow main shaft, the circular shaft on the suction cup and is connected to the inner cavity of the suction cup. The negative pressure tube is rotatably connected to the suction cup, and a vacuum pump is fixedly connected to one end of the negative pressure tube away from the suction cup.

[0013] Preferably, the swing drive assembly includes a second motor fixedly connected under the workbench, the second motor is connected to the support rod through a second belt drive assembly, a limit assembly for limiting the rotation angle of the support rod is fixedly connected to the bottom of the workbench, and the distance between the nozzle and the support rod is equal to the distance from the center of the suction cup to the support rod.

[0014] Preferably, an air pipe support arm is fixedly connected to the top of the support rod, and the nozzle is provided at one end of the air pipe support arm away from the support rod. The support rod is hollow inside and open at both ends. The air supply assembly includes an air pipe, which passes through the support rod and is connected to the nozzle.

[0015] Preferably, a nozzle hole is provided at the top of the trachea support arm, the trachea passes through the support rod and is fixedly connected to the nozzle hole, a through air passage is provided in the trachea support arm, and the nozzle hole and the nozzle are respectively connected to the through air passage.

[0016] The utility model discloses the following technical effects: the wafer is fixed by a suction cup, and a rotating driving component drives the wafer on the suction cup to make a rotational motion, and the moisture on the wafer is dried by centrifugal force, and at the same time, a swing driving component drives the nozzle to swing back and forth above the suction cup, and gas is sprayed from the nozzle to blow dry the wafer. The present application adopts a combination of spin-drying and blow-drying to dry the wafer, thereby improving the drying efficiency and drying effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 It is an axonometric drawing of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the suction cup and the hollow main shaft in the utility model;

[0020] Figure 3 It is a structural schematic diagram of the rotary drive assembly in the utility model;

[0021] Figure 4 It is a structural schematic diagram of the splash-proof recovery mechanism in the utility model;

[0022] Figure 5 It is a structural schematic diagram of the splash-proof plate in the utility model;

[0023] Figure 6 This is a structural schematic diagram of the swing arm drying mechanism in the utility model;

[0024] Figure 7 It is a structural schematic diagram of the limit assembly in the utility model;

[0025] Figure 8 It is a structural schematic diagram of the air nozzle hole and the nozzle in the utility model.

[0026] In the figure: 100, rotating fixing mechanism; 110, high-speed rotating bearing; 120, suction cup; 130, hollow main shaft; 140, rotating joint; 150, fixing fixture; 160, first belt transmission assembly; 170, first motor; 200, splash-proof recovery mechanism; 210, lifting cylinder; 220, linear support; 230, splash-proof plate; 300, swing arm drying mechanism; 310, swing arm assembly; 311, support rod; 312, air pipe support arm; 313, air nozzle hole; 314, slewing bearing; 315, nozzle; 320, limit assembly; 330, second motor; 340, second belt transmission assembly; 500, workbench. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0029] Reference Figure 1-Figure 8The utility model provides a single wafer drying device, comprising:

[0030] Workbench 500; the workbench 500 is installed on a rack box with an open top, and a DC fan for blowing air outward is fixedly connected to the bottom of the rack box to maintain high cleanliness;

[0031] The rotating fixing mechanism 100 includes a suction cup 120 rotatably connected to the workbench 500. A rotating driving assembly connected to the suction cup 120 is provided on the workbench 500. The rotating driving assembly is used to drive the suction cup 120 to rotate on the workbench 500. The suction cup 120 is connected to a negative pressure tube;

[0032] The swing-arm drying mechanism 300 includes a support rod 311 rotatably connected to the workbench 500, a nozzle 315 is provided on the support rod 311, and the nozzle 315 is located above the suction cup 120. The workbench 500 is provided with a swing drive assembly connected to the support rod 311, and the swing drive assembly is used to drive the support rod 311 to rotate forward and reverse on the workbench 500, so that the nozzle 315 reciprocates above the suction cup 120, and the nozzle 315 is connected to an air supply assembly;

[0033] The wafer is fixed by the suction cup 120, and the rotating drive component drives the wafer on the suction cup 120 to rotate, and the moisture on the wafer is dried by centrifugal force. At the same time, the swing drive component drives the nozzle 315 to swing back and forth above the suction cup 120, and the nozzle 315 sprays gas to blow dry the wafer. The present application adopts a combination of spin-drying and blow-drying to dry the wafer, thereby improving the drying efficiency and drying effect.

