High-precision pressure control sorting die bonder

Abstract

The utility model relates to the field of semiconductors, in particular to a high-precision pressure control sorting die bonder, which comprises a material changing manipulator, a material box, a die bonding workbench, a chip suction module and an automatic die bonding table. Wherein wafers are placed in the material box, the die bonding workbench moves in the X-axis direction and the Y-axis direction of the space through the first double-axis driving device, and the chip suction module comprises a chip suction device and a second double-axis driving device for driving the chip suction device to move in the X-axis direction and the Z-axis direction of the space. The chip suction device sucks a wafer located on the die bonding workbench into the automatic die bonding table through a second double-shaft driving device to achieve film expanding and die bonding operation, and the suction end of the chip suction device is further provided with a pressure sensor. The equipment adopts a high-precision pressure control technology, and can effectively sort flawed chips, so that the flawed chips are removed in the packaging process, and the reject ratio of products is remarkably reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a high-precision pressure-controlled sorting and bonding machine. Background Art

[0002] In the development history of chip packaging technology, early technologies mainly relied on a single die bonding mode, which was practical at the time, but with the continuous advancement of technology and the increasing diversification of market demand, its limitations gradually emerged. In particular, when faced with high-quality and high-efficiency production requirements, the single die bonding mode seems to be unable to meet the requirements.

[0003] First, this mode cannot effectively sort out defective chips, resulting in a high defect rate of packaged products. This not only affects the overall quality of the product, but also increases the cost of subsequent inspection and repair, and reduces production efficiency. In order to solve this problem, the industry has begun to explore more advanced pressure control technology, in order to achieve automatic sorting of defective chips during the packaging process, thereby reducing the defect rate of products.

[0004] Secondly, the expansion process in the early chip packaging process mainly relied on manual operation. This mode is not only inefficient, but also complex and requires high skills of operators. At the same time, manual operation is easily affected by various factors such as the environment and fatigue, making it difficult to ensure the stability and consistency of the production process. Therefore, realizing the automation of the expansion process has become an urgent problem to be solved. Summary of the invention

[0005] In order to solve the above problems, the utility model provides a high-precision pressure-controlled sorting and bonding machine, which realizes accurate positioning and efficient processing of wafers by introducing high-precision rotation and lifting mechanisms and coordinating with automatic control. This not only improves the accuracy of bonding, but also significantly improves production efficiency and reduces waiting time and manual intervention in the production process.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a high-precision pressure-controlled sorting and crystal bonding machine, including a material changing robot, a material box, a crystal bonding workbench, a chip suction module, and an automatic crystal bonding table; wherein the chip is placed in the material box, and the crystal bonding workbench is moved along the X-axis and Y-axis directions of the space by a first dual-axis driving device, and the chip suction module includes a chip suction device and a second dual-axis driving device for driving the chip suction device to move along the X-axis and Z-axis directions of the space, and the chip suction device sucks the chip located on the crystal bonding workbench into the automatic crystal bonding table through the second dual-axis driving device to realize film expansion and crystal bonding operations, and a pressure sensor is also provided at the suction end of the chip suction device.

[0007] Furthermore, the material box includes a discharging box and a feeding box, and the material changing robot includes a clamping robot and a third biaxial drive device that drives the clamping robot to move along the X-axis and Y-axis directions of the space, wherein the third biaxial drive device drives the clamping robot to switch and move between the discharging box and the feeding box, and at the same time, the third biaxial drive device drives the clamping robot to pass through the discharging box or the feeding box and extend to the crystal fixing workbench to clamp or release the material.

[0008] Furthermore, both inner side walls of the material box and the discharge box are provided with a plurality of positioning grooves, and the plurality of positioning grooves are arranged from top to bottom.

[0009] Furthermore, the automatic crystal bonding table can also move along the X-axis and Y-axis directions in space through a fourth dual-axis driving device.

[0010] Furthermore, the automatic crystal fixing table includes a bearing seat, a rotating seat, a crystal expanding seat, a rotating mechanism and a lifting mechanism, wherein the rotating seat is rotatably mounted on the bearing seat, the rotating mechanism is used to drive the rotating seat to rotate, and the lifting mechanism is used to drive the crystal expanding seat to lift;

[0011] Furthermore, the lifting mechanism includes a lifting sliding assembly, a lifting drive assembly and a lifting transmission assembly. The lifting transmission assembly includes a lifting screw, a lifting driven wheel, a lifting transmission wheel and a lifting transmission belt. There are several lifting transmission wheels and they are all rotatably installed on the rotating seat. There are several lifting screws and lifting transmission wheels corresponding to each other and they are respectively threadedly engaged with each lifting transmission wheel. Each of the lifting screws is fixedly installed on the crystal expansion seat, the lifting driven wheel is rotatably installed on the rotating seat, and the lifting transmission belt is wound around each lifting transmission wheel; the lifting drive assembly includes a lifting motor and a lifting drive wheel, and the output end of the lifting motor is connected to the lifting drive wheel; the lifting sliding assembly is used to drive the lifting drive wheel to approach the lifting driven wheel and engage with it.

