Wafer clamping device

Abstract

The utility model provides a wafer clamping device, comprising a YZ motion module, a support arm, a support and a pin, one end of the support arm is connected with the YZ motion module, the support is slidably connected with the other end of the support arm and can horizontally slide relative to the support arm, and the support is provided with a clamping assembly; a reset piece is arranged on the support arm, is in contact with the bracket and can drive the bracket to return to the original position when the bracket displaces; an infrared sensor is arranged at the other end of the supporting arm, a light blocking piece is arranged on the support, a light passing opening is formed in the light blocking piece, and the light passing opening is located between the transmitting end and the receiving end of the infrared sensor. According to the utility model, the support can float horizontally relative to the support arm, so that the clamping stress of the clamping assembly on the wafer is prevented from being increased sharply during material clamping; the light blocking sheet enables the infrared sensor to sense, so that the material blocking condition of the wafer can be identified; the wafer is protected from being damaged by material clamping, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing and transfer devices, in particular to a wafer clamping device. Background Art

[0002] Between two processes of chip processing, a clamping device is often required to pick up the wafer, move it forward, and then place it on the next station. The clamping device generally includes a gantry, on which a Y-axis linear module is provided along the gantry, and a Z-axis linear module is provided at the moving end of the Y-axis linear module. The moving end of the Z-axis linear module extends an arm along the horizontal X-axis, and a clamping cylinder for clamping the wafer is connected to the arm. During operation, the Z-axis linear module drives the clamping cylinder to move up and down, the clamping cylinder clamps the wafer, and then the Y-axis linear module moves along the gantry to the next station.

[0003] During wafer processing, it is inevitable that the wafer will get stuck when the equipment in the previous process outputs the wafer. However, the clamping device cannot recognize it at this time, and the clamping cylinder will clamp the wafer and move it, which will scratch or even break the wafer, causing it to be scrapped. Utility Model Content

[0004] The technical problem to be solved by the utility model is: how to identify the stuck situation of wafers.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] The utility model provides a wafer clamping device, comprising a YZ motion module, a support arm, a bracket, and a pin, wherein one end of the support arm is connected to the YZ motion module, the bracket is slidably connected to the other end of the support arm and can slide horizontally relative to the support arm, and a clamping assembly is provided on the bracket; a reset piece is provided on the support arm, the reset piece contacts with the bracket and can drive the bracket to return to its original position when the bracket is displaced; an infrared sensor is provided on the other end of the support arm, a light blocking sheet is provided on the bracket, a light through hole is provided on the light blocking sheet, and the light through hole is located between the transmitting end and the receiving end of the infrared sensor.

[0007] The beneficial effects of the utility model are:

[0008] By adopting the utility model, the bracket can float horizontally relative to the support arm, and the movement of the bracket relative to the support arm can be buffered, thereby avoiding a sharp increase in the clamping stress of the clamping component on the wafer when the material is stuck; the light shielding sheet moves synchronously with the bracket to make the infrared sensor sense, thereby being able to identify the material jamming situation of the wafer; the wafer is protected from damage by the material jamming, and the product yield is improved; in addition, the reset part can make the bracket maintain or restore the original position, thereby ensuring that the clamping component can work stably, and when the material jam is released, the infrared sensor can be guaranteed to resume the working state, thereby ensuring the sustainable operation of the device.

[0009] On the basis of the above technical solution, the present invention can also be improved as follows.

[0010] Furthermore, the reset member includes at least two pins arranged along the Y-axis direction, the pins are fixed on the support arm, and a coil spring is sleeved on the pin; a reset column is provided on the bracket, and the same end of the wire body of the two coil springs is clamped on both sides of the reset column, and the other ends of the wire body of the two coil springs are respectively clamped on the support arm.

[0011] The same end of the wire body of the two coil springs constrains the two sides of the reset column, which is convenient for constraining the reset column and the bracket in place, with a simple structure and good stability; when the bracket moves in the Y-axis direction, the wire body of one of the coil springs is pushed to deform, so that the coil spring accumulates force. When the external force disappears, the elastic force of the coil spring can drive the bracket to return to its original position, and the reset reliability is good.

