Semiconductor test dotting and drying all-in-one machine

Abstract

The utility model discloses a semiconductor testing, dotting and drying all-in-one machine, which relates to the technical field of semiconductor testing and comprises a frame, a feeding mechanism, a testing and dotting mechanism, a drying mechanism and a discharging mechanism. The feeding mechanism comprises a feeding manipulator and a placing part, the feeding manipulator is slidably mounted on the frame, the placing part is arranged on the frame, and the placing part is used for placing wafers; the testing and dotting mechanism is arranged on the frame, the feeding manipulator is used for transporting the wafer on the placing component to the testing and dotting mechanism, and the testing and dotting mechanism is used for testing the wafer and dotting; the drying mechanism is arranged on the frame and is used for drying the wafer; the discharging mechanism comprises a discharging mechanical arm and a collecting component, the discharging mechanical arm is installed on the frame in a sliding mode, the collecting component is arranged on the frame, the collecting component is used for placing the tested wafers, and the discharging mechanical arm is used for transporting the wafers on the testing and dotting mechanism to the drying mechanism and transporting the wafers on the drying mechanism to the collecting component.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor testing dotting and drying integrated machine. Background Art

[0002] In semiconductor testing, abnormal wafers usually need to be dotted and marked after testing, and the dot ink is dried through a baking process after dotting. In the prior art, testing, dotting and baking are performed by three independent devices. After the wafer test is completed, personnel are required to transport the materials to the dotting equipment. After the dotting is completed, the dotted materials also need to be transported to the baking equipment for baking. Therefore, the entire process of transporting materials takes a long time, which greatly reduces the operating efficiency.

[0003] Therefore, it is necessary to provide a new semiconductor test dotting and drying integrated machine to solve the above-mentioned technical problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a semiconductor testing dotting and drying integrated machine, aiming to improve the technical problem of low semiconductor testing operation efficiency in the prior art.

[0005] To achieve the above purpose, the semiconductor testing, dotting and drying integrated machine proposed by the utility model comprises:

[0006] frame;

[0007] A loading mechanism, the loading mechanism comprising a loading robot and a placing component, the loading robot is slidably mounted on the frame, the placing component is arranged on the frame, and the placing component is used to place the wafer;

[0008] A test dotting mechanism, wherein the test dotting mechanism is arranged on the frame, the loading robot is used to transport the wafer on the placement component to the test dotting mechanism, and the test dotting mechanism is used to test and dot the wafer;

[0009] A drying mechanism, the drying mechanism is arranged on the frame, and the drying mechanism is used to dry the wafer;

[0010] The unloading mechanism includes an unloading robot and a collecting component. The unloading robot is slidably mounted on the frame. The collecting component is arranged on the frame. The collecting component is used to place the wafers that have completed the test. The unloading robot is used to transport the wafers on the test dotting mechanism to the drying mechanism, and transport the wafers on the drying mechanism to the collecting component.

[0011] In one embodiment, the placement component includes a placement platform and a loading suction cup arranged on the top of the placement platform, and the placement platform can move toward or away from the loading suction cup.

[0012] In one embodiment, the test dotting mechanism includes a base, a supporting platform, a test needle holder and a dotting device needle holder, the test needle holder and the dotting device needle holder are both installed on the base, a test dotting area is formed on the base, the supporting platform is movably installed on the base, the loading robot is used to transport the wafer on the placement component to the supporting platform, the supporting platform can be moved to the test dotting area, the test needle holder is used to test the wafer, and the dotting device needle holder is used to dot the wafer.

[0013] In one embodiment, the test dot mechanism further includes a pressing piece component, which is mounted on the base, and the protruding end of the pressing piece component can be extended or retracted in a vertical direction so that the pressing piece component abuts against or moves away from the supporting platform.

[0014] In one embodiment, the test dot mechanism further includes an oil brushing component, which is mounted on the base and is used to brush oil on the surface of the wafer on the carrier.

[0015] In one embodiment, the test dot striking mechanism also includes an observation camera and an adjustment component, the adjustment component includes a sleeve, a main shaft and a locking piece, the observation camera is connected to the sleeve, the observation camera is located above the test dot striking area, the sleeve is rotatably sleeved on the main shaft, the main shaft is installed on the base, the sleeve is formed with a threaded hole, the locking piece is installed in the threaded hole, and the locking piece is abutted against the main shaft.