[0012] Furthermore, the lifting driven wheel includes a first driven wheel and a second driven wheel, the first driven wheel is coaxially fixedly installed on the second driven wheel and located on the top of the second driven wheel, and the lifting transmission belt is wound around the first driven wheel; wherein the lifting drive wheel is meshed with the second driven wheel.

[0013] Furthermore, the lifting and sliding assembly includes an X-axis slide rail installed on a bearing seat, an X-axis slider slidably set on the X-axis slide rail, and an X-axis cylinder drivingly connected to the X-axis slider, wherein the X-axis slider is connected to the lifting motor, and the X-axis cylinder pushes the lifting drive wheel on the lifting motor to engage with the second driven wheel.

[0014] Furthermore, the rotating mechanism includes a rotating motor, a rotating synchronous wheel, a rotating gear ring and a rotating synchronous belt. The rotating motor is installed on the supporting seat and drives the rotating synchronous wheel to rotate. The rotating gear ring is evenly distributed on the outer wall of the rotating seat, and the rotating synchronous belt is wound around the rotating gear ring and the rotating synchronous wheel.

[0015] The beneficial effects of the utility model are:

[0016] By introducing high-precision rotation and lifting mechanisms, combined with automated control, precise positioning and efficient processing of wafers are achieved. This not only improves the precision of die bonding, but also significantly improves production efficiency and reduces waiting time and manual intervention in the production process.

[0017] At the same time, the equipment adopts high-precision pressure (the suction end of the chip suction device is also equipped with a pressure sensor) control technology, which can effectively sort out defective chips and remove them during the packaging process, significantly reducing the defective rate of products. This not only improves product quality, but also helps to enhance the market competitiveness of products.

[0018] At the same time, the robot can achieve precise control during the loading and unloading process to ensure that the materials move according to the preset path and position. This helps to reduce production problems and product defect rates caused by inaccurate material positions. Compared with manual operation, the robot can reduce direct contact with the materials during the handling process, thereby reducing the risk of contamination or damage to the materials. This is of great significance to improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a high-precision pressure-controlled sorting and bonding machine.

[0020] Figure 2 This is an enlarged schematic diagram of the material changing robot and the material box structure.

[0021] Figure 3 It is a schematic diagram of the exploded structure of the automatic crystal bonding station.

[0022] Figure 4 It is a schematic diagram of the exploded structure of the automatic crystal bonding station.

[0023] Figure 5 It is a schematic diagram of the chip suction module and the second dual-axis drive device assembly structure.

[0024] Description of the accompanying drawings: material changing robot 1, material box 2, discharge box 21, feed box 22, third biaxial drive device 23, clamping slot 24, crystal fixing workbench 3, first biaxial drive device 31, chip suction module 4, second biaxial drive device 41, pressure sensor 42, automatic crystal fixing table 5, fourth biaxial drive device 6, bearing seat 51, rotating seat 52, crystal expansion seat 53, rotating mechanism 54, lifting mechanism 55, lifting screw 551, lifting driven wheel 552, lifting transmission wheel 553, lifting transmission belt 554, lifting motor 555, lifting drive wheel 556, first driven wheel 5521, second driven wheel 5522, X-axis slide rail 557, X-axis slider 558, X-axis cylinder 559, rotating motor 61, rotating synchronous wheel 62, rotating gear ring 63, rotating synchronous belt 64 DETAILED DESCRIPTION

[0025] See also Figure 1-5 As shown, the utility model is about a high-precision pressure-controlled sorting and crystal bonding machine, including a material changing manipulator 1, a material box 2, a crystal bonding workbench 3, a chip suction module 4, and an automatic crystal bonding table 5; wherein the chip is placed in the material box 2, and the crystal bonding workbench 3 is moved along the X-axis and Y-axis directions of the space through the first double-axis driving device 31, and the chip suction module 4 includes a chip suction device and a second double-axis driving device 41 that drives the chip suction device to move along the X-axis and Z-axis directions of the space, and the chip suction device sucks the chip located on the crystal bonding workbench 3 into the automatic crystal bonding table 5 through the second double-axis driving device 41 to realize the film expansion and crystal bonding operation, and the suction end of the chip suction device is also provided with a pressure sensor 42. By providing the pressure sensor 42 at the suction end of the chip suction device, high-precision control of the pressure during the chip suction process is achieved. This helps to sort out defective chips more accurately, thereby reducing the defective rate of products.

