Base material processing system

Abstract

The utility model provides a base material processing system which comprises a pay-off mechanism configured to drive a base material to move in the running direction of a production line; the cleaning mechanism is arranged on the downstream of the pay-off mechanism in the moving direction of the base material; the cleaning mechanism comprises a cleaning cavity and a cleaning unit arranged in the cleaning cavity; the cleaning cavity is provided with a base material inlet and a base material outlet which are oppositely arranged, and a base material passes through the cleaning cavity; and the cleaning unit is configured to clean the base material passing through the cleaning cavity. The cleaning mechanism is arranged before the base material is subjected to annealing operation or other operations, and the cleaning unit is used for removing impurities such as solid particles, oil stains and oxidation films on the surface of the base material, so that the base material is kept in a clean state and enters a subsequent processing procedure, the stability of the base material is improved, and the production quality of photovoltaic welding strip products is ensured.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic modules, and in particular to a substrate processing system. Background Art

[0002] Photovoltaic welding ribbon is an important component of solar photovoltaic modules. It is mainly used to connect solar cells to form circuits so that current can flow. Photovoltaic welding ribbon consists of a base material and a surface coating. The base material is copper material of different sizes with good conductivity and strength. The coating is a coating material such as tin alloy, which is evenly coated on the surface of the base material in a certain proportion and thickness. In product applications, the conductivity of photovoltaic welding ribbon directly affects the performance of the product. High-quality photovoltaic welding ribbon can reduce resistance loss and improve current transmission efficiency.

[0003] In the current substrate processing system, the substrate is directly sent to the annealing machine for annealing after being drawn by the wire drawing machine. Since the substrate is exposed to the production environment for a long time, its surface is easily oxidized to form an oxide film or is easily attached by dirt, resulting in impurities being doped in the substrate. In this way, the substrate will be affected by the impurities in the subsequent annealing operation, resulting in unstable organizational structure and affecting the mechanical properties of the substrate. In addition, due to the presence of impurities, when the substrate enters the coating operation after annealing, problems such as difficulty in coating or uneven coating will occur, affecting the production quality of the welding strip products.

[0004] Therefore, how to provide a processing system for removing impurities in a substrate before further processing is a technical problem that those skilled in the art need to solve urgently. Utility Model Content

[0005] The present application provides a substrate processing system, which realizes the cleaning of surface impurities of the substrate.

[0006] The substrate processing system comprises:

[0007] A wire-paying mechanism, configured to drive the substrate to move along the running direction of the production line;

[0008] The cleaning mechanism is arranged downstream of the pay-off mechanism along the moving direction of the substrate; the cleaning mechanism comprises: a cleaning cavity and a cleaning unit arranged in the cleaning cavity; the cleaning cavity has a substrate inlet and a substrate outlet arranged opposite to each other, and is configured for allowing the substrate to pass through the cleaning cavity; the cleaning unit is configured to clean the substrate passing through the cleaning cavity.

[0009] Preferably, the cleaning unit comprises an air knife configured to use airflow to blow away impurities on the surface of the substrate; wherein the air knife does not generate heat in the process of generating the airflow, thereby avoiding deformation and damage of the substrate material.

[0010] Specifically, the cleaning mechanism further includes: a housing; the housing defines a cleaning cavity;

[0011] Air Knife includes:

[0012] ontology;

[0013] an air inlet, disposed on the main body and extending through one side of the housing in a direction away from the main body, configured to introduce an external wind source;

[0014] an air duct, which runs through the body and is configured to allow the substrate to pass through and guide the airflow generated by the external wind source from the air inlet to the air outlet to blow away impurities on the surface of the substrate;

[0015] The air outlet is arranged on the main body and communicated with the substrate inlet and / or the substrate outlet, and is configured to discharge the airflow and surface impurities of the substrate.

