Heat insulation temperature measuring device

Abstract

The utility model relates to the field of temperature measuring devices, in particular to a heat insulation temperature measuring device, which comprises a first stackable assembly and a second stackable assembly, the first stackable assembly comprises a first substrate and a first structural member, the first structural member is in an enclosed frame shape, a cavity is enclosed by the first structural member and one surface of the first substrate, and the first substrate is used for contacting with the surface of a measured object; and the first temperature sensor is positioned in the cavity, is arranged on the first substrate and is used for measuring the temperature of a point to be measured. According to the heat-insulation temperature measuring device, the first substrate is used for transferring the surface temperature of the object to be subjected to temperature measurement to the first temperature sensor, so that the heat-insulation temperature measuring device can continuously measure the temperature; the first temperature sensor and the main board of the heat insulation temperature measuring device are separated by the air with a good heat insulation effect in the cavity, so that the first temperature sensor is not easily influenced by heating of the main board and components on the main board, and the measured temperature is closer to the actual temperature of a test point.

Description

Technical Field

[0001] The utility model relates to the field of temperature measuring devices, in particular to a heat-insulating temperature measuring device. Background Art

[0002] Public health and safety are receiving more and more attention, and human body temperature, as one of the important indicators of vital signs, is a highly valued health indicator. Improving the accuracy of body temperature monitoring is of great significance for vital sign monitoring.

[0003] Traditional temperature measurement devices mostly use PN junction temperature measurement chips. PN junction temperature measurement chips are temperature-sensitive devices made by using the characteristic that the forward voltage drop of diodes and transistors PN junctions changes with temperature. When the temperature changes, the voltage of the transistor PN junction changes, and it shows an approximately linear relationship. As long as the voltage change is measured, the temperature value can be calculated. PN junction temperature measurement chips are generally mounted on the back of the substrate, and the front of the substrate contacts the surface of the object to be measured. The temperature is transferred to the PN junction temperature measurement chip through the substrate.

[0004] Traditional temperature measuring devices such as mercury thermometers and infrared thermometers are too large to carry around, and they cannot provide continuous temperature monitoring. Some portable small temperature measuring devices such as temperature measuring watches have an ambient temperature generated by the internal battery and motherboard that can easily affect the temperature measurement accuracy. Therefore, how to manufacture a heat-insulating temperature measuring device that reduces the impact of ambient temperature on temperature testing is a technical problem that needs to be solved urgently. Utility Model Content

[0005] The utility model aims to provide a heat-insulating temperature measuring device, aiming to reduce the influence of the ambient temperature inside the heat-insulating temperature measuring device on the temperature test.

[0006] The utility model provides a heat-insulating temperature measuring device, comprising: a first stackable component, the first stackable component comprising a first substrate and a first structural member, the first structural member is in an enclosing frame shape and forms a cavity with one side of the first substrate, the first substrate is used to contact the surface of a measured object; a first temperature sensor is located in the cavity and placed on the first substrate, and is used to measure the temperature of a point to be measured.

[0007] Optionally, the thermal insulation temperature measuring device also includes: a second stackable component axially symmetrically arranged with respect to the first stackable component, the first stackable component and the second stackable component enclosing the sealed cavity, the second stackable component including a second substrate and a second structural member, the second structural member being in the shape of an enclosed frame with one end connected to the second substrate and the other end tightly connected to the first structural member.

[0008] Optionally, a plug-in interface is provided on the first substrate, and the plug-in interface is used to plug in components to achieve circuit conduction.

[0009] Optionally, a soldering pad is provided on a side of the second substrate facing the cavity, and the soldering pad is used for soldering functional components selected by a user.

[0010] Optionally, the functional component includes a second temperature sensor for measuring ambient temperature.

[0011] Optionally, the cavity is filled with a low thermal conductivity medium layer.

[0012] Optionally, a metal sheet is added to a side of the first substrate and / or the second substrate facing away from the cavity.

