Carrier plate and injection machine

Abstract

The utility model provides a carrying disc and an injection machine, the carrying disc comprises a carrying disc body and a fixing support, the carrying disc body comprises a process surface and a wafer bearing groove recessed relative to the process surface, a first end of the fixing support is located on the process surface, and a second end of the fixing support is located on the wafer bearing groove. The second end of the fixing support can move around the first end so as to extend into and move out of the wafer bearing groove. Therefore, the wafers with different sizes can be fixed by designing the wafer bearing grooves with different sizes under the condition that the overall size of the carrying disc is not changed, and the carrying disc can be compatible with the wafers with different sizes when being applied to other equipment subsequently, so that the operation process of the wafers with different sizes is realized.

Description

Technical Field

[0001] The present application relates to the technical field of wafer fixing, and in particular to a carrier and an implanter. Background Art

[0002] During the operation of the original implanter, the wafer is directly fixed in the terminal system (such as the base in the process chamber). Since the size of the terminal system is fixed, it can only perform the implantation process on wafers of a specific size (such as 12 inches). To perform the implantation process on 6-inch, 8-inch or other-sized wafers, the implanter needs to be modified and the base needs to be modified to 6-inch, 8-inch or other sizes. However, the modified equipment is not compatible with the implantation process on 6-inch, 8-inch, 12-inch or other-sized wafers. Utility Model Content

[0003] The purpose of the present application is to provide a carrier and an implanter, aiming to provide a carrier that can be compatible with and fix wafers of various sizes, so that when the carrier is subsequently applied to the equipment, it can be compatible with the operating processes of wafers of different sizes.

[0004] In one aspect, the present application provides a carrier disk, comprising:

[0005] The carrier body comprises a process surface and a wafer carrying groove recessed relative to the process surface;

[0006] A fixed bracket, wherein the first end of the fixed bracket is located on the process surface, and the second end of the fixed bracket can move around the first end to extend into and move out of the wafer carrying groove.

[0007] In some embodiments, the wafer carrying slot is circular, and the inner diameter of the wafer carrying slot is smaller than the outer diameter of the carrier, and the inner diameter of the wafer carrying slot is the same as the diameter of the wafer.

[0008] In some embodiments, the inner diameter of the wafer carrying slot is less than 12 inches, and the outer diameter of the carrier is greater than or equal to 12 inches.

[0009] In some embodiments, the fixing brackets are evenly distributed around the edge of the wafer carrying slot, and the number of the fixing brackets is 4.

[0010] In some embodiments, the carrier further comprises:

[0011] A fixing member passes through the process surface along a first direction, wherein the first direction is perpendicular to the process surface;

[0012] Wherein, the first end of the fixing bracket has a through hole, and the through hole is sleeved on the fixing piece.

[0013] In some embodiments, the fixing member includes a fixing post and a limiting portion, the fixing post extends along the first direction, and the limiting portion is located at an end of the fixing post away from the carrier body; the carrier further includes:

[0014] An elastic member, two ends of which are respectively in contact with the limiting portion and the first end.

[0015] In some embodiments, the fixing bracket includes an arched portion, the arched portion is connected between the first end and the second end, and the arched portion is arched in a direction away from the carrier body.

[0016] In some embodiments, the fixing bracket further includes a curling portion, and the curling portion is bent from the second end to a side away from the carrier body.

[0017] In another aspect, the present application provides an implanter, comprising:

[0018] Process cavity;

[0019] A base is located in the process chamber, and the base is used to accommodate the carrier in any of the above embodiments.

[0020] The present application provides a carrier and an implanter, wherein the carrier comprises a carrier body and a fixed bracket, wherein the carrier body comprises a process surface and a wafer bearing slot recessed relative to the process surface, wherein a first end of the fixed bracket is located on the process surface, and a second end of the fixed bracket can move around the first end to extend into and out of the wafer bearing slot. Therefore, wafers of various sizes can be fixed by designing wafer bearing slots of various sizes without changing the overall size of the carrier, and subsequently when the carrier is applied to other equipment, it can be compatible with wafers of various sizes, thereby realizing the operation process of wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0022] Figure 1 is a schematic diagram of a top view of a carrier provided in some embodiments of the present application;

[0023] Figure 2 Some embodiments of the present application provide Figure 1 A front view of the cross-sectional structure of the middle carrier plate at A-A1;

[0024] Figure 3 It is a schematic diagram of the structure of the injection machine provided in some embodiments of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0026] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0027] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0028] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0029] This article uses Cartesian coordinates to represent directions, where "X" represents the first direction, "Y" represents the second direction, and "Z" represents the direction perpendicular to "X" and "Y".

