Edge grinding machine for semiconductor wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses an edge grinding machine for semiconductor wafer processing, which comprises a base, a sliding plate penetrates through and is in sliding connection with the middle of the top of the inner wall of the base, a rack is fixedly connected with one side of the top of the outer wall of the sliding plate, and a fixing plate is fixedly connected with the middle of one side of the top of the outer wall of the base. And a second connecting column penetrates through and is slidably connected to the middle of the fixing plate, a second gear penetrates through and is fixedly connected to the middle of the outer ring of the second connecting column, and a first gear penetrates through and is fixedly connected to one end of the outer ring of the second connecting column. According to the semiconductor wafer edge grinding machine, firstly, through cooperation of the conveying belt, the third servo motor, the sliding block, the push rod motor, the second servo motor and the first servo motor, automatic operation of semiconductor wafer edge grinding is achieved, continuous, high-speed and accurate production is achieved, and therefore the production efficiency is greatly improved, and the production period is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to an edge grinding machine used for semiconductor wafer processing. Background Art

[0002] Wafers are the basic materials for manufacturing integrated circuits, edge grinders are used to grind wafer edges, grinding wheels are grinding tools, edge peeling is used to remove defects, tape casting processes edges, and wafer protective film covers the wafer protective surface. These entities work together in the edge grinding process to ensure the flatness and accuracy of the wafer edge and maintain product quality and efficiency in semiconductor manufacturing.

[0003] After searching, the existing Chinese patent publication number is: CN220260427U, which provides a semiconductor wafer edge grinder. This patent sets two groups of connecting rods and two groups of special-shaped rods, and can adjust the distance between the two groups of grinding blocks according to the thickness of the wafer, so that the edge grinder is suitable for wafers of different thicknesses and can better fit wafers of all thicknesses. The grinding force of the wafer edge is constant, and the grinding is more uniform and stable, avoiding damage caused by excessive local grinding. By setting a fixed plate, since the fixed plate can be adjusted at the top of the bracket, the edge grinder is suitable for wafers of different sizes, so that the two groups of sandpaper are more fitted to the wafer edge, and the wafer edge is more fully polished.

[0004] Although the above patent can grind the edge of the wafer more thoroughly, the above semiconductor wafer edge grinding machine still has the following problems: the device requires manual movement of the fixed plate for adjustment and cannot be operated automatically, resulting in reduced production efficiency.

[0005] In view of the above problems, an edge grinding machine for semiconductor wafer processing is proposed. Utility Model Content

[0006] The utility model aims to provide an edge grinding machine for semiconductor wafer processing, which solves the problem that automatic operation cannot be achieved in the background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an edge grinding machine for semiconductor wafer processing, comprising a base, a slide plate is penetrated through and slidably connected to the middle of the top of the inner wall of the base, a rack is fixedly connected to one side of the top of the outer wall of the slide plate, a fixing plate is fixedly connected to the middle of the top of one side of the outer wall of the base, a second connecting column is penetrated through and slidably connected to the middle of the fixing plate, a second gear is penetrated through and fixedly connected to the middle of the outer ring of the second connecting column, a first gear is penetrated through and fixedly connected to one end of the outer ring of the second connecting column, and the first gear is meshed with the top of the rack, and the top of one side of the fixing plate is fixedly connected A first servo motor is connected, and a third gear is fixedly connected to the output end of the first servo motor, and the third gear is meshed with the outer ring of the second gear. Push rod motors are penetrated and fixedly connected on both sides of one end of the top of the inner wall of the base, a slider is penetrated and slidably connected to one end of the top of the inner wall of the base, and the slider and the output end of the push rod motor are fixedly connected, the top of the inner wall of the slider is penetrated and fixedly connected to the third servo motor, the output end of the third servo motor is fixedly connected to a connecting plate, the top of the inner wall of the slide plate is penetrated and fixedly connected to the second servo motor, and a processing component is provided at the output end of the second servo motor.

[0008] By adopting the above technical solution, the third gear is driven by the first servo motor, and the second gear is driven to rotate by the third gear, so that the second connecting column rotates on the fixed plate and drives the first gear to rotate, and the first gear drives the slide to move through the rack, so that the slide can be moved slowly to make the processing more precise, and the connecting plate is driven to rotate by the third servo motor, and the semiconductor wafer is moved to the processing position through the connecting plate, and the slider is raised and lowered by the push rod motor, so that the semiconductor wafer is between the two grinding blocks, thereby realizing the automation of loading and processing.