[0013] Optionally, a heat dissipation coating or a porous heat dissipation structure is additionally provided on a side of the first substrate and / or the second substrate facing away from the cavity.

[0014] Optionally, the first structural member and / or the second structural member is provided with a through hole, and the through hole penetrates the first structural member and / or the second structural member in a direction perpendicular to the first substrate. The through hole is used to connect the first structural member to the first substrate, and to connect the second structural member to the second substrate. The connection methods include patch connection and bonding.

[0015] Optionally, the first substrate or the second substrate is one of an FPC substrate, an FR4 substrate, a BT substrate, a polyester film substrate, a metal substrate, a glass substrate or a ceramic substrate.

[0016] The technical effects achieved by the utility model using the above technical solution are:

[0017] 1. When the heat-insulating temperature measuring device has only the first stackable component, the side of the first substrate facing away from the cavity contacts the surface of the object to be measured, and the first substrate is used to transfer heat to the first temperature sensor, so that the temperature measuring device can perform continuous temperature measurement. The first temperature sensor and the mainboard are separated by air with good heat insulation effect in the cavity, so that the first temperature sensor is not easily affected by the heating of the battery inside the device or the heating of the components on the mainboard, so that the measured temperature is closer to the actual temperature of the test point;

[0018] 2. When the thermal insulation temperature measuring device has a first stackable component and a second stackable component, the circuit designs of the two temperature sensors are differentiated so that the two temperature sensors can be used in combination to measure the temperatures on both sides (such as the surface temperature of the object to be measured and the surface temperature of the main board inside the thermal insulation temperature measuring device) at the same time. By using the measured surface temperature of the main board as the ambient temperature and combining the algorithm to further calibrate the surface temperature of the object to be measured, a higher measurement accuracy result can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1is a cross-sectional view of the thermal insulation temperature measuring device in Example 1;

[0020] Figure 2 A bottom view of the first thermal insulation temperature measuring device in Example 1;

[0021] Figure 3 A bottom view of the second thermal insulation temperature measuring device in Example 1;

[0022] Figure 4 A bottom view of the third thermal insulation temperature measuring device in Example 1;

[0023] Figure 5 A bottom view of the fourth thermal insulation temperature measuring device in Example 1;

[0024] Figure 6 A bottom view of the fifth thermal insulation temperature measuring device in Example 1;

[0025] Figure 7 A bottom view of the sixth thermal insulation temperature measuring device in Example 1;

[0026] Figure 8 This is a schematic diagram of the structure of adding a metal sheet to the substrate in Example 1;

[0027] Fig. 9 A cross-sectional view of a combined heat-insulating temperature measuring device using a double-baseboard double-structure member pattern in Example 2;

[0028] Fig.10 A cross-sectional view of a combined heat-insulating temperature measuring device using a double-baseboard single-structure member pattern in Example 3;

[0029] Fig.11 is a cross-sectional view of the combined heat-insulating temperature measuring device in Example 4;

[0030] Fig.12 This is a cross-sectional view of the combined optional thermal insulation temperature measuring device in Example 5.

[0031] Reference numerals:

[0032] 1. First stackable component; 11. First substrate; 12. First structural member; 2. Second stackable component; 21. Second substrate; 22. Second structural member; 31. First temperature sensor; 32. Second temperature sensor; 41. Cavity; 42. Through hole; 5. Metal sheet; 6. Plug port. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] It should be noted that, in this document, relational terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0035] Example 1

[0036] The present application provides a heat insulation temperature measuring device, referring to Figure 1 and Figure 2 The heat-insulating temperature measuring device is composed of a first stackable component 1 and a first temperature sensor 31. The first stackable component 1 is composed of a first substrate 11 and a first structural member 12. The first structural member 12 and the first temperature sensor 31 are mounted on the same surface of the first substrate 11. One surface of the first substrate 11 has a solder pad, and the first temperature sensor 31 is soldered on the solder pad. The first structural member 12 is in a closed frame shape, and forms a cavity 41 with one surface of the first substrate 11. The first temperature sensor 31 is located in the cavity 41, and there is a gap between the first temperature sensor 31 and the inner wall of the first structural member 12.

