Wafer overturning and sweeping mechanism and wafer overturning, sweeping and moving mechanism

Abstract

The utility model discloses a wafer overturning and sweeping mechanism and a wafer overturning, sweeping and moving mechanism, which belong to the technical field of semiconductor equipment and comprise a rotating device and a wafer sweeping device. And the rotating device is connected with the sheet sweeping device through the adapter flange and the suction plate mounting plate. In the prior art, because a wafer sweeping assembly and an overturning assembly are separated, system errors can occur, meanwhile, the two faces of a wafer material need to be adsorbed respectively, the pollution probability is increased, and the yield of products can be reduced due to the wafer sweeping assembly and the overturning assembly. According to the utility model, the transfer process between the wafer and other materials and the reversing assembly is simplified, so that the system error caused by transfer is avoided, the working efficiency is improved, and the product yield is improved, therefore, the transfer device has obvious advantages.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor equipment, and relates to a wafer flipping and scanning mechanism and a wafer flipping and scanning movement mechanism. Background Art

[0002] In the production process of semiconductor materials, it is necessary to pick up, place and reverse the wafer. The traditional solution is generally to use a four-axis robot to take out the wafer by adsorption, and then the reversal mechanism adsorbs the other side and flips it. At present, this practice has two effects on the yield of the product process. First, the traditional solution requires adsorption of both sides of the wafer. This process increases the probability of contamination of the wafer surface due to multiple contacts, which in turn affects the yield of the product. Second, the four-axis robot transfers the material to the reversal component. There is a systematic error when the two systems are docked, which affects the positioning accuracy of the material and thus affects the yield of the product. Therefore, it is necessary to find a flip scanning mechanism that can solve the above problems. Utility Model Content

[0003] In view of this, it is necessary to overcome at least one of the above-mentioned defects in the prior art. The utility model provides a wafer flipping and scanning mechanism and a wafer flipping and scanning movement mechanism.

[0004] A wafer flipping and scanning mechanism, characterized in that it comprises: a rotating device, the rotating device comprises a rotator, a shield, and a sensing component, wherein the rotator is connected to the shield through a connecting plate, and the sensing component is fixed to the connecting plate through a mounting bracket;

[0005] A film sweeping device, the film sweeping device includes a wafer suction plate and a suction plate fixing assembly, wherein the suction plate fixing assembly includes a suction plate mounting plate, an adapter flange, and an air pipe terminal joint; the wafer suction plate is fixed to the suction plate mounting plate, and the suction plate mounting plate is connected to the adapter flange; the air pipe terminal joint passes through the center hole of the adapter flange and is connected to the air hole on the suction plate mounting plate; the rotating device is connected to the film sweeping device through the adapter flange and the suction plate mounting plate.

[0006] Furthermore, the rotator is a rotary motor or a rotary cylinder.

[0007] Furthermore, the connecting plate is a square frame structure composed of an upper mounting plate, a lower mounting plate, a rear mounting plate, and a front mounting plate through fixing parts.

[0008] Furthermore, the sensing component includes a photoelectric sensor and a photoelectric sensor amplifier. The photoelectric sensor is connected to the rear mounting plate through a mounting bracket, and the photoelectric sensor amplifier is connected to the front mounting plate through an amplifier mounting bracket. The photoelectric sensor can detect the number and position of wafers or substrates inside the wafer boat box before taking and placing the wafers, and can also detect whether there are stacked or tilted wafers, providing relevant data for the mechanism to take and place, thereby ensuring the safety and reliability of taking and placing the wafers.

[0009] Furthermore, a suction hole is provided at one end of the wafer suction plate for adsorbing the wafer, the interior of the wafer suction plate is hollow, and the air hole at the other end is connected to the small hole on the suction plate mounting plate, and a hollow pipe is provided on the suction plate mounting plate for connecting the small hole and the air pipe terminal joint.

[0010] Furthermore, the trachea terminal joint is a rotary quick-change joint.

[0011] Furthermore, a sealing ring is provided at the air hole where the suction plate mounting plate and the wafer suction plate are connected, and the suction plate mounting plate and the suction plate mounting plate pressing plate are fastened to the wafer suction plate.

[0012] A mechanism for wafer flipping and scanning movement, characterized in that it includes a wafer flipping and scanning mechanism and a multi-axis mechanical device, the multi-axis mechanical device is connected to the upper end of the rotating device through a connecting component, the connecting component includes a connecting flange and a bearing, the terminal of the multi-axis mechanical device is connected through the connecting flange, the bearing and the upper mounting plate, and the connecting flange is fixed on the protective cover.

