Double-sided aluminum-based aluminum-coated plate
By adopting the structure of aluminum plate and aluminum foil circuit board, combined with thermal adhesive and anti-oxidation layer, the problems of insufficient hardness, poor heat dissipation performance and easy oxidation of aluminum-based aluminum-clad aluminum plates are solved, and better conductive effect, anti-oxidation performance and thermal diffusion ability are achieved.
Patent Information
- Application Number
- CN202421287344.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-06
- Publication Date
- 2025-05-09
- Estimated Expiration
- 2034-06-06
AI Technical Summary
During the use of existing aluminum-based aluminum-covered plates, there are problems such as insufficient hardness of aluminum, insufficient heat dissipation performance, and prone to oxidation.
The structure of an aluminum plate and an aluminum foil circuit board is adopted. The aluminum foil circuit board includes an aluminum foil and a sandwich circuit board. The aluminum foil bonding surface is provided with a thermal adhesive, connected to the aluminum plate and aluminum foil through the first and second connecting sheets, and an anti-oxidation layer is provided on the upper end surface of the aluminum foil, and high-temperature and high-pressure compression is carried out through an external press.
It improves the conductivity and anti-oxidation performance of aluminum-based aluminum-covered aluminum plate, enhances the thermal diffusion ability, improves the thermal conductivity and product reliability, and extends the service life.
Smart Images

Figure CN222852440U_ABST
Abstract
Description
Technical Field
[0001] The utility model is applied to the technical field of aluminum-based aluminum-clad plates, and particularly relates to a double-sided aluminum-based aluminum-clad plate. Background Art
[0002] Aluminum-based aluminum-clad plate, also known as aluminum substrate, is a kind of metal raw material. It is a plate-like material made of electronic fiberglass cloth or other reinforcing materials impregnated with resin, single resin, etc. as an insulating adhesive layer, covered with aluminum foil on one side or both sides and pressed under high temperature and high pressure. It is usually called a double-sided aluminum-based aluminum-clad plate. In the use of this type of material, there are high requirements for the thermal insulation and antioxidant properties of the plate. At present, the products on the market generally have problems such as insufficient hardness of aluminum, poor heat dissipation performance, and easy oxidation. If a double-sided aluminum-based aluminum-clad plate with a simple structure, good conductivity, and good anti-oxidation effect can be designed, the above problems can be solved. Utility Model Content
[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a double-sided aluminum-based aluminum-clad plate with a simple structure, good conductive effect and good anti-oxidation effect.
[0004] The technical solution adopted by the utility model is: the utility model includes an aluminum plate and an aluminum foil circuit board, the aluminum foil circuit board includes aluminum foil and a sandwich circuit board, the aluminum foil bonding surface is provided with a layer of heat-conductive adhesive, the lower end surface of the sandwich circuit board is connected to the aluminum plate bonding surface through a first connecting piece, the upper end surface of the sandwich circuit board is connected to the lower end surface of the aluminum foil through a second connecting piece, the aluminum foil is bonded to the aluminum plate, and the upper end surface of the aluminum foil is provided with an anti-oxidation layer.
[0005] Furthermore, the corresponding surfaces of the aluminum plate and the aluminum foil are both provided with brushed surfaces.
[0006] Furthermore, the aluminum plate is provided with a plurality of positioning holes, and the aluminum foil is provided with a plurality of positioning protrusions, and the plurality of positioning protrusions are limitedly matched with the plurality of positioning holes.
[0007] Furthermore, the aluminum foil bonding surface and the aluminum plate bonding surface are pressed together by an external pressing machine.
[0008] Furthermore, the thickness of the aluminum foil circuit board is 20±2 μm.
[0009] The beneficial effects of the utility model are as follows: the aluminum plate is used as a substrate, and is combined with the interlayer circuit board, the first connecting piece, and the second connecting piece to be pressed together with the aluminum foil, which can provide a better effect on heat diffusion. By subjecting the aluminum plate and the aluminum foil bonding surfaces to wire drawing and degreasing and cleaning, the thermally conductive adhesive can be better bonded. The double-sided aluminum-based aluminum-clad plate adopts a 1.2W / mk thermally conductive adhesive, which has better thermal conductivity. A limiting mechanism can ensure that the aluminum plate and the aluminum foil can be completely bonded together, so that the pressing effect is better. The use of 5052-H111 aluminum material with high precision and good surface quality has better performance, improves product power density and reliability, and extends product service life. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 It is a three-dimensional view of the utility model;
[0011] Figure 2 It is a cross-sectional view of the hidden structure of the utility model. DETAILED DESCRIPTION
[0012] like Figure 1 to Figure 2 As shown, in this embodiment, the utility model includes an aluminum plate 1 and an aluminum foil circuit board 2, the aluminum foil circuit board 2 includes an aluminum foil 3 and a sandwich circuit board 4, the aluminum foil 3 is provided with a layer of heat-conducting adhesive 5 on the bonding surface, the lower end surface of the sandwich circuit board 4 is connected to the bonding surface of the aluminum plate 1 through a first connecting piece 6, the upper end surface of the sandwich circuit board 4 is connected to the lower end surface of the aluminum foil 3 through a second connecting piece 7, the aluminum foil 3 is bonded to the aluminum plate 1, and the upper end surface of the aluminum foil 3 is provided with an anti-oxidation layer 8. It can be seen that by using the aluminum plate 1 as a substrate, and combining the sandwich circuit board 4, the first connecting piece 6, and the second connecting piece 7 to press the aluminum foil 3, it can provide a better effect on heat diffusion, can reduce the temperature generated during product operation, improve product performance and reliability, and can extend the service life of the product at a lower cost.
