Wafer positioning and clamping device for thin film deposition

Abstract

The utility model relates to a wafer positioning and clamping device for film deposition, which comprises a base, a driving positioning block and a driven positioning block are assembled on the base along a first direction in a guiding and sliding manner, the driving positioning block and the driven positioning block are arranged at intervals along the same path, and a driving mechanism for driving the driving positioning block to reciprocate is further arranged on the base. The space between the driving positioning block and the driven positioning block and the space between the driven positioning block and the adjacent side wall of the base form a positioning space used for positioning and clamping a wafer, and the height of the side walls, clamping the wafer, of the base, the driven positioning block and the driving positioning block is not larger than the height of the upper surface of the wafer to be positioned. And when the driving positioning block moves, the driven positioning blocks can be pushed by the wafers to approach the side wall of the base so as to horizontally clamp and fix the wafers in the positioning spaces. The problems that a conventional fixing piece is too large in edge pressing and too high in height to block deposition are solved. The surface of the wafer is not shielded, the method is suitable for complex angle deposition, and an angle process window is large.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film deposition equipment, in particular to a wafer positioning and clamping device for thin film deposition. Background Art

[0002] At present, when depositing thin films on wafers of various sizes and shapes, commonly used fixing methods include using high-temperature tape to stick or fixing by a metal pressing sheet / pressing needle to fix the sample tray.

[0003] For example, a wafer stage and a wafer thinning machine are disclosed in the Chinese utility model patent document with application number CN116713837A, which place a film frame (and a wafer) on the wafer stage, and then remove the film frame from the wafer stage or place and lock the film frame on the wafer stage by switching the working position of the locking member. The locking member can press down a pressing plate through a second bracket so that the pressing plate can press against the film frame, thereby fixing the film frame.

[0004] This type of pressing form requires the pressing plate to be pressed against the upper surface of the wafer during actual operation, which leads to problems such as inconvenience in fixing the sample and the large height of the pressing plate blocking the deposition. The above-mentioned pressing form has problems such as a large fixed edge and a large pressing area when fixing the wafer or an irregular substrate; or the pressing plate is overall high, which affects the angle process window during non-vertical deposition, which will affect subsequent process processing.

[0005] In addition, the wafer surface is clamped by pressing the wafer surface. Conventional methods use a circular positioning table on a wafer carrier, and the wafer is pressed and fixed by several pressure plates on the circumference. However, this method can only position and clamp standard wafers and wafers of uniform size one by one. When positioning and clamping non-standard wafers, special equipment is required, and it cannot meet the requirements of synchronous positioning and clamping of multiple wafers. It is not applicable and the equipment cost is high. Utility Model Content

[0006] The purpose of the utility model is to provide a wafer positioning and clamping device for thin film deposition, so as to solve the problems of complicated operation, obstruction of deposition, etc. caused by positioning and clamping the wafer in the form of upper surface pressing in the prior art, and lack of applicability to multiple wafers and non-standard wafers.

[0007] In order to solve the above problems, the wafer positioning and clamping device for thin film deposition involved in the utility model adopts the following technical solutions:

[0008] A wafer positioning and clamping device for thin film deposition comprises a base, on which an active positioning block and a driven positioning block are installed for sliding movement along a first direction, and the two are arranged at intervals along the same path. The base is also provided with a driving mechanism for driving the active positioning block to move back and forth. The space between the active positioning block and the driven positioning block, and between the driven positioning block and the adjacent side wall of the base constitute a positioning space for positioning and clamping the wafer. The height of the side walls of the base, the driven positioning block, and the active positioning block for clamping the wafer is not higher than the height of the upper surface of the wafer to be positioned. When the active positioning block moves, the driven positioning block can be pushed by the wafer to approach the side wall of the base so as to horizontally clamp and fix the wafers in each positioning space.