[0016] Optionally, the wind knife includes at least one of a circular wind knife and a square wind knife; wherein, the square wind knife is convenient for threading, but the directional airflow intensity it generates is relatively large. If the width of the substrate is narrow, it will cause excessive force on the substrate, affecting the mechanical properties of the substrate; compared with the square wind knife, the circular wind knife can generate a uniform 360° annular airflow, which can cover the surface of the substrate to provide a comprehensive cleaning effect, and the circular wind knife is easier to maintain and has a lower cost than the square wind knife.

[0017] Specifically, the pay-off mechanism includes:

[0018] a pay-off roller configured to wind a substrate;

[0019] A tension unit is configured to apply tension to support the substrate released by the pay-off roller; the tension unit includes a plurality of first guide wheels and a plurality of second guide wheels; the number of the second guide wheels is greater than the number of the first guide wheels, and the second guide wheels are arranged above the first guide wheels along the longitudinal direction of the pay-off mechanism; wherein the substrate is wound around the first guide wheels and the second guide wheels;

[0020] The driving unit is configured to control the pay-off roller to rotate at a preset speed to move the substrate.

[0021] Specifically, the substrate processing system further includes: an annealing mechanism, which is disposed downstream of the cleaning mechanism along the moving direction of the substrate and is configured to perform an annealing operation on the substrate after the cleaning operation;

[0022] The annealing mechanism comprises a first roller and a second roller, wherein the first roller is connected to the positive pole of an external power source, and the second roller is connected to the negative pole of the external power source; wherein the substrate passes through the first roller and the second roller in sequence.

[0023] Specifically, the substrate processing system also includes:

[0024] The coating mechanism is arranged downstream of the annealing mechanism along the moving direction of the substrate, and is configured to perform a coating covering operation on the substrate after the annealing operation.

[0025] Preferably, the substrate processing system further comprises:

[0026] The protection mechanism is connected to the annealing mechanism and the coating mechanism respectively, and is configured to allow the substrate after the annealing operation to pass through and enter the coating mechanism, and is also configured to provide inert gas to isolate the substrate after the annealing operation from the air; wherein the setting of the protection mechanism can prevent oxidation of the substrate and other chemical reactions, and can also ensure that the substrate remains clean and dry before entering the coating operation, thereby improving the stability of the quality of the welding strip.

[0027] Specifically, the protection agencies include:

[0028] tube body;

[0029] The tube body defines a receiving cavity, and is configured to allow the inert gas to flow in the receiving cavity; the receiving cavity has a tube body inlet and a tube body outlet that are arranged opposite to each other, and is configured to allow the substrate after the annealing operation to pass through the receiving cavity;

[0030] An inert gas inlet is disposed on one side of the tube body and communicated with the accommodating chamber, and is configured to provide inert gas to the accommodating chamber;

[0031] The inert gas outlet is arranged on the other side of the tube body and communicated with the accommodating cavity, and is configured to allow the inert gas to flow out of the accommodating cavity.

[0032] Specifically, the substrate processing system also includes:

[0033] The winding mechanism is arranged downstream of the coating mechanism along the moving direction of the substrate, and is configured to perform a winding operation on the substrate after the coating operation.

[0034] The present application provides a substrate processing system, including: a pay-off mechanism, configured to drive the substrate to move along the direction of the production line; a cleaning mechanism, arranged downstream of the pay-off mechanism along the moving direction of the substrate; the cleaning mechanism includes: a cleaning chamber and a cleaning unit arranged in the cleaning chamber; the cleaning chamber has a substrate inlet and a substrate outlet arranged relatively, configured to allow the substrate to pass through the cleaning chamber; the cleaning unit is configured to clean the substrate passing through the cleaning chamber. The present application sets a cleaning mechanism before the substrate enters the annealing operation or other operation, and uses the cleaning unit to remove surface impurities of the substrate, such as solid particles, oil stains and oxide films, so that the substrate remains clean and enters the subsequent processing steps, thereby improving the stability of the substrate and ensuring the production quality of photovoltaic welding strip products. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 is a schematic diagram of a substrate processing system provided in an embodiment of the present application;

[0037] Figure 2 is a schematic diagram of a cleaning mechanism provided in an embodiment of the present application;

[0038] Figure 3 It is a schematic diagram of the protection mechanism provided in the embodiment of the present application.