[0034] A further optimized solution further includes a splash-proof recovery mechanism 200, which includes a lifting assembly and a splash-proof plate 230. The lifting assembly is arranged on a workbench 500, and the output end of the lifting assembly is connected to the splash-proof plate 230. A through hole is provided in the middle of the splash-proof plate 230, and an annular boss is fixedly connected to the through hole. The annular boss is sleeved on the circular shaft at the bottom of the suction cup 120 and is in sliding contact with the circular shaft at the bottom of the suction cup 120. A plurality of water outlets are provided on the splash-proof plate 230.

[0035] The lifting assembly includes a lifting cylinder 210 fixedly connected to the top of the workbench 500, the output end of the lifting cylinder 210 is fixedly connected to the bottom of the splash plate 230, and a plurality of linear support members 220 are also fixedly connected between the splash plate 230 and the workbench 500;

[0036] The diameter of the splash plate 230 is larger than that of the suction cup 120. When working, the splash plate 230 is driven to rise by the lifting cylinder 210 so that the height of its outer edge is higher than that of the suction cup 120, which is convenient for collecting water. The splash plate 230 has a draft angle, that is, the middle is low, the circumference and the center of the circle are the highest, and the water outlet is opened in the middle part, which is convenient for collecting water droplets thrown off the wafer. By setting an annular boss at the center position, water is prevented from flowing down the hollow main shaft 130.

[0037] The linear support 220 includes a first sleeve fixedly connected to the top of the workbench 500 and a second sleeve fixedly connected to the bottom of the splash plate 230. The outer wall of the second sleeve is slidably connected to the inner wall of the first sleeve. Compression springs are installed in the first sleeve and the second sleeve to provide supporting force to the splash plate 230.

[0038] Further optimized solution, the rotary drive assembly includes a hollow main shaft 130 rotatably connected to the workbench 500, a first motor 170 is fixedly connected to the bottom of the workbench 500, the first motor 170 is transmission-connected to the hollow main shaft 130 through a first belt transmission assembly 160, the top of the hollow main shaft 130 is fixedly connected to the circular shaft on the suction cup 120, the bottom of the hollow main shaft 130 is located below the workbench 500 and is rotatably connected to a rotary joint 140, and the rotary joint 140 is fixedly connected to the workbench 500 through a fixing fixture 150;

[0039] The negative pressure tube sequentially passes through the rotary joint 140, the hollow main shaft 130, the round shaft on the suction cup 120 and is connected to the inner cavity of the suction cup 120. The negative pressure tube is rotatably connected to the suction cup 120, and a vacuum pump (not shown in the figure) is fixedly connected to one end of the negative pressure tube away from the suction cup 120.

[0040] The hollow main shaft 130 is rotatably connected to the workbench 500 via a high-speed rotating bearing 110;

[0041] The first belt transmission assembly includes a first pulley fixedly connected to the output shaft of the first motor 170, and a second pulley fixedly connected to the hollow main shaft 130, and the first pulley and the second pulley are driven by a belt;

[0042] The suction cup 120 has an air outlet and an air intake port, and a negative pressure pipe is connected to the air outlet. The wafer is placed at the air intake port of the suction cup 120, and air is pumped by a vacuum pump, so that the suction cup 120 sucks the wafer.

