Cleaning device for wafer processing

Abstract

The utility model discloses a cleaning device for wafer processing, which comprises a bottom plate, a box body arranged at one end of the outer wall of the top of the bottom plate, a wafer frame arranged above the bottom plate, a plurality of wafer bodies arranged on the wafer frame and distributed at equal intervals, and a feeding assembly arranged at the other end of the outer wall of the top of the bottom plate, a comprehensive pipeline assembly is installed on the outer wall of the top of the box body. According to the utility model, the wafer rack can be fed into the box body through the feeding assembly, the wafer bodies and the rotating pipes are distributed in a staggered manner, and cleaning fluid can be introduced into the rotating pipes through the comprehensive pipeline assembly and sprayed out from the through holes in the two sides of the rotating pipes, so that the plurality of wafer bodies can be conveniently washed at the same time; in the washing process, the rotating pipe can be driven by the driving assembly to rotate by 360 degrees, the washing effect is improved, after washing is completed, hot air can be introduced into the rotating pipe through the comprehensive pipeline assembly, the hot air is blown out of the through hole again and is blown to the wafer body, the outer wall of the wafer body is directly dried, and more convenience is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning, in particular to a cleaning device for wafer processing. Background Art

[0002] During the wafer production process, the wafer surface needs to be cleaned to avoid contamination of the wafer by metal particles and to ensure the performance and qualified rate of the wafer. Although the current cleaning device can clean the wafer well, it needs to fix the wafer in the cleaning position and then clean the wafer. It is troublesome to clean multiple wafers at the same time, and after cleaning, it needs to be transferred and dried, which is not convenient. Utility Model Content

[0003] The utility model aims to provide a cleaning device for wafer processing, so as to solve the problems in the above background technology that it is troublesome to fix multiple wafers at the same time and the wafers need to be transferred and dried after cleaning, which is not convenient.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cleaning device for wafer processing, comprising: a base plate, a box body installed on one end of the top outer wall of the base plate, a wafer rack arranged above the base plate and a plurality of equally spaced wafer bodies placed on the wafer rack, and also comprising: a feeding assembly installed on the other end of the top outer wall of the base plate, an integrated pipeline assembly is installed on the top outer wall of the box body, and a driving assembly is installed on the outer wall of one side of the box body, an equally spaced mounting plate is fixed to the inner wall of the box body, and a plurality of equally spaced rotating tubes are plugged into the top outer wall of the mounting plate through bearings, a plurality of equally spaced through holes are opened on the outer walls on both sides of the rotating tube, and the rotating tube is rotatably connected to the bottom of the integrated pipeline assembly.

[0005] The feeding assembly comprises an electric slide, a fixing plate installed on the top of the electric slide, a sealing plate installed on the outer wall of one side of the fixing plate, and a hanging plate installed on the outer wall of one side of the sealing plate.

[0006] The integrated pipeline assembly comprises a water pipe, a hot air pipe connected to the top of the water pipe and a diversion pipe connected to one end of the water pipe.

[0007] The driving assembly comprises a worm wheel mounted on the outer wall of the rotating tube and a motor mounted on the outer wall of the box body, a worm connected to one end of the motor output shaft, and the worm is meshed with the worm wheel.

[0008] The inner wall of the top pipe opening of the rotating pipe is rotatably connected with the outer wall of the bottom pipe opening of the diversion pipe.

[0009] The inner wall of one side of the box body is connected with a liquid discharge pipe.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] The utility model discloses a cleaning device for wafer processing. The wafer rack can be sent into a box body through a feeding assembly. At this time, the wafer body and the rotating tube are staggered. At this time, the cleaning liquid can be introduced into the rotating tube through the integrated pipeline assembly and sprayed out from the through holes on both sides of the rotating tube, which is convenient for simultaneously flushing multiple wafer bodies. During the flushing process, the rotating tube can be driven by the driving assembly to rotate 360 ​​degrees to improve the flushing effect. After the wafer body is cleaned, hot air can be introduced into the rotating tube through the integrated pipeline assembly, and the hot air is blown out from the through hole again and blown on the wafer body to directly dry the outer wall of the wafer body, which is more convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 For the utility model External View Structural diagram;