[0039] Description of the drawings: 5. substrate; 10. pay-off mechanism; 100. pay-off roller; 110. first guide wheel; 120. second guide wheel; 130. drive unit; 20. cleaning mechanism; 200. shell; 210. substrate inlet; 220. cleaning unit; 230. substrate outlet; 2200. air inlet; 2201. air duct; 2202. air outlet; 30. annealing mechanism; 300. first roller; 310. second roller; 40. coating mechanism; 50. winding mechanism; 60. protection mechanism; 600. tube body; 610. tube body inlet; 620. tube body outlet; 630. inert gas inlet; 640. inert gas outlet. DETAILED DESCRIPTION

[0040] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0041] As described in the background technology, since the substrate is exposed to the production environment for a long time, its surface is easily oxidized to form an oxide film or is easily attached by dirt, resulting in impurities being doped in the substrate; thus, the substrate will be affected by the impurities in the subsequent annealing operation, resulting in an unstable organizational structure, affecting the mechanical properties of the substrate, and due to the presence of impurities, when the substrate enters the coating operation after annealing treatment, problems such as difficulty in coating or uneven coating coverage will occur, affecting the production quality of the welding strip products.

[0042] In order to solve one or more of the above problems, the core of the present application is to provide a substrate processing system to clean the surface impurities of the substrate, improve the stability of the substrate, and ensure the production quality of photovoltaic welding strip products.

[0043] Example 1

[0044] Embodiment 1 of the present application provides a substrate processing system, such as Figure 1 As shown, it includes: a pay-off mechanism 10, used to drive the substrate 5 to move along the running direction of the production line; a cleaning mechanism 20, used to clean the substrate 5 after the pay-off operation; an annealing mechanism 30, used to anneal the substrate 5 after the cleaning operation; a coating mechanism 40, used to coat the substrate 5 after the annealing operation; a protection mechanism 60, connecting the substrate outlet of the annealing mechanism 30 and the substrate inlet of the coating mechanism 40, used to provide inert gas to isolate the substrate 5 after the annealing operation from the air; a winding mechanism 50, used to wind the substrate 5 after the coating operation.

[0045] Specifically, Figure 1 As shown, the substrate processing system includes: a pay-off mechanism 10, configured to drive the substrate 5 to move along the running direction of the production line; a cleaning mechanism 20, which is arranged downstream of the pay-off mechanism 10 along the moving direction of the substrate 5 and is configured to clean the substrate 5 after the pay-off operation.

[0046] Among them, there are impurities attached to the surface of the substrate 5, such as solid particles, oil stains, dust and oxide films generated by long-term contact with the air. Since the substrate 5 is made of hard copper, the copper will be oxidized by oxygen in the air to form a copper oxide film attached to the surface of the substrate 5; the cleaning mechanism 20 can use different technical equipment, depending on the type and cleanliness of the substrate, including but not limited to ultrasonic cleaning machines, high-pressure cleaning machines, chemical cleaning machines and steam cleaning machines, etc., which are used to remove surface impurities of the substrate 5, ensure the cleanliness of the substrate 5, and facilitate subsequent processing and manufacturing processes.

[0047] Specifically, Figure 2 As shown, the cleaning mechanism 20 includes: a cleaning cavity and a cleaning unit 220 disposed in the cleaning cavity; the cleaning cavity has two oppositely disposed openings, configured to allow the substrate 5 to pass through the cleaning cavity; the cleaning unit 220 is configured to clean the substrate 5 after the wire-laying operation.