[0043] The first motor 170 drives the hollow main shaft 130 to rotate, thereby driving the suction cup 120 to rotate to achieve spin drying. During the rotation of the suction cup 120, the negative pressure tube will not rotate accordingly; the stability of the hollow main shaft 130 is improved by the fixing clamp 150; the first motor 170 cannot have a brake to prevent the wafer from being thrown out due to the centripetal force being greater than the adsorption force, causing danger.

[0044] Further optimized solution, the swing drive assembly includes a second motor 330 fixedly connected to the bottom of the workbench 500, the second motor 330 is connected to the support rod 311 through a second belt drive assembly 340, the support rod 311 is connected to the workbench 500 through a slewing bearing 314, a limit assembly 320 for limiting the rotation angle of the support rod 311 is fixedly connected to the bottom of the workbench 500, and the distance between the nozzle 315 and the support rod 311 is equal to the distance from the center of the suction cup 120 to the support rod 311;

[0045] The second belt transmission assembly 340 includes a third pulley fixedly connected to the output shaft of the second motor 330 and a fourth pulley fixedly connected to the support rod 311, and the third pulley and the fourth pulley are driven by a belt;

[0046] A gas pipe support arm 312 is fixedly connected to the top of the support rod 311, and a nozzle 315 is provided at one end of the gas pipe support arm 312 away from the support rod 311. The support rod 311 is hollow inside and open at both ends. The gas supply assembly includes a gas pipe (not shown in the figure), which passes through the support rod 311 and is connected to the nozzle 315; the gas pipe is connected to a gas supply tank (not shown in the figure) to provide dry nitrogen;

[0047] A nozzle hole 313 is provided at the top of the trachea support arm 312. The trachea passes through the support rod 311 and is fixedly connected to the nozzle hole 313. A through air passage is provided in the trachea support arm 312. The nozzle hole 313 and the nozzle 315 are respectively connected to the through air passage. The gas passes through the nozzle hole 313 and the through air passage in sequence and is finally ejected through the nozzle 315.

[0048] The support rod 311, the air pipe support arm 312, the air nozzle hole 313, the slewing bearing 314, and the nozzle 315 constitute the swing arm assembly 310;

[0049] The limit assembly 320 is composed of two limit sensors and an origin sensor. A lever is fixedly connected to the support rod 311. When the support rod 311 rotates, the lever is driven to rotate. When the lever rotates to the limit sensor position, the limit sensor transmits a signal to the controller. The controller controls the second motor 330 to rotate in the opposite direction, thereby causing the support rod 311 to rotate in the opposite direction. When it rotates to another limit sensor position, it rotates in the opposite direction again, thereby realizing the reciprocating swing of the nozzle 315; the nozzle 315 swings from the center of the wafer to the edge, thereby realizing the drying of the wafer.

[0050] When the utility model is in use, the wafer is placed on the suction cup 120, and negative pressure adsorption is performed by a vacuum pump. The control system performs negative pressure judgment. When the pressure difference reaches -20KPa~-40KPa, it is considered that the adsorption is completed, and the lifting cylinder 210 is lifted to make the splash plate 230 to the specified position. The first motor 170 is started to drive the hollow main shaft 130 to rotate, and maintain 2000rpm for 10~120S. At the same time as the first motor 170 is started, the second motor 330 is started to drive the nozzle 315 to the center of the wafer, and then rotate 45° clockwise. At the same time, the nozzle 315 sprays dry nitrogen or dry positive pressure air, and the movement ends after swinging continuously for 1~3 times, and then the first motor 170 stops rotating, the speed is 0rpm and waits for 1s, and the negative pressure is switched to 0.05~0.1map positive pressure to break the vacuum for 1~2S, and then the wafer is taken. The device has a simple and compact structure and a high cleanliness level, which meets the requirements of the semiconductor industry.

[0051] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] The embodiments described above are only descriptions of the preferred methods of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should fall within the protection scope determined by the claims of the present invention.