[0016] In one embodiment, the placement component includes a plurality of baffle rods, the placement platform is a circular placement platform, the frame is formed with a plurality of slide grooves, the plurality of slide grooves are arranged at circumferential intervals along the central axis of the circular placement platform, and the plurality of slide grooves extend along the diameter direction of the circular placement platform, the number of the plurality of slide grooves is equal to the number of the plurality of baffle rods, and the plurality of baffle rods are respectively slidably installed on the plurality of slide grooves.

[0017] In one embodiment, the test dot-marking mechanism further includes a plurality of first ejectors, the plurality of first ejectors are telescopically disposed on the support platform, the first ejectors can extend out of or retract into the support platform, and the plurality of first ejectors are arranged in a circle.

[0018] In one embodiment, the drying mechanism also includes a heating plate and a plurality of second ejector pins, wherein the plurality of second ejector pins are telescopically disposed on the heating plate, the second ejector pins can extend or retract into the supporting platform, the plurality of second ejector pins are arranged in a circle, and the heating plate is used to place and heat the wafer.

[0019] In one embodiment, the collecting component includes a base, a mounting plate, a collecting platform, a limiting rod, a support plate, and a telescopic frame. The number of the telescopic frames and the number of the support plates are both two. The two telescopic frames are telescopically mounted on the frame. The two support plates are respectively mounted on the two telescopic frames. The two support plates can approach or move away from each other to support the wafer or make the wafer fall onto the collecting platform. The mounting plate is mounted on the frame, the base is telescopically mounted on the mounting plate, the collecting platform is arranged on the base, the number of the limiting rods is multiple, and the multiple limiting rods are all arranged on the base and are arranged in a rectangular shape. The multiple limiting rods are all in contact with the side wall of the collecting platform.

[0020] In the above scheme, the semiconductor test dotting and drying integrated machine includes a frame, a loading mechanism, a test dotting mechanism, a drying mechanism and an unloading mechanism; the loading mechanism includes a loading robot and a placing component, the loading robot is slidably installed on the frame, the placing component is arranged on the frame, and the placing component is used to place wafers; the test dotting mechanism is arranged on the frame, the loading robot is used to transport the wafers on the placing component to the test dotting mechanism, and the test dotting mechanism is used to test and dot the wafers; the drying mechanism is arranged on the frame, and the drying mechanism is used to dry the wafers; the unloading mechanism includes an unloading robot and a collecting component, the unloading robot is slidably installed on the frame, the collecting component is arranged on the frame, and the collecting component is used to place wafers that have completed the test, and the unloading robot is used to transport the wafers on the test dotting mechanism to the drying mechanism, and transport the wafers on the drying mechanism to the collecting component. Specifically, the wafer to be tested is placed on the placing component, and the loading robot transports the wafer to be tested on the placing component to the test dotting mechanism for testing. If there is an abnormality during the wafer testing, the test dotting mechanism will dot the abnormal wafer with ink. After the test or dotting operation is completed, the unloading robot will transport the wafer to the drying mechanism, and the drying mechanism will dry the ink on the wafer after dotting. Then the unloading robot transports the dried wafer to the collecting component, thus completing the entire process. The utility model integrates the test dotting mechanism and the drying mechanism into a frame, and then transports the wafer through the loading robot and the unloading robot in the semiconductor test dotting and drying machine, so there is no need for manual transportation of materials, thereby greatly improving the efficiency of semiconductor testing operations. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the mechanisms shown in these drawings without paying creative work.

[0022] Figure 1 This is a schematic diagram of the overall structure of the semiconductor testing, dotting and drying integrated machine provided by the utility model;

[0023] Figure 2 A schematic diagram of the structure of the feeding mechanism and the unloading mechanism provided by the utility model;

[0024] Figure 3 A structural schematic diagram of the feeding mechanism provided by the utility model;

[0025] Figure 4 A schematic diagram of the structure of the test dot mechanism provided by the utility model;

[0026] Figure 5 This is a structural schematic diagram of the drying mechanism provided by the utility model.

