Material frame inspection device

Abstract

The utility model belongs to the technical field of semiconductors, and particularly discloses a material frame inspection device which comprises a supporting frame, the inner surface of the supporting frame is in sliding connection with a shifting table through a lifting mechanism, the top of the shifting table is rotationally connected with a half-tooth rotating table, the top of the half-tooth rotating table is fixedly connected with a table plate, and the table plate is fixedly connected with a base. The inner surface of the table plate is rotationally connected with a rotating shaft, and the outer surface of the rotating shaft is fixedly sleeved with an inspection table. According to the material frame inspection device, the inspection angle of the inspection table can be adjusted in the horizontal direction and the vertical direction through the redirection mechanism, the adaptability of the device is higher through the self-adaptive adjustment capacity, rapid adjustment can be achieved under different production batches or wafer sizes, and therefore comprehensive and accurate wafer inspection is guaranteed. For different types of wafers or wafers at different positions, an operator can conveniently adjust the inspection angle, so that the inspection efficiency and accuracy are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a material frame inspection device. Background Art

[0002] Wafers (i.e., silicon wafers) are the basic materials for semiconductor chip manufacturing, and their quality directly affects the performance and reliability of the final chip. Therefore, comprehensive inspection and evaluation of wafers can ensure that they meet strict quality standards.

[0003] Currently, when workers inspect wafers in cutting frames, the existing inspection jigs are not easy to change the inspection angle according to environmental changes. The difficult-to-adjust inspection jigs easily limit workers' effective inspection of wafers of different types or in different positions. Under different production batches or different wafer sizes, the inspection angle needs to be flexibly adjusted to ensure comprehensive and accurate inspection. Utility Model Content

[0004] In view of this, the purpose of the present invention is to solve the shortcomings of the background technology and to provide a material frame inspection device to solve the problems in the prior art.

[0005] To achieve the above purpose, the utility model provides a material frame inspection device, including a support frame, the inner surface of the support frame is slidably connected to a shift platform through a lifting mechanism, the top of the shift platform is rotatably connected to a semi-toothed rotary platform, the top of the semi-toothed rotary platform is fixedly connected to a table plate, the inner surface of the table plate is rotatably connected to a rotating shaft, the outer surface of the rotating shaft is fixedly sleeved with an inspection table, the semi-toothed rotary platform is provided with a redirecting mechanism for changing the angle of the inspection table, and the top of the inspection table is provided with a guide plate.

[0006] Preferably, the lifting mechanism includes a rack fixedly connected to the bottom of the shift platform, the inner surface of the support frame is rotatably connected to a rotating shaft, the outer surface of the rotating shaft is fixedly sleeved with a gear, and the outer surface of the gear is meshed with the outer surface of the rack. The height of the inspection platform can be adjusted by the lifting mechanism.

[0007] Preferably, a rotary disk is provided at one end of the rotary shaft away from the support frame, a plurality of through holes are provided on the outer surface of the rotary disk, a positioning rod is movably provided on the inner side of the rotary disk, and a positioning hole is provided on the outer surface of the support frame.

[0008] Preferably, the redirecting mechanism includes a first rotating rod rotatably connected to the top of the shifting platform, and a driving wheel is fixedly sleeved on the outer surface of the first rotating rod. The outer surface of the driving wheel is meshed and connected with the teeth of the semi-toothed rotating platform. The inspection angle of the inspection platform can be adjusted in the horizontal and vertical directions respectively through the redirecting mechanism.

[0009] Preferably, the top of the half-tooth rotary table is rotatably connected to a worm, and a second rotary rod is provided on the top of the worm.

[0010] Preferably, a worm wheel is fixedly connected to one end of the rotating shaft, and the outer surface of the worm wheel is meshedly connected with the outer surface of the worm.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] 1. The material frame inspection device uses a redirection mechanism to adjust the inspection platform's inspection angle in both the horizontal and vertical directions. This adaptive adjustment capability makes the device more adaptable, allowing for rapid adjustments to different production batches or wafer sizes, ensuring comprehensive and accurate wafer inspection. Whether for different wafer types or wafer positions, operators can easily adjust the inspection angle, improving inspection efficiency and accuracy.