[0048] In the specific embodiments of the present application, Figure 2 As shown, the cleaning mechanism includes: a shell 200, the shell 200 defines a cleaning cavity; the cleaning cavity has a substrate inlet 210 and a substrate outlet 230 that are relatively arranged; the substrate inlet 210 is provided at one end of the shell 200, and is configured to allow the substrate 5 after the wire-laying operation to extend into the cleaning cavity; a cleaning unit 220 is provided in the cleaning cavity, and is configured to use airflow to blow away surface impurities of the substrate 5; the substrate outlet 230 is provided at one end of the shell 200 away from the substrate inlet 210, and is configured to allow the substrate 5 after the impurity removal operation to extend out of the cleaning cavity.

[0049] The cleaning unit 220 is aimed at the surface of the substrate 5 at a preset angle, and uses compressed air to generate a high-speed airflow to blow the substrate 5 to remove dust and impurities on the surface.

[0050] In some embodiments of the present application, the cleaning mechanism 20 further includes: a dust suction unit configured to promptly suck away the impurities blown away by the cleaning unit 220 to prevent them from being re-deposited on the surface of the substrate 5 .

[0051] Preferably, if Figure 2 As shown, the cleaning unit 220 includes an air knife configured to use airflow to blow away impurities on the surface of the substrate 5 .

[0052] Specifically, Figure 2 As shown, the wind knife includes: a main body; an air inlet 2200, which is arranged on the main body and extends through one side of the shell 200 in a direction away from the main body, and is configured to introduce an external wind source; an air duct 2201, which runs through the main body, and is configured to allow the substrate 5 to pass through, and guide the airflow generated by the external wind source to flow from the air inlet 2200 to the air outlet 2202 to blow away surface impurities of the substrate 5; an air outlet 2202, which is arranged on the main body and is connected to the substrate inlet 210 and / or the substrate outlet 230, and is configured to discharge the airflow and surface impurities of the substrate 5.

[0053] The body of the air knife is made of stainless steel to ensure durability. The air inlet 2200 is connected to an external compressed air system or fan to provide the airflow required for cleaning; the air outlet 2202 can be connected to an external filtration system or recycling system to collect and process the discharged impurities. The air duct 2201 is used to guide the airflow and ensure that the airflow can evenly act on the surface of the substrate 5 when the substrate 5 passes through it; the shape and size of the air duct 2201 are optimized according to the width and thickness of the substrate 5 to provide the best cleaning effect.

[0054] In an optional embodiment of the present application, the wind knife includes a square wind knife.

[0055] Among them, the square air knife is convenient for threading, but the directional airflow intensity it generates is relatively large. If the width of the substrate 5 is relatively narrow, it will cause the substrate 5 to be subjected to excessive force, thereby affecting the mechanical properties of the substrate 5.

[0056] In a preferred embodiment of the present application, the wind knife is a circular wind knife.

[0057] Compared with the square wind knife, the circular wind knife can generate a uniform 360° annular airflow, which can cover the surface of the substrate 5 to provide a comprehensive cleaning effect. In addition, compared with the square wind knife, the circular wind knife is easier to maintain and has a lower cost.

[0058] In a preferred embodiment of the present application, the airflow is high-temperature steam, which can remove stubborn grease and dirt on the surface of the substrate 5 .

[0059] In the preferred embodiment of the present application, the temperature of the high temperature steam is controlled at 100°C ± 15°C and the pressure is maintained at 30kg / cm 2 , the air pressure of the circular air knife is maintained at 100kpa±10kpa to achieve the cleaning of surface impurities of the substrate by high-temperature steam.

[0060] In a preferred embodiment of the present application, Figure 2 As shown, there are two air inlets 2200, which are arranged on two symmetrical sides of the body along the width direction of the body.

[0061] In some embodiments of the present application, when the direction of the airflow is oblique to the substrate 5, the air outlet 2202 is disposed on a side of the substrate inlet 210 or the substrate outlet 230 that is close to the direction of the airflow. Figure 2 As shown, when the airflow direction is to the left, that is, along the direction from the substrate outlet 230 to the substrate inlet 210, the air outlet 2202 is arranged on a side close to the substrate inlet 210 and is connected to the substrate inlet 210 to discharge the airflow and waste impurities.