[0013] Figure 2 It is a working schematic diagram of the utility model;

[0014] Figure 3 This is a cross-sectional structural diagram of the box body of the utility model;

[0015] Figure 4 This is a structural diagram of a wafer rack of the utility model;

[0016] Figure 5 This is a structural diagram of the feeding assembly of the utility model;

[0017] Figure 6 This is a structural diagram of the comprehensive pipeline assembly of the utility model;

[0018] Figure 7 This is the structure diagram of the drive component of the utility model

[0019] In the figure: 1. bottom plate; 2. box body; 3. feeding assembly; 301. electric slide; 302. fixing plate; 303. sealing plate; 304. hanging plate; 4. wafer rack; 5. wafer body; 6. integrated pipeline assembly; 601. water pipe; 602. hot air pipe; 603. shunt pipe; 7. driving assembly; 701. worm gear; 702. motor; 703. worm; 8. mounting plate; 9. rotating tube; 10. through hole; 11. drain pipe. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-7 The utility model provides a wafer processing cleaning device, comprising: a base plate 1, a box body 2 installed on one end of the top outer wall of the base plate 1, a wafer rack 4 arranged above the base plate 1 and a plurality of equally spaced wafer bodies 5 placed on the wafer rack 4, and also comprising: a feeding assembly 3 installed on the other end of the top outer wall of the base plate 1, an integrated pipeline assembly 6 installed on the top outer wall of the box body 2, and a driving assembly 7 installed on one side outer wall of the box body 2, an equidistantly distributed mounting plate 8 is fixed to the inner wall of the box body 2, and a plurality of equally spaced rotating tubes 9 are plugged into the top outer wall of the mounting plate 8 through bearings, a plurality of equally spaced through holes 10 are opened on the outer walls on both sides of the rotating tube 9, and the rotating tube 9 is rotatably connected to the bottom of the integrated pipeline assembly 6.

[0022] It should be noted here that: the wafer rack 4 can be placed on the feeding assembly 3, and the wafer rack 4 can be sent into the box body 2 through the feeding assembly 3. At this time, the wafer body 5 and the rotating tube 9 are staggered. At this time, the cleaning liquid can be introduced into the rotating tube 9 through the integrated pipeline assembly 6. After the introduction, the cleaning liquid is sprayed out from the through holes 10 on both sides of the rotating tube 9 to rinse the outer wall of the wafer body 5. During the rinsing process, the rotating tube 9 can be driven by the driving assembly 7 to rotate 360° to improve the rinsing effect. After the wafer body 5 is cleaned, hot air can be introduced into the rotating tube 9 through the integrated pipeline assembly 6, and the hot air is blown out from the through hole 10 again and blown on the wafer body 5 to directly dry the outer wall of the wafer body 5.

[0023] In a preferred embodiment, the feeding assembly 3 includes an electric slide 301, a fixed plate 302 installed on the top of the electric slide 301, a sealing plate 303 installed on the outer wall of one side of the fixed plate 302, and a hanging plate 304 installed on the outer wall of one side of the sealing plate 303.

[0024] It should be noted here that the wafer rack 4 can be hung on the hanging plate 304 , and the fixed plate 302 can be driven to move by the electric slide 301 , so that the wafer rack 4 can be pushed into the box body 2 .

[0025] In a preferred embodiment, the integrated pipeline assembly 6 includes a water pipe 601 , a hot air pipe 602 connected to the top of the water pipe 601 , and a diversion pipe 603 connected to one end of the water pipe 601 .

[0026] It should be noted here that: when cleaning, the valve on the water pipe 601 can be opened to pass the cleaning liquid into the shunt pipe 603, and the cleaning liquid then flows into the rotating tube 9. When drying, the valve on the water pipe 601 can be closed, and the valve on the hot air pipe 602 can be opened to pass hot air into the shunt pipe 603 through the hot air pipe 602, and the hot air then flows into the rotating tube 9.

[0027] In a preferred embodiment, the driving assembly 7 includes a worm gear 701 mounted on the outer wall of the rotating tube 9 and a motor 702 mounted on the outer wall of the box body 2, a worm 703 connected to one end of the output shaft of the motor 702, and the worm 703 is meshed with the worm gear 701.