[0009] Furthermore, there are more than two driven positioning blocks, and the driven positioning blocks are arranged at intervals along the first direction, and the positioning space is formed between the driven positioning blocks.

[0010] Furthermore, a guide groove extending along the first direction is provided on the base, and the side walls of the active positioning block and the driven positioning block are slidably assembled with the guide groove.

[0011] Furthermore, the driving mechanism includes a screw rotatably assembled in the guide groove, the active positioning block is provided with a threaded hole arranged through along the first direction, the screw is threadedly assembled with the threaded hole to drive the active positioning block to reciprocate when the screw rotates.

[0012] Furthermore, the driving mechanism also includes an operating handle connected to the end of the screw rod.

[0013] Furthermore, the driven positioning block is provided with a through hole which is arranged to penetrate along the first direction, and the screw rod passes through the through hole and is assembled with the threaded hole.

[0014] Furthermore, a protective layer is provided between the side of the active positioning block facing away from the driven positioning block and the other side wall of the base.

[0015] Furthermore, there are more than two active positioning blocks, which are arranged side by side at intervals along a second direction, and the second direction is perpendicular to the first direction.

[0016] Furthermore, the corresponding side walls of the active positioning block, the corresponding side walls of the passive positioning block and one side wall of the base are provided with horizontally extending step surfaces on both side walls of the positioning space, the depth of the step surface is lower than the height of the chip to be clamped, and the step surface is used to support the chip.

[0017] Furthermore, the corresponding side walls of the active positioning block, the corresponding side walls of the driven positioning block and the side walls of the base enclose side walls of the positioning space that are planes extending perpendicular to the first direction.

[0018] The beneficial effects of the utility model are as follows: the wafer positioning and clamping device for thin film deposition adopts the relative arrangement of active positioning blocks and driven positioning blocks, which are relatively enclosed with the side wall of the base to form multiple positioning spaces arranged along the first direction, and adopts manual sliding driven positioning blocks and driving mechanisms to drive the active positioning blocks to precisely adjust, and squeezes and fixes the wafers at both ends of the active positioning blocks and driven positioning blocks. A driving mechanism can meet the synchronous positioning and clamping of the wafers in various positioning spaces such as between the active positioning blocks and the driven positioning blocks, and between the driven positioning blocks and the side wall of the base. This multi-positioning block matching method can adapt to wafers of various standard sizes and non-standard sizes (minimum processing size <5mm*5mm), and adopts the circumferential side to squeeze the edge of the wafer for positioning and clamping, which solves the problem of conventional fixings with excessive pressure edges and fixings that block deposition due to excessive height. The wafer surface is free of any obstruction, which can be applied to complex angle deposition, and has a large angle process window. The angle window of non-vertical deposition is improved, which can adapt to various deposition angle processes, support the processing of samples of various sizes, and can be expanded to etching and cleaning processes, with multi-scenario application prospects; it also reduces the risk of fixed pressing pieces contaminating the wafer, improves the critical conditions for the design of wafer edge drawings, eliminates the contamination of mechanical mechanisms due to multiple coatings, and can further improve the chip yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solution of the embodiment of the utility model, the following is a brief introduction to the drawings required for use in the embodiment:

[0020] Figure 1 It is a schematic structural diagram of a specific embodiment of the wafer positioning and clamping device for thin film deposition of the utility model;

[0021] Figure 2 for Figure 1 A top view of

[0022] Figure 3 for Figure 2 Middle AA section view;

[0023] Figure 4 The schematic diagram of the structure of the device is applicable to a wafer.

[0024] Description of reference numerals: 1-base; 11-guide groove;

[0025] 2-active positioning block; 21-threaded hole; 22-step surface;

[0026] 3-driven positioning block; 31-through hole;

[0027] 4-screw; 5-operating handle; 6-wafer; 7-positioning space; 8-protective layer. DETAILED DESCRIPTION

[0028] In order to make the technical purpose, technical solution and beneficial effects of the utility model clearer, the technical solution of the utility model is further described below in conjunction with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model, that is, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The components of the embodiments of the utility model described and shown in the drawings can be arranged and designed in various different configurations.