[0062] Example 2

[0063] Embodiment 2 of the present application provides a specific structure of the wire-releasing mechanism 10 based on Embodiment 1.

[0064] Specifically, Figure 1 As shown, the pay-off mechanism 10 includes: a pay-off roller 100, configured to wind the substrate 5; a tension unit, configured to apply tension to support the substrate 5 released by the pay-off roller 100; the tension unit includes a plurality of first guide wheels 110 and a plurality of second guide wheels 120; the number of the second guide wheels 120 is greater than the number of the first guide wheels 110, and the second guide wheels 120 are arranged above the first guide wheels 110 along the longitudinal direction of the pay-off mechanism 10; wherein the substrate 5 is wound around the first guide wheels 110 and the second guide wheels 120; and a driving unit 130, configured to control the pay-off roller 100 to rotate at a preset speed to move the substrate 5.

[0065] Among them, through the cooperation of the pay-off roller 100, the tension unit and the driving unit 130, the rotation speed of the pay-off roller 100 and the tension applied to the substrate 5 by the tension unit are adapted to each other, which can avoid the influence of the substrate 5 yielding or the substrate 5 knotting due to incompatibility, and improve the stability of the substrate 5.

[0066] In some embodiments of the present application, the second guide wheel 120 is a bridge guide wheel, and the first guide wheel 110 is a swing arm guide wheel. With such a design, when the substrate 5 is wound around the bridge guide wheel and the swing arm guide wheel for multiple turns, the routing stability of the substrate 5 is higher, and the influence on its yielding can be reduced. Exemplarily, when the number of bridge guide wheels is two and the number of swing arm guide wheels is one, the substrate 5 is first connected to a bridge guide wheel after being released by the pay-off roller 100, and then is extended outward from a bridge guide wheel after being wound around the swing arm guide wheel and the bridge guide wheel for two turns, so that mutual interference between the substrates 5 can be avoided.

[0067] In an optional embodiment of the present application, the pay-off mechanism 10 can be replaced by a wire drawing mechanism; the pay-off mechanism 10 is used to evenly spread the substrate 5 and convey it to the next link of the production line; the wire drawing mechanism is used to draw the substrate 5 into the required specifications through processes such as stretching, cooling and lubrication, and then convey it to the next link of the production line. The selection of the pay-off mechanism 10 and the wire drawing mechanism can be determined according to specific production requirements and process flow.

[0068] In some embodiments of the present application, when a wire drawing mechanism is used, an oil film formed after the wire drawing operation will adhere to the surface of the substrate, and the oil film can be blown off by high-temperature steam.

[0069] Example 3

[0070] Embodiment 3 of the present application provides a specific structure of an annealing mechanism based on Embodiment 2.

[0071] Specifically, Figure 1 As shown, the substrate processing system further includes: an annealing mechanism 30, which is disposed downstream of the cleaning mechanism 20 along the moving direction of the substrate 5 and is configured to perform annealing treatment on the substrate 5 after the cleaning operation.

[0072] The annealing treatment is used to improve the physical properties of the substrate 5, such as hardness and toughness. The annealing mechanism 30 can adopt different types of heating methods and cooling methods, such as flame heating, resistance heating and induction heating, and cooling such as water cooling and air cooling. The annealing mechanism 30 is connected to the cleaning mechanism 20 to ensure that the substrate 5 is clean before annealing, thereby avoiding uneven heating or cooling of the substrate 5 due to surface impurities during the annealing process, which affects the annealing effect.

[0073] Specifically, the annealing mechanism 30 includes a first roller 300 and a second roller 310 , wherein the first roller 300 is connected to the positive pole of the external power source, and the second roller 310 is connected to the negative pole of the external power source; wherein the substrate passes through the first roller 300 and the second roller 310 in sequence.