[0027] Description of Figure Numbers:

[0028] 100. Semiconductor testing, dotting and drying machine; 1. Frame; 2. Loading mechanism; 3. Testing, dotting mechanism; 4. Drying mechanism; 5. Unloading mechanism; 21. Loading manipulator; 22. Placing component; 51. Unloading manipulator; 52. Collecting component; 221. Placing platform; 222. Loading suction cup; 31. Base; 32. Carrying platform; 33. Test needle holder; 34. Dotting device needle holder; 311. Testing, dotting area; 35. Pressing component; 36. Oil brushing component; 37. Observation camera; 38. Adjusting component; 381. Bushing; 382. Spindle; 383. Locking piece; 11. Slide; 223. Stop rod; 321. First ejector; 41. Heating plate; 42. Second ejector; 521. Base; 522. Mounting plate; 523. Collecting platform; 524. Limit rod; 525. Support plate; 526. Telescopic frame.

[0029] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0032] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0033] In the current existing technology, testing, dotting and baking are carried out by three independent devices. After the wafer testing is completed, personnel are required to transport the materials to the dotting equipment. After the dotting is completed, the dotted materials are also required to be transported to the baking equipment for baking. Therefore, the whole process of transporting materials takes a long time, which greatly reduces the operating efficiency.

[0034] See also Figures 1 to 5The utility model proposes a semiconductor test, dotting and drying integrated machine 100, comprising a frame 1, a loading mechanism 2, a test dotting mechanism 3, a drying mechanism 4 and a unloading mechanism 5; the loading mechanism 2 comprises a loading robot 21 and a placing component 22, the loading robot 21 is slidably mounted on the frame 1, the placing component 22 is arranged on the frame 1, and the placing component 22 is used to place wafers; the test dotting mechanism 3 is arranged on the frame 1, the loading robot 21 is used to transport the wafers on the placing component 22 to the test dotting mechanism 3, and the test dotting mechanism 3 is used to test the wafers and dot; the drying mechanism 4 is arranged on the frame 1, and the drying mechanism 4 is used to dry the wafers; the unloading mechanism 5 comprises a unloading robot 51 and a collecting component 52, the unloading robot 51 is slidably mounted on the frame 1, the collecting component is arranged on the frame 1, and the collecting component 52 is used to place the wafers that have completed the test, and the unloading robot 51 is used to transport the wafers on the test dotting mechanism 3 to the drying mechanism 4, and transport the wafers on the drying mechanism 4 to the collecting component 52. Specifically, the wafer to be tested is placed on the placement component 22, and the loading robot 21 transports the wafer to be tested on the placement component 22 to the test dotting mechanism 3 for testing. If there is an abnormality during the wafer testing, the test dotting mechanism 3 will dot the abnormal wafer with ink. After the test or dotting operation is completed, the unloading robot 51 will transport the wafer to the drying mechanism 4, and the drying mechanism 4 will dry the ink on the wafer after dotting. Then the unloading robot 51 transports the dried wafer to the collecting component 52, thus completing the entire process. In this embodiment, the test dotting mechanism 3 and the drying mechanism 4 are integrated into a frame 1, and then transported by the loading robot 21 and the unloading robot 51 in the semiconductor test dotting and drying machine, so that there is no need for manual transportation of materials, thereby greatly improving the efficiency of semiconductor testing operations.

[0035] See also Figures 1 to 3 In one embodiment, the placement component 22 includes a placement platform 221 and a loading suction cup 222 disposed on the top of the placement platform 221 , and the placement platform 221 can move toward or away from the loading suction cup 222 . The wafer to be tested is placed on the placement platform 221, and then the placement platform 221 moves toward the loading suction cup 222 until the wafer on the placement platform 221 abuts against the loading suction cup 222, and the loading suction cup 222 sucks the wafer tightly, and the placement platform 221 moves away from the loading suction cup 222, and then the loading robot 21 moves to the bottom of the loading suction cup 222, and the loading suction cup 222 no longer sucks the wafer tightly, and the wafer will fall onto the loading robot 21, and the loading robot 21 will transport the wafer to the test dotting mechanism 3, and the wafer can be tested and dotted; through the above-mentioned structure and the loading robot 21, the wafer is transported to the test dotting mechanism 3, so that the loading robot 21 will not interfere with the placement component 22, thereby affecting the transportation of the wafer, and protecting the loading robot 21 from damage.

