Modular single-chip wet processing equipment

Abstract

The utility model relates to modular single-chip wet processing equipment, which comprises a bottom bearing base, a processing chamber is arranged on the bottom bearing base, gap adjusting devices distributed in pairs are arranged in the processing chamber, and a liquid discharging mechanism is arranged on the bottom bearing base and positioned between the gap adjusting devices. Wafer limiting equipment is arranged on the gap adjusting equipment, a processing area is formed between the wafer limiting equipment, and two cleaning devices which are distributed up and down are arranged in the processing area of the processing cavity. Therefore, the clamping and positioning requirements of 6-inch and 8-inch wafers can be met, two sets of independent wafer limiting equipment do not need to be prepared, the implementation cost is reduced, and the adjustment downtime is also reduced. By adopting the two cleaning devices, the upper and lower to-be-processed surfaces of the wafer can be cleaned, turning is not needed, and the risk that the wafer falls accidentally is avoided.

Description

Technical Field

[0001] The utility model relates to processing equipment, in particular to modular single-chip wet processing equipment. Background Art

[0002] For existing semiconductor processing, it is necessary to clean the surface of the wafer. Currently, the conventional method is mainly to use wet processing equipment.

[0003] The current wet processing equipment mainly supports the bottom of the wafer and then rinses the wafer with a spray device. After that, a flipping device is used to flip the wafer over and then rinse the other side. It takes a long time and the wafer is prone to falling during the flipping process. At the same time, during cleaning, the cleaning liquid can only be collected through the bottom water tray, which is prone to water overflow. If an external cleaning brush is used, the cleaning liquid or water is prone to splashing outward at the joint position of the cleaning brush. Moreover, the existing components for wafer positioning are customized. If a 6-inch or 8-inch wafer processing switch is encountered, the positioning component needs to be shut down and replaced, which reduces the processing efficiency and may cause assembly tolerances, affecting subsequent use.

[0004] In addition, a modular configuration is not adopted. The wet processing equipment needs to be equipped with independent pipelines and control equipment, and needs to occupy an independent workstation on the processing production line, which cannot achieve integrated adaptation.

[0005] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a modular single-chip wet processing equipment to make it more valuable for industrial use. Utility Model Content

[0006] In order to solve the above technical problems, the purpose of the utility model is to provide a modular single-chip wet processing equipment.

[0007] The modular single-chip wet processing equipment of the utility model includes a bottom bearing base, wherein: a processing chamber is arranged on the bottom bearing base, gap adjustment devices distributed in pairs are arranged in the processing chamber, a liquid discharge mechanism is arranged between the gap adjustment devices on the bottom bearing base, a wafer limiting device is arranged on the gap adjustment device, a processing area is formed between the wafer limiting devices, the processing chamber is located in the processing area and is provided with two cleaning devices distributed up and down, the cleaning device is a driving roller brush, and a cleaning gap is formed between the driving roller brushes; a cleaning gap control device is arranged on the back side of the bottom bearing base, the cleaning gap control device is connected to the driving roller brush through a control rod, the driving roller brush includes a rotating motor connected to the cleaning gap control device, a roller brush assembly is arranged on the driving end of the rotating motor, and a filtering device is arranged on the top of the processing chamber.

[0008] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the processing chamber includes a chamber frame, a plurality of transparent baffles are arranged on the chamber frame, the transparent baffle located on the front side of the chamber frame is provided with a door body, and a filtering device is installed on the transparent baffle located on the upper side of the chamber frame, and a port connected to the filtering device is provided.

[0009] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the door body is connected to the chamber frame through a hinge assembly; or, the door body is connected to the chamber frame through an opening and closing drive motor.

[0010] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the gap adjustment device includes guide rails distributed in pairs, a driving component is provided at one end of the guide rail, a slider is provided on the driving component, and the slider is movably connected to the guide rail.

[0011] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the driving component is an electric cylinder, or a pneumatic cylinder; or, the driving component is a screw motor, and the slider is threadedly connected to the screw of the screw motor.

[0012] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the drainage mechanism includes a drainage pipe arranged on the bottom supporting base, and a drainage hopper is arranged at the top of the drainage pipe below the processing area.

[0013] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the cleaning gap control device includes a storage box, two groups of gap adjustment components are arranged in the storage box, a control rod is arranged on the driving end of the gap adjustment component, a clearance hole is opened at the upper end of the storage box, the control rod passes through the clearance hole, a mounting base is arranged at the upper end of the control rod, the mounting base is connected to the corresponding rotating motor, and the gap adjustment component is an electric cylinder or a pneumatic cylinder.