[0026] The solid crystal workbench 3 and the chip suction module 4 are respectively moved along the X-axis, Y-axis and Z-axis directions of the space through the first biaxial drive device 31 and the second biaxial drive device 41, which makes the entire solid crystal process more automated and efficient. Compared with the traditional manual expansion method, the production efficiency is significantly improved. The equipment can automatically complete the absorption, film expansion and solid crystal operations of the chip, simplifying the production process. This reduces the dependence on manual operation and reduces the complexity of the process. The design of the material changing manipulator 1 enables the equipment to easily replace different types of chip materials, enhancing the flexibility and applicability of the equipment. Through high-precision pressure control and automated operation, the impact of human factors on product quality is reduced. This helps to improve the overall quality and reliability of the product.

[0027] Furthermore, the material box 2 includes a discharge box 21 and a feed box 22, and the material changing robot 1 includes a clamping robot and a third dual-axis drive device 23 that drives the clamping robot to move along the X-axis and Y-axis directions of the working platform, wherein the third dual-axis drive device 23 drives the clamping robot to switch and move between the discharge box 21 and the feed box 22, and at the same time, the third dual-axis drive device 23 drives the clamping robot to pass through the discharge box 21 or the feed box 22 and extend to the solid crystal workbench 3 to clamp or release materials.

[0028] The manipulator can automatically clamp the material in the discharge box 21 and place it on the crystal bonding workbench 3, and clamp the material after the crystal bonding operation from the crystal bonding workbench 3 and place it on the feed box 22. This automated material flow process reduces human intervention and improves production efficiency. Through the automatic clamping and placement actions of the manipulator, the continuity and seamless connection of the production process are achieved. This helps to reduce the time of production interruption and improve the utilization rate and production efficiency of the equipment. The design of the manipulator can reduce material contamination and damage caused by human factors. Compared with manual operation, the manipulator can handle materials more accurately and stably, reducing material waste and cost. The manipulator can flexibly move between the discharge box 21, the crystal bonding workbench 3 and the feed box 22 to adapt to wafer materials of different sizes and types. This enhances the flexibility and applicability of the equipment, enabling it to adapt to a variety of production needs. Through the automated operation of the manipulator, the impact of human factors on product quality is reduced. The precise control and stable operation of the manipulator help to improve the overall quality and stability of the product.

[0029] Furthermore, both inner side walls of the material box 2 and the discharge box 21 are provided with a plurality of positioning grooves 24 , and the plurality of positioning grooves 24 are arranged from top to bottom.

[0030] The design of the positioning slots 24 enables the materials to be arranged in an orderly manner in the material box, which is convenient for the manipulator to pick up and place. This improves the management efficiency of materials and reduces the confusion and misplacement of materials. The positioning slots 24 can provide stable support for the materials to prevent the materials from shaking or tilting in the material box. This helps to maintain the stability of the materials and ensure that the manipulator can accurately pick up and place the materials. By setting positioning slots 24 of different sizes, the material box can adapt to wafer materials of different sizes. This enhances the flexibility of the equipment and enables it to handle materials of various specifications. The positioning slots 24 are arranged from top to bottom, making full use of the vertical space of the material box. This helps to reduce the floor space of the material box and optimize the spatial layout of the production line. The design of the positioning slots 24 makes the inventory of materials more intuitive. The operator can easily check the quantity and status of the materials in the material box and replenish and manage them in time.

[0031] Furthermore, the automatic crystal bonding stage 5 can also move along the X-axis and Y-axis directions in space through the fourth dual-axis driving device 6. The mobility of the automatic crystal bonding stage 5 enables it to be more accurately positioned at different positions on the crystal bonding workbench 3, thereby improving the accuracy of crystal bonding. At the same time, this flexibility also enables the device to adapt to wafers of different sizes and shapes, as well as more complex crystal bonding patterns.

[0032] By moving the automatic crystal bonding station 5, continuous and efficient crystal bonding operations can be achieved. After completing the crystal bonding at one position, the automatic crystal bonding station 5 can be quickly moved to the next position, reducing the waiting time and interruptions in the production process, thereby improving production efficiency. The mobile function of the automatic crystal bonding station 5 reduces the need for manual adjustment. The operator only needs to set the crystal bonding parameters and path, and the equipment can automatically complete the crystal bonding operation, reducing the impact of human factors on production efficiency and product quality. The mobility of the automatic crystal bonding station 5 makes it easier for the equipment to adapt to different production needs and process changes. In addition, this design also provides greater flexibility for possible equipment upgrades and expansions in the future. Through precise mobile control and stable crystal bonding operations, the automatic crystal bonding station 5 helps to improve the overall quality and stability of the product. Reduce product defects caused by improper human operation or inaccurate equipment positioning.