[0029] The specific embodiment of the wafer positioning and clamping device for thin film deposition involved in the utility model, as shown in the figure, comprises a base 1 and an active positioning block 2, a driven positioning block 3 and a driving mechanism arranged on the base 1. The active positioning block 2 and the driven positioning block 3 can be guided and slid along a first direction on the base 1, and the first direction is positioned as a left-right direction. In this embodiment, the driving mechanism is assembled on the base 1 and is connected to the active positioning block 2 in a transmission manner. The driven positioning block 3 is arranged between the left side wall of the base 1 and the active positioning block 2, and the moving paths of the active positioning block 2 and the driven positioning block 3 are consistent. Specifically, the driven positioning block 3 is arranged in the space between the left side of the active positioning block 2 and the right side of the left side wall of the base 1. And the space between the active positioning block 2 and the driven positioning block 3, and between the driven positioning block 3 and the adjacent side wall of the base 1 constitutes a positioning space 7 for positioning and clamping the wafer. During the actual clamping process, the driving mechanism drives the active positioning block 2 to move leftward. When the active positioning block 2 moves, the wafer 6 can push the passive positioning block 3 to the left toward the left side wall of the base 1 to horizontally clamp and fix the wafer 6 in each positioning space 7.

[0030] During the actual operation, a positioning space 7 is formed between the left side wall of the active positioning block 2 and the right side wall of the driven positioning block 3, and a positioning space 7 is formed between the left side wall of the driven positioning block 3 and the left side wall of the base 1. First, each chip 6 is placed in each positioning space 7 arranged along the first direction, and then when the active positioning block 2 moves to the left, it pushes the chip 6 in the adjacent positioning space 7 to move to the left. At the same time, the chip 6 pushes the driven positioning block 3 to the left, and the driven positioning block 3 pushes the chip 6 in another positioning space 7 to move to the left until it is in contact with the left side wall of the base 1, thereby achieving the same clamping and fixation of the chips 6 in each positioning space 7.

[0031] In order to avoid blocking the upper surface of the wafer 6 and increase the process window, the height of the side walls of the base 1, the driven positioning block 3, and the active positioning block 2 for clamping the wafer 6 is not higher than the height of the upper surface of the wafer 6 to be positioned. After the wafer 6 is positioned and clamped, the upper surface of the wafer 6 protrudes from the positioning space 7, and there is no blocking on the surrounding side, and the wafer 6 is fixed only by the clamping force in the horizontal direction.

[0032] In order to realize the guided sliding assembly of the active positioning block 2 and the driven positioning block 3, the base 1 is provided with a guide groove 11 extending along the first direction, and the side walls of the active positioning block 2 and the driven positioning block are guided and slidably assembled with the guide groove 11. Figure 1 As shown, the base 1 is a rectangular frame structure, and a guide groove 11 is provided inside thereof, which runs through from top to bottom. The guide groove 11 extends along the left-right direction (i.e., the first direction). The active positioning block 2 and the driven positioning block 3 are inserted downward into the guide groove 11, and at the same time, the front and rear side walls thereof are fitted with the front and rear groove walls of the guide groove 11 to realize the guided sliding assembly.

[0033] In order to realize the driving of the active positioning block 2, the driving mechanism includes a screw rod 4 rotatably assembled in the guide groove 11, and the active positioning block 2 is provided with a threaded hole 21 which is arranged through in the left-right direction. The screw rod 4 is threadedly assembled with the threaded hole 21 to drive the active positioning block 2 to move back and forth when the screw rod 4 rotates. The two ends of the screw rod 4 are rotatably assembled on the left and right side walls of the base 1 through bearings. At the same time, the left end of the screw rod 4 protrudes to the left of the base 1, and a screw handle is connected to the left end of the screw rod 4. In order to avoid the screw rod 4, the driven positioning block 3 is provided with a through hole 31 which is through in the left-right direction. The screw rod 4 passes through the through hole 31 and is threadedly assembled with the threaded hole 21. In this way, during the rotation of the screw rod 4, the active positioning block 2 can be driven to slide in the left-right direction. At the same time, through the push of the active positioning block 2 or the wafer 6, the driven positioning block 3 can be pushed to the left to move to the left.