[0014] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the processing chamber is located at the rear end of the cleaning device and is provided with a waterproof mechanism, the waterproof mechanism includes a waterproof baffle, the waterproof baffle is provided with a vertical adjustment groove, the adjustment groove is respectively slidably connected with an upper cover and a lower cover, the upper cover and the lower cover are both provided with a connecting hole, and the connecting rod that drives the roller brush passes through the connecting hole.

[0015] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the upper and lower ends of the waterproof baffle are provided with self-cleaning components, and the self-cleaning components are polyurethane blocks with meshes, or are artificial sponge blocks.

[0016] Furthermore, in the above-mentioned modular single-chip wet processing equipment, the filtering device is a fan filtering device.

[0017] By means of the above solution, the utility model has at least the following advantages:

[0018] 1. It can meet the clamping and positioning needs of 6-inch and 8-inch wafers without the need to prepare two independent sets of wafer limiting equipment, which reduces the implementation cost and the adjustment downtime.

[0019] 2. Two cleaning devices are used to clean the upper and lower processing surfaces of the wafer without turning it over, avoiding the risk of accidental wafer falling.

[0020] 3. A waterproof mechanism is added to avoid spillage of cleaning liquid and does not affect the use environment of the integrated processing equipment.

[0021] 4. The roller brush assembly can achieve self-cleaning, without the need to stop the machine for cleaning, thus improving processing efficiency.

[0022] 5. The modular configuration allows for easy adaptation and installation with integrated processing equipment.

[0023] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of a modular single-chip wet processing equipment.

[0025] Figure 2 It is a schematic diagram of the side structure of a modular single-chip wet processing equipment.

[0026] Figure 3 It is a schematic diagram of the wafer cleaning process principle.

[0027] Figure 4 It is a structural diagram of the waterproof mechanism.

[0028] The meanings of the reference numerals in the drawings are as follows.

[0029] 1 Bottom bearing base 2 Gap adjustment device

[0030] 3 Liquid discharge mechanism 4 Wafer limit device

[0031] 5 Roller brush assembly 6 Filter device

[0032] 7 Chamber frame 8 Transparent baffle

[0033] 9 Door body 10 Opening and closing drive motor

[0034] 11 Storage box 12 Control lever

[0035] 13 Mounting base 14 Rotating motor

[0036] 15 Waterproof baffle 16 Upper cover

[0037] 17 Lower cover 18 Connecting hole

[0038] 19 Self-cleaning components 20 Wafer DETAILED DESCRIPTION

[0039] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0040] like Figures 1 to 4The modular single-chip wet processing equipment includes a bottom bearing base 1, which is different in that: a processing chamber is arranged on the bottom bearing base 1 for constructing an independent wet processing environment. At the same time, gap adjustment devices 2 distributed in pairs are arranged in the processing chamber. In this way, adaptive adjustment can be achieved according to the size of the current wafer 20 to meet the clamping and positioning needs of 6-inch and 8-inch wafers. In addition, a drainage mechanism 3 is arranged between the bottom bearing base 1 and the gap adjustment device 2. Thus, the liquid during cleaning can be diverted to the gas-liquid collection device corresponding to the integrated processing equipment installed in the utility model to achieve centralized processing. During the implementation, in order to achieve displacement limiting of the current wafer 20, a wafer limiting device 4 is arranged on the gap adjustment device 2, so that a processing area is formed between the wafer limiting devices 4. The wafer limiting device 4 can use the currently available limiting columns or supporting blocks, etc., or some contact blocks with self-rotation functions, which will not be repeated here. In order to achieve convenient cleaning processing, the processing chamber is located in the processing area and two cleaning devices distributed up and down are arranged. Specifically, the cleaning device is a driving roller brush, and a cleaning gap is formed between the driving roller brushes. In order to adjust the cleaning gap according to the actual thickness of the current wafer 20, so as to facilitate better cleaning, a cleaning gap control device is provided on the back of the bottom bearing base 1, and the cleaning gap control device is connected to the driving roller brush through a control rod 12. Considering that a more convenient driving control can be provided to achieve cleaning similar to rolling contact, the driving roller brush used includes a rotating motor 14 connected to the cleaning gap control device, and a roller brush assembly 5 is provided on the driving end of the rotating motor 14. Furthermore, in order to centrally filter foreign matter such as dust that may appear during processing, the utility model is provided with a filter device 6 at the top of the processing chamber. Considering the convenience of centralized control, the drive ports of each device can be connected to the integrated processing equipment where the utility model is installed through an integrated control terminal, and unified control is achieved through the industrial control computer configured therein. Of course, for some special use environment needs, an industrial control computer can also be integrated in the bottom bearing base 1.