[0074] When the first roller 300 is connected to the positive pole of the external power supply and the second roller 310 is connected to the negative pole of the external power supply, the substrate 5 is energized between the first roller 300 and the second roller 310 to form a short circuit, and the wire body of the substrate 5 is instantly heated so that the substrate 5 reaches the annealing temperature, thereby achieving annealing treatment of the substrate 5.

[0075] In an optional embodiment of the present application, the roller may be a copper wheel to improve conductivity.

[0076] In the preferred embodiment of the present application, the substrate outlet of the pay-off mechanism 10, the substrate inlet of the cleaning mechanism 20 and the annealing mechanism 30 are arranged flush, and the three are located on the same horizontal line, so that the substrate 5 after the pay-off operation can directly and smoothly pass through the cleaning mechanism 20 and enter the annealing mechanism 30 without turning, and will not cause damage to the mechanical properties of the substrate 5. At the same time, the setting of the cleaning mechanism 20 can also alleviate the adhesion of a small amount of vaporized carbides of the substrate 5 to the annealing mechanism 30 during the annealing operation, so as to extend the maintenance cycle of the equipment.

[0077] Example 4

[0078] Embodiment 4 of the present application provides, on the basis of Embodiment 3, a coating mechanism, a winding mechanism, and a protection mechanism applied between an annealing mechanism and a coating mechanism of a substrate processing system.

[0079] Specifically, Figure 1 As shown, the substrate processing system further includes: a coating mechanism 40, which is disposed downstream of the annealing mechanism 30 along the moving direction of the substrate 5 and is configured to perform a coating treatment on the substrate 5 after the annealing operation.

[0080] The coating mechanism 40 is used to uniformly coat one or more layers of materials, such as paint and metal, on the surface of the substrate 5. Since the substrate 5 has been cleaned and annealed before the coating operation, the substrate 5 has good cleanliness and physical and mechanical properties. No carbide and / or copper oxide will remain on the substrate 5 after the cleaning operation in the aforementioned annealing operation. Furthermore, the substrate 5 in a clean state can avoid problems such as poor coating caused by the detachment of carbide and / or copper oxide when the coating operation is performed. Therefore, the coating on the surface of the substrate 5 will not be affected by impurities, thereby improving the production quality of the welding strip product.

[0081] In some embodiments of the present application, the coating material is tin.

[0082] Originally, a pre-coating flux mechanism was provided between the annealing mechanism and the coating mechanism, which was used to pre-evenly coat a layer of flux on the surface of the substrate to improve the welding performance of the substrate. However, the flux is corrosive to a certain extent. When the substrate covered with the flux enters the next process, the flux will come into contact with the equipment, causing varying degrees of corrosion to the equipment, shortening the service life of the equipment. In addition, since the flux cannot be completely volatilized, part of it will remain on the final finished solder strip, reducing the storage period of the solder strip and affecting the production quality of the solder strip product.

[0083] In order to solve the above-mentioned problems, the present application eliminates the step of pre-coating the soldering flux to reduce the contamination of the soldering flux, and adds a protection mechanism between the annealing mechanism and the coating mechanism to protect the substrate after the annealing operation.

[0084] Preferably, if Figure 1 As shown, the substrate processing system also includes: a protection mechanism 60, one end of which is connected to the annealing mechanism 30, and the other end is connected to the coating mechanism 40, configured to allow the substrate 5 after the annealing operation to pass through and enter the coating mechanism 40, and configured to provide inert gas to isolate the substrate 5 after the annealing operation from the air.

[0085] Among them, after the annealing operation is completed, the substrate 5 is easy to react with oxygen, water vapor or other elements that may cause the reaction in the air. Inert gases such as nitrogen or argon can prevent the substrate 5 from undergoing oxidation reaction with oxygen in the air after annealing, thereby avoiding the formation of an oxide layer and cooling the substrate 5. At the same time, the inert gas environment helps to keep the surface of the substrate 5 clean, prevent the deposition of pollutants, and ensure stable coverage of the coating during subsequent coating operations.

