Semiconductor wafer adjusting, selecting and registering equipment
By designing semiconductor chip selection and registration equipment, and using automated transfer and detection mechanisms, the problems of slow manual selection speed, low efficiency and information errors are solved, and the fast, efficient selection and accurate registration of semiconductor chips are achieved.
Patent Information
- Application Number
- CN202421648398.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-07-12
AI Technical Summary
During the packaging design or R&D design process of semiconductor chips, when manually selecting and transferring semiconductor chips from intelligent warehouses, the speed is slow, the efficiency is low, and information or position errors are likely to occur during long-term use.
Design a semiconductor wafer selection registration device, including a device rack, a tray with information encoding, and a transplant component. The equipment automatically transfers between the retrieval station, the feed station and the transfer station, combined with the detection mechanism and the control system, realizes automatic retrieval and supplement of semiconductor chips in the pallet, and records physical position information to ensure the matching of performance and position information.
It realizes fast and efficient selection and registration of semiconductor chips, reduces the risk of manual misinput and improves production efficiency and accuracy.
Smart Images
Figure CN222851393U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to semiconductor production equipment technology, in particular to a semiconductor wafer selection and registration device. Background Art
[0002] During the manufacturing process of integrated circuits, each produced wafer is cut into small semiconductor chips, each of which is an independent electronic component with its own circuit and function.
[0003] Existing finished memory chips are all packaged by a single or several semiconductor wafers. In order to ensure the quality and performance of memory chips, batches of semiconductor wafers cut from round wafers need to be tested to detect and eliminate possible defects or faults. The tested semiconductor wafers are usually divided into multiple levels according to the test performance and stored in the warehouse. When the memory chip with the target performance needs to be packaged, the semiconductor wafer needs to be packaged or designed for R&D, and then the corresponding semiconductor wafers are selected from the warehouse for packaging. With the development of technology, storage warehouses are becoming more and more intelligent, and detailed test performance information of semiconductor wafers corresponding to each storage position in each tray storing semiconductor wafers can be saved. When conducting R&D design or trial production, various representative semiconductor wafers can be selected for packaging testing. When conducting R&D design or trial production packaging tests in small batches (generally between dozens and one thousand), representative individuals are selected in the intelligent storage warehouse based on the specific performance information of the semiconductor wafers, and they are manually taken out and transferred from the corresponding storage trays. To avoid the storage trays for storing semiconductor wafers becoming empty after one or more semiconductor wafers are called out, which affects subsequent production and inventory, the semiconductor wafers in the corresponding tail material trays need to be transferred to the trays with vacancies after the semiconductor wafers are called out, and they need to be filled. To ensure that the performance information and physical position information of the semiconductor wafers in all trays match each other without missing after the physical position of the semiconductor wafers in the storage warehouse is updated, the information of the corresponding supplementary transferred semiconductor wafers needs to be manually updated, which is slow and inefficient, and some information or position errors may be entered during long-term use. Utility Model Content
[0004] The utility model discloses a semiconductor wafer selection and registration device, which solves the technical problems of slow speed, low efficiency and incorrect entry of some information or position during manual precise selection and transfer of semiconductor wafers from an intelligent warehouse during semiconductor wafer packaging design or R&D design, and long-term use.
[0005] The technical solution adopted by the utility model to solve its technical problems is: a semiconductor wafer selection and registration device, including an equipment frame and a tray with information coding, wherein the tray is evenly arranged with acupuncture points for limiting the loading of semiconductor wafers, and the equipment frame is horizontally arranged with at least one call-out station, at least one material replenishment station and at least one call-in station for limiting the tray, and the equipment frame is provided with a transplantation component for transferring semiconductor wafers between the call-out station, the material replenishment station and the call-in station, and the transplantation component is provided with a detection mechanism for identifying the information coding on the collection tray and locating the position of the semiconductor wafer in the acupuncture points on the collection tray and the transfer information, and the transplantation component and the detection mechanism are connected to a control system. Automatically complete the call-out and replenishment of semiconductor wafers in the tray and collect and record the corresponding physical position update of the semiconductor wafer, ensure that the performance information and physical position information of the semiconductor wafers in all trays match and correspond without missing, facilitate the subsequent call-in and call-out application of semiconductor wafers, and have high speed, high efficiency and low error rate.