Claims

1. A single wafer drying device, characterized in that: include: Workbench(500); A rotating fixing mechanism (100), the rotating fixing mechanism (100) comprising a suction cup (120) rotatably connected to the workbench (500), a rotating driving assembly connected to the suction cup (120) being arranged on the workbench (500), the rotating driving assembly being used to drive the suction cup (120) to rotate on the workbench (500), and a negative pressure pipe being connected to the suction cup (120); A swing-arm drying mechanism (300), the swing-arm drying mechanism (300) comprising a support rod (311) rotatably connected to the workbench (500), a nozzle (315) being arranged on the support rod (311), the nozzle (315) being located above the suction cup (120), a swing drive assembly connected to the support rod (311) being arranged on the workbench (500), the swing drive assembly being used to drive the support rod (311) to rotate forward and reverse on the workbench (500), thereby causing the nozzle (315) to swing back and forth above the suction cup (120), and the nozzle (315) being connected to an air supply assembly.

2. The single wafer drying device according to claim 1, characterized in that: The invention also comprises a splash-proof recovery mechanism (200), the splash-proof recovery mechanism (200) comprising a lifting assembly and a splash-proof plate (230), the lifting assembly being arranged on the workbench (500), the output end of the lifting assembly being connected to the splash-proof plate (230), a through hole being provided in the middle of the splash-proof plate (230), an annular boss being fixedly connected to the through hole, the annular boss being sleeved on the circular shaft at the bottom of the suction cup (120) and being in sliding contact with the circular shaft at the bottom of the suction cup (120), and a plurality of water outlets being provided on the splash-proof plate (230).

3. The single wafer drying device according to claim 2, characterized in that: The lifting assembly comprises a lifting cylinder (210) fixedly connected to the top of the workbench (500), the output end of the lifting cylinder (210) is fixedly connected to the bottom of the splash plate (230), and a plurality of linear support members (220) are also fixedly connected between the splash plate (230) and the workbench (500).

4. The single wafer drying device according to claim 1, characterized in that: The rotary drive assembly comprises a hollow main shaft (130) rotatably connected to the workbench (500); a first motor (170) is fixedly connected to the bottom of the workbench (500); the first motor (170) is transmission-connected to the hollow main shaft (130) via a first belt drive assembly (160); the top of the hollow main shaft (130) is fixedly connected to the circular shaft on the suction cup (120); the bottom of the hollow main shaft (130) is located below the workbench (500) and is rotatably connected to a rotary joint (140); the rotary joint (140) is fixedly connected to the workbench (500) via a fixing fixture (150).

5. The single wafer drying device according to claim 4, characterized in that: The negative pressure tube sequentially passes through the rotary joint (140), the hollow main shaft (130), the circular shaft on the suction cup (120) and is connected to the inner cavity of the suction cup (120); the negative pressure tube is rotatably connected to the suction cup (120); and a vacuum pump is fixedly connected to one end of the negative pressure tube away from the suction cup (120).

6. The single wafer drying device according to claim 1, characterized in that: The swing drive assembly includes a second motor (330) fixedly connected below the workbench (500); the second motor (330) is connected to the support rod (311) via a second belt drive assembly (340); a limit assembly (320) for limiting the rotation angle of the support rod (311) is fixedly connected to the bottom of the workbench (500); the distance between the nozzle (315) and the support rod (311) is equal to the distance from the center of the suction cup (120) to the support rod (311).

7. The single wafer drying device according to claim 1, characterized in that: An air pipe support arm (312) is fixedly connected to the top of the support rod (311); the nozzle (315) is provided at one end of the air pipe support arm (312) away from the support rod (311); the support rod (311) is hollow inside and open at both ends; the air supply assembly comprises an air pipe, which passes through the support rod (311) and is connected to the nozzle (315).

8. The single wafer drying device according to claim 7, characterized in that: A nozzle hole (313) is provided at the top of the trachea support arm (312); the trachea passes through the support rod (311) and is fixedly connected to the nozzle hole (313); a through air passage is provided in the trachea support arm (312); the nozzle hole (313) and the nozzle (315) are respectively connected to the through air passage.

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