[0041] In view of a preferred embodiment of the utility model, in order to provide stable bearing, the processing chamber includes a chamber frame 7, and a plurality of transparent baffles 8 are arranged on the chamber frame 7, so that the current cleaning processing status can be observed conveniently. At the same time, the transparent baffle 8 located on the front side of the chamber frame 7 is provided with a door body 9, which can facilitate the placement of the wafer 20 and meet the sealing effect of the internal space during processing. The transparent baffle 8 located on the upper side of the chamber frame 7 is installed with a filter device 6, and a port connected to the filter device 6 is provided. During the implementation, the door body 9 is connected to the chamber frame 7 through a hinge assembly. Of course, considering the convenience of subsequent automated coordinated control, the door body 9 can also be connected to the chamber frame 7 through an opening and closing drive motor 10.

[0042] Looking further, the gap adjustment device 2 includes guide rails distributed in pairs, a driving assembly is provided at one end of the guide rail, a slider is provided on the driving assembly, and the slider is movably connected to the guide rail. In this way, stable gap adjustment can be achieved, and unnecessary up and down shaking will not occur under the constraint of the guide rail. At the same time, considering the convenience of implementation, the driving assembly is an electric cylinder or a pneumatic cylinder. Of course, a screw motor can also be used to form the driving assembly, and the slider is threadedly connected to the screw to which the screw motor belongs. In addition, the drainage mechanism 3 includes a drainage pipe arranged on the bottom bearing base 1, and a drainage hopper is provided at the top of the drainage pipe below the processing area. In this way, centralized diversion can be achieved.

[0043] In view of the actual implementation, the cleaning gap control device includes a storage box 11, in which two sets of gap adjustment components are arranged, and a control rod 12 is arranged on the driving end of the gap adjustment component. At the same time, a clearance hole is opened at the upper end of the storage box 11, and the control rod 12 passes through the clearance hole. A mounting base 13 is arranged at the upper end of the control rod 12, and the mounting base 13 is connected to the corresponding rotating motor 14. In addition, considering the convenience of control, the gap adjustment component is an electric cylinder or a pneumatic cylinder. In this way, the gap adjustment component uses the control rod 12 to adjust the upper and lower positions of the rotating motor 14, so as to achieve the adjustment of the relative gap between the two cleaning devices.

[0044] Looking further, the processing chamber is located at the rear end of the cleaning device and is provided with a waterproof mechanism to prevent leakage of the cleaning liquid during cleaning. Specifically, the waterproof mechanism includes a waterproof baffle 15, and a vertical adjustment groove is provided on the waterproof baffle 15. The upper cover 16 and the lower cover 17 are respectively slidably connected in the adjustment groove. The upper cover 16 and the lower cover 17 are both provided with a connection hole 18. The connecting rod driving the roller brush passes through the connection hole 18 and is connected to the driving end of the corresponding motor. In this way, the normal operation of the gap adjustment component is not affected, and the splashing and overflow of the cleaning liquid is avoided as much as possible. During the implementation, in order to meet the cleaning of the roller brush component 5 itself and prevent the dirt attached thereto from scratching the surface of the wafer 20, the upper and lower ends of the waterproof baffle 15 are provided with self-cleaning components 19. During the implementation, the self-cleaning component 19 is a polyurethane block with a mesh, or an artificial sponge block. In this way, when the gap adjustment assembly controls the two roller brush assemblies 5 to reach the upper and lower limit positions respectively, the roller brush assembly 5 contacts the self-cleaning assembly 19, and the surface of the roller brush assembly 5 is cleaned as it rotates.

[0045] Furthermore, the filter device 6 adopted in the present invention is a fan filter device 6 (FFU), which can achieve better filtering. Of course, during the implementation period, a suitable type of filter device 6 can be selected as needed, which will not be described in detail here.

[0046] The working principle of the utility model is as follows:

[0047] The utility model is installed in the integrated processing equipment to achieve the docking of the corresponding pipelines. The external feeding device feeds the wafer 20 into the processing chamber, and the gap adjustment device 2 drives the wafer limiting device 4 to limit the wafer 20.

[0048] Afterwards, the cleaning device, under the control of the cleaning gap control device, contacts the areas to be cleaned on the upper and lower surfaces of the wafer 20 to perform wet processing on the wafer 20. During this period, the cleaning liquid is guided by the drainage mechanism 3, and there will be no bottom accumulation and overflow.

[0049] After the processing is completed, the material taking device attached to the integrated processing equipment takes out the wafer 20. Subsequently, the two roller brush assemblies 5 run to the upper and lower extreme positions respectively, and the self-cleaning assembly 19 is used for cleaning.