[0006] Furthermore, the invention also includes a pallet transfer mechanism with universal wheels at the bottom, the pallet transfer mechanism includes at least one transfer box, and the transfer box is provided with a plurality of transfer limit structures for limiting the pallet and the semiconductor wafers in the pallet. Multiple pallets of multiple categories can be transferred at one time, and the pallet transfer is stable, so that the semiconductor wafers in the pallet are prevented from being lost or shifted during the transfer process, resulting in the physical position information in the pallet not matching the performance information of the corresponding semiconductor wafer.
[0007] Furthermore, the transplant assembly includes a first horizontal driving mechanism fixed on the equipment frame, a second horizontal driving mechanism horizontally arranged on the first horizontal driving mechanism and driven by the first horizontal driving mechanism to move in the horizontal left-right direction, a plurality of vertical driving mechanisms arranged in parallel vertically on the second horizontal driving mechanism and driven by the second horizontal driving mechanism to move in the horizontal front-back direction, and a vacuum adsorption assembly arranged on the vertical driving mechanism and driven by the vertical driving mechanism to move in the vertical direction. Multiple vacuum adsorption assemblies can be independently controlled to adsorb and place semiconductor wafers in the tray respectively, and multiple semiconductor wafers can be transferred and transplanted at one time, with high efficiency and high speed.
[0008] Furthermore, the transfer-out station, the material replenishment station and the transfer-in station are all provided with a tray limiting block, the upper end surface of the tray limiting block is provided with a concave platform for limiting the tray, the two sides of the tray limiting block are correspondingly provided with a first pick-up and placement recess extending relatively horizontally to the concave platform, and the concave platform and the first pick-up and placement recess are correspondingly provided with a second concave pick-up and placement recess. It is more convenient to take and place the tray.
[0009] Furthermore, the transfer limiting structure includes a plurality of horizontal limiting cavities arranged in a vertical direction on the transfer box and capable of limiting the horizontal sliding of the tray therein, and an elastic limiting structure for elastically limiting the tray in the horizontal limiting cavity. The horizontal limiting cavity is used for a pick-up and placement port for the tray, and a third pick-up and placement clearance groove is arranged at the outer end of one side of the pick-up and placement port of the horizontal limiting cavity on the transfer box. In order to avoid the movement or vibration of the tray during the transfer process, which may cause the semiconductor wafer in the tray to be lost or shifted during the transfer process, resulting in the physical position information in the tray not matching the performance information of the corresponding semiconductor wafer, the third pick-up and placement clearance groove facilitates the pressing and removal of the tray in the horizontal limiting cavity.
[0010] Furthermore, the elastic limiting structure includes at least one vertical through-limiting hole, a plurality of first limiting columns, a pressure column, an elastic compression mechanism and a displacement adjustment mechanism, the vertical through-limiting hole vertically penetrates from the upper end of the transfer box close to the pick-up and placement port to the lowermost horizontal limiting cavity, the vertical through-limiting hole corresponds to the part without acupuncture points on the side of the tray for sliding limitation in the horizontal limiting cavity, a plurality of the first limiting columns are vertically slidably arranged in the vertical through-limiting hole, the height of the first limiting column is equal to the distance between the bottom sides of two adjacent horizontal limiting cavities, the lower ends and upper ends of the plurality of the first limiting columns are respectively located at the bottom sides of the corresponding horizontal limiting cavities and the corresponding On the bottom side of a horizontal limit cavity on a horizontal limit cavity, the upper and lower ends of the first limit column are both set to smooth hemispherical surfaces, and the radius of the hemispherical surface is not less than the height of the horizontal limit cavity. The pressure column is set to slide in the vertical through-limit hole in the vertical direction. The lower end of the pressure column is located on the bottom side of the uppermost horizontal limit cavity among the multiple horizontal limit cavities. The upper end of the pressure column extends to the upper part of the lower end of the pressure column and is connected to the elastic pressing mechanism. The lower ends are both set to smooth hemispherical surfaces, and the radius of the hemispherical surface is not less than the height of the horizontal limit cavity. The elastic displacement distance of the displacement adjustment mechanism limiting the elastic pressing mechanism is between one and two times the height of the horizontal limit cavity. The elastic sliding linkage is used to realize the elastic limiting of the trays in multiple horizontal limit cavities by an elastic pressing mechanism.
