Semiconductor processing equipment

Abstract

The utility model discloses semiconductor processing equipment which comprises a semiconductor material conveying combination plate and anti-skid cushion blocks, the anti-skid cushion blocks are fixedly installed at the four corners of the bottom face of the semiconductor material conveying combination plate in an adhesive mode, a combination square groove is formed in the semiconductor material conveying combination plate, and supporting idler wheels are installed in the combination square groove. A supporting shaft body is installed on the side face of a frame of the semiconductor material conveying combined plate, a supporting stud is arranged in the center of the tail end of the supporting shaft body, and an adjusting sleeve connector is installed on the outer side of the supporting stud in a sleeving mode. According to the semiconductor processing equipment, supporting rollers are arranged on a semiconductor material conveying combination plate and translation rollers are arranged on conveying side plates, and meanwhile, the supporting rollers and the translation rollers can rotate stably, so that after the supporting rollers and the translation rollers are attached to a semiconductor plate material subsequently, the semiconductor plate material can be conveniently conveyed through rotation; and the stability in the conveying translation process is kept.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to semiconductor processing equipment. Background Art

[0002] Semiconductor processing is used for various technical processing of semiconductors. The semiconductor processing process requires different processes, including the conveying and processing equipment during the cutting and processing of semiconductor materials. However, the semiconductor processing equipment on the market still has the following problems:

[0003] When used for cutting and processing semiconductor materials, the materials need to be moved smoothly by conveying equipment to facilitate subsequent cutting and processing. The overall conveying equipment cannot be adjusted appropriately according to the width of the semiconductor materials, and the overall size is generally fixed.

[0004] In response to the above problems, innovative designs are carried out based on the original semiconductor processing equipment. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor processing equipment to solve the problem raised in the above background technology that the common semiconductor processing equipment on the market currently needs to smoothly move the materials through a conveying device when used for cutting and processing semiconductor materials to facilitate subsequent cutting and processing, and the overall conveying equipment cannot be appropriately adjusted according to the width of the semiconductor material, and the overall size is generally fixed.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor processing equipment, comprising a semiconductor material conveying assembly plate and an anti-skid pad, the anti-skid pads are adhesively fixedly installed at the four corners of the bottom surface of the semiconductor material conveying assembly plate, and a combination square groove is opened on the semiconductor material conveying assembly plate, and a support roller is installed inside the combination square groove, a support shaft is installed on the side of the frame of the semiconductor material conveying assembly plate, and a support stud is arranged at the end center of the support shaft, an adjustment sleeve joint is sleeved on the outer side of the support stud, and the outer side of the adjustment sleeve joint is The surface is provided with anti-slip stripes, and an extrusion sleeve is provided on the outer side of the center of the adjusting sleeve joint, and the extrusion sleeve is sleeved and installed on the outer side of the support shaft and the support stud, the support shaft passes through the conveying side plate, and the outer surface of the conveying side plate is connected with the outer surface of the extrusion sleeve, a receiving square groove is opened on the conveying side plate, and a translation roller is installed inside the receiving square groove, and the translation roller is connected to the conveying side plate through a connecting shaft, and a support spring body is sleeved and installed on the outer side of the support shaft, and the support spring body is located between the semiconductor material conveying combination plate and the conveying side plate.

[0007] Preferably, the diameter of the support roller is greater than the thickness of the semiconductor material conveying assembly plate, and the support roller is connected to the semiconductor material conveying assembly plate through the combined square groove by a rotating shaft, and the combined square groove and the support roller are evenly spaced on the semiconductor material conveying assembly plate.

[0008] Preferably, the support shaft body, the semiconductor material conveying assembly plate and the support studs are arranged as an integrated structure, and the support shaft body and the support studs are symmetrically distributed on the semiconductor material conveying assembly plate.

[0009] Preferably, the adjusting sleeve joint, the anti-slip stripes and the extrusion sleeve are arranged as an integrated structure, and the anti-slip stripes are distributed at equal angles on the adjusting sleeve joint, and the connection mode between the adjusting sleeve joint and the supporting stud is a threaded connection.

[0010] Preferably, the extrusion sleeve is connected to the support shaft body by a rotational sliding connection, and the diameter of the support shaft body is larger than the diameter of the support stud.

[0011] Preferably, the conveying side plate forms a telescopic structure through a supporting spring body and a supporting shaft body, and the conveying side plate is provided with receiving square grooves and translation rollers at equal intervals, and the translation roller is rotationally connected to the conveying side plate through a connecting shaft, and the diameter of the translation roller is greater than the thickness of the conveying side plate.