[0012] Furthermore, a limiting column is provided on the support arm, and the limiting column and the reset column are arranged along the X-axis direction, and the same end of the wire body of the two coil springs is clamped on both sides of the limiting column.

[0013] When installing the coil spring, the limit column can be used for pre-tightening to avoid the elastic forces of the two coil springs from opposing each other, thereby increasing the reset elastic force; when the external force of the bracket disappears, the elastic force of the coil spring pushed by the bracket can quickly drive the bracket to reset, while the elastic force of the other coil spring can reduce excessive movement of the bracket, and the reset time is short.

[0014] Furthermore, at least two adjustment blocks are provided on the support arm, and long holes are provided on the adjustment blocks, and bolts are passed through the long holes to fix the adjustment blocks on the support arm; the other end of the wire body of the coil spring is clamped on one side of the adjustment block.

[0015] The position of the adjusting block can be adjusted along the direction of the long hole to change the line clamping position of the coil spring, which is convenient for adjusting the preload force of the coil spring.

[0016] Furthermore, the clamping assembly includes a clamping cylinder, an upper clamping plate and a lower clamping plate. The cylinder body of the clamping cylinder is fixed on the upper clamping plate. The piston rod of the clamping cylinder passes downward through the upper clamping plate and the bracket and then connects to the lower clamping plate. The upper clamping plate is provided with an upper clamping lip, and the lower clamping plate is provided with a lower clamping lip; the upper clamping plate is connected to the bracket.

[0017] The piston rod of the clamping cylinder can drive the lower clamping plate and the lower clamping lip to move, thereby realizing the wafer clamping action, which is easy to operate.

[0018] Furthermore, a vertically arranged guide rail is provided on the bracket, and the upper clamp is slidably connected to the guide rail; a return spring is provided below the upper clamp, the lower end of the return spring abuts against the bracket, and the return spring is sleeved on the piston rod of the clamping cylinder.

[0019] In the initial state, the piston rod of the clamping cylinder retracts, the upper clamping lip and the lower clamping lip are closed, and the two ends of the reset spring are compressed by the upper clamping plate and the bracket; when the piston rod of the clamping cylinder extends, the reset spring can use the force of the bracket to push the upper clamping plate upward, and at the same time, the piston rod of the clamping cylinder passes through the bracket, which can push the lower clamping plate downward; thus, the upper clamping lip and the lower clamping lip open at the same time, making it easy to align the opening with the wafer and the clamping position is accurate.

[0020] Furthermore, a limit block is provided at the upper end of the guide rail.

[0021] After the upper clamping plate moves upward to the limit, it abuts against the limit block, which is convenient for limiting the upward movement of the upper clamping plate, ensuring that the opening range of the upper clamping lip and the lower clamping lip is appropriate, and improving the clamping accuracy. Preferably, the upward movement range of the upper clamping plate is 0mm to 3mm.

[0022] Furthermore, a small head section is provided at the lower end of the piston rod of the clamping cylinder, and the small head section passes through the upper clamping plate and the bracket and then connects to the lower clamping plate.

[0023] After the small head section extends out of the bracket, the step formed by the small head section and the piston rod abuts the bracket, which is convenient for limiting the downward movement of the lower clamping plate and ensuring that the lower clamping lip can accurately extend to the lower side of the wafer. Preferably, the limit of the downward movement of the lower clamping plate is 0mm to 1mm.

[0024] Furthermore, a guide column is provided on the lower clamping plate, and the upper end of the guide column passes through the bracket and the upper clamping plate in sequence.

[0025] The lower clamping plate and the upper clamping plate are ensured to move in the vertical direction, the lower clamping plate and the upper clamping plate are prevented from rotating, and the accuracy of the clamping action is improved.

[0026] Furthermore, the YZ motion module includes a gantry, a Y-axis linear motor is provided on the gantry, a Z-axis linear motor is provided at the moving end of the Y-axis linear motor, and the moving end of the Z-axis linear motor is connected to the support arm.

[0027] The YZ axis motion superposition is achieved, which can drive the support arm to realize Y-axis and Z-axis motion, making it easier for the clamping component to clamp the wafer and move it to the next station; the vibration is small and the movement is smooth. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of the utility model.

[0029] Figure 2 Detailed structural drawing of the bracket and clamping assembly.

