Tray and wafer measuring equipment

Abstract

The utility model belongs to the technical field of wafer measurement, and particularly relates to a tray and wafer measurement equipment. The tray is used for fixing a wafer, the wafer comprises a straight line edge and an arc line edge, and the tray comprises a substrate and a limiting ring; the substrate is used for bearing a wafer; the limiting ring is made of a macromolecular elastic material; the limiting ring comprises an abutting part and a deformation part, the abutting part is fixed to the substrate, and the deformation part is movably arranged on the substrate; the wafer can abut against the inner side wall of the limiting ring and enables the deformation part to deform, and the deformation part generates resilience force so as to fix the wafer. Deformation is generated through the deformation part, the tray can fix wafers of multiple sizes respectively, the universality of the measurement equipment is improved, and the wafer measurement cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer measurement, in particular to a tray and wafer measurement equipment. Background Art

[0002] In the semiconductor manufacturing process, the same wafer measurement equipment is usually not compatible with wafers of all sizes. Due to cost requirements, it is often necessary to measure small-sized wafers (such as 4 inches) on the measurement equipment that measures large-sized wafers (such as 12 inches).

[0003] Since the electrostatic chuck in the equipment cavity only supports the fixed placement of large-sized wafers, it cannot be fixed if a small-sized wafer is placed, causing the small-sized wafer to shake in the measurement cavity, making the small-sized wafer unable to be measured and easily damaged; if you purchase measurement equipment that supports small-sized wafers, the cost will increase. Utility Model Content

[0004] The utility model aims to provide a tray and a wafer measuring device to solve the problem in the prior art that small-sized wafers cannot be fixed on an electrostatic chuck, resulting in the small-sized wafers being unable to be measured and being easily damaged; the problem that purchasing a measuring device that supports small-sized wafers will increase the cost, thereby improving the versatility of the wafer measuring device and reducing the wafer measurement cost.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A tray for fixing a wafer, wherein the wafer comprises a straight edge and an arc edge, and the tray comprises:

[0007] A substrate and a limiting ring, wherein the substrate is used to support the wafer; the limiting ring is made of a polymer elastic material; the limiting ring comprises an abutting portion and a deformation portion, wherein the abutting portion is fixed on the substrate, and the deformation portion is movably arranged on the substrate; the wafer can abut against the inner side wall of the limiting ring and cause the deformation portion to deform, and the deformation portion generates a rebound force to fix the wafer.

[0008] As an optional technical solution for the pallet, an arc groove is provided on the limiting ring, and a line connecting the center of the limiting ring to the two ends of the arc groove, including the portion of the arc groove, is the deformation portion, and the rest of the limiting ring is the abutment portion.

[0009] As an optional technical solution for the pallet, two arc-shaped grooves are arranged at intervals along the radial direction of the limiting ring, and a support bar is formed between the two arc-shaped grooves, and the support bar can increase the deformation range of the deformation part.

[0010] As an optional technical solution for the pallet, the support bar is provided with a notch, which separates the support bar into a first support bar and a second support bar. The first support bar and the second support bar have the same length, and the notch can increase the deformation range of the deformation part.

[0011] As an optional technical solution for the tray, the tray also includes a positioning block, which is arranged between the inner arc groove and the wafer. The positioning block corresponds to the position of the notch, and the wafer can abut against the positioning block.

[0012] As an optional technical solution for the pallet, limiting structures are provided at both ends of the positioning block to prevent the positioning block from being separated from the limiting ring.

[0013] As an optional technical solution for the tray, the inner side wall of the limiting ring is provided with a plurality of abutment blocks at intervals around the axial direction of the limiting ring, and the abutment blocks can abut against the side wall of the wafer.

[0014] As an optional technical solution for the tray, three abutment blocks are provided, including a first abutment block, a second abutment block and a third abutment block. The second abutment block and the third abutment block are of the same size and are arranged in parallel. The first abutment block is used to abut the arc edge of the wafer, and the second abutment block and the third abutment block are used to abut the straight edge of the wafer.

[0015] As an optional technical solution for the tray, the abutting portion and the substrate are glued together.

[0016] Wafer measurement equipment, including the tray described in any of the above solutions.