[0013] like Figure 1 to Figure 2 As shown, in this embodiment, the corresponding surfaces of the aluminum plate 1 and the aluminum foil 3 are both provided with a brushed surface. It can be seen that by brushing and degreasing the bonding surfaces of the aluminum plate 1 and the aluminum foil 3, the thermal conductive adhesive 5 can be better bonded.
[0014] like Figure 2 As shown, in this embodiment, the aluminum plate 1 is provided with a plurality of positioning holes 9, and the aluminum foil 3 is provided with a plurality of positioning protrusions 10, and the plurality of positioning protrusions 10 are limitedly matched with the plurality of positioning holes 9. It can be seen that the plurality of positioning protrusions 10 and the plurality of positioning holes 9 can ensure that the aluminum plate 1 and the aluminum foil 3 can be completely attached to prevent deviation.
[0015] like Figure 1 to Figure 2 As shown, in this embodiment, the bonding surface of the aluminum foil 3 and the aluminum plate 1 are pressed together by an external pressing machine. It can be seen that the external pressing machine generates high temperature and high pressure to press the aluminum plate 1 and the aluminum foil circuit board 2 together.
[0016] like Figure 1 As shown, in this embodiment, the thickness of the aluminum foil circuit board 2 is 20±2μm. It can be seen that the thickness of the aluminum foil circuit board 2 is 20±2μm, and the performance is better. The aluminum plate 1 is made of 5052-H111 aluminum material with high precision and good surface quality, which can ensure the performance of the product and have a longer service life.
[0017] The working principle of the utility model is as follows: 1.2W / mk thermal conductive adhesive is coated on the bonding surface of the aluminum foil 3 after degreasing, cleaning and wire drawing to make a sheet of aluminum foil resin glue (ACC), and then the sandwich circuit board 4 is respectively connected to the aluminum plate 1 and the bonding surface of the aluminum foil 3, and positioned by a positioning mechanism, and the anti-oxidation layer 8 is placed on the upper end surface of the aluminum foil 3, and then an external high-temperature and high-pressure pressing machine is used to form the aluminum plate 1, the sandwich circuit board 4, the aluminum foil 3 and the anti-oxidation layer 8 into a whole to make a double-sided aluminum-based aluminum-clad plate.
[0018] Although the embodiments of the present invention are described with practical solutions, they do not constitute limitations on the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.
Claims
1. A double-sided aluminum-based aluminum-clad plate, comprising an aluminum plate (1) and an aluminum foil circuit board (2), characterized in that: The aluminum foil circuit board (2) comprises an aluminum foil (3) and a sandwich circuit board (4); a layer of heat-conducting adhesive (5) is provided on the bonding surface of the aluminum foil (3); the lower end surface of the sandwich circuit board (4) is connected to the bonding surface of the aluminum plate (1) via a first connecting piece (6); the upper end surface of the sandwich circuit board (4) is connected to the lower end surface of the aluminum foil (3) via a second connecting piece (7); the aluminum foil (3) is bonded to the aluminum plate (1); and an anti-oxidation layer (8) is provided on the upper end surface of the aluminum foil (3).
2. A double-sided aluminum-based aluminum-clad plate according to claim 1, characterized in that: The corresponding surfaces of the aluminum plate (1) and the aluminum foil (3) that are bonded to each other are both provided with brushed surfaces.
3. The double-sided aluminum-based aluminum-clad plate according to claim 1, characterized in that: The aluminum plate (1) is provided with a plurality of positioning holes (9), and the aluminum foil (3) is provided with a plurality of positioning protrusions (10), and the plurality of positioning protrusions (10) are limitedly matched with the plurality of positioning holes (9).
4. The double-sided aluminum-based aluminum-clad plate according to claim 1, characterized in that: The bonding surface of the aluminum foil (3) and the bonding surface of the aluminum plate (1) are pressed together by an external pressing machine.
5. The double-sided aluminum-based aluminum-clad plate according to claim 1, characterized in that: The thickness of the aluminum foil circuit board (2) is 20±2 μm.