[0013] Furthermore, the rotator, the front mounting plate, and the upper mounting plate are hollow structures; the air pipe terminal joint is connected to the air pump of the multi-axis mechanical device through an air pipe, and the air pipe passes through the hollow parts of the connecting flange, the bearing, the upper mounting plate, the rotator, the front mounting plate, and the adapter flange to be connected to the air pipe terminal joint.

[0014] Furthermore, the multi-axis mechanical device is a four-axis manipulator.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0017] Figure 1 This is a three-dimensional diagram of the wafer flip scanning mechanism

[0018] Figure 2 It is a top view of the wafer flipping and scanning mechanism;

[0019] Figure 3 It is a rear view of the wafer flipping and scanning mechanism;

[0020] Figure 4 It is an exploded view of the scanning device of the wafer flip scanning mechanism;

[0021] Figure 5 This is an exploded view of the wafer flipping and scanning mechanism;

[0022] Figure 6 This is a structural diagram of the wafer flipping and scanning mechanism;

[0023] Figure 7 It is a diagram of an embodiment of a mechanism for wafer flipping and scanning movement;

[0024] In the figure, 100 is a scanning device, 111 is a suction plate mounting plate, 102 is a wafer suction plate, 103 is a suction hole, 112 is a sealing ring, 114 is an air pipe terminal joint, 115 is an adapter flange, 106 is a suction plate mounting plate pressure plate, 107 is an air hole, 200 is a rotating device, 210 is a protective cover, 201 is a right protective cover, 202 is a left protective cover, 220 is a connecting plate, 203 is an upper mounting plate, 204 is a rear mounting plate, 205 is a front mounting plate, 206 is a mounting bracket, 230 is a sensing component, 207 is a photoelectric sensor, 208 is a photoelectric sensor amplifier, 209 is a lower mounting plate, 211 is an amplifier mounting bracket, 212 is a rotator, 300 is a connecting flange, 301 is a bearing, and 400 is a multi-axis mechanical device. DETAILED DESCRIPTION

[0025] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be interpreted as limiting the present invention.

[0026] In the description of the present invention, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "back", "inside", "outside", "horizontal", "vertical", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "connection", "communication", "connected", "connection" and "fitting" should be understood in a broad sense. For example, it can be a fixed connection, an integral connection, or a detachable connection; it can be the internal communication of two elements; it can be a direct connection or an indirect connection through an intermediate medium; "fitting" can be the fit between surfaces, or the fit between points and surfaces or lines and surfaces, and also includes the fit between holes and axes. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0028] The invention concept of the utility model is as follows: by integrating the rotating wafer picking device into the multi-axis manipulator motion system, it is ensured that the wafer is sucked on a single side, avoiding contact contamination of the other side of the wafer. At the same time, the handover process between the transportation of materials such as wafers and the reversal components is simplified, thereby avoiding the system error caused by the handover, thereby improving the operating efficiency and the product yield, and thus having obvious advantages.

[0029] The wafer flipping and scanning mechanism of the present invention will be described below with reference to the accompanying drawings, wherein Figure 1 It is a three-dimensional diagram of the wafer flipping and scanning mechanism; Figure 2 It is a top view of the wafer flipping and scanning mechanism; Figure 3 It is a rear view of the wafer flipping and scanning mechanism; Figure 4 It is an exploded view of the scanning device of the wafer flip scanning mechanism; Figure 5 This is an exploded view of the wafer flip scanning mechanism. Figure 7 The figure is an embodiment of a mechanism for wafer flipping and scanning movement.

[0030] like Figures 1 to 7 As shown, the utility model discloses a wafer flipping and scanning mechanism. In one embodiment of the utility model, the wafer flipping and scanning mechanism includes a scanning device 100 and a rotating device 200. The rotating device includes a rotator 212, a shield 210, and a sensing component 230. The rotator 212 is connected to the shield 210 through a connecting plate 220, and the sensing component 230 is fixed to the connecting plate 220 through a mounting bracket 206.

[0031] The wafer scanning device 100 comprises a wafer suction plate 102 and a suction plate fixing assembly 101, wherein the suction plate fixing assembly 101 comprises a suction plate mounting plate 111, a sealing ring 112, an adapter flange 115, and an air pipe terminal joint 114; the wafer suction plate 102 is fixed on the suction plate mounting plate 111, and the suction plate mounting plate 111 is connected to the adapter flange 115; the air pipe terminal joint 114 passes through the middle hole of the adapter flange 115 and is connected to the air hole on the suction plate mounting plate 111;

[0032] The rotating device 200 is connected to the film sweeping device 100 via the adapter flange 115 and the suction plate mounting plate 111 .