[0030] Ion implantation technology provides an accurate and efficient means for doping and modifying semiconductor materials. The target disk device (also called the base) of the ion implanter is used to place the wafer to be processed, and realize the ion implantation process through the graphite electrode unit and the power supply unit. The target disk device of the implanter plays a vital role in semiconductor manufacturing, ensuring the safety and stability of the wafer in each processing step. However, in the prior art, the target disk device of the implanter is of fixed size, and can only perform the implantation process on wafers of fixed size, and is not compatible with the implantation process of wafers of other sizes. Of course, the implantation process of wafers of other sizes can be realized by modifying the size of the target disk device in the implanter, but after the modification, it is still not compatible with wafers of various other sizes, and the modification cost is very high.

[0031] Based on this, the present application provides a carrier that can be compatible with and fix wafers of various sizes. When the carrier is directly applied to the target plate device of the implanter, the implantation process of wafers of various sizes can be realized. In addition, the design cost of the carrier that is compatible with wafers of various sizes is 80% lower than the cost of modifying the implanter.

[0032] See also Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a top view of a carrier provided in some embodiments of the present application, Figure 2 Some embodiments of the present application provide Figure 1 A front view of the cross-sectional structure of the middle loading plate at A-A1.

[0033] The carrier 100 includes a carrier body 10 and a fixing bracket 20, wherein the carrier body 10 includes a process surface 11 and a wafer bearing slot 12 recessed relative to the process surface 11, a first end 21 of the fixing bracket 20 is located on the process surface 11, and a second end 22 of the fixing bracket 20 can move around the first end 21 to extend into and out of the wafer bearing slot 12. Therefore, wafers of various sizes can be fixed by designing wafer bearing slots 12 of various sizes without changing the overall size of the carrier 100, and when the carrier 100 is subsequently applied to other equipment, it can be compatible with wafers of various sizes and realize the operation process of wafers of different sizes.

[0034] In some embodiments, the material of the carrier body 10 can be bakelite, which has good insulation properties and has the advantages of high temperature resistance, corrosion resistance, high mechanical strength, easy processing, light weight, and environmental protection.

[0035] In some embodiments, the process surface 11 surrounds the edge of the wafer carrying groove 12, and one end of the fixing bracket 20 is fixed on the process surface 11. Figure 1 As shown, the process surface 11 is in a ring shape surrounding the edge of the wafer carrying groove 12 .

[0036] In some embodiments, the top view of the wafer bearing slot 12 is circular, and the inner diameter of the wafer bearing slot 12 is smaller than the outer diameter of the carrier 100, and the inner diameter of the wafer bearing slot 12 is the same as the diameter of the wafer. The wafer bearing slot 12 is used to carry the wafer, and the thickness of the carrier 100 at the process surface 11 is greater than the thickness of the carrier 100 at the wafer bearing slot 12, and the depth of the wafer bearing slot 12 along the first direction X can be the same as the thickness of the wafer.

[0037] Exemplarily, the inner diameter of the wafer carrying slot 12 is less than 12 inches, and the outer diameter of the carrier 100 is greater than or equal to 12 inches. It should be noted that the larger the outer diameter of the carrier 100, the larger the inner diameter range of the wafer carrying slot 12 can be, that is, the larger the diameter range of the adapted wafers. For example, when the outer diameter of the carrier 100 is equal to 12 inches, the inner diameter of the wafer carrying slot 12 can be 6 inches or 8 inches, etc., and the diameter of the wafer that can be fixed can be 6 inches or 8 inches, etc. When the outer diameter of the carrier 100 is equal to 8 inches, the inner diameter of the wafer carrying slot 12 can only be designed to be less than 8 inches, and the diameter of the wafer that can be fixed is also less than 8 inches.

[0038] Therefore, a carrier 100 having wafer bearing slots 12 of various sizes can be provided, and the process of digging the slots is simple, easy to operate, and low in cost. When it is needed, the carrier 100 can be directly and conveniently carried, and a 6-inch or 8-inch or other-sized wafer can be directly placed in the wafer bearing slot 12 of the carrier 100 for use. Since the overall or external dimensions of the carrier 100 remain unchanged, the carrier 100 can be switched at will in the device to realize the operation process of wafers of different sizes.

[0039] In some embodiments, the fixing brackets 20 are evenly distributed around the edge of the wafer holding slot 12 to stably fix the wafer.