[0086] Preferably, if Figure 1 and Figure 3 As shown, the protection mechanism 60 includes: a tube body 600; the tube body 600 defines a receiving cavity, which is configured to allow an inert gas to flow in the receiving cavity; the receiving cavity has openings at both ends, which is configured to allow the substrate 5 after the annealing operation to pass through the receiving cavity; an inert gas inlet 630, which is provided on one side of the tube body 600 and communicated with the receiving cavity, and is configured to provide an inert gas to the receiving cavity; an inert gas outlet 640, which is provided on the other side of the tube body 600 and communicated with the receiving cavity, and is configured to allow the inert gas to flow out of the receiving cavity.

[0087] In a specific embodiment of the present application, the protection mechanism also includes: a tube body inlet 610, which is provided at one end of the tube body 600 and is configured to allow the substrate 5 to extend into the accommodating cavity; a tube body outlet 620, which is provided at one end of the tube body 600 away from the tube body inlet 610 and is configured to allow the substrate 5 to extend out of the accommodating cavity.

[0088] The tube body 600 is made of corrosion-resistant and high-temperature resistant materials, and is used to provide a channel for the substrate 5 and accommodate the flow of inert gas; the inert gas inlet 630 is connected to an external inert gas source to provide inert gas in the tube body 600 to maintain the gas flow in the tube body 600 and ensure that the substrate 5 is always covered by the inert gas; the inert gas outlet 640 is connected to an external inert gas recovery mechanism to recover the used inert gas and transport it to the inert gas source after cleaning to achieve the recycling of the inert gas. In this way, the protection mechanism 60 can not only provide an oxygen-free processing link for the substrate 5 to prevent oxidation and other chemical reactions, but also ensure that the substrate 5 remains clean and dry before entering the coating operation, thereby improving the stability of the quality of the welding strip.

[0089] In an optional embodiment of the present application, sealing rings or plugs are provided at the tube inlet 610 and the tube outlet 620 to prevent the inert gas from leaking out during the movement of the substrate 5 .

[0090] In a preferred embodiment of the present application, the protection mechanism 60 also includes: a gas flow meter and a control valve (both shown in the figure), which are arranged on the tube body 600 and are used to control the flow rate and pressure of the inert gas to ensure the stability of the inert gas environment.

[0091] Specifically, Figure 1 As shown, the substrate processing system further includes: a winding mechanism 50, which is disposed downstream of the coating mechanism 40 along the moving direction of the substrate 5 and is configured to wind up the substrate 5 after the coating operation.

[0092] The winding mechanism 50 is used to wind and support the substrate 5. During the winding process, tension control is used to maintain the appropriate tension of the substrate 5 to prevent the substrate 5 from being loose or too tight, which affects the quality of the coating or the neatness of the winding.

[0093] Example 5

[0094] Embodiment 5 of the present application provides an operation flow of a substrate processing system based on Embodiment 4.

[0095] Combination Figure 1 The substrate 5 enters the cleaning mechanism 20 under the guidance of the tension unit of the pay-off mechanism 10. The cleaning mechanism 20 uses high-temperature steam to decompose and remove impurities on the surface of the substrate 5. The purified substrate 5 then enters the annealing mechanism 30 and moves at a uniform speed driven by the traction wheel of the annealing mechanism 30. The uniformly annealed substrate 5 enters the protection mechanism 60, and after being protected and cooled by the inert gas, enters the coating mechanism 40 for coating operation to form a welding strip, which is then wound up by the winding mechanism 50 and the processing is completed.

[0096] In an optional embodiment of the present application, a cooling mechanism is provided between the coating mechanism 40 and the winding mechanism 50, so that after the coating operation is completed, the substrate 5 is cooled by the cooling mechanism before the winding operation is performed.