[0033] Furthermore, the automatic crystal fixing table 5 includes a bearing seat 51, a rotating seat 52, a crystal expanding seat 53, a rotating mechanism 54 and a lifting mechanism 55. The rotating seat 52 is rotatably mounted on the bearing seat 51, the rotating mechanism 54 is used to drive the rotating seat 52 to rotate, and the lifting mechanism 55 is used to drive the crystal expanding seat 53 to move up and down;

[0034] The lifting mechanism 55 includes a lifting sliding assembly, a lifting driving assembly and a lifting transmission assembly. The lifting transmission assembly includes a lifting screw 551, a lifting driven wheel 552, a lifting transmission wheel 553 and a lifting transmission belt 554. There are several lifting transmission wheels 553 and they are all rotatably installed on the rotating seat 52. The lifting screws 551 and the lifting transmission wheels 553 are respectively provided with a plurality of threads corresponding to each other and are respectively threadedly engaged with each lifting transmission wheel 553. Each of the lifting screws 551 is fixedly installed on the crystal expansion seat 53. The lifting driven wheel 552 is rotatably installed on the rotating seat 52. The lifting transmission belt 554 is wound around each lifting transmission wheel 553. The lifting driving assembly includes a lifting motor 555 and a lifting driving wheel 556. The output end of the lifting motor 555 is connected to the lifting driving wheel 556. The lifting sliding assembly is used to drive the lifting driving wheel 556 to approach the lifting driven wheel 552 and engage with it.

[0035] When the wafer needs to be expanded, the X-axis slider 558 is first driven to be lifted through the X-axis cylinder 559, so that the lifting drive wheel 556 on the lifting motor 555 engages with the second driven wheel 5522, and then the lifting drive wheel 556 is driven to rotate by the lifting motor 555, so that the second driven wheel 5522 and each lifting transmission wheel 553 rotate together, so that the lifting screw 551 drives the expansion seat 53 to lift and lower to achieve wafer expansion.

[0036] Furthermore, the lifting driven wheel 552 includes a first driven wheel 5521 and a second driven wheel 5522, wherein the first driven wheel 5521 is coaxially fixedly installed on the second driven wheel 5522 and is located on the top of the second driven wheel 5522, and the lifting transmission belt 554 is wound around the first driven wheel 5521; wherein the lifting drive wheel 556 is meshed with the second driven wheel 5522.

[0037] Furthermore, the lifting and sliding assembly includes an X-axis slide rail 557 installed on the supporting seat 51, an X-axis slider 558 slidably set on the X-axis slide rail 557, and an X-axis cylinder 559 drivingly connected to the X-axis slider 558, wherein the X-axis slider 558 is connected to the lifting motor 555, and the X-axis cylinder 559 pushes the lifting drive wheel 556 on the lifting motor 555 to engage with the second driven wheel 5522.

[0038] By pushing the X-axis cylinder 559, the lifting drive wheel 556 on the lifting motor 555 can quickly engage or disengage with the second driven wheel 5522. This design enables the device to quickly start or stop the lifting movement when needed, thereby improving the response speed and flexibility of the device. When the lifting drive wheel 556 is engaged with the second driven wheel 5522, the transmission efficiency between them is higher and the transmission is more stable. This helps to reduce errors and jitters during the transmission process and improve the accuracy and stability of the lifting movement. The design of the lifting sliding assembly simplifies the structure of the equipment, making the installation, commissioning and maintenance of the equipment more convenient. At the same time, due to the reduction of complex transmission mechanisms, the maintenance cost of the equipment is also reduced accordingly.

[0039] Furthermore, the rotating mechanism 54 includes a rotating motor 61, a rotating synchronous wheel 62, a rotating ring gear 63 and a rotating synchronous belt 64. The rotating motor 61 is installed on the bearing seat 51 and drives the rotating synchronous wheel 62 to rotate. The rotating ring gear 63 is evenly distributed on the outer wall of the rotating seat 52, and the rotating synchronous belt 64 is wound around the rotating ring gear 63 and the rotating synchronous wheel 62. Through the design of the rotating mechanism 54, the rotating motor 61 drives the rotating synchronous wheel 62 to rotate, and then drives the rotating ring gear 63 and the rotating seat 52 to rotate through the rotating synchronous belt 64. This allows the chip on the crystal expansion seat 53 to be accurately adjusted to the required angle, meeting different process requirements. The rotation correction function enables the equipment to quickly adapt to the angle requirements of different chips, and the angle adjustment can be automatically completed without manual intervention. This greatly improves the production efficiency and flexibility of the equipment.

