The invention relates to the technical field of
semiconductor detection, in particular to a
semiconductor wafer detection method and
system. During application, the whole process is automatically executed, that is, automatic
probe calibration, automatic vector network calibration, automatic visual calibration and automatic teaching are realized, and finally, automatic detection of each to-be-detected
chip of the to-be-detected
wafer is realized. The full-process
automation of
wafer detection is realized through parameter configuration, multi-dimensional calibration, visual teaching and automatic detection,
chip and probe parameters are firstly set, then probe horizontal calibration, vector network
system error calibration and
visual positioning calibration are sequentially completed,
chip model features are created, a
needle insertion teaching position is marked, and the chip model features and the probe
insertion teaching position are marked. According to the method, automatic chip searching, accurate probe
insertion and electrified loop detection are achieved, the whole execution process can eliminate multi-dimensional errors such as probe postures,
signal transmission and space positioning, it is guaranteed that detection data are real and reliable, the wafer detection precision, efficiency and consistency are improved, and the method meets the high-precision detection requirement of large-scale
semiconductor wafers.