[0034] The screw 4 is used for transmission because the sample needs to be transferred in different cavities under high vacuum during the preparation process, and the process requires accurate knowledge of the angle of the sample. The ordinary horizontal clamping drive method may cause the sample to loosen and the angle change to cause the sample preparation to fail. The manual drive using the operating handle 5 can avoid the situation where the clamping is too tight due to electric control or other control methods, and the sample thickness is about 0.5 mm, which may crush the sample.

[0035] Of course, in other embodiments, electric drive may be used, and pressure sensors may be arranged on the corresponding clamping surfaces to transmit signals in time to achieve precise control of the horizontal driving stroke and the clamping force. Other methods may also be used to drive the active positioning block 2, such as cam push rods, connecting rod mechanisms, etc., without specific limitation.

[0036] The left side of the active positioning block 2 in the above-mentioned base 1 is defined as the working space, and the space on the right side of the active positioning block 2 is defined as the floating space. In order to prevent metal from growing onto the screw 4 and affecting the normal use of the screw 4 as the number of film growth increases, and to prevent impurities from entering the floating space and affecting the accurate and stable operation of the equipment, a protective layer 8 is provided between the right side wall of the active positioning block 2 and the right side wall of the base 1. The protective layer 8 can be implemented in the form of a folding cover plate, or a cover cloth, a flexible plastic plate, a rubber telescopic cloth, etc.

[0037] In order to achieve precise clamping of the wafer and avoid blocking the upper end surface of the wafer 6, that is, to achieve that the height of the side walls of the base 1, the driven positioning block 3, and the active positioning block 2 for clamping the wafer 6 is not higher than the upper surface height of the wafer 6 to be positioned, in this embodiment, the upper end surfaces of the base 1, the driven positioning block 3, and the active positioning block 2 are arranged at the same height. At the same time, on the inner side surface of the left side wall of the base 1, on the side wall surfaces of the driven positioning block 3, and on the left side wall surface of the active positioning block 2, horizontally extending step surfaces 22 are provided on the side walls of the positioning space 7. The depth of the step surface 22 is lower than the height of the wafer 6 to be clamped. The step surface 22 is used to support the wafer 6. Specifically, through the design of the step surface 22, it is convenient to hold and clamp the wafer. The height of the step surface 22 is 0.1-1mm, preferably 0.3-0.5mm, which is suitable for the thickness requirements of most wafers 6.

[0038] In order to adapt to the size and specifications of the rectangular wafer 6, the side walls of the positioning space 7 are arranged on the inner side of the left side wall of the base 1, the side walls of the driven positioning block 3, and the left side wall of the active positioning block 2 to form a planar structure extending in the front-to-back direction. This ensures that the two sides of the positioning space 7 are relatively fitted and fixed by contact between the two planes during the clamping process.

[0039] In order to adapt to the size and specifications of the circular wafer 6, as Figure 4 As shown, on the inner side surface of the left side wall of the base 1, on the side wall surfaces of the driven positioning block 3, and on the left side wall surface of the active positioning block 2, the side walls of the positioning space 7 are arranged to be arc-shaped surfaces convex outward in opposite directions, and the arc-shaped surface is crescent-shaped as a whole, which is adapted to the curvature design of the chip 6.

[0040] In order to adapt to the size and specifications of other types of circular wafers 6, the side walls on both sides can also be designed as a structural form adapted to the peripheral surface of the wafer, such as a polygonal wafer 6 using a flared surface.