[0040] The above implementation modes are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A high-precision pressure-controlled sorting and bonding machine, characterized in that: Including material changing manipulator, material box, crystal bonding workbench, chip suction module, automatic crystal bonding table; The chip is placed in a material box, and the crystal bonding workbench is moved along the X-axis and Y-axis directions of the space through a first dual-axis driving device. The chip suction module includes a chip suction device and a second dual-axis driving device that drives the chip suction device to move along the X-axis and Z-axis directions of the space. The chip suction device sucks the chip on the crystal bonding workbench into the automatic crystal bonding table through the second dual-axis driving device to realize film expansion and crystal bonding operations, and a pressure sensor is also provided at the suction end of the chip suction device.

2. The high-precision pressure-controlled separation and bonding machine according to claim 1, characterized in that: The material box includes a discharging box and a feeding box, and the material changing robot includes a clamping robot and a third dual-axis drive device that drives the clamping robot to move along the X-axis and Y-axis directions of the space, wherein the third dual-axis drive device drives the clamping robot to switch and move between the discharging box and the feeding box, and at the same time, the third dual-axis drive device drives the clamping robot to pass through the discharging box or the feeding box and extend to the crystal bonding workbench to clamp or release the material.

3. The high-precision pressure-controlled separation and bonding machine according to claim 2, characterized in that: Both inner side walls of the material box and the discharging box are provided with a plurality of clamping grooves, and the plurality of clamping grooves are arranged from top to bottom.

4. The high-precision pressure-controlled separation and bonding machine according to claim 2, characterized in that: The automatic crystal bonding table can also move along the X-axis and Y-axis directions in space through a fourth dual-axis driving device.

5. The high-precision pressure-controlled separation and bonding machine according to claim 4, characterized in that: The automatic crystal fixing table includes a bearing seat, a rotating seat, a crystal expanding seat, a rotating mechanism and a lifting mechanism. The rotating seat is rotatably mounted on the bearing seat, the rotating mechanism is used to drive the rotating seat to rotate, and the lifting mechanism is used to drive the crystal expanding seat to lift; The lifting mechanism includes a lifting sliding assembly, a lifting driving assembly and a lifting transmission assembly. The lifting transmission assembly includes a lifting screw, a lifting driven wheel, a lifting transmission wheel and a lifting transmission belt. There are a plurality of lifting transmission wheels and they are all rotatably mounted on a rotating seat. There are a plurality of lifting screws and a plurality of lifting transmission wheels corresponding to each other and they are respectively threadedly engaged with each lifting transmission wheel. Each of the lifting screws is fixedly mounted on a crystal expansion seat. The lifting driven wheel is rotatably mounted on a rotating seat. The lifting transmission belt is wound around each lifting transmission wheel. The lifting driving assembly includes a lifting motor and a lifting driving wheel. The output end of the lifting motor is connected to the lifting driving wheel. The lifting sliding assembly is used to drive the lifting driving wheel to approach the lifting driven wheel and engage with it.

6. The high-precision pressure-controlled separation and bonding machine according to claim 5, characterized in that: The lifting driven wheel comprises a first driven wheel and a second driven wheel, wherein the first driven wheel is coaxially fixedly mounted on the second driven wheel and is located on the top of the second driven wheel, and the lifting transmission belt is wound around the first driven wheel; wherein the lifting drive wheel (16) is meshed with the second driven wheel.

7. The high-precision pressure-controlled separation and bonding machine according to claim 6, characterized in that: The lifting and sliding assembly includes an X-axis slide rail installed on a bearing seat, an X-axis slider slidably arranged on the X-axis slide rail, and an X-axis cylinder drivingly connected to the X-axis slider, wherein the X-axis slider is connected to the lifting motor, and the X-axis cylinder pushes the lifting driving wheel on the lifting motor to engage with the second driven wheel.

8. The high-precision pressure-controlled separation and bonding machine according to claim 7, characterized in that: The rotating mechanism includes a rotating motor, a rotating synchronous wheel, a rotating gear ring and a rotating synchronous belt. The rotating motor is installed on the supporting seat and drives the rotating synchronous wheel to rotate. The rotating gear ring is evenly distributed on the outer side wall of the rotating seat. The rotating synchronous belt is wound around the rotating gear ring and the rotating synchronous wheel.

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