[0013] 2. The material frame inspection device can accurately adjust the height of the inspection table through the lifting mechanism, thereby ensuring that the distance and angle between the inspection table and the wafer are within the ideal range. This is particularly important for accurately measuring and inspecting wafer surface features (such as flatness, surface defects, etc.). Height adjustment can eliminate measurement errors that may be caused by inaccurate positioning, thereby improving the accuracy of inspection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of this application;

[0015] Figure 2 This is a schematic diagram of the internal structure of the support frame of this application;

[0016] Figure 3 This is a schematic diagram of the surface structure of the turntable of this application;

[0017] Figure 4 This is a schematic diagram of the surface structure of our semi-tooth rotary table.

[0018] Among them: 1. Support frame; 2. Shifting platform; 3. Rack; 4. Rotary axis; 5. Gear; 6. Rotary disk; 7. Perforation; 8. Positioning rod; 9. Positioning hole; 10. Half-tooth rotary table; 11. Table; 12. Rotating axis; 13. Inspection table; 14. Guide plate; 15. First rotary rod; 16. Drive wheel; 17. Worm; 18. Second rotary rod; 19. Worm wheel. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] See also Figure 1-4 A material frame inspection device includes a support frame 1, the inner surface of the support frame 1 is slidably connected to a shift platform 2 through a lifting mechanism, the top of the shift platform 2 is rotatably connected to a semi-toothed rotary platform 10, the top of the semi-toothed rotary platform 10 is fixedly connected to a table plate 11, the inner surface of the table plate 11 is rotatably connected to a rotating shaft 12, the outer surface of the rotating shaft 12 is fixedly sleeved with an inspection table 13, a redirecting mechanism for changing the angle of the inspection table 13 is provided on the semi-toothed rotary platform 10, and a guide plate 14 is provided on the top of the inspection table 13.

[0021] Through the above technical solution, in the process of inspecting the wafers in the cutting frame, the frame must first be placed on the inspection table 13, and the guide plate 14 can take out and put in the wafers in the frame. During the inspection process, the height of the inspection table 13 can be adjusted through the lifting mechanism, and the inspection angle of the inspection table 13 can be adjusted through the redirection mechanism.

[0022] Specifically, the lifting mechanism includes a rack 3 fixedly connected to the bottom of the shift platform 2, the inner surface of the support frame 1 is rotatably connected to the rotary shaft 4, the outer surface of the rotary shaft 4 is fixedly sleeved with a gear 5, and the outer surface of the gear 5 is meshed with the outer surface of the rack 3.

[0023] Through the above technical solution, the rotating shaft 4 can drive the gear 5 to rotate synchronously during the rotation process. During this process, the gear 5 will drive the rack 3 meshing with it to move up and down.

[0024] Specifically, a rotary disk 6 is provided at one end of the rotary shaft 4 away from the support frame 1 , and a plurality of through holes 7 are provided on the outer surface of the rotary disk 6 . A positioning rod 8 is movably provided on the inner side of the rotary disk 6 , and a positioning hole 9 is provided on the outer surface of the support frame 1 .

[0025] Through the above technical solution, the positioning rod 8 can pass through the through hole 7 and enter the positioning hole 9, thereby limiting the rotating disk 6.

[0026] Specifically, the redirection mechanism includes a first rotary rod 15 rotatably connected to the top of the shifting platform 2 , and a driving wheel 16 is fixedly sleeved on the outer surface of the first rotary rod 15 , and the outer surface of the driving wheel 16 is meshed with the teeth of the semi-toothed rotary platform 10 .

[0027] Through the above technical solution, the teeth of the driving wheel 16 and the half-toothed rotary table 10 are in the same horizontal plane, so the driving wheel 16 can drive the half-toothed rotary table 10 meshing therewith to rotate during the rotation process.

[0028] Specifically, a worm 17 is rotatably connected to the top of the half-tooth rotary table 10 , and a second rotary rod 18 is provided on the top of the worm 17 .

[0029] Through the above technical solution, rotating the second rotating rod 18 can drive the worm 17 to rotate, and during this process, the worm wheel 19 meshing with it will rotate accordingly.

[0030] Specifically, a worm gear 19 is fixedly connected to one end of the rotating shaft 12 , and an outer surface of the worm gear 19 is meshed with an outer surface of the worm 17 .