[0011] Furthermore, the elastic compression mechanism includes a bracket, an elastic pressure plate, a plurality of second limiting columns and a plurality of springs, the bracket is arranged on the upper edge of the transfer box, an elastic limiting plate is arranged on the upper end of the bracket, a plurality of second limiting columns are vertically fixedly arranged between the upper end of the transfer box and the elastic limiting plate, the elastic pressure plate is provided with sliding holes penetrating in the vertical direction corresponding to the plurality of second limiting columns, the elastic pressure plate is slidably arranged on the plurality of second limiting columns, a plurality of the springs are sleeved on the plurality of second limiting columns one by one, and the upper and lower ends are respectively in contact with the lower end of the elastic limiting plate and the upper end of the transfer box, and the upper end of the compression column is fixed to the elastic pressure plate. Long-term and effective stable elastic compression of the compression column is achieved.
[0012] Furthermore, the displacement adjustment mechanism is a bolt rotatably arranged on the elastic limiting plate, and the lower end of the bolt extends to the upper side of the elastic pressing plate. The structure is simple and easy to install and disassemble.
[0013] Furthermore, a pallet transfer mechanism storage position for accommodating the pallet transfer mechanism is arranged at the lower part of the equipment frame, thereby saving space occupied by the equipment.
[0014] Furthermore, the horizontal limiting cavity horizontally penetrates the transfer box, and a fixing plate is detachably provided on the side of the transfer box away from the vertically penetrating limiting hole, and a convex plate extending into the horizontal limiting cavity to limit the tray in the horizontal direction is provided on the fixing plate, and an air flow groove is provided on the convex plate that penetrates the fixing plate away from the transfer box. Various wastes can be effectively cleaned out of the horizontal limiting cavity that horizontally penetrates the transfer box, and cleaning is more convenient. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a main schematic diagram of the utility model;
[0016] Figure 2 is a schematic diagram of the main view of the transplant assembly;
[0017] Figure 3 It is a schematic diagram of the main view of the pallet limit block;
[0018] Figure 4 It is a main schematic diagram of the transfer box;
[0019] Figure 5 It is a schematic diagram of the longitudinal section of the transfer box.
[0020] Marked in the figure are: equipment frame 100, tray limit block 110, concave platform 111, first pick-up and placement recessed platform 112, second pick-up and placement recessed platform 113, tray 200, transplant assembly 300, first horizontal drive mechanism 301, second horizontal drive mechanism 302, vertical drive mechanism 303, vacuum adsorption assembly 304, detection mechanism 400, tray transfer mechanism 500, transfer box 510, horizontal limit cavity 520, elastic limit structure 530, vertical through limit hole 531, first limit column 532, pressure column 533, bracket 541, elastic limit plate 542, elastic pressure plate 543, second limit column 544, spring 545, shift adjustment mechanism 550, fixing plate 560, convex plate 561. DETAILED DESCRIPTION
[0021] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods.
[0022] like Figure 1A semiconductor wafer selection and registration device shown in the figure includes an equipment frame 100 and a tray 200 with information coding, wherein the tray 200 is provided with holes for limiting the loading of semiconductor wafers arranged evenly in the vertical and horizontal directions, and the equipment frame 100 is horizontally provided with at least one call-out station, at least one material replenishing station and at least one call-in station for limiting the tray 200, and the equipment frame 100 is provided with a transplantation component 300 for transferring semiconductor wafers between the call-out station, the material replenishing station and the call-in station, and the transplantation component 300 is provided with a detection mechanism 400 for identifying the information coding on the collection tray 200 and locating the position of the semiconductor wafer in the hole on the collection tray 200 and the transfer information, and the transplantation component 300 and the detection mechanism 400 are connected to a control system.