[0036] See also Figure 1 and Figure 4 In one embodiment, the test dotting mechanism 3 includes a base 31, a carrier 32, a test needle holder 33 and a dotting device needle holder 34. The test needle holder 33 and the dotting device needle holder 34 are both installed on the base 31. A test dotting area 311 is formed on the base 31. The carrier 32 is movably installed on the base 31. The loading robot 21 is used to transport the wafer on the placement component 22 to the carrier 32. The carrier 32 can be moved to the test dotting area 311. The test needle holder 33 is used to test the wafer, and the dotting device needle holder 34 is used to dot the wafer. After the loading robot 21 transports the wafer to the carrier 32, the carrier 32 is started to move the carrier 32 to the test dotting area 311, and then the test needle holder 33 is started, and the test needle on the test needle holder 33 abuts against the wafer, so that the wafer can be tested. If the wafer has no abnormality, the unloading robot 51 will directly transport the wafer on the carrier 32 to the collecting component 52. If the wafer has an abnormality, the dotting device needle holder 34 will be started, so that the abnormal wafer will be dotted. Generally speaking, it is dotted by ink. In order to prevent the ink from sticking to other components or wafers, the unloading robot 51 will transport the dotted wafer to the drying mechanism 4 for drying. In this way, the ink will dry and form ink dots on the wafer, and it will not stick to other components or wafers. In the above structure, the test needle holder 33 and the dotting device needle holder 34 are integrated in a base 31, so that testing and dotting can be performed at the same time, and there is no need for transportation in the middle, which further improves the efficiency of semiconductor testing.

[0037] See also Figure 1 and Figure 4 In one embodiment, the test dotting mechanism 3 further includes a pressing component 35, which is mounted on the base 31. The protruding end of the pressing component 35 can be extended or retracted in the vertical direction so that the pressing component 35 abuts against or moves away from the carrier 32. Generally speaking, the wafer may have edge warping. When the edge warping is serious, it will affect the test and cannot be adsorbed and fixed on the carrier 32. At this time, the carrier 32 will be moved to the bottom of the pressing component 35, and then the pressing component 35 will be started. The protruding end of the pressing component 35 will extend and move toward the carrier 32, and the protruding end will flatten the wafer. At this time, the contact area between the wafer and the carrier 32 will be greatly increased, so that the wafer can be better adsorbed on the carrier 32 and facilitate subsequent testing.

[0038] See also Figure 1 and Figure 4In one embodiment, the test dotting mechanism 3 further includes an oil brushing component 36, which is mounted on the base 31 and is used to brush oil on the surface of the wafer on the carrier 32. When the wafer is undergoing a high-voltage test, it is easy to spark and damage the wafer. Before the carrier 32 moves to the test dotting area 311, the carrier 32 will first move to the oil brushing device, and the oil brushing device will brush a layer of oil film on the surface of the wafer, which will isolate oxygen, prevent sparks, protect the wafer from damage, and reduce the damage rate during the process.

[0039] See also Figure 1 and Figure 4 In one embodiment, the test dotting mechanism 3 also includes an observation camera 37 and an adjustment part 38, the adjustment part 38 includes a sleeve, a main shaft 382 and a locking piece 383, the observation camera 37 is connected to the sleeve, the observation camera 37 is located above the test dotting area 311, the sleeve is rotatably sleeved on the main shaft 382, ​​the main shaft 382 is installed on the base 31, the sleeve is formed with a threaded hole, the locking piece 383 is installed in the threaded hole, and the locking piece 383 is abutted against the main shaft 382. In order to ensure whether the position of the carrier 32 is moved to the test dotting area 311, an observation camera 37 is set, and the observation camera 37 is set above the test dotting area 311, so that when the observation camera 37 does not detect the existence of the carrier 32 in the test dotting area 311, the carrier 32 is controlled to continue to move until the carrier 32 moves to the test dotting area 311, and when the observation camera 37 detects the existence of the carrier 32 in the test dotting area 311, the carrier 32 stops moving, thereby ensuring that the carrier 32 is located in the test dotting area 311, so that normal dotting and testing can be performed; in order to ensure that the observation camera 37 can accurately detect the position of the carrier 32, the observation camera 37 is connected to the shaft sleeve, and the shaft sleeve is rotatably sleeved on the main shaft 382, ​​so that the shaft sleeve slides on the main shaft 382, ​​so that the height of the observation camera 37 can be adjusted, and the shaft sleeve is rotated on the main shaft 382, ​​so that the observation position of the observation camera 37 can be adjusted. Through such a setting, the height and position of the observation camera 37 can be adjusted.

