Single-end glass-sealed high-temperature impregnation packaged sensor

Abstract

The utility model discloses a single-ended glass-sealed high-temperature impregnation packaging sensor, which comprises a single-ended thermistor chip, two side surfaces of the single-ended thermistor chip are respectively welded with one end of a metal pin, the single-ended thermistor chip and the metal pin are wrapped and fixed through a packaging piece I, and the outer side of the packaging piece I is wrapped with a packaging piece II. In the using process of the single-end glass-sealed high-temperature impregnation packaging sensor, after the single-end thermistor chip and the metal pins arranged on the two side faces of the single-end thermistor chip are welded and fixed, the first packaging piece and the second packaging piece are sequentially arranged in a wrapping mode, the metal pins are sleeved with the PI insulating sleeves, insulation protection on the metal pins can be achieved, and the service life of the single-end glass-sealed high-temperature impregnation packaging sensor is prolonged. And the temperature sensor can adapt to work in a high-temperature environment of 280 DEG C, and the application range of the temperature sensor is greatly widened.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature sensors, in particular to a single-end glass-sealed high-temperature glue-impregnated packaged sensor. Background Art

[0002] A temperature sensor is a sensor that converts temperature variables into a standardized output signal that can be transmitted. Temperature sensors are divided into two categories according to the measurement method: contact and non-contact. According to the sensor material and electronic component characteristics, they are divided into thermal resistors and thermocouples. They are mostly used in temperature detection, testing, display, temperature control and overheat protection.

[0003] In the prior art, the single-ended glass-sealed temperature sensor structure is to wrap the metal pins of the thermistor with insulating material to provide insulation protection for the metal pins. At the same time, due to the high temperature resistance of the wrapped insulating layer material, the temperature sensor cannot work in a high temperature environment above 200 degrees Celsius, which greatly reduces the use range of the temperature sensor. Utility Model Content

[0004] The utility model aims to provide a single-end glass-sealed high-temperature resin-impregnated package sensor, which is used to solve the problem of poor application effect of single-end glass-sealed temperature sensors in the prior art.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A single-ended glass-sealed high-temperature dip-gel packaged sensor comprises a single-ended thermistor chip, one end of a metal pin is welded to the two side surfaces of the single-ended thermistor chip respectively, and the single-ended thermistor chip and the metal pin are wrapped and fixed by a package part 1, and a package part 2 is provided on the outer side of the package part 1.

[0007] As a further solution of the utility model: a PI insulating sleeve is sleeved on the metal pin, and one end of the PI insulating sleeve close to the first packaging piece is wrapped and fixed by the second packaging piece.

[0008] As a further solution of the utility model: a filling gap is provided between the PI insulating sleeve and the first packaging component.

[0009] As a further solution of the utility model: the first packaging component is a glass sealing layer, and the shape of the glass sealing layer is a water drop-shaped structure.

[0010] As a further solution of the utility model: the second packaging component is a PI solution solidified layer.

[0011] Beneficial effects of the utility model:

[0012] (1) During the use of the single-ended glass-sealed high-temperature dipped plastic package sensor of the present application, the single-ended thermistor chip is welded and fixed with the metal pins arranged on its two sides, and then the package one and the package two are wrapped in sequence, and a PI insulating sleeve is set on the metal pin, which can achieve insulation protection for the metal pin, and can realize that the temperature sensor of the present application can adapt to work in a high temperature environment of 280°C, greatly improving the use range of the temperature sensor;

[0013] (2) The single-ended thermistor chip of the present application is wrapped by a glass sealing layer with a water droplet-shaped structure to form a glass sealing part of a single end of the temperature sensor, which has good thermal conductivity and thermal stability, so that the temperature sensor of the present application can adapt to high temperature environments. The single-ended thermistor chip inside it can quickly sense changes in temperature parameters in the environment and can obtain them accurately and quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings.

[0015] Figure 1 It is a structural schematic diagram of the utility model.

[0016] In the figure: 10, single-ended thermistor chip; 20, metal pin; 30, package one; 40, PI insulating sleeve; 50, package two. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] In the description of the present invention, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; in the description of the present invention, "multiple" and "several" mean at least two, for example two, three, etc., unless otherwise clearly and specifically defined.

[0019] See also Figure 1As shown, the utility model is a single-ended glass-sealed high-temperature dip-emulsion packaged sensor, comprising a single-ended thermistor chip 10, one end of a metal pin 20 being welded to two side surfaces of the single-ended thermistor chip 10 respectively, and the single-ended thermistor chip 10 and the metal pin 20 are wrapped and fixed by a packaging component 1 30, and a packaging component 2 50 is provided on the outer side of the packaging component 1 30.