[0030] Figure 3 Detailed drawing of the connection between the clamping cylinder and the lower clamping plate.

[0031] In the accompanying drawings, the technical features represented by the reference numerals are as follows:

[0032] 1-arm; 2-bracket; 3-pin; 4-infrared sensor; 5-light shield; 6-light port; 7-coil spring; 8-reset column; 9-limit column; 10-adjustment block; 11-clamping cylinder; 12-upper clamping plate; 13-lower clamping plate; 14-upper clamping lip; 15-lower clamping lip; 16-guide rail; 17-reset spring; 18-limiting block; 19-small head section; 20-guide column; 21-gantry; 22-Y-axis linear motor; 23-Z-axis linear motor. DETAILED DESCRIPTION

[0033] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0034] This utility model refers to Figure 1-3 .

[0035] The utility model provides a wafer clamping device, including a YZ motion module, an arm 1, a bracket 2, and a pin 3. One end of the arm 1 is connected to the YZ motion module, the bracket 2 is slidably connected to the other end of the arm 1 and can slide horizontally relative to the arm 1, and a clamping assembly is provided on the bracket 2; a reset piece is provided on the arm 1, the reset piece contacts with the bracket 2 and can drive the bracket 2 to return to its original position when the bracket 2 is displaced; an infrared sensor 4 is provided at the other end of the arm 1, a light blocking sheet 5 is provided on the bracket 2, a light through hole 6 is provided on the light blocking sheet 5, and the light through hole 6 is located between the transmitting end and the receiving end of the infrared sensor 4.

[0036] principle:

[0037] The YZ motion module is a superposition of the Y-axis linear module and the Z-axis linear module. The linear module belongs to the prior art, such as a linear motor, a lead screw pair, etc. The clamping assembly is used to clamp the wafer, and the clamping cylinder 11 in the prior art can be used. During operation, the YZ motion module drives the clamping assembly to move up and down, the clamping assembly clamps the wafer, and then the YZ motion module drives the clamping assembly to move along the Y axis to the next station. The working processes of the YZ motion module and the clamping assembly are both prior art.

[0038] The bracket 2 can slide horizontally relative to the arm 1. When the bracket 2 is subjected to external force, it can float and push the reset part on the arm 1 to elastically deform and store force. When the external force disappears, the reset part can drive the bracket 2 to return to its original position, so that the clamping assembly has a stable position and can clamp the wafer; at the same time, the light opening 6 of the light shielding sheet 5 remains in place, and the infrared sensor 4 has no induction. When the wafer is stuck, the resistance of the clamping assembly is transmitted to the bracket 2, and the YZ motion module drives the arm 1 to move, then the bracket 2 floats relative to the arm 1, and the bracket 2 drives the light shielding sheet 5 to make the light opening 6 deviate from its original position, so that the light shielding sheet 5 cuts off the infrared signal between the transmitting end and the receiving end of the infrared sensor 4. Therefore, the infrared sensor 4 senses the light shielding sheet 5 and can identify the wafer jam. Based on this, the user can connect the infrared sensor 4 with the controller signal of the YZ motion module to promptly control the YZ motion module to stop; the user can also connect the infrared sensor 4 with the signal of the processing equipment to promptly control the opening of the processing equipment outlet to release the stuck material; the user can also connect the infrared sensor 4 with the controller signal of the clamping component to promptly control the clamping component to release the wafer; the above usage methods can protect the wafer and avoid wafer scrapping.

[0039] Preferably, the light opening 6 is a barrel groove along the X direction; when the bracket 2 only moves along the X direction, the infrared sensor 4 does not sense. A slide rail is provided on the arm 1 along the Y direction, and the bracket 2 is slidably connected to the slide rail; so that the bracket 2 can float along the Y direction, matching the forward direction of the YZ motion module after clamping the wafer.

[0040] By adopting the utility model, the bracket 2 can float horizontally relative to the support arm 1, and can buffer the movement of the bracket 2 relative to the support arm 1, thereby avoiding a sharp increase in the clamping stress of the clamping component on the wafer when the material is stuck; the light shielding sheet 5 moves synchronously with the bracket 2, so that the infrared sensor 4 is sensed, thereby being able to identify the material jam of the wafer; the wafer is protected from damage by the material jam, and the product yield is improved; in addition, the reset component can keep the bracket 2 or restore it to its original position, ensuring that the clamping component can work stably, and when the material jam is released, the infrared sensor 4 can be restored to a working state, thereby ensuring the sustainable operation of the device.