[0040] See also Figures 1 to 3In one embodiment, the placement component 22 includes a plurality of blocking rods 223, the placement platform 221 is a circular placement platform 221, and the frame 1 is formed with a plurality of slide grooves 11, the plurality of slide grooves 11 are arranged at intervals along the central axis of the circular placement platform 221, and the plurality of slide grooves 11 extend along the diameter direction of the circular placement platform 221, the number of the plurality of slide grooves 11 is equal to the number of the plurality of blocking rods 223, and the plurality of blocking rods 223 are respectively slidably mounted on the plurality of slide grooves 11. The wafer is placed on the circular placement platform 221, and then the plurality of blocking rods 223 are respectively moved along the plurality of slide grooves 11, and the plurality of blocking rods 223 are moved along the center of the circular placement platform 221 until the blocking rods 223 abut against the wafer, so that the center of the wafer can be arranged coaxially with the center of the circular placement platform 221, so that the wafer is centered, so that the contact area between the loading suction cup 222 and the wafer is larger, and the wafer is better sucked and prevented from falling.

[0041] See also Figure 2 and Figure 4 In one embodiment, the test dotting mechanism 3 further includes a plurality of first ejector pins 321, which are telescopically arranged on the carrier platform 32. The first ejector pins 321 can extend or retract into the carrier platform 32, and the plurality of first ejector pins 321 are arranged in a circle. The wafer to be tested is placed on the placement platform 221, and then the placement platform 221 moves toward the loading suction cup 222 until the wafer on the placement platform 221 abuts against the loading suction cup 222, and the loading suction cup 222 sucks the wafer tightly, and the placement platform 221 moves away from the loading suction cup 222, and then the loading robot 21 moves to the bottom of the loading suction cup 222, and the loading suction cup 222 no longer sucks the wafer tightly, and the wafer will fall onto the loading robot 21, and the loading robot 21 will transport the wafer to the top of the carrier platform 32, at this time, the plurality of first ejector pins 321 extend, and the plurality of first ejector pins 321 will abut against the wafer, lift the wafer, and separate the wafer from the loading robot 21 , then the loading robot 21 continues to move away, and then the multiple first ejectors 321 retract into the carrier table 32, so that the wafer will fall onto the carrier table 32; after the test or dotting is completed, the multiple first ejectors 321 extend again, and the unloading robot 51 extends between the wafer and the carrier table 32, and then the multiple first ejectors 321 retract, and the wafer will fall onto the unloading robot 51, and the unloading robot 51 will move to the drying mechanism 4, and place the wafer on the drying mechanism 4 for drying. Through such a setting, the wafer can be removed from the loading robot 21 to the carrier table 32, and the wafer can also be placed from the carrier table 32 to the unloading robot 51.

[0042] See also Figure 5In one embodiment, the drying mechanism 4 also includes a heating plate 41 and a plurality of second ejector pins 42. The plurality of second ejector pins 42 are telescopically arranged on the heating plate 41. The second ejector pins 42 can extend or retract into the heating plate 41. The plurality of second ejector pins 42 are arranged in a circle. The heating plate 41 is used to place heated wafers. When the unloading robot 51 drives the wafer to be transported to the drying mechanism 4, multiple second ejectors 42 extend out to lift the wafer on the unloading robot 51 to separate the wafer from the unloading robot 51, and then the unloading robot 51 is moved away, and the multiple second ejectors 42 descend into the heating plate 41, and the wafer will fall on the heating plate 41, and then the heating plate 41 is heated to dry the ink on the wafer; after drying, the multiple second ejectors 42 extend out of the heating plate 41 to lift the wafer, and the unloading robot 51 moves between the wafer and the heating plate 41, and then the multiple second ejectors 42 retract into the heating plate 41, so that the wafer after drying will fall on the unloading robot 51, and then the unloading robot 51 transports the wafer to the collecting component 52 for collection; through such a setting, the drying mechanism 4 can remove the wafer from the unloading robot 51. Due to the increased drying effect, the wafers can be stacked after dotting, which will reduce the use of material boxes. At the same time, the stacking can also store more wafers and save storage space.