[0037] The first substrate 11 uses a thin PCB board with low thermal conductivity, for example, a polyimide substrate (such as an FPC substrate), a resin substrate (such as an FR4, BT substrate), a polyester film substrate, a metal substrate, a glass substrate, or a ceramic substrate. In this embodiment, a thin (0.1 mm thick) FPC substrate is preferably used as the first substrate 11.

[0038] Reference Figure 1 and Figure 2 One side (top side) of the first substrate 11 is a flat surface without any components; the other side (bottom side) opposite to it is provided with pads for convenient direct chip mounting, and the first temperature sensor 31 and the first structural member 12 are fixed on this side.

[0039] Reference Figures 2 to 7The first structural member 12 may be cylindrical or square cylindrical, and one axial end of the first structural member 12 is fixed to the surface of the first substrate 11. The first structural member 12 is hollow inside, and the hollow internal shape of the first structural member 12 may be cylindrical or a right prism. The first structural member 12 has a plurality of through holes 42, and the through holes 42 penetrate the first structural member 12 in a direction perpendicular to the first substrate 11. The through holes 42 are used to facilitate assembly and welding of the first structural member 12 and the first substrate 11 by patching, or to connect them by bonding with conductive silver glue. The cross-sectional shape of the through hole 42 along the direction parallel to the surface of the first substrate 11 may be a complete circle or an incomplete circle.

[0040] The first structural member 12 can be connected to the first substrate 11 by means of snap, bonding, pressing, hot melting, welding, bonding, etc. In this embodiment, the first structural member 12 and the first substrate 11 are preferably welded by conventional SMT patch process at room temperature and pressure, which has high manufacturability. The first structural member 12 can be formed by stamping, wire cutting, etching, sintering, etc. using resin (such as FR4), polyimide (such as FPC), polyester film material, metal, glass, ceramic or silicon dioxide. In this embodiment, a first structural member 12 with a thickness of 0.6 mm is preferably used.

[0041] Reference Figure 1 , one axial end of the first structural member 12 is fixedly connected to a side of the first substrate 11 where the solder pad is provided, and the hollow interior of the first structural member 12 and the surface of the first substrate 11 form a cavity 41; the first temperature sensor 31 is located at the center of the cavity 41, and the center of the cavity 41 is the axis of the first structural member 12, and the height of the first temperature sensor 31 is less than the depth of the cavity 41. The cavity 41 is filled with air and has a large thermal resistance. The cavity 41 can also be filled with a low thermal conductivity medium layer, such as aerogel, and the first temperature sensor 31 is wrapped with a low thermal conductivity medium layer to achieve a heat insulation effect.

[0042] Reference Figure 8 A metal sheet 5, such as a stainless steel sheet, can be attached and fixed to the top surface of the first substrate 11 where no components are arranged. The metal sheet 5 is used to reinforce the first substrate 11 and its circuit. The metal sheet 5 has little effect on the overall size of the thermal insulation temperature measuring device, but can greatly enhance the structural strength and is also beneficial to the heat exchange between the first substrate 11 and the environment.

[0043] A heat dissipation coating or a porous heat dissipation structure may be added to the top surface of the first substrate 11 where no components are arranged, which can reduce the equivalent heat transfer coefficient and is beneficial to reducing the equivalent thermal resistance between the first substrate 11 and the air.

[0044] When the thermal insulation temperature measuring device is working, the stackable component 1 is located between the object to be measured and the internal heat source (main board) of the thermal insulation temperature measuring device. The number of stackable components 1 can be one or a combination of two. This embodiment discusses the case where there is only one stackable component 1 between the object to be measured and the main board, as follows:

[0045] Reference Figure 1 A first structural member 12 and a first temperature sensor 31 are arranged on the bottom surface of the first substrate 11 (the side facing the main board), and the top surface of the first substrate 11 is used to be attached to the surface of the object to be measured; the first temperature sensor 31 and the main board are separated by the air in the cavity 41 and / or other low thermal conductivity medium layer, and the cavity 41 can be in an unsealed state, that is, the air in the cavity 41 can directly contact the main board.