[0031] Through the above technical solution, the worm gear 19 will drive the rotating shaft 12 to rotate synchronously during the rotation process, so that the entire inspection table 13 can be flipped and the angle can be adjusted.

[0032] Working principle: During the inspection of the wafers in the cutting frame, the device can adjust the height and angle of the inspection platform 13 respectively. When adjusting the height of the inspection platform 13, the rotary disk 6 can be rotated to drive the rotary shaft 4 to rotate. During this process, the gear 5 rotates synchronously, and the rack 3 meshing with it will move in the vertical direction under the drive of the gear 5, thereby driving the shift platform 2 to move longitudinally synchronously until the inspection platform 13 above the shift platform 2 is moved to a suitable height. At this time, the positioning rod 8 can be passed through the corresponding through-hole 7 on the rotary disk 6 and finally inserted into the positioning hole 9. The rotary disk 6 is braked by the positioning rod 8 to prevent the shift platform 2 from deviating. When the inspection platform 13 is adjusted, the positioning rod 8 can be used to adjust the height of the inspection platform 13. When the angle is adjusted, the first rotary rod 15 can be rotated to drive the driving wheel 16 to rotate. The driving wheel 16 will drive the half-tooth rotary table 10 meshing with it to rotate, that is, the inspection table 13 will rotate in the horizontal direction to adjust the inspection angle in the horizontal direction. When the second rotary rod 18 is rotated to drive the worm 17 to rotate, the worm wheel 19 meshing with the worm 17 will rotate accordingly and drive the rotating shaft 12 to rotate synchronously. At this time, the inspection table 13 will flip over at a corresponding angle as the rotating shaft 12 rotates, thereby changing the inspection angle of the inspection table 13 in the vertical direction. At this point, the entire inspection table 13 can be adjusted in the horizontal and vertical directions respectively.

[0033] In summary, the wafer inspection device in this application significantly improves inspection efficiency and accuracy by enhancing adjustment capabilities and operational convenience, thereby improving the overall production process and product quality control.

[0034] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A material frame inspection device, comprising a support frame (1), characterized in that: The inner surface of the support frame (1) is slidably connected to a shifting platform (2) via a lifting mechanism; the top of the shifting platform (2) is rotatably connected to a semi-toothed rotary platform (10); the top of the semi-toothed rotary platform (10) is fixedly connected to a table plate (11); the inner surface of the table plate (11) is rotatably connected to a rotating shaft (12); an inspection table (13) is fixedly sleeved on the outer surface of the rotating shaft (12); a redirecting mechanism for changing the angle of the inspection table (13) is provided on the semi-toothed rotary platform (10); and a guide plate (14) is provided on the top of the inspection table (13).

2. A material frame inspection device according to claim 1, characterized in that: The lifting mechanism comprises a rack (3) fixedly connected to the bottom of the shifting platform (2); the inner surface of the support frame (1) is rotatably connected to a rotating shaft (4); the outer surface of the rotating shaft (4) is fixedly sleeved with a gear (5); and the outer surface of the gear (5) is meshingly connected to the outer surface of the rack (3).

3. A material frame inspection device according to claim 2, characterized in that: A rotary disk (6) is arranged at one end of the rotary shaft (4) away from the support frame (1); a plurality of groups of through holes (7) are provided on the outer surface of the rotary disk (6); a positioning rod (8) is movably provided on the inner side of the rotary disk (6); and a positioning hole (9) is provided on the outer surface of the support frame (1).

4. A material frame inspection device according to claim 1, characterized in that: The redirection mechanism comprises a first rotary rod (15) rotatably connected to the top of the shifting platform (2); a driving wheel (16) is fixedly sleeved on the outer surface of the first rotary rod (15); and the outer surface of the driving wheel (16) is meshedly connected with the teeth of the semi-tooth rotary platform (10).

5. A material frame inspection device according to claim 1, characterized in that: The top of the semi-tooth rotary table (10) is rotatably connected to a worm (17), and the top of the worm (17) is provided with a second rotary rod (18).

6. A material frame inspection device according to claim 5, characterized in that: A worm wheel (19) is fixedly connected to one end of the rotating shaft (12), and the outer surface of the worm wheel (19) is meshingly connected with the outer surface of the worm (17).

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