[0012] Compared with the prior art, the beneficial effects of the utility model are: the semiconductor processing equipment,

[0013] 1. The support rollers arranged on the semiconductor material conveying assembly plate and the translation rollers arranged on the conveying side plate can be rotated smoothly at the same time, so that the support rollers and translation rollers can be rotated to keep the conveying translation stable after the subsequent support rollers and translation rollers are fitted with the semiconductor sheet;

[0014] 2. The staff can adjust the anti-slip stripes on the sleeve joint by rotating it, which can drive the extrusion sleeve to push the conveying side plate to retract. The conveying side plate slides on the supporting shaft, adjusts the spacing between the conveying side plates, and pushes according to the elastic force of the supporting spring body to prevent shaking and dislocation after adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall combined three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall top view structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the overall front view structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the three-dimensional structure of the support shaft and the extrusion sleeve separated from each other in the utility model;

[0019] Figure 5 It is a schematic diagram of the cross-sectional three-dimensional structure of the extrusion sleeve and the adjustment sleeve joint of the utility model.

[0020] In the figure: 1. Semiconductor material conveying combined plate; 2. Anti-skid pad; 3. Combined square groove; 4. Support roller; 5. Support shaft; 6. Support stud; 7. Adjustment sleeve joint; 8. Anti-skid stripes; 9. Extrusion sleeve; 10. Conveying side plate; 11. Storage square groove; 12. Translation roller; 13. Connecting shaft; 14. Support spring body. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-5 The utility model provides a technical solution: a semiconductor processing equipment, including a semiconductor material conveying composite plate 1 and an anti-skid pad 2, the anti-skid pad 2 is adhesively fixedly installed at the four corners of the bottom surface of the semiconductor material conveying composite plate 1, and a composite square groove 3 is opened on the semiconductor material conveying composite plate 1, and a supporting roller 4 is installed inside the composite square groove 3, a supporting shaft 5 is installed on the side of the frame of the semiconductor material conveying composite plate 1, and a supporting stud 6 is arranged at the end center of the supporting shaft 5, an adjusting sleeve joint 7 is sleeved and installed on the outer side of the supporting stud 6, and the outer surface of the adjusting sleeve joint 7 is provided with anti-skid stripes 8, and the adjusting sleeve joint 7 is provided with anti-skid stripes 8. An extrusion sleeve 9 is provided on the outer side of the center of the joint sleeve 7, and the extrusion sleeve 9 is sleeved and installed on the outer sides of the support shaft 5 and the support stud 6. The support shaft 5 passes through the conveying side plate 10, and the outer surface of the conveying side plate 10 is connected to the outer surface of the extrusion sleeve 9. A receiving square groove 11 is opened on the conveying side plate 10, and a translation roller 12 is installed inside the receiving square groove 11, and the translation roller 12 is connected to the conveying side plate 10 through a connecting shaft 13. A support spring body 14 is sleeved and installed on the outer side of the support shaft 5, and the support spring body 14 is located between the semiconductor material conveying combination plate 1 and the conveying side plate 10.

[0023] The diameter of the support roller 4 is greater than the thickness of the semiconductor material conveying assembly plate 1, and the support roller 4 is connected to the semiconductor material conveying assembly plate 1 through the combined square groove 3 by a rotating shaft, and the combined square groove 3 and the support roller 4 are evenly spaced on the semiconductor material conveying assembly plate 1. The support roller 4 and the combined square groove 3 distributed on the semiconductor material conveying assembly plate 1 facilitate the rotation of the support roller 4 after the subsequent semiconductor sheet material is fitted with the support roller 4, thereby driving the smooth movement of the semiconductor sheet material.

[0024] The support shaft 5, the semiconductor material conveying assembly plate 1 and the support stud 6 are integrated into a structure, and the support shaft 5 and the support stud 6 are symmetrically distributed on the semiconductor material conveying assembly plate 1. The support shaft 5 and the support stud 6 can support and stabilize the operation of the conveying side plate 10 to avoid misalignment and maintain the accuracy of adjustment.

[0025] The adjusting sleeve joint 7, the anti-slip stripes 8 and the extrusion sleeve 9 are integrated into a structure, and the anti-slip stripes 8 are distributed at equal angles on the adjusting sleeve joint 7, and the connection method between the adjusting sleeve joint 7 and the supporting stud 6 is a threaded connection. According to the distribution of the anti-slip stripes 8 on the adjusting sleeve joint 7, it is convenient to manually rotate the adjusting sleeve joint 7, and the adjusting sleeve joint 7 can be rotated and moved on the supporting stud 6.

[0026] The connection method between the extrusion sleeve 9 and the support shaft 5 is a rotational sliding connection, and the diameter of the support shaft 5 is larger than the diameter of the support stud 6. The extrusion sleeve 9 can rotate and slide on the support shaft 5 to facilitate the subsequent pushing of the conveying side plate 10. At the same time, the extrusion sleeve 9 will not rub against the support stud 6.