[0009] As a further description of the above technical solution: the processing component includes a bidirectional threaded rod, which is fixedly connected to the output end of the second servo motor, and grinding blocks are passed through and threadedly connected at both ends of the middle of the outer ring of the bidirectional threaded rod, and first connecting columns are passed through and slidably connected on both sides of the middle of the inner wall of the grinding block, and the first connecting columns are fixedly connected to one end of the top of the outer wall of the skateboard.

[0010] By adopting the above technical solution, the grinding block can only slide up and down through the two first connecting columns, the bidirectional threaded rod is driven to rotate by the second servo motor, and the two grinding blocks are driven to move inward or outward at the same time by the bidirectional threaded rod, so that the grinding thickness is more accurate.

[0011] As a further description of the above technical solution: conveyor belts are arranged on both sides of one end of the top of the outer wall of the base.

[0012] By adopting the above technical solution, automatic loading and unloading of materials can be achieved through a conveyor belt.

[0013] As a further description of the above technical solution: a vacuum pump is fixedly connected to the middle end of the bottom of the connecting plate.

[0014] By adopting the above technical solution, the position of the vacuum pump is fixed by the connecting plate, and the air in the suction cup is extracted by the vacuum pump.

[0015] As a further description of the above technical solution: one end of the connecting plate passes through and is rotatably connected to a rotating tube, and the rotating tube is fixedly connected to the output end of the vacuum pump.

[0016] By adopting the above technical solution, the suction cup is driven to rotate by the rotating tube.

[0017] As a further description of the above technical solution: a fourth servo motor is fixedly connected to the middle of the bottom of the connecting plate, and a pulley is fixedly connected to the output end of the fourth servo motor.

[0018] By adopting the above technical solution, the pulley is driven to rotate by the fourth servo motor.

[0019] As a further description of the above technical solution: a belt is arranged between the pulley and the rotating tube.

[0020] By adopting the above technical solution, the pulley and the rotating tube are connected by a belt, so that the rotating tube rotates following the pulley.

[0021] As a further description of the above technical solution: a suction cup is fixedly connected to the top of the rotating tube.

[0022] By adopting the above technical solution, the semiconductor wafer is sucked up and fixed by the suction cup.

[0023] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0024] 1. The utility model provides an edge grinding machine for semiconductor wafer processing, which first realizes the automated operation of semiconductor wafer edge grinding through the cooperation between the conveyor belt, the third servo motor, the slider, the push rod motor, the second servo motor and the first servo motor, and realizes continuous, high-speed and precise production, thereby greatly improving production efficiency and shortening production cycle.

[0025] 2. The utility model provides an edge grinding machine for semiconductor wafer processing. Through the cooperation between the first servo motor, the third gear, the second gear, the first gear, the rack, the slide plate, the second servo motor, the bidirectional threaded rod and the grinding block, the edge grinding machine is suitable for wafers of different sizes, so that the two sets of grinding blocks can fit the edge of the wafer more closely, and a more precise grinding distance can be controlled, thereby improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0027] Figure 2 It is a cross-sectional view of the base of the utility model;

[0028] Figure 3 This is a schematic diagram of a fourth servo motor of the present utility model;

[0029] Figure 4 This is a schematic diagram of the first gear of the present utility model.

[0030] Legend:

[0031] 1. Base; 2. Rack; 3. First gear; 4. Second gear; 5. Fixed plate; 6. First servo motor; 7. Third gear; 8. Grinding block; 9. First connecting column; 10. Bidirectional threaded rod; 11. Slider; 12. Conveyor belt; 13. Connecting plate; 14. Suction cup; 15. Second servo motor; 16. Slide plate; 17. Second connecting column; 18. Third servo motor; 19. Push rod motor; 20. Vacuum pump; 21. Fourth servo motor; 22. Pulley; 23. Belt; 24. Rotating tube. DETAILED DESCRIPTION

[0032] The following will refer to the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] In order to further understand the content of the utility model, the utility model is described in detail with reference to the accompanying drawings.