[0041] There are two positioning spaces 7 on the base 1. In order to expand the number of positioning spaces 7 and realize the synchronous positioning and clamping of multiple wafers 6, there are more than two driven positioning blocks 3, and each driven positioning block 3 is arranged at intervals along the left-right direction, and a positioning space 7 is formed between the driven positioning blocks 3 and the driven positioning blocks 3. In order to realize the clamping of more wafers 6 and ensure the compact design of the structure of the base 1, there are more than two active positioning blocks 2, which are arranged side by side at intervals along the front-back direction, and the corresponding guide grooves 11, screw rods 4, operating handles 5, etc. are also designed with more than two, corresponding to each active positioning block 2.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate but not to limit the technical solutions of the present invention, and any equivalent substitutions of the present invention and any modifications or partial substitutions that do not depart from the spirit and scope of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A wafer positioning and clamping device for thin film deposition, characterized in that: The invention comprises a base, on which an active positioning block and a driven positioning block are installed for sliding movement along a first direction, and the two are arranged at intervals along the same path. The base is also provided with a driving mechanism for driving the active positioning block to move back and forth. The space between the active positioning block and the driven positioning block, and between the driven positioning block and the adjacent side wall of the base constitutes a positioning space for positioning and clamping the wafer. The height of the side walls of the base, the driven positioning block and the active positioning block for clamping the wafer is not higher than the height of the upper surface of the wafer to be positioned. When the active positioning block moves, the driven positioning block can be pushed by the wafer to approach the side wall of the base so as to horizontally clamp and fix the wafers in each positioning space.

2. The wafer positioning and clamping device for thin film deposition according to claim 1, characterized in that: There are more than two driven positioning blocks, and the driven positioning blocks are arranged at intervals along the first direction, and the positioning space is formed between the driven positioning blocks.

3. The wafer positioning and clamping device for thin film deposition according to claim 2, characterized in that: The base is provided with a guide groove extending along a first direction, and the side walls of the active positioning block and the driven positioning block are slidably assembled with the guide groove.

4. The wafer positioning and clamping device for thin film deposition according to claim 3, characterized in that: The driving mechanism includes a screw rod rotatably assembled in the guide groove, the active positioning block is provided with a threaded hole arranged through along the first direction, the screw rod is threadedly assembled with the threaded hole to drive the active positioning block to reciprocate when the screw rod rotates.

5. The wafer positioning and clamping device for thin film deposition according to claim 4, characterized in that: The driving mechanism also includes an operating handle connected to the end of the screw rod.

6. The wafer positioning and clamping device for thin film deposition according to claim 4, characterized in that: The driven positioning block is provided with a through hole which is arranged through in a first direction, and the screw rod passes through the through hole and is assembled with the threaded hole.

7. The wafer positioning and clamping device for thin film deposition according to claim 4, characterized in that: A protective layer is provided between the side of the active positioning block facing away from the driven positioning block and the other side wall of the base.

8. The wafer positioning and clamping device for thin film deposition according to any one of claims 1 to 7, characterized in that: There are more than two active positioning blocks, which are arranged side by side at intervals along a second direction, and the second direction is perpendicular to the first direction.

9. The wafer positioning and clamping device for thin film deposition according to any one of claims 1 to 7, characterized in that: The corresponding side walls of the active positioning block, the corresponding side walls of the driven positioning block and one side wall of the base enclose the positioning space on both sides of the side walls, and horizontally extending step surfaces are provided on the side walls. The depth of the step surface is lower than the height of the chip to be clamped, and the step surface is used to support the chip.

10. The wafer positioning and clamping device for thin film deposition according to claim 9, characterized in that: The corresponding side walls of the active positioning block, the corresponding side walls of the driven positioning block and the side walls of the base enclose the two side walls of the positioning space as planes extending perpendicularly to the first direction.

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