The invention discloses an ultrathin
chip packaging device and method, and relates to the technical field of
chip packaging device.The ultrathin
chip packaging device comprises a
workbench, a packaging drive adjusting
assembly is installed at the bottom end of the interior of the
workbench, and temperature fine adjustment of a fine part of an ultrathin chip material is achieved under cooperation of a packaging
temperature control assembly; the temperature uniformity in the packaging process is effectively improved, the
thermal reaction speed is increased, the influence of thermal stress on the ultra-thin chip material is reduced, the heat conduction abutting-in piece and the guide connection groove are arranged in an inserted connection and
contact mode, it is ensured that heat is rapidly and evenly transmitted to the surface of the ultra-thin chip material, the heat conduction efficiency is optimized, or when packaging heat is gathered, the heat conduction efficiency is improved, and the heat conduction efficiency is improved. The temperature is led out through the heat conduction abutting-in piece, the phenomenon that the ultrathin chip material is damaged or has internal defects due to overheating of the ultrathin chip material is avoided, the overall performance is improved, the service life is prolonged, precise control and fine adjustment of local temperature in the packaging process are achieved, and damage of thermal stress to the ultrathin chip material is reduced.