[0028] It should be noted here that the motor 702 can drive the worm 703 to rotate, thereby driving the worm wheel 701 to rotate, and further driving the rotating tube 9 to rotate.

[0029] In a preferred embodiment, the inner wall of the top pipe opening of the rotating tube 9 is rotatably connected to the outer wall of the bottom pipe opening of the diversion tube 603 .

[0030] It should be noted here that the rotation of the rotating tube 9 does not affect the diverter tube 603 .

[0031] In a preferred embodiment, a drain pipe 11 is connected to the inner wall of one side of the box body 2 .

[0032] It should be noted here that the liquid flowing down from the box body 2 after cleaning can be discharged through the drain pipe 11.

[0033] Working principle: the wafer rack 4 can be hung on the hanging plate 304, and the fixed plate 302 can be moved by the electric slide 301 to push the wafer rack 4 into the box 2. At this time, the wafer body 5 and the rotating tube 9 are staggered. The valve on the water pipe 601 can be opened to pass the cleaning liquid into the shunt pipe 603, and the cleaning liquid then flows into the rotating tube 9. The cleaning liquid is sprayed out from the through holes 10 on both sides of the rotating tube 9 to wash the outer wall of the wafer body 5, which is convenient for washing multiple wafer bodies 5 at the same time. During the flushing process, the motor 702 can drive the worm 703 to rotate, which in turn drives the worm wheel 701 to rotate, and then drives the rotating tube 9 to rotate 360°, thereby improving the flushing effect. After the wafer body 5 is cleaned, the valve on the water pipe 601 can be closed, and hot air can be introduced into the diversion pipe 603 through the hot air pipe 602. The hot air is then introduced into the rotating tube 9 and blown onto the outer wall of the wafer body 5 through the through hole 10, thereby directly drying the outer wall of the wafer body 5, which is more convenient.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A wafer processing cleaning device, comprising: A base plate (1), a box body (2) mounted on one end of the top outer wall of the base plate (1), a wafer rack (4) arranged above the base plate (1), and a plurality of wafer bodies (5) placed on the wafer rack (4) and distributed at equal distances; The invention is characterized in that it also includes: a feeding assembly (3) installed at the other end of the top outer wall of the bottom plate (1); an integrated pipeline assembly (6) is installed on the top outer wall of the box body (2); and a driving assembly (7) is installed on the outer wall of one side of the box body (2); an equidistantly distributed mounting plate (8) is fixed to the inner wall of the box body (2); and a plurality of equidistantly distributed rotating tubes (9) are plugged into the top outer wall of the mounting plate (8) through bearings; a plurality of equidistantly distributed through holes (10) are opened on the outer walls on both sides of the rotating tube (9), and the rotating tube (9) is rotatably connected to the bottom of the integrated pipeline assembly (6).

2. A wafer processing cleaning device according to claim 1, characterized in that: The feeding assembly (3) comprises an electric slide (301), a fixing plate (302) mounted on the top of the electric slide (301), a sealing plate (303) mounted on an outer wall of one side of the fixing plate (302), and a hanging plate (304) mounted on an outer wall of one side of the sealing plate (303).

3. A wafer processing cleaning device according to claim 1, characterized in that: The integrated pipeline assembly (6) comprises a water pipe (601), a hot air pipe (602) connected to the top of the water pipe (601), and a diversion pipe (603) connected to one end of the water pipe (601).

4. The wafer processing cleaning device according to claim 1, characterized in that: The driving assembly (7) comprises a worm gear (701) mounted on the outer wall of the rotating tube (9) and a motor (702) mounted on the outer wall of the box body (2), a worm (703) connected to one end of the output shaft of the motor (702), and the worm (703) is meshed with the worm gear (701).

5. The wafer processing cleaning device according to claim 3, characterized in that: The inner wall of the top pipe opening of the rotating pipe (9) is rotatably connected to the outer wall of the bottom pipe opening of the diversion pipe (603).

6. The wafer processing cleaning device according to claim 1, characterized in that: A liquid discharge pipe (11) is connected to the inner wall of one side of the box body (2).

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