[0097] The technical solution provided by the present application is described in detail above. The principle and implementation method of the present application are described in detail using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A substrate processing system, characterized in that: include: A wire-paying mechanism, configured to drive the substrate to move along the running direction of the production line; A cleaning mechanism, disposed downstream of the pay-off mechanism along the moving direction of the substrate; The cleaning mechanism comprises: a cleaning cavity and a cleaning unit arranged in the cleaning cavity; the cleaning cavity has a substrate inlet and a substrate outlet arranged opposite to each other, configured for allowing the substrate to pass through the cleaning cavity; the cleaning unit is configured to clean the substrate passing through the cleaning cavity.

2. The substrate processing system according to claim 1, characterized in that: The cleaning unit includes an air knife configured to use airflow to blow away impurities on the surface of the substrate.

3. The substrate processing system according to claim 2, characterized in that: The cleaning mechanism further comprises: a shell; the shell defines the cleaning cavity; The wind knife comprises: ontology; an air inlet, disposed on the body and extending through one side of the housing in a direction away from the body, configured to introduce an external wind source; an air duct, which passes through the body and is configured to allow the substrate to pass through and guide the airflow generated by the external wind source to flow from the air inlet to the air outlet to blow away impurities on the surface of the substrate; An air outlet is provided on the main body and is communicated with the substrate inlet and / or the substrate outlet, and is configured to discharge the airflow and impurities on the surface of the substrate.

4. The substrate processing system according to claim 1, characterized in that: The pay-off mechanism comprises: a pay-off roller configured to wind the substrate; A tension unit is configured to apply tension to support the substrate released by the pay-off roller; the tension unit comprises a plurality of first guide wheels and a plurality of second guide wheels; the number of the second guide wheels is greater than the number of the first guide wheels, and the second guide wheels are arranged above the first guide wheels along the longitudinal direction of the pay-off mechanism; wherein the substrate is wound around the first guide wheels and the second guide wheels; The driving unit is configured to control the pay-off roller to rotate at a preset speed so as to move the substrate.

5. The substrate processing system according to claim 1, characterized in that: Also includes: An annealing mechanism, disposed downstream of the cleaning mechanism along the moving direction of the substrate, and configured to perform an annealing operation on the substrate after the cleaning operation; The annealing mechanism comprises a first roller and a second roller, wherein the first roller is connected to a positive electrode of an external power source, and the second roller is connected to a negative electrode of the external power source; wherein the substrate passes through the first roller and the second roller in sequence.

6. The substrate processing system according to claim 5, characterized in that: Also includes: The coating mechanism is disposed downstream of the annealing mechanism along the moving direction of the substrate, and is configured to perform a coating covering operation on the substrate after the annealing operation.

7. The substrate processing system according to claim 6, characterized in that: Also includes: The protection mechanism is connected to the annealing mechanism and the coating mechanism respectively, and is configured to allow the substrate after the annealing operation to pass through and enter the coating mechanism, and is also configured to provide inert gas to isolate the substrate after the annealing operation from the air.

8. The substrate processing system according to claim 7, characterized in that: The protection agencies include: tube body; The tube body defines a receiving cavity, configured to allow an inert gas to flow in the receiving cavity; the receiving cavity has a tube body inlet and a tube body outlet arranged opposite to each other, configured to allow the substrate after the annealing operation to pass through the receiving cavity; an inert gas inlet, disposed on one side of the tube body and in communication with the accommodating chamber, and configured to provide the inert gas to the accommodating chamber; The inert gas outlet is disposed on the other side of the tube body and communicated with the accommodating cavity, and is configured to allow the inert gas to flow out of the accommodating cavity.

9. The substrate processing system according to claim 6, characterized in that: Also includes: The winding mechanism is arranged downstream of the coating mechanism along the moving direction of the substrate, and is configured to perform a winding operation on the substrate after the coating operation.

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