[0034] Reference Figure 1 and Figure 3 The utility model is an edge grinding machine for semiconductor wafer processing, comprising a base 1, a vacuum pump 20 is fixedly connected to one end of the bottom middle of a connecting plate 13, a rotating tube 24 is passed through and rotatably connected to one end of the connecting plate 13, the rotating tube 24 is fixedly connected to the output end of the vacuum pump 20, a fourth servo motor 21 is fixedly connected to the middle of the bottom of the connecting plate 13, a pulley 22 is fixedly connected to the output end of the fourth servo motor 21, a belt 23 is arranged between the pulley 22 and the rotating tube 24, and a suction cup 14 is fixedly connected to the top of the rotating tube 24;

[0035] The air in the suction cup 14 is extracted through the vacuum pump 20, so that the suction cup 14 adsorbs the semiconductor wafer, and the semiconductor wafer is driven to rotate through the connecting plate 13. The pulley 22 is driven by the fourth servo motor 21, and the rotating tube 24 is driven by the pulley 22, so that the suction cup 14 drives the semiconductor wafer to rotate for grinding processing.

[0036] Reference Figure 1 , Figure 2 and Figure 4 A slide plate 16 is passed through and slidably connected to the middle of the top of the inner wall of the base 1, and a rack 2 is fixedly connected to one side of the top of the outer wall of the slide plate 16. A fixed plate 5 is fixedly connected to the middle of the top of one side of the outer wall of the base 1. A second connecting column 17 is passed through and slidably connected to the middle of the fixing plate 5. A second gear 4 is passed through and fixedly connected to the middle of the outer ring of the second connecting column 17. A first gear 3 is passed through and fixedly connected to one end of the outer ring of the second connecting column 17, and the first gear 3 is meshed and connected to the top of the rack 2. A first servo motor 6 is fixedly connected to the top of one side of the fixing plate 5. The output end of the servo motor 6 is fixedly connected with the third gear 7, and the third gear 7 is meshed with the outer ring of the second gear 4. Push rod motors 19 are penetrated and fixedly connected on both sides of one end of the top of the inner wall of the base 1. A slider 11 is penetrated and slidably connected at one end of the top of the inner wall of the base 1, and the slider 11 and the output ends of the push rod motor 19 are fixedly connected. A third servo motor 18 is penetrated and fixedly connected at the top of the inner wall of the slider 11. A connecting plate 13 is fixedly connected to the output end of the third servo motor 18. Conveyor belts 12 are arranged on both sides of one end of the top of the outer wall of the base 1.

[0037] The third gear 7 is driven by the first servo motor 6, and the second gear 4 and the first gear 3 are driven to rotate by the third gear 7. The slide plate 16 is driven by the first gear 3 to slide slightly on the base 1, so that the edge grinding width of the semiconductor wafer is more accurate. The connecting plate 13 is driven to rotate by the third servo motor 18, and the slider 11 is driven to slide up and down by the push rod motor 19, so that the connecting plate 13 moves up and down, and the semiconductor wafer is fed through the conveyor belt 12 on one side. The suction cup 14 is driven by the connecting plate 13 to adsorb, fix and move the semiconductor wafer, and the finished product is unloaded through the conveyor belt 12 on the other side, thereby realizing automated operation.

[0038] Reference Figure 4 , a second servo motor 15 is penetrated and fixedly connected to one end of the top of the inner wall of the slide plate 16, a bidirectional threaded rod 10 is fixedly connected to the output end of the second servo motor 15, a grinding block 8 is penetrated and threadedly connected to both ends of the middle of the outer ring of the bidirectional threaded rod 10, a first connecting column 9 is penetrated and slidably connected to both sides of the middle of the inner wall of the grinding block 8, and the first connecting column 9 is fixedly connected to one end of the top of the outer wall of the slide plate 16;

[0039] The bidirectional threaded rod 10 is driven to rotate by the second servo motor 15, and the bidirectional threaded rod 10 drives the grinding block 8 to move inward or outward, so that the grinding block 8 can accurately process the thickness of the semiconductor wafer, thereby ensuring the quality of the finished product.