[0041] Furthermore, the reset member includes at least two pins 3 arranged along the Y-axis direction, the pins 3 are fixed on the support arm 1, and a coil spring 7 is sleeved on the pin 3; a reset column 8 is provided on the bracket 2, and the same end of the wire body of the two coil springs 7 is clamped on both sides of the reset column 8, and the other ends of the wire bodies of the two coil springs 7 are respectively clamped on the support arm 1.

[0042] Note: The wire body of the coil spring 7, i.e., the steel wire used to make the coil spring 7, has its middle portion curled into a spring shape, and its two ends extending out in the tangential direction of the spring.

[0043] The same end of the wire body of the two coil springs 7 constrains the two sides of the reset column 8, which is convenient for constraining the reset column 8 and the bracket 2 in place. The structure is simple and the stability is good. When the bracket 2 moves in the Y-axis direction, the wire body of one of the coil springs 7 is pushed to deform, so that the coil spring 7 accumulates force. When the external force disappears, the elastic force of the coil spring 7 can drive the bracket 2 to return to its original position, and the reset reliability is good.

[0044] Furthermore, a limiting column 9 is also provided on the support arm 1 . The limiting column 9 and the reset column 8 are arranged along the X-axis direction, and the same end of the wire body of the two coil springs 7 is clamped on both sides of the limiting column 9 .

[0045] When installing, the coil spring 7 can be pre-tightened with the help of the limit column 9 to avoid the elastic forces of the two coil springs 7 from opposing each other, thereby increasing the reset elastic force; when the external force of the bracket 2 disappears, the elastic force of the coil spring 7 pushed by the bracket 2 can quickly drive the bracket 2 to reset, while the elastic force of the other coil spring 7 can reduce the excessive movement of the bracket 2, and the reset time is short.

[0046] Furthermore, at least two adjustment blocks 10 are provided on the support arm 1 , and a long hole is provided on the adjustment block 10 , and the adjustment block 10 is fixed to the support arm 1 by bolts passing through the long hole; the other end of the wire body of the coil spring 7 is clamped on one side of the adjustment block 10 .

[0047] The position of the adjusting block 10 can be adjusted along the direction of the long hole to change the line clamping position of the coil spring 7, so as to facilitate the adjustment of the preload force of the coil spring 7.

[0048] Furthermore, the clamping assembly includes a clamping cylinder 11, an upper clamping plate 12 and a lower clamping plate 13. The cylinder body of the clamping cylinder 11 is fixed on the upper clamping plate 12. The piston rod of the clamping cylinder 11 penetrates downward through the upper clamping plate 12 and the bracket 2 and then connects to the lower clamping plate 13. The upper clamping plate 12 is provided with an upper clamping lip 14, and the lower clamping plate 13 is provided with a lower clamping lip 15; the upper clamping plate 12 is connected to the bracket 2.

[0049] The piston rod of the clamping cylinder 11 can drive the lower clamping plate 13 and the lower clamping lip 15 to move, thereby realizing the wafer clamping action, and the operation is convenient.

[0050] Furthermore, a vertically arranged guide rail 16 is provided on the bracket 2, and the upper clamping plate 12 is slidably connected to the guide rail 16; a return spring 17 is provided below the upper clamping plate 12, and the lower end of the return spring 17 abuts against the bracket 2, and the return spring 17 is sleeved on the piston rod of the clamping cylinder 11.

[0051] In the initial state, the piston rod of the clamping cylinder 11 retracts, the upper clamping lip 14 and the lower clamping lip 15 are closed, and the two ends of the return spring 17 are compressed by the upper clamping plate 12 and the bracket 2; when the piston rod of the clamping cylinder 11 extends, the return spring 17 can use the support 2 to push the upper clamping plate 12 to move upward. At the same time, the piston rod of the clamping cylinder 11 passes through the bracket 2, and can push the lower clamping plate 13 to move downward; thereby, the upper clamping lip 14 and the lower clamping lip 15 are opened at the same time, so that the opening is aligned with the wafer and the clamping position is accurate.