[0023] In this specific embodiment, there is one call-out station, one replenishing station and one transfer-in station and they are arranged in sequence. In the specific implementation, the number of the call-out station, one replenishing station and one transfer-in station can also be set to two or more according to the needs and arranged according to the specific structure and needs; the information code on the pallet 200 is a QR code label. In the specific implementation, the information code on the pallet 200 can also be a laser QR code or other information labels that can be identified and distinguished; the detection mechanism 400 is an industrial camera. In the specific implementation, the detection mechanism 400 can also be other detection and identification mechanisms with scanning and identification information coding and high-precision positioning.
[0024] During specific implementation: an empty tray 200 is placed at the transfer-in station, a tray 200 storing semiconductor wafers to be transferred out is placed at the transfer-out station, and a tail material tray 200 that is in the same classified storage position as the tray 200 from which the semiconductor wafers are to be transferred out is placed at the replenishing station (when there is no tail material tray 200, the first tray 200 from which the semiconductor wafers are transferred out can be used as the tail material tray 200, that is, the semiconductor wafers in this tray are transferred to the replenishing station after being transferred out). The tail material tray 200 is an underloaded tray 200. During this process, the detection mechanism 400 identifies and collects the information codes of the trays 200 on the transfer-out station, the replenishing station and the transfer-in station and uploads them to the control system; the control system controls the transplant component 300 to transfer the semiconductor wafers to be transferred out of the tray 200 on the transfer-out station to the transfer-in station The control system controls the transplant component 300 to transfer the semiconductor wafers in the tail material tray 200 on the replenishing station to the tray 200 on the transfer-out station to fill the tray 200 on the transfer-out station, and then the control system controls the transplant component 300 to transfer out all the semiconductor wafers that need to be transferred out of the tray 200 on the transfer-out station according to the above steps. During each transfer of the semiconductor wafers in and out of the tray 200, the detection mechanism 400 locates the position of the semiconductor wafer in the tray 200 and records and collects the position information of each semiconductor wafer during transfer; when it is necessary to continue to transfer the semiconductor wafers in other trays 200, the above transfer steps are followed and the trays 200 on one or more of the transfer-out station, the replenishing station and the transfer-in station can be replaced according to needs until all the transfer operations are completed.
[0025] The semiconductor wafers in the tray 200 are automatically called out and replenished, and the corresponding physical position updates of the semiconductor wafers are collected and recorded to ensure that the performance information and physical position information of the semiconductor wafers in all trays 200 match and correspond without omission, which is convenient for the subsequent semiconductor wafer calling in and out application with high speed, high efficiency and low error rate.
[0026] On the basis of the above, if Figure 1As shown, it also includes a pallet transfer mechanism 500 with universal wheels at the bottom, and the pallet transfer mechanism 500 includes at least one transfer box 510, and the transfer box 510 is provided with a plurality of transfer limit structures for limiting the pallet 200 and the semiconductor wafers in the pallet 200. In this specific embodiment, there are four transfer boxes 510 and they are fixed in parallel in the frame of the pallet transfer mechanism 500, and there are twelve transfer limit structures, which can transfer twelve pallets 200 of each category of four categories. In the specific implementation, the number and position structure of the transfer boxes 510 and the transfer limit structures can also be changed according to demand. In the specific implementation, the pallets 200 and the tail trays that need to be transferred out of the semiconductor wafer storage warehouse are transferred to the transfer box 510 according to the category, and the pallet transfer mechanism 500 is used for transfer, and multiple pallets 200 of multiple categories can be transferred at one time. The transfer of the pallet 200 is stable, and the semiconductor wafers in the pallet 200 are prevented from being lost or shifted during the transfer process, resulting in the physical position information in the pallet 200 not matching the performance information of the corresponding semiconductor wafer.