[0043] See also Figure 1 and Figure 2In one embodiment, the collecting component 52 includes a base 521, a mounting plate 522, a collecting platform 523, a limiting rod 524, a support plate 525, and a telescopic frame 526. The number of the telescopic frames 526 and the number of the support plates 525 are both two. The two telescopic frames 526 are telescopically mounted on the frame 1. The two support plates 525 are respectively mounted on the two telescopic frames 526. The two support plates 525 can approach or move away from each other to support the wafer or make the wafer fall onto the collecting platform 523; the mounting plate 522 is mounted on the frame 1, the base 521 is telescopically mounted on the mounting plate 522, the collecting platform 523 is arranged on the base 521, the number of the limiting rods 524 is multiple, the multiple limiting rods 524 are all arranged on the base 521 and are arranged in a rectangular shape, and the multiple limiting rods 524 are all in contact with the side wall of the collecting platform 523. Specifically, after the unloading robot 51 is transported to the collecting component 52, the two pallets 525 move away from each other, so that the distance between the two pallets 525 is greater than the unloading robot 51, and then the spacing between the two pallets 525 is smaller than the diameter of the wafer, and then the two telescopic frames 526 rise at the same time, and the two pallets 525 will lift the wafer away from the unloading robot 51, and then the unloading robot 51 is moved away, and the base 521 moves toward the pallet 525. At this time, the limit rod 524 and the collecting platform 523 will both move toward the pallet 525, and the two pallets 525 move away from each other, and the wafer will fall onto the collecting platform 523 through the channel formed by multiple limit rods 524, thus completing the collection; through such a setting, it is possible to prevent the height between the wafer and the collecting platform 523 from being too high, thereby causing damage to the wafer.

[0044] Each process in the above embodiment is independent. The semiconductor testing dotting and drying machine 100 also includes a control center, a variety of position sensors and wafer detection sensors. The control center obtains the status of each unit module and correctly controls the module action to prevent errors. For example, when the placement platform 221 is empty, an alarm will be triggered to remind you to put the material in; when the collection platform 523 is full of wafers, an alarm will be triggered to remind you to take the material to ensure that the material is placed and taken away in time to prevent the phenomenon of lack of material and material blockage. The control execution is carried out according to certain steps and processes. The specific process is as follows:

[0045] Wafer pickup: The operator places the wafer on the placement platform 221 to prepare the first wafer of this cycle. Multiple test dotting mechanisms 3 are operated in sequence. The loading robot 21 sucks the wafer and places it on the carrier 32.

[0046] Test: If the wafer is warped, the carrier 32 first moves to the tablet pressing device to flatten the wafer, then transports the carrier 32 to the oil brushing device to brush the wafer with oil, and then transports it to the test dotting area 311, observes the camera 37 to determine the position of the carrier 32, and then starts the test;

[0047] Dotting: Dotting is performed on abnormal wafers after testing. The movement path of the ink dots is consistent with the movement path of the test.

[0048] Baking: The unloading robot 51 moves the wafers onto the heating plate 41 in sequence;

[0049] Wafer placement: After the ink is dried, the unloading robot 51 transfers the wafers to the collecting component 52 in sequence, and finally drops them into the collecting platform 523 .

[0050] After the above process is completed, the sensor at the collection platform 523 detects whether the wafers are fully stored. If they are fully stored, a signal is sent to the control center, and the control center controls the warning light or alarm to remind the operator.

[0051] The above are only exemplary embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A semiconductor testing dotting and drying machine, characterized in that: include: frame; A loading mechanism, the loading mechanism comprising a loading robot and a placing component, the loading robot is slidably mounted on the frame, the placing component is arranged on the frame, and the placing component is used to place the wafer; A test dotting mechanism, wherein the test dotting mechanism is arranged on the frame, the loading robot is used to transport the wafer on the placement component to the test dotting mechanism, and the test dotting mechanism is used to test and dot the wafer; A drying mechanism, the drying mechanism is arranged on the frame, and the drying mechanism is used to dry the wafer; The unloading mechanism includes an unloading robot and a collecting component. The unloading robot is slidably mounted on the frame. The collecting component is arranged on the frame. The collecting component is used to place the wafers that have completed the test. The unloading robot is used to transport the wafers on the test dotting mechanism to the drying mechanism, and transport the wafers on the drying mechanism to the collecting component.