[0052] Furthermore, a limit block 18 is provided at the upper end of the guide rail 16 .

[0053] After the upper clamping plate 12 moves upward to the limit, it abuts against the limit block 18, which is convenient for limiting the upward movement of the upper clamping plate 12, ensuring that the upper clamping lip 14 and the lower clamping lip 15 are opened appropriately, thereby improving the clamping accuracy. Preferably, the upward movement of the upper clamping plate 12 is 0mm to 3mm.

[0054] Furthermore, a small head section 19 is provided at the lower end of the piston rod of the clamping cylinder 11 , and the small head section 19 passes through the upper clamping plate 12 and the bracket 2 and is connected to the lower clamping plate 13 .

[0055] Note: The small head section 19 specifically refers to a section where the diameter of the piston rod of the clamping cylinder 11 becomes smaller.

[0056] After the small head section 19 extends out of the bracket 2, the step formed by the small head section 19 and the piston rod abuts the bracket 2, which is convenient for limiting the downward movement of the lower clamping plate 13 and ensuring that the lower clamping lip 15 can accurately extend to the lower side of the wafer. Preferably, the downward movement limit of the lower clamping plate 13 is 0mm to 1mm.

[0057] Furthermore, a guide column 20 is provided on the lower clamping plate 13 , and the upper end of the guide column 20 passes through the bracket 2 and the upper clamping plate 12 in sequence.

[0058] The lower clamping plate 13 and the upper clamping plate 12 are ensured to move in the vertical direction, the lower clamping plate 13 and the upper clamping plate 12 are prevented from rotating, and the accuracy of the clamping action is improved.

[0059] Furthermore, the YZ motion module includes a gantry 21 , on which a Y-axis linear motor 22 is disposed, and a Z-axis linear motor 23 is disposed at the moving end of the Y-axis linear motor 22 , and the moving end of the Z-axis linear motor 23 is connected to the support arm 1 .

[0060] Note: The linear motor is a prior art, the fixed end of the linear motor is its guide rail 16 part, and the movable end is its slider part; the fixed end of the Y-axis linear motor 22 is arranged and fixed along the gantry 21, and the fixed end of the Z-axis linear motor 23 is fixed to the movable end of the Y-axis linear motor 22.

[0061] The YZ axis motion superposition is achieved, and the support arm 1 can be driven to realize Y axis and Z axis motion, so that the clamping assembly can clamp the wafer and move it to the next station; the vibration is small and the motion is stable.

[0062] Preferably, the Y-axis linear motor 22 is connected to the infrared sensor 4. When the infrared sensor 4 senses the signal of the light shield 5 and transmits it to the Y-axis linear motor 22, the Y-axis linear motor 22 stops, thereby preventing the clamping assembly from damaging the wafer.

[0063] In the description of the present invention, it should be understood that if there are descriptive terms indicating orientation, direction or positional relationship, such as: "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of understanding the present invention and simplifying the description, and does not indicate or imply that the referred part, element or whole must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0064] In addition, if there are order description terms, such as "first", "second", etc., their purpose in this specification is to facilitate understanding or simplify description. For example, in order to distinguish multiple technical features of the same type or function, but they have to be mentioned separately, this specification may use prefix or suffix order description terms to distinguish them. Therefore, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0065] In the present utility model, if the terms describing the relative functional relationship of the structures are used, such as "install", "connect", "connect", "fix", etc., they should be understood in a broad sense unless otherwise clearly specified and limited. For example, "install", "connect", "connect", etc. can be a fixed connection, a detachable connection, or an integrated one; can be a mechanical connection or an electrical connection; can be a direct connection or an indirect connection through an intermediate medium, can be the internal connection of two elements or the interaction relationship between two elements; "fix" can be an integrated fixation or a detachable fixation through fasteners; can be a direct fixation or a fixation through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above-mentioned descriptive terms in the present utility model can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0066] In the present invention, if there are descriptive terms with subsidiary or connecting meanings, for example, the first feature is "on" or "below" the second feature, unless otherwise clearly specified and limited, it should not be interpreted in a restrictive manner. For example, "on" or "below" can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0067] Furthermore, the first feature being “above”, “above”, and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “below”, “below”, and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments, examples and features of the different embodiments and examples described in this specification without contradiction, and these combinations or combinations shall all fall within the scope summarized by the utility model.