[0027] On the basis of the above, if Figure 1 and Figure 2 As shown, the transplant component 300 includes a first horizontal driving mechanism 301 fixed on the equipment frame 100, a second horizontal driving mechanism 302 horizontally arranged on the first horizontal driving mechanism 301 and driven by the first horizontal driving mechanism 301 to move in the horizontal left-right direction, a plurality of vertical driving mechanisms 303 arranged in parallel vertical directions on the second horizontal driving mechanism 302 and driven by the second horizontal driving mechanism 302 to move in the horizontal front-back direction, and a vacuum adsorption component 304 arranged on the vertical driving mechanism 303 and driven by the vertical driving mechanism 303 to move in the vertical direction.
[0028] In this specific embodiment, the first horizontal drive mechanism 301 and the second horizontal drive mechanism 302 are linear motors, and the vertical drive mechanism 303 is a distance-controllable cylinder. In the specific implementation, the first horizontal drive mechanism 301, the second horizontal drive mechanism 302 and the vertical drive mechanism 303 can also be other linear drive mechanisms with controllable driving distances; the vacuum adsorption component 304 includes a vacuum suction head and a corresponding negative pressure component for matching adsorption of semiconductor wafers. Multiple vertical drive mechanisms 303 can independently control multiple vacuum adsorption components 304 to adsorb and place semiconductor wafers in the tray 200 respectively, and multiple semiconductor wafers can be transferred and transplanted at one time, with high efficiency and high speed.
[0029] On the basis of the above, if Figure 1 and Figure 3As shown, the transfer-out station, the material replenishment station and the transfer-in station are all provided with a tray limiting block 110, and the upper end surface of the tray limiting block 110 is provided with a concave recessed platform 111 for limiting the tray 200, and the two sides of the tray limiting block 110 are correspondingly provided with a first pick-up and placement recessed platform 112 extending relatively horizontally to the concave recessed platform 111, and the concave second pick-up and placement recessed platform 113 is provided at the corresponding position of the concave recessed platform 111 and the first pick-up and placement recessed platform 112. In a specific embodiment, during the pick-up and placement process, the first pick-up and placement recessed platform 112 can realize the grasping of the corresponding two sides of the tray 200, and the second pick-up and placement recessed platform 113 can realize the grasping of the corresponding two sides of the bottom of the tray 200, so that the pick-up and placement of the tray 200 is more convenient.
[0030] On the basis of the above, if Figure 1 and Figure 4 As shown, the transfer limiting structure includes a plurality of horizontal limiting cavities 520 arranged in a vertical direction on the transfer box 510 and capable of limiting the tray 200 to slide in the horizontal direction therein, and an elastic limiting structure 530 for elastically limiting the tray 200 in the horizontal limiting cavity 520. The horizontal limiting cavity 520 is used for a pick-up and placement port for taking and placing the tray 200. A third pick-up and placement clearance groove is provided at the outer end of one side of the pick-up and placement port of the horizontal limiting cavity 520 on the transfer box 510. In a specific implementation, the tray 200 in the horizontal limiting cavity 520 is limited in all directions to avoid the movement or vibration of the tray 200 during the transfer process, which may cause the semiconductor wafer in the tray 200 to be lost or shifted during the transfer process, resulting in the physical position information in the tray 200 not matching the performance information of the corresponding semiconductor wafer. The third pick-up and placement clearance groove facilitates the pressing and taking out of the tray 200 in the horizontal limiting cavity 520.
[0031] On the basis of the above, if Figure 1 , Figure 4 and Figure 5As shown, the elastic limiting structure 530 includes at least one vertical through limiting hole 531, a plurality of first limiting columns 532, a pressure column 533, an elastic compression mechanism and a shift adjustment mechanism 550. The vertical through limiting hole 531 vertically penetrates from the upper end of the transfer box 510 close to the pick-up and placement port to the lowermost horizontal limiting cavity 520. The vertical through limiting hole 531 corresponds to the part without acupuncture points on the side of the tray 200 that is slidably limited in the horizontal limiting cavity 520. The plurality of first limiting columns 532 are vertically slidably arranged in the vertical through limiting hole 531. The height of the first limiting column 532 is equal to the distance between the bottom sides of two adjacent horizontal limiting cavities 520. The lower ends and upper ends of the plurality of first limiting columns 532 are respectively located on the bottom sides of the corresponding horizontal limiting cavities 520. and the bottom side of a horizontal limit cavity 520 on the corresponding horizontal limit cavity 520, the upper and lower ends of the first limit column 532 are both set to a smooth hemispherical surface and the radius of the hemispherical surface is not less than the height of the horizontal limit cavity 520, the pressure column 533 is vertically slidably set in the vertical through-limiting hole 531, the lower end of the pressure column 533 is located on the bottom side of the uppermost horizontal limit cavity 520 among the multiple horizontal limit cavities 520, the upper end of the pressure column 533 extends to the upper part of the lower end of the pressure column 533 and is connected to the elastic pressing mechanism, the lower ends are both set to a smooth hemispherical surface and the radius of the hemispherical surface is not less than the height of the horizontal limit cavity 520, the elastic displacement distance of the displacement adjustment mechanism 550 limiting the elastic pressing mechanism is between one and two times the height of the horizontal limit cavity 520.
