Packaging chip test fixture
By designing a package chip test fixture including multiple tabletops, sliding grooves, clamping mechanisms, transmission mechanisms and power mechanisms, the problem of the inability to clamp multiple package chips in batches in the prior art is solved, and efficient testing operations and equipment versatility are achieved.
Patent Information
- Application Number
- CN202420751966.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2034-04-11
AI Technical Summary
The existing package chip test fixtures cannot clamp multiple package chips in batches, resulting in complex operation steps and affecting the overall testing efficiency.
A package chip test fixture including multiple tabletops, sliding grooves, clamping mechanisms, transmission mechanisms and power mechanisms is designed. Through the power mechanism and the transmission mechanism driven by the cylinder, the synchronous operation of multiple clamping mechanisms is realized, and multiple packaging chips can be clamped and fixed at one time.
The synchronous clamping and release of multiple package chips is achieved, the operation steps are simplified, the overall testing efficiency is improved, and the design of T-shaped grooves and T-shaped blocks is convenient to replace the clamping blocks, and the versatility and practicality of the equipment are improved.
Smart Images

Figure CN222857716U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of fixtures, in particular to a packaged chip testing fixture. Background Art
[0002] Packaging chips is the process of encapsulating integrated circuits in a shell to protect the chip from environmental influences and provide convenient installation and connection methods. Packaging chips can improve the reliability and stability of the chip and reduce the size and weight of the chip, making it easier to use and transport.
[0003] Existing, such as Chinese patent number: CN220419491U, a packaged chip testing fixture includes an operating table and a placement table, the placement table is fixedly installed at the top center axis position of the operating table, an inner cavity is arranged inside the operating table, the top of the inner cavity is located at both sides of the placement table and a movable groove is opened, a movable clamping arm is arranged in the movable groove, a support plate is fixedly installed at the bottom end of the clamping arm, a rack 2 for driving the movement is fixedly installed on the support plate, a gear 2 is arranged between the two racks 2, and a rotating structure for driving the gear 2 to rotate is arranged below the gear 2, the clamping arm is driven to move toward the chip through the support plate, the sponge head is used to protect the clamping arm from clamping the side of the chip, because the moving speed of the racks 2 on both sides is the same, the chip is always clamped at the center position of the placement groove, which is convenient for clamping chips of different sizes and more convenient to use.
[0004] Although the above patent can always clamp the chip at the center of the placement slot, making it convenient to clamp chips of different sizes and more convenient to use, the existing fixture can only clamp and fix one packaged chip at a time and cannot clamp multiple packaged chips in batches synchronously, which makes the operation steps complicated and affects the overall test efficiency. Therefore, in response to the above problems, we propose a new type of packaged chip test fixture. Utility Model Content
[0005] The utility model mainly provides a packaged chip testing fixture which can synchronously clamp and fix a plurality of packaged chips at one time, has simple operation steps and improves the overall testing efficiency.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a packaged chip testing fixture, including a table top, the number of the table tops is set to be multiple, four sliding grooves are equidistantly opened on the top of the table top, a clamping mechanism is arranged inside the sliding groove, a transmission mechanism is arranged between the bottoms of the four clamping mechanisms, a power mechanism is arranged at the bottom of the transmission mechanism, the power mechanism includes a cylinder, a connecting rod is fixedly connected to the telescopic end of the cylinder, and a plurality of top columns are equidistantly fixedly connected to the top of the connecting rod, and the plurality of top columns respectively correspond to the positions of the plurality of table tops.
[0007] Compared with the prior art, the advantages and positive effects of the utility model are:
[0008] 1. In the utility model, by setting a power mechanism in cooperation with a transmission mechanism, the four clamping blocks in the multiple clamping mechanisms can be driven to move closer to or farther from each other, thereby completing the clamping or unclamping action of the packaged chip. The design structure is novel, and a cylinder can be used as a drive to achieve the effect of synchronously clamping and fixing multiple packaged chips. The operation steps are simple, and the overall test efficiency of the packaged chips is effectively improved.
[0009] 2. In the utility model, the design of the T-slot and the T-block allows the clamping block to be replaced by a simple plug-in and pull-out action. This design allows the corresponding clamping block to be easily replaced when clamping packaged chips of different shapes without replacing the entire set of equipment. The versatility and practicality are greatly improved, and the economic cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 A three-dimensional diagram of a packaged chip testing fixture is provided for the utility model;
[0011] Figure 2 Another perspective view of a packaged chip testing fixture proposed by the utility model;
[0012] Figure 3 A schematic diagram of the table structure of a packaged chip test fixture is provided for the utility model;
[0013] Figure 4 The utility model provides a schematic diagram of the transmission mechanism structure of a packaged chip test fixture;
[0014] Figure 5 The utility model provides a schematic diagram of the power mechanism structure of a packaged chip testing fixture.