[0046] The heat-insulating temperature measuring device proposed in this embodiment has the following working principle:

[0047] A cavity 41 with a certain heat-insulating function is formed on the first substrate 11 for accommodating the first temperature sensor 31. At the same time, the first temperature sensor 31 is mounted on one side of the first substrate 11, and the other side of the first substrate 11 contacts the surface of the object to be measured. The first substrate 11 is used to transfer heat to the first temperature sensor 31, so that the heat-insulating temperature measuring device can perform continuous temperature measurement. The first temperature sensor 31 and the mainboard of the heat-insulating temperature measuring device are separated by air with good heat-insulating effect in the cavity 41, so that the first temperature sensor 31 is not easily affected by the heat generated by the mainboard and components on the mainboard, so that the measured temperature is closer to the actual temperature of the test point.

[0048] Example 2

[0049] The present application embodiment provides a combined heat insulation temperature measuring device based on embodiment 1, which adopts a double substrate and double structural member style. Fig. 9 This embodiment discusses the situation where there are two stackable components (i.e., a first stackable component 1 and a second stackable component 2) between the object to be measured and the main board. The two stackable components are stacked and combined into one for use. The two temperature sensors of the two stackable components simultaneously measure the temperature of the object to be measured and the temperature of the main board.

[0050] Reference Fig. 9The second stackable component 2 is composed of a second substrate 21 and a second structural member 22; the second stackable component 2 has the same structure as the first stackable component 1, but the two are axially symmetrically arranged; the second structural member 22 is tightly connected to the first structural member 21 and connects the through holes 42 therein, and closes the originally open cavities 41 on the first stackable component 1 and the second stackable component 2 into a sealed cavity; the surface where the second structural member 22 is connected to the first structural member 21 is a plane, and the stackable component 2 and the first stackable component 1 are symmetrical about the plane. The second substrate 21 has a solder pad on one side facing the first substrate 11, and a second temperature sensor 32 is soldered on the solder pad. Fig. 9 When two stackable components are stacked, the two substrates of the two stackable components are parallel to and face each other, and the two structural members of the two stackable components are sealed and connected to form a sealed cavity 41. The top surface of the substrate of a stackable component closer to the object to be measured is used to be attached to the surface of the object to be measured, and the temperature sensor on the substrate can measure the surface temperature of the object to be measured through heat transfer of the substrate; the top surface of the substrate of a stackable component closer to the main board is used to be attached to the surface of the main board, and the temperature sensor on the substrate can measure the surface temperature of the main board through heat transfer of the substrate.

[0051] It is best to attach the substrate surface and the mainboard surface without an air gap. However, since there are many components on the mainboard, it is sometimes inconvenient to attach the substrate to the mainboard surface. Therefore, an air gap between the substrate and the mainboard surface is allowed. The measurement error of the mainboard temperature by the temperature sensor caused by the air gap can be calibrated through an algorithm.

[0052] The stacking of two stackable components is not a simple addition of structures, but a differentiation of the circuit designs of the two stackable components, so that the two temperature sensors can be used in combination to measure the temperatures on both sides (such as the temperature of the mainboard heating and the temperature of the test point) at the same time. By taking the measured mainboard temperature as the ambient temperature and combining the algorithm to further calibrate the surface temperature of the test point, a higher measurement accuracy result can be obtained. In addition, when two stackable components are stacked, the upper and lower symmetrical structure can make it sealed to become a product with a higher degree of integrity.