[0032] In a specific implementation, the plurality of first limiting columns 532 and the pressure columns 533 vertically penetrating the limiting holes 531 can be slidably linked to each other to transmit elastic compressive forces to each other; when the tray 200 is inserted into the horizontal limiting cavity 520, the side wall of the tray 200 contacts the hemispherical surface of the lower end of the first limiting column 532 or the lower end of the pressure column 533, and the lower end of the first limiting column 532 or the lower end of the pressure column 533 is compressed and elastically moves upward. When the tray 200 is pressed into a preset position in the horizontal limiting cavity 520, the first limiting column 532 or the pressure column 533 is compressed and its lower end moves downward, thereby pressing the tray 200 into the preset position. 0 is elastically limited at one end close to the insertion port of the horizontal limiting cavity 520; when the tray 200 is pulled out of the horizontal limiting cavity 520, the side wall of the tray 200 contacts the hemispherical surface of the lower end of the first limiting column 532 or the lower end of the pressure column 533, and the lower end of the first limiting column 532 or the lower end of the pressure column 533 is compressed and elastically moves upward. When the tray 200 is completely pulled out of the horizontal limiting cavity 520, the lower end of the first limiting column 532 or the pressure column 533 is compressed and elastically moves downward and reset; this elastic limiting structure can effectively elastically limit the tray 200 in the horizontal limiting cavity 520;
[0033] The elastic displacement distance of the limiting elastic pressing mechanism of the shift adjustment mechanism 550 is between one and one and a half times the height of the horizontal limiting cavity 520, so that the maximum sum of the spacings between all adjacent first limiting columns 532 and pressure columns 533 is between one and two times the height of the horizontal limiting cavity 520, that is, only one pallet 200 can be inserted or pulled out from the multiple horizontal limiting cavities 520 on the transfer box 510 at a time, so as to prevent other pallets 200 from accidentally sliding out or falling during operation;
[0034] An elastic pressing mechanism is used to elastically limit the trays 200 in the multiple horizontal limiting cavities 520 through elastic sliding linkage.
[0035] On the basis of the above, if Figure 1 , Figure 4 and Figure 5 As shown, the elastic compression mechanism includes a bracket 541, an elastic pressure plate 543, a plurality of second limiting columns 544 and a plurality of springs 545. The bracket 541 is arranged at the upper edge of the transfer box 510. The upper end of the bracket 541 is provided with an elastic limiting plate 542. The plurality of second limiting columns 544 are vertically fixedly arranged between the upper end of the transfer box 510 and the elastic limiting plate 542. The elastic pressure plate 543 is provided with sliding holes penetrating in the vertical direction corresponding to and matching the plurality of second limiting columns 544. The elastic pressure plate 543 is slidably arranged on the plurality of second limiting columns 544. The plurality of springs 545 are sleeved on the plurality of second limiting columns 544 one by one, and the upper and lower ends are respectively in contact with the lower end of the elastic limiting plate 542 and the upper end of the transfer box 510. The upper end of the compression column 533 is fixed to the elastic pressure plate 543. A long-term and effective stable elastic compression of the compression column 533 is achieved.
[0036] On the basis of the above, if Figure 5 As shown, the displacement adjustment mechanism 550 is a bolt rotatably arranged on the elastic limiting plate 542 and the lower end of the bolt extends to the upper side of the elastic pressing plate 543. The structure is simple and easy to install and disassemble.