[0040] Working principle: When in use, feeding is carried out through the conveyor belt 12 on one side, the vacuum pump 20 is started, the semiconductor wafer is adsorbed by the suction cup 14, the third servo motor 18 and the push rod motor 19 are started, the connecting plate 13 is driven to rotate by the third servo motor 18, and the connecting plate 13 is moved up and down by the push rod motor 19, thereby driving the semiconductor wafer to bypass the conveyor belt 12 and enter the processing area, and the fourth servo motor 21 is started to rotate the semiconductor wafer for grinding processing. After waiting for the processing to be completed, the semiconductor wafer is transported to the conveyor belt 12 on the other side for unloading, realizing automated operation and improving production efficiency, starting the second servo motor 15, and driving the bidirectional threaded rod 10 through the output end of the second servo motor 15. The distance between the two grinding blocks 8 is adjusted by rotating the bidirectional threaded rod 10 to accurately grind the thickness of the semiconductor wafer, starting the first servo motor 6, and driving the third gear 7 to rotate through the output end of the first servo motor 6, so that the first gear 3 drives the slide plate 16 to move slowly, so that the grinding block 8 grinds the semiconductor wafer, thereby ensuring accurate grinding of the width of the semiconductor wafer.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An edge grinding machine for semiconductor wafer processing, comprising a base (1), characterized in that: A slide plate (16) is passed through and slidably connected to the middle of the top of the inner wall of the base (1); a rack (2) is fixedly connected to one side of the top of the outer wall of the slide plate (16); a fixing plate (5) is fixedly connected to the middle of the top of one side of the outer wall of the base (1); a second connecting column (17) is passed through and slidably connected to the middle of the fixing plate (5); a second gear (4) is passed through and fixedly connected to the middle of the outer ring of the second connecting column (17); a first gear (3) is passed through and fixedly connected to one end of the outer ring of the second connecting column (17); the first gear (3) is meshedly connected to the top of the rack (2); a first servo motor (6) is fixedly connected to the top of one side of the fixing plate (5); an output end of the first servo motor (6) is fixedly connected to the output end of the fixing plate (5); A third gear (7) is connected, and the third gear (7) is meshed with the outer ring of the second gear (4); both sides of the top end of the inner wall of the base (1) are penetrated and fixedly connected with a push rod motor (19); a slider (11) is penetrated and slidably connected at one end of the top end of the inner wall of the base (1), and the slider (11) and the output end of the push rod motor (19) are fixedly connected; a third servo motor (18) is penetrated and fixedly connected at the top of the inner wall of the slider (11); the output end of the third servo motor (18) is fixedly connected with a connecting plate (13); a second servo motor (15) is penetrated and fixedly connected at one end of the top end of the inner wall of the slide plate (16); and a processing component is provided at the output end of the second servo motor (15).

2. The edge grinding machine for semiconductor wafer processing according to claim 1, characterized in that: The processing assembly comprises a bidirectional threaded rod (10), the bidirectional threaded rod (10) is fixedly connected to the output end of the second servo motor (15), both ends of the middle of the outer ring of the bidirectional threaded rod (10) are penetrated and threadedly connected with a grinding block (8), both sides of the middle of the inner wall of the grinding block (8) are penetrated and slidably connected with a first connecting column (9), and the first connecting column (9) is fixedly connected to one end of the top of the outer wall of the slide plate (16).

3. The edge grinding machine for semiconductor wafer processing according to claim 1, characterized in that: Conveyor belts (12) are arranged on both sides of one end of the top of the outer wall of the base (1).

4. The edge grinding machine for semiconductor wafer processing according to claim 1, characterized in that: A vacuum pump (20) is fixedly connected to a middle end of the bottom of the connecting plate (13).

5. The edge grinding machine for semiconductor wafer processing according to claim 1, characterized in that: A rotating tube (24) passes through and is rotatably connected to one end of the connecting plate (13); the rotating tube (24) is fixedly connected to the output end of the vacuum pump (20).

6. The edge grinding machine for semiconductor wafer processing according to claim 1, characterized in that: A fourth servo motor (21) is fixedly connected to the middle of the bottom of the connecting plate (13), and a pulley (22) is fixedly connected to the output end of the fourth servo motor (21).

7. The edge grinding machine for semiconductor wafer processing according to claim 6, characterized in that: A belt (23) is arranged between the pulley (22) and the rotating tube (24).

8. The edge grinding machine for semiconductor wafer processing according to claim 5, characterized in that: The top of the rotating tube (24) is fixedly connected with a suction cup (14).

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