[0040] Exemplarily, the number of the fixing brackets 20 is 4. It is understandable that the present application does not limit the number of the fixing brackets 20, and the number of the fixing brackets 20 can be set according to actual needs, so as to stably fix the wafer.

[0041] In some embodiments, the carrier 100 further includes a fixing member 30, and the fixing member 30 passes through the process surface 11 along a first direction X, and the first direction X is perpendicular to the process surface 11. The fixing member 30 can be used to fix one end of the fixing bracket 20. Exemplarily, the fixing member 30 can be a screw.

[0042] In some embodiments, the first end 21 of the fixed bracket 20 has a through hole 211, and the through hole 211 is sleeved on the fixing member 30, so as to limit the first end 21 and allow the first end 21 to rotate around the fixing member 30, thereby realizing the rotational movement of the second end 22 around the first end 21, so that when the wafer needs to be placed, the second end 22 of the fixed bracket 20 is first moved out of the wafer supporting groove 12, and when the wafer needs to be fixed, the second end 22 is rotated to extend into the wafer supporting groove 12, so that the second end 22 is pressed on the upper surface of the wafer to achieve the purpose of fixing the wafer.

[0043] In some embodiments, the fixing bracket 20 may be an elastic member so that it can be flexibly lifted and lowered to reduce wear on the wafer.

[0044] In some embodiments, the fixing bracket 20 includes an arched portion 23, the arched portion 23 is connected between the first end 21 and the second end 22, and the arched portion 23 is arched in a direction away from the carrier body 10. Exemplarily, the first end 21, the second end 22 and the arched portion 23 can be a whole, and the design of the arched portion 23 can facilitate the movement of the fixing bracket 20.

[0045] In some embodiments, the fixing bracket 20 further includes a curling portion 24, and the curling portion 24 is bent from the second end 22 to a side away from the carrier body 10. The design of the curling portion 24 is conducive to reducing damage to the wafer during the process of taking and placing and fixing.

[0046] In some embodiments, the distance between the first end 21 and the second end 22 is greater than the distance from the first end 21 to the edge of the wafer bearing slot 12. It should be noted that the distance between the first end 21 and the second end 22 is a straight line distance, and the distance from the first end 21 to the edge of the wafer bearing slot 12 is the shortest distance from the first end 21 to the edge of the wafer bearing slot 12.

[0047] In some embodiments, the fixing member 30 may pass through the carrier body 10 and be fixed on a side of the carrier body 10 opposite to the process surface 11. Figure 2 As shown, the side wall of the fixing member 30 has an inwardly recessed clamping portion 31, and the clamping portion 31 is arranged along the circumferential direction of the fixing member 30. The carrier body 10 has a through hole 211 passing through the process surface 11, and the through hole 211 surrounds the clamping portion 31 and is connected to the clamping portion 31. It should be noted that the size of the clamping portion 31 along the second direction Y is smaller than the size of other parts of the fixing member 30 along the second direction Y.

[0048] In some embodiments, the fixing member 30 includes a fixing column 32 and a limiting portion 33, wherein the fixing column 32 extends along the first direction X, and the limiting portion 33 is located at an end of the fixing column 32 away from the carrier body 10. The fixing column 32 can pass through the carrier body 10 along the first direction X, and the two ends of the fixing column 32 are respectively located on both sides of the process surface 11. Among them, the clamping portion 31 is a part of the fixing column 32, and the size of the clamping portion 31 along the second direction Y is smaller than the size of other parts of the fixing column 32 along the second direction Y.

[0049] The carrier 100 may further include an elastic member 40 , and two ends of the elastic member 40 are respectively in contact with the limiting portion 33 and the first end 21 .

[0050] In some embodiments, the maximum dimension of the fixing column 32 along the second direction Y (i.e., the dimension of the other parts of the fixing column 32 along the second direction Y) is smaller than the dimension of the limiting portion 33 along the second direction Y. The elastic member 40 may be arranged around the circumference of the fixing column 32, one end of the elastic member 40 may abut against one end of the limiting portion 33 close to the fixing bracket 20, and the other end of the elastic member 40 may abut against the first end 21 of the fixing bracket 20. Exemplarily, the elastic member 40 may be a spring.