[0037] On the basis of the above, if Figure 1 As shown, a pallet transfer mechanism storage position for accommodating the pallet transfer mechanism 500 is provided at the lower part of the equipment frame 100, thereby saving the space occupied by the equipment.
[0038] On the basis of the above, if Figure 5 As shown, the horizontal limiting cavity 520 horizontally penetrates the transfer box 510, and the transfer box 510 is detachably provided with a fixing plate 560 on the side away from the vertical limiting hole 531, and the fixing plate 560 is provided with a protruding plate 561 extending into the horizontal limiting cavity 520 to limit the pallet 200 in the horizontal direction, and the protruding plate 561 is provided with an air flow groove penetrating to the side of the fixing plate 560 away from the transfer box 510.
[0039] In a specific implementation, the fixing plate 560 is fixed to the transfer box 510 by bolts. When cleaning the horizontal limiting cavity 520, the fixing plate 560 can be removed for cleaning. Various wastes can be effectively cleaned out from the horizontal limiting cavity 520 that horizontally passes through the transfer box 510, making cleaning more convenient.
[0040] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A semiconductor wafer selection and registration device, characterized in that: The invention comprises an equipment frame (100) and a tray (200) with information coding, wherein the tray (200) is provided with holes for limiting the loading of semiconductor wafers in a uniformly arranged manner in both the vertical and horizontal directions, and the equipment frame (100) is provided with at least one call-out station, at least one material replenishment station and at least one call-in station for limiting the position of the tray (200) in a horizontal manner, and a transplantation component (300) for transferring semiconductor wafers between the call-out station, the material replenishment station and the call-in station is arranged on the equipment frame (100), and a detection mechanism (400) for identifying the information coding on the collection tray (200) and locating the position of the semiconductor wafer in the holes on the collection tray (200) and the transfer information is arranged on the transplantation component (300), and the transplantation component (300) and the detection mechanism (400) are connected to a control system.
2. A semiconductor wafer selection and registration device according to claim 1, characterized in that: It also includes a pallet transfer mechanism (500) with universal wheels arranged at the bottom, the pallet transfer mechanism (500) including at least one transfer box (510), and the transfer box (510) is provided with a plurality of transfer limiting structures for limiting the position of the pallet (200) and the semiconductor wafers in the pallet (200).
3. The semiconductor wafer selection and registration device according to claim 1, characterized in that: The transplantation assembly (300) comprises a first horizontal driving mechanism (301) fixed on the equipment frame (100), a second horizontal driving mechanism (302) horizontally arranged on the first horizontal driving mechanism (301) and driven by the first horizontal driving mechanism (301) to move in a horizontal left-right direction, a plurality of vertical driving mechanisms (303) arranged in parallel in vertical directions on the second horizontal driving mechanism (302) and driven by the second horizontal driving mechanism (302) to move in a horizontal front-back direction, and a vacuum adsorption assembly (304) arranged on the vertical driving mechanism (303) and driven by the vertical driving mechanism (303) to move in a vertical direction.
4. The semiconductor wafer selection and registration device according to claim 1, characterized in that: The transfer-out station, the material replenishment station and the transfer-in station are all provided with a tray limiting block (110); the upper end surface of the tray limiting block (110) is provided with a concave recessed platform (111) for limiting the tray (200); both sides of the tray limiting block (110) are correspondingly provided with first pick-up and placement recessed platforms (112) extending relatively horizontally to the concave recessed platform (111); and a second inwardly concave pick-up and placement recessed platform (113) is provided at a position corresponding to the concave recessed platform (111) and the first pick-up and placement recessed platform (112).
5. The semiconductor wafer selection and registration device according to claim 2, characterized in that: The transfer limiting structure comprises a plurality of horizontal limiting cavities (520) arranged in a corresponding manner in the vertical direction on the transfer box (510) and capable of limiting the tray (200) to slide horizontally therein, and an elastic limiting structure (530) for elastically limiting the tray (200) in the horizontal limiting cavity (520); the horizontal limiting cavity (520) is a pick-up and placement port for picking up and placing the tray (200); and a third pick-up and placement clearance groove is provided at an outer end of one side of the pick-up and placement port of the horizontal limiting cavity (520) on the transfer box (510).