[0033] According to the prior art described in the background technology of this patent, the four-axis manipulator first takes out the wafer by adsorption, and then the reversing mechanism adsorbs the other side and then flips it. This approach has two effects on the yield of the product process. Because the two surfaces of the material will be in contact during flipping, the probability of contamination on the wafer surface is increased. The mobile transmission and flipping are completed on two systems. There are system errors when the two systems are docked, which affects the positioning accuracy of the material. The above situation will eventually affect the yield of the product. The wafer flipping and scanning mechanism disclosed in the utility model has obvious advantages because it can reduce contact contamination and system errors by integrating the rotating wafer taking device into the multi-axis manipulator motion system, thereby reducing the probability of contamination on the wafer surface and improving the positioning accuracy.

[0034] In addition, the wafer flipping and scanning mechanism disclosed in the present invention also has the following additional technical features:

[0035] In another embodiment of the present invention, the rotator 212 is a rotary motor or a rotary cylinder.

[0036] In another embodiment of the present invention, the connecting plate is a square frame structure composed of an upper mounting plate 203, a lower mounting plate 209, a rear mounting plate 204, and a front mounting plate 205 through fixing parts.

[0037] In another embodiment of the present invention, the sensing component 230 includes a photoelectric sensor 207 and a photoelectric sensor amplifier 208. The photoelectric sensor 207 is connected to the rear mounting plate 204 via a mounting bracket 206. The sensing component 230 is used to collect parameters for the multi-axis mechanical device 400 to pick up and place wafers, ensuring the safety and reliability of wafer picking and placing. The photoelectric sensor amplifier 208 is connected to the front mounting plate 205 via an amplifier mounting bracket 211. The photoelectric sensor 207 can detect the number and position of wafers or substrates inside the wafer boat box before picking up and placing wafers, and can also detect whether there are stacked or tilted wafers, providing relevant data for the mechanism of the present invention to pick up and place wafers, ensuring the safety and reliability of wafer picking and placing. The photoelectric sensor amplifier 208 is used to assist the photoelectric sensor 207 in adjusting the adsorption terminal.

[0038] In another embodiment of the utility model, a suction hole 103 is provided at one end of the wafer suction plate 102 for adsorbing the wafer, the interior of the wafer suction plate 102 is hollow, and the air hole 107 at the other end is connected to the small hole on the suction plate mounting plate 111, and a hollow pipe is provided on the suction plate mounting plate 111 for connecting the small hole and the air pipe terminal connector 114.

[0039] In another embodiment of the present invention, the trachea terminal connector 114 is a rotary quick-change connector. Figure 4 shown.

[0040] In another embodiment of the present invention, a sealing ring is provided at the air hole 107 where the suction plate mounting plate 111 and the wafer suction plate are connected, and the suction plate mounting plate 111 and the suction plate mounting plate pressing plate 106 are fastened to the wafer suction plate 102. Figure 5 shown.

[0041] In another embodiment of the utility model, the mechanism for moving the wafer flipping and scanning film includes a wafer flipping and scanning film mechanism and a multi-axis mechanical device 400, and the multi-axis mechanical device 400 is connected to the upper end of the rotating device 200 through a connecting component, and the connecting component includes a connecting flange 300 and a bearing 301. The terminal of the multi-axis mechanical device 400 is connected through the connecting flange 300, the bearing 301 and the upper mounting plate 203, and the connecting flange 300 is fixed on the protective cover 210.

[0042] In addition, based on the wafer flipping and scanning mechanism disclosed in the present case, the utility model also discloses a wafer flipping and scanning movement mechanism having the following additional technical features:

[0043] According to some embodiments of the present case, the rotator 212, the front mounting plate 205, and the upper mounting plate 203 are hollow structures; the air pipe terminal joint 114 is connected to the air pump of the multi-axis mechanical device 400 through an air pipe, and the air pipe passes through the connecting flange 300, the bearing 301, the upper mounting plate 203, the rotator 212, the front mounting plate 205, and the hollow parts of the adapter flange 115 to be connected to the air pipe terminal joint 114.

[0044] According to some embodiments of the present case, the multi-axis mechanical device 400 is a four-axis robot.