[0015] Legend: 1. Table; 11. Support frame; 12. Sliding groove; 2. Transmission mechanism; 201. Connecting block; 202. First rotating seat; 203. First rotating shaft; 204. Connecting rod; 205. Second rotating shaft; 206. Second rotating seat; 3. Clamping mechanism; 301. Sliding block; 302. T-block; 303. Clamping block; 304. T-slot; 4. Power mechanism; 401. Cylinder; 402. Connecting rod; 403. Top column. DETAILED DESCRIPTION
[0016] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0017] See also Figure 1-Figure 5 The utility model provides a technical solution: a packaged chip test fixture, including a table 1, the number of the table 1 is set to be multiple, four sliding grooves 12 are equidistantly opened on the top of the table 1, a clamping mechanism 3 is arranged inside the sliding groove 12, a transmission mechanism 2 is arranged between the bottoms of the four clamping mechanisms 3, a power mechanism 4 is arranged at the bottom of the transmission mechanism 2, the power mechanism 4 includes a cylinder 401, a connecting rod 402 is fixedly connected to the telescopic end of the cylinder 401, and a plurality of top columns 403 are equidistantly fixedly connected to the top of the connecting rod 402, and the plurality of top columns 403 respectively correspond to the positions of the plurality of table 1.
[0018] like Figure 2 , Figure 4 and Figure 5 As shown, the transmission mechanism 2 includes a connecting block 201, the connecting block 201 and the top of the top column 403 are fixedly connected, the cylinder 401 is fixedly installed at the bottom of one of the table tops 1, the bottom of the table top 1 is fixedly connected with a support frame 11, the number of connecting blocks 201 corresponds to the number of top columns 403, when the cylinder 401 is started, the connecting rod 402 can drive multiple top columns 403 to rise and fall synchronously, thereby driving multiple connecting blocks 201 to move upward or downward synchronously.
[0019] like Figure 2 and Figure 4 As shown, the outer surfaces of the four sides of the connecting block 201 are fixedly connected to the first rotating seat 202, the first rotating shaft 203 is rotatably connected between the inner surface walls of the first rotating seat 202, and the outer surface of the first rotating shaft 203 is fixedly connected to the connecting rod 204. When the connecting block 201 moves upward or downward, the first rotating shaft 203 inside the first rotating seat 202 will rotate with it, and drive the bottom position of the connecting rod 204 to change, and at the same time, the inclination angle of the connecting rod 204 will also change.
[0020] like Figure 2 and Figure 4 As shown, the outer surface of the connecting rod 204 is symmetrically fixedly connected with a second rotating shaft 205 near the top, and a second rotating seat 206 is rotatably sleeved between the outer surfaces of the two second rotating shafts 205. When the inclination angle of the connecting rod 204 changes, the second rotating shaft 205 on the surface will rotate inside the second rotating seat 206 and pull the second rotating seat 206 to move.
[0021] like Figure 1 and Figure 4As shown, four clamping mechanisms 3 are set as a group, and each group of clamping mechanisms 3 includes a slider 301. The four sliders 301 are respectively slidably embedded in the inside of four adjacent sliding grooves 12. The bottoms of the four sliders 301 are respectively connected to the tops of four second rotating seats 206. The sliding grooves 12 are provided to play the role of installing the sliders 301, and have a limiting effect on the sliders 301, so that the sliders 301 in each group of clamping mechanisms 3 can only move away from or approach each other. The second rotating seat 206 and the slider 301 are fixedly connected, so when the second rotating seat 206 moves, the slider 301 will follow the movement.
[0022] like Figure 1 and Figure 4 As shown, a clamping block 303 is provided on the top of the slider 301, and a T-slot 304 is provided on the outer surface of one side of the clamping block 303. When the four sliders 301 in each group of clamping mechanisms 3 are close to each other, the clamping block 303 on the top will clamp and fix the packaged chip on the table 1, and then the fixed packaged chip can be tested by the testing device. When they are away from each other, all the packaged chips will be released synchronously.