6. A semiconductor wafer selection and registration device according to claim 5, characterized in that: The elastic limiting structure (530) includes at least one vertically penetrating limiting hole (531), a plurality of first limiting columns (532), a pressure column (533), an elastic compression mechanism and a displacement adjustment mechanism (550), wherein the vertically penetrating limiting hole (531) vertically penetrates from the upper end of the transfer box (510) close to the pick-up and placement port to the lowest horizontal limiting cavity (520), and the vertically penetrating limiting hole (531) corresponds to a portion of the side of the tray (200) without acupuncture points that is slidably limited in the horizontal limiting cavity (520), and a plurality of the first limiting columns (532) are vertically slidably arranged in the vertically penetrating limiting hole (531), and the height of the first limiting column (532) is equal to the distance between the bottom sides of two adjacent horizontal limiting cavities (520), and the lower ends and upper ends of the plurality of the first limiting columns (532) are respectively located at the bottom of the corresponding horizontal limiting cavity (520). The first limiting column (532) is located on the side and the bottom side of the horizontal limiting cavity (520) on the corresponding horizontal limiting cavity (520), the upper and lower ends of the first limiting column (532) are both set to smooth hemispherical surfaces and the radius of the hemispherical surface is not less than the height of the horizontal limiting cavity (520), the pressure column (533) is vertically slidably set in the vertical through limiting hole (531), the lower end of the pressure column (533) is located on the bottom side of the uppermost horizontal limiting cavity (520) among the multiple horizontal limiting cavities (520), the upper end of the pressure column (533) extends to the upper part of the lower end of the pressure column (533) and is connected to the elastic pressing mechanism, the lower end is set to a smooth hemispherical surface and the radius of the hemispherical surface is not less than the height of the horizontal limiting cavity (520), and the elastic displacement distance of the displacement adjustment mechanism (550) limiting the elastic pressing mechanism is between one and two times the height of the horizontal limiting cavity (520).
7. A semiconductor wafer selection and registration device according to claim 6, characterized in that: The elastic compression mechanism comprises a bracket (541), an elastic pressure plate (543), a plurality of second limiting columns (544) and a plurality of springs (545); the bracket (541) is arranged at the upper edge of the transfer box (510); an elastic limiting plate (542) is arranged at the upper end of the bracket (541); a plurality of second limiting columns (544) are vertically fixedly arranged between the upper end of the transfer box (510) and the elastic limiting plate (542); a sliding hole penetrating in the vertical direction corresponding to and matching the plurality of second limiting columns (544) is arranged on the elastic pressure plate (543); the elastic pressure plate (543) is slidably arranged on the plurality of second limiting columns (544); a plurality of springs (545) are correspondingly sleeved on the plurality of second limiting columns (544) one by one, and the upper and lower ends respectively contact the lower end of the elastic limiting plate (542) and the upper end of the transfer box (510); and the upper end of the pressure column (533) is fixed to the elastic pressure plate (543).
8. The semiconductor wafer selection and registration device according to claim 7, characterized in that: The displacement adjustment mechanism (550) is a bolt rotatably arranged on the elastic limiting plate (542), and the lower end of the bolt extends to the upper side of the elastic pressure plate (543).
9. The semiconductor wafer selection and registration device according to claim 2, characterized in that: A pallet transfer mechanism storage position for accommodating the pallet transfer mechanism (500) is provided at the lower part of the equipment frame (100).
10. The semiconductor wafer selection and registration device according to claim 7, characterized in that: The horizontal limiting cavity (520) passes through the transfer box (510) horizontally, and a fixing plate (560) is detachably provided on the side of the transfer box (510) away from the vertical limiting hole (531). The fixing plate (560) is provided with a convex plate (561) extending into the horizontal limiting cavity (520) to limit the tray (200) in the horizontal direction, and the convex plate (561) is provided with an air flow groove that passes through the fixing plate (560) away from the transfer box (510).