[0051] The carrier 100 provided in the embodiment of the present application includes a carrier body 10 and a fixing bracket 20, wherein the carrier body 10 includes a process surface 11 and a wafer bearing slot 12 recessed relative to the process surface 11, wherein a first end 21 of the fixing bracket 20 is located on the process surface 11, and a second end 22 of the fixing bracket 20 can move around the first end 21 to extend into and out of the wafer bearing slot 12. Therefore, wafers of various sizes can be fixed by designing various sizes of the wafer bearing slot 12 without changing the overall size of the carrier 100, and when the carrier 100 is subsequently applied to other equipment, it can be compatible with wafers of various sizes, thereby realizing the operation process of wafers of different sizes.

[0052] See also Figure 3 , Figure 3 It is a schematic diagram of the structure of the injection machine provided in some embodiments of the present application.

[0053] The implanter 200 includes a process chamber 201 and a base 202 located in the process chamber 201, and the base 202 is used to accommodate a carrier 203 in any of the above embodiments. The carrier 203 includes a carrier body and a fixed support, the carrier body includes a process surface and a wafer bearing slot recessed relative to the process surface, the first end of the fixed support is located on the process surface, and the second end of the fixed support can move around the first end to extend into and out of the wafer bearing slot.

[0054] In some embodiments, the base 202 and the carrier plate 203 are both circular in top view, and the outer diameter of the carrier plate 203 is the same as the inner diameter of the base 202. For example, the inner diameter of the base 202 is 12 inches, and the outer diameter of the carrier plate 203 is also 12 inches.

[0055] When performing the ion implantation process, the wafer is fixed in the carrier 203, and then the carrier 203 is placed in the base 202 to perform the ion implantation process on the wafer. Placing the wafer together with the carrier 203 in the base 202 can also effectively protect the wafer in the implanter 200.

[0056] For an implanter 200 with a 12-inch base 202, it is very costly to modify the size of the base 202 to implement an implantation process for wafers of other sizes (e.g., 8 inches). The present application only requires replacing a carrier 203 with different wafer carrying slots 12 sizes, and can flexibly switch the implantation process for 6-inch and 8-inch, 12-inch, or other sized wafers, which has the advantages of being safe, portable, and easy to operate, and can also greatly reduce the cost of modification.

[0057] The implanter 200 may also include multiple parts such as an ion source, an accelerator tube, a scanning system, an aspirator, a mass analyzer, a control system, and a vacuum system, each of which plays an important role and together completes the task of high-precision ion implantation. Among them, the process chamber is the area where ion implantation is actually performed, and usually contains a vacuum environment to prevent contamination and protect the sample.

[0058] The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technical personnel in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A carrier plate, characterized in that: include: The carrier body comprises a process surface and a wafer carrying groove recessed relative to the process surface; A fixed bracket, wherein the first end of the fixed bracket is located on the process surface, and the second end of the fixed bracket can move around the first end to extend into and move out of the wafer carrying groove.

2. The carrier according to claim 1, characterized in that: The wafer carrying groove is circular, and the inner diameter of the wafer carrying groove is smaller than the outer diameter of the carrier, and the inner diameter of the wafer carrying groove is the same as the diameter of the wafer.

3. The carrier plate according to claim 2, characterized in that: The inner diameter of the wafer carrying slot is less than 12 inches, and the outer diameter of the carrier is greater than or equal to 12 inches.

4. The carrier according to claim 1, characterized in that: The fixing brackets are evenly distributed around the edge of the wafer carrying slot, and the number of the fixing brackets is 4.

5. The carrier plate according to claim 1, characterized in that: The carrier plate also includes: A fixing member passes through the process surface along a first direction, wherein the first direction is perpendicular to the process surface; Wherein, the first end of the fixing bracket has a through hole, and the through hole is sleeved on the fixing piece.

6. The carrier plate according to claim 5, characterized in that: The fixing member includes a fixing post and a limiting portion, the fixing post extends along the first direction, and the limiting portion is located at an end of the fixing post away from the carrier body; the carrier also includes: An elastic member, two ends of which are respectively in contact with the limiting portion and the first end.

7. The carrier plate according to claim 1, characterized in that: The fixing bracket includes an arched portion, the arched portion is connected between the first end and the second end, and the arched portion arches in a direction away from the carrier body.

8. The carrier plate according to claim 1, characterized in that: The fixing bracket further includes a curling portion, and the curling portion is bent from the second end to a side away from the carrier body.

9. An injection machine, characterized in that: include: Process cavity; A base located in the process chamber, the base is used to accommodate the carrier according to any one of claims 1 to 8.

10. The injection machine according to claim 9, characterized in that The base and the carrier are both circular, and the outer diameter of the carrier is the same as the inner diameter of the base.

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