[0050] Then, it enters the standby state and waits for the next wafer.

[0051] It can be seen from the above text description and the accompanying drawings that the following advantages are achieved after adopting the utility model:

[0052] 1. It can meet the clamping and positioning needs of 6-inch and 8-inch wafers without the need to prepare two independent sets of wafer limiting equipment, which reduces the implementation cost and the adjustment downtime.

[0053] 2. Two cleaning devices are used to clean the upper and lower processing surfaces of the wafer without turning it over, avoiding the risk of accidental wafer falling.

[0054] 3. A waterproof mechanism is added to avoid spillage of cleaning liquid and does not affect the use environment of the integrated processing equipment.

[0055] 4. The roller brush assembly can achieve self-cleaning, without the need to stop the machine for cleaning, thus improving processing efficiency.

[0056] 5. The modular configuration allows for easy adaptation and installation with integrated processing equipment.

[0057] In addition, the indicated orientations or positional relationships described in the present invention are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or structure referred to must have a specific orientation or be operated with a specific orientation structure. Therefore, they cannot be understood as a limitation on the present invention.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A modular single-chip wet processing device, comprising a bottom supporting base, characterized in that: A processing chamber is arranged on the bottom bearing base, and gap adjustment devices distributed in pairs are arranged in the processing chamber. A drainage mechanism is arranged on the bottom bearing base between the gap adjustment devices, and a wafer limiting device is arranged on the gap adjustment device. A processing area is formed between the wafer limiting devices. The processing chamber is located in the processing area and is provided with two cleaning devices distributed up and down. The cleaning devices are driving roller brushes, and a cleaning gap is formed between the driving roller brushes. A cleaning gap control device is arranged on the back side of the bottom bearing base, and the cleaning gap control device is connected to the driving roller brush through a control rod. The driving roller brush includes a rotating motor connected to the cleaning gap control device, and a roller brush assembly is arranged on the driving end of the rotating motor. A filtering device is arranged on the top of the processing chamber.

2. The modular single-chip wet processing equipment according to claim 1, characterized in that: The processing chamber includes a chamber frame, on which a plurality of transparent baffles are arranged, the transparent baffle located at the front side of the chamber frame is provided with a door body, the transparent baffle located at the upper side of the chamber frame is installed with a filter device, and is provided with a port connected to the filter device.

3. The modular single-chip wet processing equipment according to claim 2, characterized in that: The door body is connected to the chamber frame via a hinge assembly; or, the door body is connected to the chamber frame via an opening and closing drive motor.

4. The modular single-chip wet processing equipment according to claim 1, characterized in that: The gap adjustment device comprises guide rails distributed in pairs, a driving assembly is arranged at one end of the guide rail, a slider is arranged on the driving assembly, and the slider is movably connected to the guide rail.

5. The modular single-chip wet processing equipment according to claim 4, characterized in that: The driving component is an electric cylinder or a pneumatic cylinder; or, the driving component is a screw motor, and the slider is threadedly connected to the screw of the screw motor.

6. The modular single-chip wet processing equipment according to claim 1, characterized in that: The drainage mechanism comprises a drainage pipe arranged on the bottom bearing base, and a drainage hopper is arranged at the top of the drainage pipe below the processing area.

7. The modular single-chip wet processing equipment according to claim 1, characterized in that: The cleaning gap control device includes a storage box, in which two groups of gap adjustment components are arranged, a control rod is arranged on the driving end of the gap adjustment component, a clearance hole is opened at the upper end of the storage box, the control rod passes through the clearance hole, and a mounting base is arranged at the upper end of the control rod, and the mounting base is connected to the corresponding rotating motor. The gap adjustment component is an electric cylinder or a pneumatic cylinder.

8. The modular single-chip wet processing equipment according to claim 1, characterized in that: The processing chamber is located at the rear end of the cleaning device and is provided with a waterproof mechanism, the waterproof mechanism includes a waterproof baffle, the waterproof baffle is provided with a vertical adjustment groove, the adjustment groove is slidably connected with an upper cover and a lower cover, the upper cover and the lower cover are both provided with a connecting hole, and the connecting rod that drives the roller brush passes through the connecting hole.

9. The modular single-chip wet processing equipment according to claim 8, characterized in that: The upper and lower ends of the waterproof baffle are both provided with self-cleaning components, and the self-cleaning components are polyurethane blocks with meshes, or artificial sponge blocks.

10. The modular single-chip wet processing equipment according to claim 1, characterized in that: The filter device is a fan filter device.

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