[0027] The conveying side plate 10 forms a telescopic structure with the supporting spring body 14 and the supporting shaft body 5, and the conveying side plate 10 is provided with receiving square grooves 11 and translation rollers 12 at equal intervals, and the translation rollers 12 are connected to the conveying side plate 10 by a connecting shaft 13 in a rotational manner, and the diameter of the translation roller 12 is greater than the thickness of the conveying side plate 10. According to the translation roller 12 arranged on the conveying side plate 10, it is beneficial for the side surface of the semiconductor sheet to fit with the translation roller 12, and the whole can be clamped, and the rotation of the translation roller 12 will not affect the conveying work.

[0028] Working principle: According to Figure 1-5After the semiconductor material conveying assembly plate 1 is placed in the semiconductor sheet cutting and processing area through the anti-skid pad 2, the semiconductor sheet can be placed above the semiconductor material conveying assembly plate 1, so that the semiconductor sheet and the top surface of the supporting roller 4 are in contact with each other and supported to maintain stability. Then, according to the width of the semiconductor sheet, the adjusting sleeve joint 7 can be rotated through the anti-skid stripes 8, and the adjusting sleeve joint 7 can be rotated and moved on the supporting stud 6 to facilitate the adjusting sleeve joint 7 to drive the extrusion sleeve 9 to rotate and slide on the supporting shaft body 5, which is beneficial for the extrusion sleeve 9 to squeeze and push the conveying side plate 10, or loosen and separate the operation work, so that the conveying side plate 10 slides smoothly on the supporting shaft body 5 according to the supporting spring body 14, and the conveying side plate 10 drives the translation roller 12 to fit with the side of the semiconductor sheet to maintain the overall placement stability. Subsequently, the semiconductor sheet can be translated by the rotation of the supporting roller 4 and the translation roller 12, which is beneficial for the cutting and processing operation. The above is the working process of the entire device, and the contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor processing device, comprising a semiconductor material conveying assembly plate (1) and an anti-skid pad (2), characterized in that: The bottom surface of the semiconductor material conveying assembly plate (1) is bonded and fixed with anti-skid pads (2) at the four corners, and the semiconductor material conveying assembly plate (1) is provided with a combination square groove (3), and a support roller (4) is installed inside the combination square groove (3). A support shaft (5) is installed on the side of the frame of the semiconductor material conveying assembly plate (1), and a support stud (6) is arranged at the end center of the support shaft (5). An adjustment sleeve joint (7) is sleeved and installed on the outer side of the support stud joint (6), and the outer surface of the adjustment sleeve joint (7) is provided with anti-skid stripes (8). An extrusion sleeve (9) is arranged on the outer side of the center of the adjustment sleeve joint (7), and the extrusion sleeve ( 9) is sleeved and installed on the outer side of the support shaft (5) and the support stud (6), the support shaft (5) passes through the conveying side plate (10), and the outer surface of the conveying side plate (10) is connected to the outer surface of the extrusion sleeve (9), the conveying side plate (10) is provided with a receiving square groove (11), and a translation roller (12) is installed inside the receiving square groove (11), and the translation roller (12) is connected to the conveying side plate (10) through a connecting shaft (13), and a support spring body (14) is sleeved and installed on the outer side of the support shaft (5), and the support spring body (14) is located between the semiconductor material conveying assembly plate (1) and the conveying side plate (10).

2. A semiconductor processing equipment according to claim 1, characterized in that: The diameter of the support roller (4) is greater than the thickness of the semiconductor material conveying assembly plate (1), and the support roller (4) is connected to the semiconductor material conveying assembly plate (1) via the combined square groove (3) in the form of a rotating shaft, and the combined square groove (3) and the support roller (4) are evenly spaced on the semiconductor material conveying assembly plate (1).

3. A semiconductor processing equipment according to claim 1, characterized in that: The support shaft (5), the semiconductor material conveying assembly plate (1) and the support studs (6) are arranged as an integrated structure, and the support shaft (5) and the support studs (6) are symmetrically distributed on the semiconductor material conveying assembly plate (1).

4. A semiconductor processing equipment according to claim 1, characterized in that: The adjusting sleeve joint (7), the anti-slip stripes (8) and the extrusion sleeve (9) are arranged as an integrated structure, and the anti-slip stripes (8) are distributed at equal angles on the adjusting sleeve joint (7), and the connection method between the adjusting sleeve joint (7) and the supporting stud (6) is threaded connection.

5. The semiconductor processing equipment according to claim 1, characterized in that: The extrusion sleeve (9) and the support shaft (5) are connected in a rotational sliding manner, and the diameter of the support shaft (5) is greater than the diameter of the support stud (6).

6. The semiconductor processing equipment according to claim 1, characterized in that: The conveying side plate (10) forms a telescopic structure through a supporting spring body (14) and a supporting shaft body (5), and the conveying side plate (10) is provided with receiving square grooves (11) and translation rollers (12) at equal intervals, and the translation rollers (12) are connected to the conveying side plate (10) in a rotational manner through a connecting shaft (13), and the diameter of the translation roller (12) is greater than the thickness of the conveying side plate (10).

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