[0045] The scanning device 100 controls the scanning device 100 to scan the wafer according to the parameters collected by the sensing component 230, and adsorbs the wafer material on the wafer suction plate 102 through the suction hole 103. During the process of the multi-axis mechanical device 400 moving the wafer material to the specified position, the rotating device 200 realizes the flipping of the wafer material by rotating the rotator 212 inside it.

[0046] Any reference to "some embodiments", "one embodiment", "embodiment", "illustrative embodiment", etc. means that the specific components, structures, or features described in conjunction with the embodiment are included in at least one embodiment of the present invention. Such illustrative expressions throughout this specification do not necessarily refer to the same embodiment. Moreover, when specific components, structures, or features are described in conjunction with any embodiment, it is claimed that it is within the scope of those skilled in the art to implement such components, structures, or features in conjunction with other embodiments.

[0047] Although the specific implementation of the utility model has been described in detail with reference to a plurality of illustrative embodiments of the utility model, it must be understood that a person skilled in the art may design a variety of other modifications and embodiments that will fall within the spirit and scope of the principles of the utility model. Specifically, within the scope of the foregoing disclosure, the accompanying drawings, and the claims, reasonable variations and improvements may be made in the arrangement of the components and / or the dependent combination layout without departing from the spirit of the utility model. Except for variations and improvements in components and / or layout, the scope is defined by the appended claims and their equivalents.

Claims

1. A wafer flipping and scanning mechanism, characterized in that ,include: A rotating device, comprising a rotator, a shield, and a sensing component, wherein the rotator is connected to the shield via a connecting plate, and the sensing component is fixed to the connecting plate via a mounting bracket; A wafer sweeping device, the wafer sweeping device comprises a wafer suction plate and a suction plate fixing assembly, wherein the suction plate fixing assembly comprises a suction plate mounting plate, an adapter flange, and an air pipe terminal joint; the wafer suction plate is fixed to the suction plate mounting plate, and the suction plate mounting plate is connected to the adapter flange; the air pipe terminal joint passes through the middle hole of the adapter flange and is connected to the air hole on the suction plate mounting plate; The rotating device is connected to the film sweeping device through the adapter flange and the suction plate mounting plate; the connecting plate is a square frame structure composed of an upper mounting plate, a lower mounting plate, a rear mounting plate and a front mounting plate through fixing parts.

2. The wafer flipping and scanning mechanism according to claim 1, characterized in that: The rotator is a rotary motor or a rotary cylinder.

3. The wafer flipping and scanning mechanism according to claim 1, characterized in that: The sensing component includes a photoelectric sensor and a photoelectric sensor amplifier. The photoelectric sensor is connected to the rear mounting plate via a mounting bracket, and the photoelectric sensor amplifier is connected to the front mounting plate via an amplifier mounting bracket.

4. The wafer flipping and scanning mechanism according to claim 1, characterized in that: The wafer suction plate is used to absorb the wafer and has a suction hole at one end. The wafer suction plate is hollow inside, and the air hole at the other end is connected to the small hole on the suction plate mounting plate. The suction plate mounting plate has a hollow pipe for connecting the small hole and the air pipe terminal joint.

5. The wafer flipping and scanning mechanism according to claim 1, characterized in that: The trachea terminal joint is a rotary quick-change joint.

6. The wafer flipping and scanning mechanism according to claim 1, characterized in that: A sealing ring is provided at the air hole where the suction plate mounting plate and the wafer suction plate are connected, and the suction plate mounting plate and the suction plate mounting plate pressing plate are fastened to the wafer suction plate.

7. A wafer flipping and scanning movement mechanism based on any one of claims 1 to 6, characterized in that: It includes a wafer flipping and scanning mechanism and a multi-axis mechanical device, the multi-axis mechanical device is connected to the upper end of the rotating device through a connecting component, the connecting component includes a connecting flange and a bearing, the terminal of the multi-axis mechanical device is connected through the connecting flange, the bearing and the upper mounting plate, and the connecting flange is fixed on the shield.

8. The wafer flipping and scanning movement mechanism according to claim 7, characterized in that: The rotator, the front mounting plate and the upper mounting plate are hollow structures; the air pipe terminal joint is connected to the air pump of the multi-axis mechanical device through an air pipe, and the air pipe passes through the hollow parts of the connecting flange, the bearing, the upper mounting plate, the rotator, the front mounting plate and the adapter flange to be connected to the air pipe terminal joint.

9. The wafer flipping and scanning movement mechanism according to claim 8, characterized in that: The multi-axis mechanical device is a four-axis manipulator.

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