2. The semiconductor testing, dotting and drying integrated machine as claimed in claim 1, characterized in that: The placing component comprises a placing platform and a loading suction cup arranged on the top of the placing platform, and the placing platform can move toward or away from the loading suction cup.

3. The semiconductor testing, dotting and drying integrated machine according to any one of claims 1 or 2, characterized in that: The test dotting mechanism includes a base, a carrying platform, a test needle holder and a dotting device needle holder. The test needle holder and the dotting device needle holder are both installed on the base. A test dotting area is formed on the base. The carrying platform is movably installed on the base. The loading robot is used to transport the wafer on the placement component to the carrying platform. The carrying platform can be moved to the test dotting area. The test needle holder is used to test the wafer, and the dotting device needle holder is used to dot the wafer.

4. The semiconductor testing, dotting and drying integrated machine as claimed in claim 3, characterized in that: The test dot-marking mechanism further comprises a pressing piece component, which is mounted on the base. The protruding end of the pressing piece component can be extended or retracted in a vertical direction so that the pressing piece component abuts against or moves away from the supporting platform.

5. The semiconductor testing, dotting and drying integrated machine as claimed in claim 3, characterized in that: The test dotting mechanism also includes an oil brushing component, which is installed on the base and is used to brush oil on the surface of the wafer on the carrier.

6. The semiconductor testing, dotting and drying integrated machine as claimed in claim 3, characterized in that: The test dotting mechanism also includes an observation camera and an adjustment component, the adjustment component includes a sleeve, a main shaft and a locking piece, the observation camera is connected to the sleeve, the observation camera is located above the test dotting area, the sleeve is rotatably sleeved on the main shaft, the main shaft is installed on the base, the sleeve is formed with a threaded hole, the locking piece is installed in the threaded hole, and the locking piece abuts against the main shaft.

7. The semiconductor testing, dotting and drying integrated machine as claimed in claim 2, characterized in that: The placement component also includes a plurality of baffle rods, the placement platform is a circular placement platform, the frame is formed with a plurality of slide grooves, the plurality of slide grooves are arranged at circumferential intervals along the central axis of the circular placement platform, and the plurality of slide grooves extend along the diameter direction of the circular placement platform, the number of the plurality of slide grooves is equal to the number of the plurality of baffle rods, and the plurality of baffle rods are respectively slidably installed on the plurality of slide grooves.

8. The semiconductor testing, dotting and drying integrated machine as claimed in claim 3, characterized in that: The test dot mechanism further includes a plurality of first ejector pins, which are telescopically arranged on the support platform, and can be extended out of or retracted into the support platform, and are arranged in a circle.

9. The semiconductor testing, dotting and drying integrated machine as claimed in claim 3, characterized in that: The drying mechanism also includes a heating plate and a plurality of second ejector pins. The plurality of second ejector pins are telescopically arranged on the heating plate. The second ejector pins can extend or retract into the supporting platform. The plurality of second ejector pins are arranged in a circle. The heating plate is used to place and heat the wafer.

10. The semiconductor testing, dotting and drying integrated machine as claimed in claim 2, characterized in that: The collecting component comprises a base, a mounting plate, a collecting platform, a limiting rod, a support plate, and a telescopic frame. The number of the telescopic frames and the number of the support plates are both two. The two telescopic frames are telescopically mounted on the frame. The two support plates are respectively mounted on the two telescopic frames. The two support plates can approach or move away from each other to support the wafer or make the wafer fall onto the collecting platform. The mounting plate is mounted on the frame, the base is telescopically mounted on the mounting plate, the collecting platform is arranged on the base, the number of the limiting rods is multiple, and the multiple limiting rods are all arranged on the base and are arranged in a rectangular shape. The multiple limiting rods are all in contact with the side wall of the collecting platform.

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