[0020] During the use of the single-ended glass-sealed high-temperature dipped glue packaged sensor of the present application, the single-ended thermistor chip 10 is welded and fixed to the metal pins 20 set on its two sides, and then wrapped and fixed by the packaging part 1 30. The single-ended thermistor chip 10 inside the packaging part 1 30 can quickly sense the changes in temperature parameters in the environment, and can obtain them accurately and quickly. After the packaging part 1 30 is wrapped and fixed, it is then wrapped and fixed by the packaging part 2 50. The packaging part 2 50 realizes the insulation and fixation of the metal pins 20 on both sides. The packaging part 1 30 and the packaging part 2 50 are wrapped and applied in sequence, which can improve the ability of the temperature sensor of the present application to adapt to high temperature environments and greatly improve the scope of use of the temperature sensor.

[0021] In this specific embodiment, a PI insulating sleeve 40 is sleeved on the metal pin 20, and the end of the PI insulating sleeve 40 close to the package 1 30 is wrapped and fixed by the package 2 50. The metal pin 20 is tightly connected by the sleeved PI insulating sleeve 40 to strengthen the insulation protection of the metal pin 20; wherein, the diameter of the metal pin 20 is 2 mm, the inner diameter of the PI insulating sleeve 40 is 2.5 mm, and the outer diameter is 3 mm, and the length range of the tail end of the PI insulating sleeve 40 from the package end of the single-ended thermistor chip 10 is 7-9 mm.

[0022] In this specific implementation, there is a filling gap between the PI insulating sleeve 40 and the packaging component 1 30, which can increase the filling area wrapped with the packaging component 2 50 to increase the fixing of the wrapping.

[0023] In this specific embodiment, the package 1 30 is a glass sealing layer, and the shape of the glass sealing layer is a water drop-shaped structure, so that the single-ended thermistor chip 10 is wrapped by the glass sealing layer with a water drop-shaped structure to form a glass sealing part of a single end of the temperature sensor, which has good thermal conductivity and thermal stability, so that the temperature sensor of the present application can adapt to high temperature environments, and the single-ended thermistor chip 10 inside it can quickly sense changes in temperature parameters in the environment and can obtain them accurately and quickly.

[0024] In this specific embodiment, the second package 50 is a PI solution solidified layer, the length of the PI solution solidified layer does not exceed 6mm, and the PI solution solidified layer and the PI insulating sleeve 40 are respectively made of thermosetting polyimide. Thermosetting polyimide refers to a type of heterocyclic polymer containing an imide group in the main chain of the macromolecule, and is one of the organic polymer materials with the best comprehensive performance. It has the characteristics of corrosion resistance, fatigue resistance, damage resistance, impact resistance, low density, low noise, long service life, and excellent high and low temperature performance (long-term -269℃-280℃ without deformation); the thermal decomposition temperature can reach up to 600℃, which is one of the polymers with the highest thermal stability to date; so that the PI solution solidified layer and the PI insulating sleeve both have the high temperature resistance of 280℃, on the one hand, the temperature sensor of the present application can insulate and protect the metal pin 20, and the PI solution solidified layer and the PI insulating sleeve 40 are tested under 2Kv DC withstand voltage conditions. The test results are good, and on the other hand, the temperature sensor of the present application can adapt to work in a high temperature environment of 280℃, which greatly improves the scope of use of the temperature sensor.

[0025] It should be understood that after the package 30 is completed by wrapping and fixing the single-ended thermistor chip 10 with a glass sealing layer, the PI solution is applied to the glass sealing part, and then the glass sealing part is placed facing up and placed in an oven for drying, and then a temperature gradient drying and curing process is performed in sequence, wherein the drying parameters are set to drying at 70°C for 30 minutes, 110°C for 60 minutes, 160°C for 60 minutes, 210°C for 40 minutes, and 280°C for 30 minutes, and finally the curing process of the glass sealing part of the package 2 50 wrapped with the PI solution curing layer is completed.

[0026] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A single-ended glass-sealed high-temperature dip-coated sensor, characterized in that: The invention comprises a single-ended thermistor chip (10), one end of a metal pin (20) being welded to two side surfaces of the single-ended thermistor chip (10), and the single-ended thermistor chip (10) and the metal pin (20) are wrapped and fixed by a first packaging component (30), and a second packaging component (50) is arranged on the outer side of the first packaging component (30).

2. A single-ended glass-sealed high-temperature dip-emulsion packaged sensor according to claim 1, characterized in that: The metal pin (20) is sleeved with a PI insulating sleeve (40), and one end of the PI insulating sleeve (40) close to the first packaging part (30) is wrapped and fixed by the second packaging part (50).

3. A single-ended glass-sealed high-temperature dip-emulsion packaged sensor according to claim 2, characterized in that: There is a filling gap between the PI insulating sleeve (40) and the packaging component (30).

4. A single-ended glass-sealed high-temperature resin-impregnated packaged sensor according to claim 3, characterized in that: The package one (30) is a glass sealing layer, and the shape of the glass sealing layer is a water drop structure.

5. The single-ended glass-sealed high-temperature resin-impregnated package sensor according to claim 3, characterized in that: The second packaging component (50) is a PI solution solidified layer.

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