[0023] like Figure 1 and Figure 4 As shown, the T-slot 304 is internally plugged and connected with a T-block 302, and the T-block 302 is fixedly connected to the top of the slider 301. The design of the T-slot 304 and the T-block 302 allows the clamping block 303 to be replaced by a simple plug-in and pull-out action. This design allows the corresponding clamping block 303 to be easily replaced when clamping packaged chips of different shapes, without the need to replace the entire set of equipment, thereby greatly improving versatility and practicality and reducing economic costs.
[0024] The method of use and working principle of the device: When using the device to clamp and fix the packaged chip, first place the packaged chip in the middle position of the top of each table 1 in turn, and then start the cylinder 401 to push the connecting rod 402 to move downward. At this time, the top column 403 on the connecting rod 402 will pull the connecting block 201 in each transmission mechanism 2 to move downward. At this time, the first rotating seat 202 around the connecting block 201 cooperates with the first rotating shaft 203 to pull the bottom end of the surrounding connecting rods 204 to move downward. At this time, the top of each group of four connecting rods 204 cooperates with the second rotating shaft 205 and the second rotating seat 206 to pull the sliders 301 closer to each other. At this time, the clamping block 303 at the top of each group of four sliders 301 will be aligned with the opposite The four surfaces of the packaged chip should be tightly fitted to complete the clamping and fixing operation. When releasing the fixation, start the cylinder 401 to pull the connecting rod 402 to move upward. The design structure is novel. A cylinder 401 can be used as a drive to achieve the effect of synchronously clamping and fixing multiple packaged chips. The operation steps are simple, and the overall testing efficiency of the packaged chips is effectively improved. In addition, the design of the T-slot 304 and the T-block 302 allows the clamping block 303 to be replaced by a simple plug-in and pull-out action. This design allows the corresponding clamping block 303 to be easily replaced when clamping packaged chips of different shapes. There is no need to replace the entire set of equipment, so the versatility and practicality are greatly improved, and the economic cost is reduced.
[0025] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.
Claims
1. A packaged chip testing fixture, comprising a table (1), characterized in that: The table tops (1) are provided in a plurality, four sliding grooves (12) are equidistantly provided on the top of the table top (1), a clamping mechanism (3) is provided inside the sliding groove (12), a transmission mechanism (2) is provided between the bottoms of the four clamping mechanisms (3), and a power mechanism (4) is provided at the bottom of the transmission mechanism (2); The power mechanism (4) comprises a cylinder (401), the telescopic end of the cylinder (401) is fixedly connected to a connecting rod (402), the top of the connecting rod (402) is fixedly connected to a plurality of top columns (403) at equal intervals, and the plurality of top columns (403) respectively correspond to the positions of a plurality of table tops (1).
2. A packaged chip testing fixture according to claim 1, characterized in that: The transmission mechanism (2) comprises a connecting block (201), the connecting block (201) is fixedly connected to the top of a top column (403), the cylinder (401) is fixedly mounted on the bottom of one of the table tops (1), and the bottom of the table top (1) is fixedly connected to a support frame (11).
3. A packaged chip testing fixture according to claim 2, characterized in that: The outer surfaces of the connection block (201) are all fixedly connected to a first rotating seat (202), the inner surface walls of the first rotating seat (202) are rotatably connected to a first rotating shaft (203), and the outer surface of the first rotating shaft (203) is fixedly connected to a connecting rod (204).
4. A packaged chip testing fixture according to claim 3, characterized in that: A second rotating shaft (205) is symmetrically and fixedly connected to the outer surface of the connecting rod (204) near the top, and a second rotating seat (206) is rotatably sleeved between the outer surfaces of the two second rotating shafts (205).
5. The packaged chip testing fixture according to claim 1, characterized in that: The four clamping mechanisms (3) are arranged as a group, and each group of the clamping mechanisms (3) comprises a slider (301). The four sliders (301) are respectively slidably embedded in four adjacent sliding grooves (12), and the bottoms of the four sliders (301) are respectively connected to the tops of four second rotating seats (206).
6. The packaged chip testing fixture according to claim 5, characterized in that: A clamping block (303) is provided on the top of the sliding block (301), and a T-shaped groove (304) is provided on an outer surface of one side of the clamping block (303).
7. The packaged chip testing fixture according to claim 6, characterized in that: A T-shaped block (302) is plugged and connected inside the T-shaped slot (304), and the T-shaped block (302) is fixedly connected to the top of the sliding block (301).
Citation Information
Patent Citations
Packaging chip test fixture
CN220419491U