[0017] Beneficial effects of the utility model:

[0018] The utility model provides a tray, the tray is used to fix the wafer, the wafer includes a straight edge and an arc edge, the tray includes a substrate and a limiting ring; the substrate is used to carry the wafer; the limiting ring is made of a polymer elastic material; the limiting ring includes an abutting portion and a deformation portion, the abutting portion is fixed on the substrate, and the deformation portion is movably arranged on the substrate; the wafer can abut against the inner side wall of the limiting ring and cause the deformation portion to deform, and the deformation portion generates a rebound force to fix the wafer. Through the deformation of the deformation portion, the tray can fix wafers of multiple sizes respectively, improve the versatility of the measuring equipment, and reduce the wafer measurement cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0020] Figure 1 It is an axonometric view of a pallet provided in an embodiment of the utility model;

[0021] Figure 2 It is a top view of a tray provided in an embodiment of the utility model.

[0022] In the figure:

[0023] 100. Wafer;

[0024] 10. substrate; 20. limiting ring; 21. arc groove; 22. first support bar; 23. second support bar; 24. positioning block; 25. first abutting block; 26. second abutting block; 27. third abutting block. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0026] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0028] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0029] In the prior art, it is often necessary to measure small-sized (such as 4-inch) wafers on measuring equipment that measures large-sized (such as 12-inch) wafers. Since the electrostatic chuck in the equipment cavity only supports the fixed placement of large-sized wafers, if a small-sized wafer is placed, it cannot be fixed, causing the small-sized wafer to shake in the measurement cavity, resulting in the small-sized wafer being unable to be measured and easily damaged. Purchasing measuring equipment that supports small-sized wafers will increase costs.

[0030] To solve the above problems, this embodiment provides a wafer measurement device, including a tray. Figure 1 and Figure 2 The tray is used to fix the wafer 100, and the wafer 100 includes a straight edge and an arc edge. The tray includes a substrate 10 and a limiting ring 20, and the substrate 10 is used to carry the wafer 100; the limiting ring 20 is made of a polymer elastic material, such as TPE (Thermoplastic Elastomer) or EPDM (Ethylene Propylene Diene Monomer), etc., and the polymer elastic material has good tensile strength; the limiting ring 20 includes an abutting portion and a deformation portion, the abutting portion is fixed on the substrate 10, and the deformation portion can be movably arranged on the substrate 10; the wafer 100 can abut against the inner side wall of the limiting ring 20 and cause the deformation portion to deform, and the deformation portion generates a rebound force to fix the wafer 100. Through the deformation of the deformation portion, the tray can fix wafers 100 of multiple sizes respectively, improve the versatility of the measuring equipment, and reduce the measurement cost of the wafer 100.

[0031] In this embodiment, the abutting portion is glued to the substrate 10. In other embodiments, the abutting portion and the substrate 10 may also be fixed by a clamp or a binding. Further, the size of the substrate 10 is the same as the size of the largest wafer 100, and the size of the hollow part of the limiting ring 20 is the same as the size of the smallest wafer 100.

[0032] Furthermore, the limiting ring 20 is provided with an arc groove 21, and the part including the arc groove 21 is the deformation part, and the rest of the limiting ring 20 is the abutment part. After the arc groove 21 is provided on the limiting ring 20, the parts on both sides of the arc groove 21 will become thinner, and the corresponding wider ring will also have increased elasticity, which is conducive to accommodating large-sized wafers 100 and increasing the deformation range of the limiting ring 20. In other embodiments, the deformation part can also be set as a plurality of rubber bands or springs.

[0033] Furthermore, two arc-shaped grooves 21 are provided at intervals along the radial direction of the limiting ring 20, and a support bar is formed between the two arc-shaped grooves 21, and the support bar can increase the deformation range of the deformation part. Specifically, the support bar is provided with a notch, and the notch separates the support bar into a first support bar 22 and a second support bar 23, and the first support bar 22 and the second support bar 23 have the same length, and the notch can increase the deformation range of the deformation part.

[0034] Furthermore, the tray further includes a positioning block 24, which is disposed between the inner arc groove 21 and the wafer 100. The positioning block 24 corresponds to the position of the notch, and the wafer 100 can abut against the positioning block 24. The positioning block 24 is used to abut against the wafer 100, thereby reducing the contact area between the wafer 100 and the limiting ring 20, and preventing the wafer 100 from being embedded in the side wall of the limiting ring 20 or being too tightly attached to the side wall of the limiting ring 20, which makes it difficult to place or remove the wafer 100.