[0053] Example 3

[0054] The present application embodiment provides a combined heat insulation temperature measuring device based on the embodiment 2, which adopts a double-baseboard single-structure style. Fig.10 In order to simplify the structure and improve assembly efficiency, the two structural members in Example 2, namely the second structural member 22 and the first structural member 21, are simplified into one structural member, and the two substrates are connected and fixed by using one structural member.

[0055] Example 4

[0056] The present embodiment provides a combined heat-insulating temperature measuring device based on the embodiment 2. Compared with the temperature measuring device of the embodiment 2, the following contents are newly added:

[0057] Reference Fig.11 The first substrate 11 and / or the second substrate 21 can be lengthened and a plug interface 6 (such as a gold finger) can be designed so that the thermal insulation temperature measuring device can be used as an independent connector and inserted on or sunk on the main board, thereby reducing restrictions on the application. The design of the plug interface 6 further broadens the application scope of the thermal insulation temperature measuring device.

[0058] Example 5

[0059] The present application embodiment provides a combined optional heat insulation temperature measuring device based on embodiment 2, referring to Fig.12 Compared with the heat-insulating temperature measuring device of Example 2, pads without soldered components are reserved on the substrate close to the mainboard, i.e., the second substrate 21, for users to choose whether to install functional components, which are temperature sensors or humidity sensors.

[0060] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat-insulating temperature measuring device, characterized in that: include: A first stackable component (1), the first stackable component (1) comprising a first substrate (11) and a first structural member (12), the first structural member (12) being in the shape of an enclosed frame and forming a cavity (4) with one side of the first substrate (11), the first substrate (11) being used for contacting a surface of a measured object; A first temperature sensor (31) is located in the cavity (4) and placed on the first substrate (11) and is used to measure the temperature of a point to be measured.

2. The heat-insulating temperature measuring device according to claim 1, characterized in that: Also includes: A second stackable component (2) is arranged axially symmetrically with the first stackable component (1), the first stackable component (1) and the second stackable component (2) enclose a sealed cavity (4), the second stackable component (2) comprises a second substrate (21) and a second structural member (22), the second structural member (22) is in the shape of an enclosed frame, one end of the second structural member is connected to the second substrate (21), and the other end is tightly connected to the first structural member (12).

3. The heat-insulating temperature measuring device according to claim 1 or 2, characterized in that: The first substrate (11) is provided with an insertion interface (6), and the insertion interface (6) is used for inserting components to realize circuit conduction.

4. The heat-insulating temperature measuring device according to claim 2, characterized in that: A soldering pad is provided on a side of the second substrate (21) facing the cavity (4), and the soldering pad is used for soldering functional components selected by a user.

5. The heat-insulating temperature measuring device according to claim 4, characterized in that: The functional component comprises a second temperature sensor (32) for measuring the ambient temperature.

6. The heat-insulating temperature measuring device according to claim 1 or 2, characterized in that: The cavity (4) is filled with a low thermal conductivity medium layer.

7. The heat-insulating temperature measuring device according to claim 2, characterized in that: A metal sheet (5) is added to a side of the first substrate (11) and / or the second substrate (21) facing away from the cavity (4).

8. The heat-insulating temperature measuring device according to claim 2, characterized in that: A heat dissipation coating or a porous heat dissipation structure is additionally provided on a side of the first substrate (11) and / or the second substrate (21) facing away from the cavity (4).

9. The heat-insulating temperature measuring device according to claim 2, characterized in that: The first structural member (12) and / or the second structural member (22) are provided with a through hole (42), and the through hole (42) penetrates the first structural member (12) and / or the second structural member (22) in a direction perpendicular to the first substrate (11). The through hole (42) is used to connect the first structural member (12) with the first substrate (11), and to connect the second structural member (22) with the second substrate (21), and the connection methods include patch connection and bonding.

10. The heat-insulating temperature measuring device according to claim 2, characterized in that: The first substrate (11) or the second substrate (21) is one of an FPC substrate, an FR4 substrate, a BT substrate, a polyester film substrate, a metal substrate, a glass substrate or a ceramic substrate.

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