[0069] Although the embodiments of the present invention have been shown and described above, it is understandable that the above embodiments are illustrative and cannot be construed as limitations on the present invention. Changes, modifications, substitutions and variations of the above embodiments made by ordinary technicians in the field within the scope of information available from public channels and in combination with the technical inspiration given by the application documents are still within the scope of protection of the present application.

Claims

1. A wafer clamping device, characterized in that: The invention comprises a YZ motion module, a support arm (1), a bracket (2), and a pin (3); one end of the support arm (1) is connected to the YZ motion module; the bracket (2) is slidably connected to the other end of the support arm (1) and can slide horizontally relative to the support arm (1); a clamping assembly is provided on the support arm (1); a reset member is provided on the support arm (1); the reset member contacts the bracket (2) and can drive the bracket (2) to return to its original position when the bracket (2) is displaced; an infrared sensor (4) is provided on the other end of the support arm (1); a light shielding sheet (5) is provided on the bracket (2); a light through hole (6) is provided on the light shielding sheet (5); and the light through hole (6) is located between the transmitting end and the receiving end of the infrared sensor (4).

2. The wafer clamping device according to claim 1, characterized in that: The reset member comprises at least two pins (3) arranged along the Y-axis direction, the pins (3) are fixed on the support arm (1), and a coil spring (7) is sleeved on the pin (3); a reset column (8) is provided on the bracket (2), the same end of the wire bodies of the two coil springs (7) are clamped on both sides of the reset column (8), and the other ends of the wire bodies of the two coil springs (7) are respectively clamped on the support arm (1).

3. The wafer clamping device according to claim 2, characterized in that: The support arm (1) is also provided with a limiting column (9), the limiting column (9) and the reset column (8) are arranged along the X-axis direction, and the same end of the wire body of the two coil springs (7) is clamped on both sides of the limiting column (9).

4. The wafer clamping device according to claim 2, characterized in that: The support arm (1) is also provided with at least two adjustment blocks (10), each of which is provided with a long hole, through which a bolt passes to fix the adjustment block (10) to the support arm (1); the other end of the wire body of the coil spring (7) is clamped on one side of the adjustment block (10).

5. The wafer clamping device according to claim 1, characterized in that: The clamping assembly comprises a clamping cylinder (11), an upper clamping plate (12) and a lower clamping plate (13); the cylinder body of the clamping cylinder (11) is fixed on the upper clamping plate (12); the piston rod of the clamping cylinder (11) passes through the upper clamping plate (12) and the bracket (2) downward and is connected to the lower clamping plate (13); an upper clamping lip (14) is provided on the upper clamping plate (12), and a lower clamping lip (15) is provided on the lower clamping plate (13); the upper clamping plate (12) is connected to the bracket (2).

6. The wafer clamping device according to claim 5, characterized in that: The bracket (2) is provided with a vertically arranged guide rail (16), and the upper clamping plate (12) is slidably connected to the guide rail (16); a return spring (17) is provided below the upper clamping plate (12), the lower end of the return spring (17) abuts against the bracket (2), and the return spring (17) is sleeved on the piston rod of the clamping cylinder (11).

7. The wafer clamping device according to claim 6, characterized in that: A limit block (18) is provided at the upper end of the guide rail (16).

8. The wafer clamping device according to claim 6, characterized in that: The lower end of the piston rod of the clamping cylinder (11) is provided with a small head section (19), and the small head section (19) penetrates the upper clamping plate (12) and the bracket (2) and is connected to the lower clamping plate (13).

9. The wafer clamping device according to claim 6, characterized in that: A guide column (20) is also provided on the lower clamping plate (13), and the upper end of the guide column (20) passes through the bracket (2) and the upper clamping plate (12) in sequence.

10. The wafer gripping device according to claim 1, characterized in that: The YZ motion module comprises a gantry (21), a Y-axis linear motor (22) is provided on the gantry (21), a Z-axis linear motor (23) is provided at the moving end of the Y-axis linear motor (22), and the moving end of the Z-axis linear motor (23) is connected to the support arm (1).

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