The invention relates to a one-time eroding-before-plating
metal frame subtraction embedded
chip inversely-arranged
salient point structure and a technological method. The one-time eroding-before-plating
metal frame subtraction embedded
chip inverse arranged salient structure is characterized in that a
metal substrate frame is included, a
paddle and pins are arranged in the
metal substrate frame, chips are arranged on the back face of the
paddle and the step surfaces of the pins through bottom filled glue,
plastic packaging materials wrap the area of the periphery of the
paddle, the area between the paddle and the pins, the area between the pins, the areas on the upper portion of the paddle, the areas on the upper portions of the pins, the area on the lower portion of the paddle, and the area on the lower portions of the pins and the chips, the
plastic packaging materials are aligned with the upper surface and the lower surface of the
metal substrate frame, anti oxidation
layers are plated on or
organic solderability preservative (OSP) wraps the front face of the paddle, the front faces and the back faces of the pins and the surface of the
metal substrate frame, and metal balls are arranged on the back faces of the pins. The one-time eroding-before-plating metal frame subtraction embedded
chip inversely-arranged
salient point structure has the advantages of being capable of solving the problem that the function and the application performance of a metal
wire frame are restricted due to the fact that objects cannot be buried in the plate thickness of the traditional metal
wire frame.