[0035] Furthermore, limiting structures are provided at both ends of the positioning block 24 to prevent the positioning block 24 from being separated from the limiting ring 20. In this embodiment, the positioning block 24 is set to be U-shaped, and the closed end of the positioning block 24 faces the notch, and a chamfered structure inclined from the inside of the positioning block 24 to the outside is provided at the U-shaped opening to abut against the inner wall of the limiting ring 20, thereby preventing the positioning block 24 from being separated from the limiting ring 20. In other embodiments, the positioning block 24 can also be glued to the limiting ring 20.

[0036] Furthermore, a plurality of abutment blocks are arranged at intervals around the axial direction of the limiting ring 20 on the inner side wall of the limiting ring 20, and the abutment blocks can abut against the side wall of the wafer 100. Specifically, there are three abutment blocks, all of which are semicircular protruding blocks, including a first abutment block 25, a second abutment block 26 and a third abutment block 27, and the second abutment block 26 and the third abutment block 27 are of the same size and arranged in parallel; the first abutment block 25 is used to abut against the arc edge of the wafer 100, and the tangents of the second abutment block 26 and the third abutment block 27 are connected as a straight line, so the second abutment block 26 and the third abutment block 27 are used to abut against the straight edge of the wafer 100.

[0037] When the tray provided in this embodiment is in use, the positioning block 24 is first moved radially out along the limiting ring 20 by hand, and then the wafer 100 is placed in the ring of the limiting ring 20 and abuts against the first abutment block 25, the second abutment block 26 and the third abutment block 27. Then, the hands are slowly released to allow the deformation portion to rebound with the positioning block 24 and abut against the wafer 100. At this time, the wafer 100 is fixed on the substrate 10.

[0038] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A tray for fixing a wafer (100), wherein the wafer (100) comprises a straight edge and an arc edge, characterized in that: The tray comprises: A substrate (10), the substrate (10) being used to carry the wafer (100); A limiting ring (20), wherein the limiting ring (20) is made of a polymer elastic material; the limiting ring (20) comprises a contact portion and a deformation portion, wherein the contact portion is fixed on the substrate (10), and the deformation portion is movably arranged on the substrate (10); the wafer (100) can contact the inner side wall of the limiting ring (20) and cause the deformation portion to deform, and the deformation portion generates a rebound force to fix the wafer (100).

2. The pallet according to claim 1, characterized in that: The limiting ring (20) is provided with an arc-shaped groove (21), and a line connecting the center of the limiting ring (20) to the two ends of the arc-shaped groove (21) includes a portion including the arc-shaped groove (21) as the deformation portion, and the rest of the limiting ring (20) as the abutment portion.

3. The pallet according to claim 2, characterized in that: Two arc-shaped grooves (21) are arranged at intervals along the radial direction of the limiting ring (20), and a support bar is formed between the two arc-shaped grooves (21), and the support bar can increase the deformation range of the deformation part.

4. The pallet according to claim 3, characterized in that: The support bar is provided with a notch, the notch separates the support bar into a first support bar (22) and a second support bar (23), the first support bar (22) and the second support bar (23) have the same length, and the notch can increase the deformation range of the deformation part.

5. The pallet according to claim 4, characterized in that: The tray further comprises a positioning block (24), wherein the positioning block (24) is arranged between the inner arc-shaped groove (21) and the wafer (100), the positioning block (24) corresponds to the position of the notch, and the wafer (100) can abut against the positioning block (24).

6. The pallet according to claim 5, characterized in that: Limiting structures are provided at both ends of the positioning block (24) to prevent the positioning block (24) from detaching from the limiting ring (20).

7. The pallet according to any one of claims 1 to 6, characterized in that: The inner side wall of the limiting ring (20) is provided with a plurality of abutment blocks at intervals around the axial direction of the limiting ring (20), and the abutment blocks are all capable of abutting against the side wall of the wafer (100).

8. The pallet according to claim 7, characterized in that: The abutment blocks are provided in three numbers, including a first abutment block (25), a second abutment block (26) and a third abutment block (27); the second abutment block (26) and the third abutment block (27) are of the same size and are arranged in parallel; the first abutment block (25) is used to abut the arc edge of the wafer (100); the second abutment block (26) and the third abutment block (27) are used to abut the straight edge of the wafer (100).

9. The pallet according to any one of claims 1 to 6, characterized in that: The abutting portion is glued to the substrate (10).

10. Wafer measurement equipment, characterized in that Comprising a pallet as described in any one of claims 1-9.

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